CN113696087A - Vibration grinding disc cleaning process for piezoresistor ceramic chip - Google Patents
Vibration grinding disc cleaning process for piezoresistor ceramic chip Download PDFInfo
- Publication number
- CN113696087A CN113696087A CN202111167593.7A CN202111167593A CN113696087A CN 113696087 A CN113696087 A CN 113696087A CN 202111167593 A CN202111167593 A CN 202111167593A CN 113696087 A CN113696087 A CN 113696087A
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- Prior art keywords
- ceramic
- vibration
- grinding
- tray
- ceramic chip
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/06—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving oscillating or vibrating containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a vibration grinding sheet cleaning process of a piezoresistor ceramic sheet, which comprises the following steps of (1) placing the sintered piezoresistor ceramic sheet in a vibration groove, wherein the loose volume does not exceed 90% of the volume of the vibration groove, adding clear water until the ceramic sheet is submerged, and starting the vibration groove to start vibration grinding; (2) after grinding, filtering and separating the ceramic sheets and the wastewater by using a screen with 5-10 meshes, washing the ceramic sheets once by using clear water, and recovering the wastewater; (3) and putting the ceramic chips into a tray, then placing the tray in an oven, and drying the tray at 100-120 ℃ until the ceramic chips are completely dried. The rotating speed of the vibration groove is set to be 1300-1600 r/min, the amplitude is set to be 3-6 mm, and the grinding time is 10-20 min. According to the invention, the ceramic chips are mutually collided and rubbed by utilizing high-frequency vibration so as to remove rough edges and attached powder and break up the adhered ceramic chips, so that the ceramic chips are adhered and separated due to sintering, the process is simple, the efficiency is high, water is used as buffer, the lower edge defect rate is realized, the padding powder is not required to be added for grinding, the pollution to water in the whole cleaning process is less, and the water resource can be effectively saved.
Description
Technical Field
The invention relates to a vibration grinding sheet cleaning process of a piezoresistor ceramic sheet, belonging to the technical field of electronic element manufacturing.
Background
The performance of the piezoresistor depends on the piezoresistor ceramic sheet, most of the ceramics have the characteristics of high hardness and low toughness, and the sintered ceramics are easy to cause edge deletion and damage due to severe collision. If the damaged voltage-sensitive ceramic chip is manufactured into a voltage-sensitive resistor, when current flows through the voltage-sensitive ceramic chip, the current is locally concentrated due to the damage of the structure of the voltage-sensitive ceramic chip, so that breakdown failure is easy to occur, the safety of an electric appliance cannot be protected, and the hidden danger of fire can be caused. In the production process, the process which is most likely to cause the ceramic chip damage is the cleaning process of the ceramic chip after the ceramic chip is fired. The main purposes of the grinding sheet cleaning process are to separate the ceramic sheets adhered together after sintering and to remove the rough edges of the ceramic sheets caused in the tabletting process. The existing cleaning method is to grind ceramic chips by a grinding disc and ball mill by a roller, wherein the grinding disc and the roller ball milling method need to be barreled one by one and need to be added with padding powder for grinding, and the whole cleaning process is complex and has serious pollution to water.
Disclosure of Invention
The invention aims to solve the technical problem of providing a vibration grinding sheet cleaning process of a piezoresistor ceramic chip, which is used for removing fragile rough edges on the ceramic chip and sintering padding attached to the ceramic chip by utilizing mutual collision and friction among the ceramic chips.
The technical scheme of the invention is as follows: a vibration grinding sheet cleaning process of a piezoresistor ceramic chip comprises the following steps: (1) placing the sintered piezoresistor ceramic chip in a vibration tank, wherein the loose volume does not exceed 90% of the volume of the vibration tank, adding clear water until the ceramic chip is submerged, and starting the vibration tank to start vibration grinding; (2) after grinding, filtering and separating the ceramic sheets and the wastewater by using a screen with 5-10 meshes, washing the ceramic sheets once by using clear water, and recovering the wastewater; (3) and putting the ceramic chips into a tray, then placing the tray in an oven, and drying the tray at 100-120 ℃ until the ceramic chips are completely dried.
The rotating speed of the vibration groove is set to be 1300-1600 r/min, the amplitude is set to be 3-6 mm, and the grinding time is 10-20 min.
The invention utilizes high-frequency vibration to enable the ceramic chips to mutually collide and rub so as to remove burrs and attached powder and break up the adhered ceramic chips, can separate the ceramic chips caused by sintering from adhesion, does not need to be barreled one by one like a roller ball grinding method, has simple process and high efficiency, has lower edge defect rate because the applied energy in the process is lower and water is used as buffer, and simultaneously has less pollution to water in the whole cleaning process because the cushion powder is not needed to be added in the process, so the water after the ceramic chips can be recycled after filtration treatment, and can effectively save water resources.
Detailed Description
Example 1:
1. 220kg of sintered phi 7 pressure-sensitive ceramic is loosely loaded into a vibration tank with the volume of 150L, the model of the vibration tank is NFC-503, the volume of the vibration tank is about 60 percent of that of the vibration tank, and enough clear water is added to submerge the ceramic chip.
2. Starting a vibration groove, setting the rotating speed to be 1300r/min, setting the amplitude to be 3mm, and grinding for 10 min;
3. after grinding, filtering and separating the ceramic sheets and the waste water by using a 10-mesh screen, and washing the ceramic sheets once by using clear water;
4. the tiles were placed in a tray and then placed in an oven and dried at 100 ℃ until completely dry. Thus obtaining the pressure-sensitive ceramic chip with a smooth and perfect surface. The ceramic chip qualification rate and the electrical properties of the finished product obtained by the ceramic chip after surface metallization, welding and encapsulation are shown in Table 1.
Example 2:
1. 220kg of sintered phi 10 pressure-sensitive ceramic is loosely loaded into a vibration tank with the volume of 150L, the model of the vibration tank is NFC-503, the volume of the vibration tank is about 65 percent of that of the vibration tank, and enough clear water is added to submerge the ceramic chip.
2. Starting a vibration groove, setting the rotating speed to be 1300r/min, setting the amplitude to be 3mm, and grinding for 15 min;
3. after grinding, filtering and separating the ceramic sheets and the waste water by using a 10-mesh screen, and washing the ceramic sheets once by using clear water;
4. the tiles were placed in a tray and then placed in an oven and dried at 100 ℃ until completely dry. Thus obtaining the pressure-sensitive ceramic chip with a smooth and perfect surface. The ceramic chip qualification rate and the electrical properties of the finished product obtained by the ceramic chip after surface metallization, welding and encapsulation are shown in Table 1.
Example 3:
1. 220kg of sintered phi 14 pressure-sensitive ceramic is loosely loaded into a vibration tank with the volume of 150L, the model of the vibration tank is NFC-503, the volume of the vibration tank is about 70 percent of that of the vibration tank, and enough clean water is added to submerge the ceramic chip.
2. Starting a vibration groove, setting the rotating speed to be 1400r/min, setting the amplitude to be 4mm, and grinding for 20 min;
3. after grinding, filtering and separating the ceramic sheets and the waste water by using a 10-mesh screen, and washing the ceramic sheets once by using clear water;
4. the tiles were placed in a tray and then placed in an oven and dried at 120 ℃ until completely dry. Thus obtaining the pressure-sensitive ceramic chip with a smooth and perfect surface. The ceramic chip qualification rate and the electrical properties of the finished product obtained by the ceramic chip after surface metallization, welding and encapsulation are shown in Table 1.
Example 4:
1. 200kg of sintered phi 20 pressure-sensitive ceramic is loosely loaded into a vibration tank with the volume of 150L, the model of the vibration tank is NFC-503, the volume of the vibration tank is about 80 percent of that of the vibration tank, and enough clear water is added to submerge the ceramic chip.
2. Starting a vibration groove, setting the rotating speed to be 1500r/min, setting the amplitude to be 5mm, and grinding for 18 min;
3. after grinding, filtering and separating the ceramic sheets and the waste water by using a 5-mesh screen, and washing the ceramic sheets once by using clear water;
4. the tiles were placed in a tray and then placed in an oven and dried at 120 ℃ until completely dry. Thus obtaining the pressure-sensitive ceramic chip with a smooth and perfect surface. The ceramic chip qualification rate and the electrical properties of the finished product obtained by the ceramic chip after surface metallization, welding and encapsulation are shown in Table 1.
Example 5:
1. 200kg of sintered phi 25 pressure-sensitive ceramic is loosely loaded into a vibration tank with the volume of 150L, the model of the vibration tank is NFC-503, the volume of the vibration tank is about 90 percent of that of the vibration tank, and enough clear water is added to submerge the ceramic chip.
2. Starting a vibration groove, setting the rotating speed to be 1600r/min, setting the amplitude to be 6mm, and grinding for 20 min;
3. after grinding, filtering and separating the ceramic sheets and the waste water by using a 5-mesh screen, and washing the ceramic sheets once by using clear water;
4. the tiles were placed in a tray and then placed in an oven and dried at 120 ℃ until completely dry. Thus obtaining the pressure-sensitive ceramic chip with a smooth and perfect surface. The ceramic chip qualification rate and the electrical properties of the finished product obtained by the ceramic chip after surface metallization, welding and encapsulation are shown in Table 1.
TABLE 1 Electrical Properties of the finished products prepared by cleaning the ceramic chip and the polishing pad of the examples
Claims (2)
1. A vibration abrasive disc cleaning process of a piezoresistor ceramic chip is characterized in that: the process comprises the following steps: (1) placing the sintered piezoresistor ceramic chip in a vibration tank, wherein the loose volume does not exceed 90% of the volume of the vibration tank, adding clear water until the ceramic chip is submerged, and starting the vibration tank to start vibration grinding; (2) after grinding, filtering and separating the ceramic sheets and the wastewater by using a screen with 5-10 meshes, washing the ceramic sheets once by using clear water, and recovering the wastewater; (3) and putting the ceramic chips into a tray, then placing the tray in an oven, and drying the tray at 100-120 ℃ until the ceramic chips are completely dried.
2. The vibrating abrasive disc cleaning process for varistor ceramic discs as recited in claim 1, further comprising: the rotating speed of the vibration groove is set to be 1300-1600 r/min, the amplitude is set to be 3-6 mm, and the grinding time is 10-20 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111167593.7A CN113696087A (en) | 2021-10-07 | 2021-10-07 | Vibration grinding disc cleaning process for piezoresistor ceramic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111167593.7A CN113696087A (en) | 2021-10-07 | 2021-10-07 | Vibration grinding disc cleaning process for piezoresistor ceramic chip |
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| Publication Number | Publication Date |
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| CN113696087A true CN113696087A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111167593.7A Pending CN113696087A (en) | 2021-10-07 | 2021-10-07 | Vibration grinding disc cleaning process for piezoresistor ceramic chip |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101179007A (en) * | 2007-11-27 | 2008-05-14 | 万向硅峰电子股份有限公司 | Ultrasonic cleaning monocrystalline silicon piece method and device thereof |
| CN101314214A (en) * | 2008-06-28 | 2008-12-03 | 广东风华高新科技股份有限公司 | Method for removing rough edges of element base substrate and application thereof |
| CN101534950A (en) * | 2006-09-08 | 2009-09-16 | 普法夫Aqs自动质量控制系统有限责任公司 | Vibration mill and method for the operation of a vibration mill |
| DE102009040099A1 (en) * | 2009-09-04 | 2011-03-10 | Rodenbeck, Arno W., Dipl.-Ing. | Ceramic elements i.e. saddle body ceramic elements, cleaning method for heat exchanger, involves careful feeding of ceramic elements in feeding device and dosing device, and washing contaminated ceramic elements with drying process |
| CN103722481A (en) * | 2013-12-10 | 2014-04-16 | 广西新未来信息产业股份有限公司 | Method for grinding zinc oxide voltage dependent resistor porcelain sheet |
| CN105174920A (en) * | 2015-09-07 | 2015-12-23 | 无锡康伟工程陶瓷有限公司 | Production method of ceramic tile |
-
2021
- 2021-10-07 CN CN202111167593.7A patent/CN113696087A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534950A (en) * | 2006-09-08 | 2009-09-16 | 普法夫Aqs自动质量控制系统有限责任公司 | Vibration mill and method for the operation of a vibration mill |
| CN101179007A (en) * | 2007-11-27 | 2008-05-14 | 万向硅峰电子股份有限公司 | Ultrasonic cleaning monocrystalline silicon piece method and device thereof |
| CN101314214A (en) * | 2008-06-28 | 2008-12-03 | 广东风华高新科技股份有限公司 | Method for removing rough edges of element base substrate and application thereof |
| DE102009040099A1 (en) * | 2009-09-04 | 2011-03-10 | Rodenbeck, Arno W., Dipl.-Ing. | Ceramic elements i.e. saddle body ceramic elements, cleaning method for heat exchanger, involves careful feeding of ceramic elements in feeding device and dosing device, and washing contaminated ceramic elements with drying process |
| CN103722481A (en) * | 2013-12-10 | 2014-04-16 | 广西新未来信息产业股份有限公司 | Method for grinding zinc oxide voltage dependent resistor porcelain sheet |
| CN105174920A (en) * | 2015-09-07 | 2015-12-23 | 无锡康伟工程陶瓷有限公司 | Production method of ceramic tile |
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