CN203527228U - Silicon wafer grinding optical polishing system - Google Patents
Silicon wafer grinding optical polishing system Download PDFInfo
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- CN203527228U CN203527228U CN201320712728.8U CN201320712728U CN203527228U CN 203527228 U CN203527228 U CN 203527228U CN 201320712728 U CN201320712728 U CN 201320712728U CN 203527228 U CN203527228 U CN 203527228U
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Abstract
The utility model discloses a silicon wafer grinding optical polishing system, which comprises a heating device, a vertical plane milling and grinding machine and a silicon dioxide one-sided polishing machine, wherein the heating device comprises a heating base and a round loading disk, the upper surface of the loading disk is a smooth plane, a bonding wax layer is arranged between a silicon wafer and the loading disk, the vertical plane milling and grinding machine comprises a first rack and a first worktable, the first worktable is provided with a plurality of round cavities which are matched with the loading disk, and a diamond disk is arranged above the first rack. The silicon wafer grinding optical polishing system does not use grinding sands during the grinding process by matching the heating device, the vertical plane milling and grinding machine and the silicon dioxide one-sided polishing machine with each other, thereby reducing emission of wastes, further improving production efficiency simultaneously, improving yield, and reducing production cost.
Description
Technical field
The utility model relates to a kind of silicon chip grinding optical field, is specifically related to a kind of silicon chip grinding optical polish system.
Background technology
At present, silicon chip surface will carry out optical grinding polishing batch production, and operation is two kinds, and the first is silicon chip Two sides milling and polishing technique: the polishing of silicon wafer thickness classification → diamond dust twin grinder grinding → silicon wafer thickness classification → silica Twp-sided polishing machine; The second is silicon chip one side abrasive polishing process: wax silicon chip is attached on the load plate → silica single side polishing machine polishing of classifying → use of silicon wafer thickness classification → diamond dust twin grinder grinding → silicon wafer thickness.
Yet two kinds of techniques in existing activity in production all must be used abrasive sand to grind, and expense is high, and discarded object is many; Twin grinding silicon chip is to grind under free state, and grinding time needs 80～100 minutes, as long as and car load have a slice cracked in grinding, car load silicon chip is scrapped more than 50%, so yield rate is not high.
The silicon chip of process twin grinding is to Twp-sided polishing machine polishing, because thickness error and Twp-sided polishing machine between sheet and sheet can not add weight, the damage layer depth of silicon chip surface after abrasive sand is ground, therefore polishing velocity is slow, and the time of polishing one car needs 2.5 hours, and yield rate is identical with twin grinding.
If employing single-sided polishing, exists paster rear surface not in one plane equally, and the problem of surface damage layer depth, the time of polishing one car needs more than 2 hours, and yield rate can be higher than Twp-sided polishing machine polishing.
Therefore, be a kind ofly beneficial to environmental protection, reduce waste discharge, enhance productivity and yield rate, the silicon chip grinding optical polish system reducing production costs urgently occurs.
Utility model content
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of environmental protection that is beneficial to, and reduces waste discharge, enhance productivity and yield rate, and the silicon chip grinding optical polish system reducing production costs.
For achieving the above object, the technical solution of the utility model is as follows: a kind of silicon chip grinding optical polish system, comprise firing equipment, vertical shaft plane milling grinding machine and silica single side polishing machine, described firing equipment comprises heated base and circular load plate, described load plate upper surface is smooth plane, is provided with bonding wax layer between described silicon chip and described load plate;
Described vertical shaft plane milling grinding machine comprises the first frame and the first workbench, offers the circular chamber that a plurality of and described load plate matches on described the first workbench, above described the first frame, is provided with diamond disk.
Preferably, described silica single side polishing machine comprises the second frame and the second workbench, in described the second workbench upper surface, be provided with polishing cloth, in described the second frame, be equiped with platen, described upper platen outside is arranged with fixedly lasso, below described fixedly lasso, inner side is provided with the described load plate matching with it, and described load plate is between described fixedly lasso and described polishing cloth;
Described upper platen is at least one.
Preferably, described the first workbench is circular table, on described the first workbench central authorities lower surface, is connected with rotatable driving mechanism;
Described circular chamber is uniformly distributed on described the first workbench, and the center of circle of described a plurality of circular chamber is positioned on same circle.
Preferably, described the second workbench is circular table, and described upper platen is 4.
Preferably, between platen and described the second frame, be equiped with telescoping mechanism on described.
Preferably, described fixedly lasso cross section is the I shape of accumbency, and described fixedly lasso upper end and described upper platen match, and lower end and described load plate match.
The utility model also provides a kind of silicon chip grinding optical polish system processing technology, specifically comprises the steps:
(1) will need the silicon chip of grinding and polishing with bonding wax, to paste on the load plate having heated;
(2) after load plate is cooling, be put on vertical shaft plane milling grinding machine workbench, the silicon chip on load plate, is piled load plate upward on this platform, starts vertical shaft plane milling grinding machine and grinds;
(3) after grinding, take off load plate and rinse silica flour well, be directly put into polishing on silica single side polishing machine, down, pressurization 1.4kg/c ㎡, throws and takes off load plate after 35 minutes silicon chip on load plate, with running water, silicon dioxide polishing solution is rinsed well, with gauze, wiped clean silicon chip surface;
(4) load plate with silicon chip is put on heated base and is heated together, to bonding wax, melt, with single-edge blade, insert between load plate and silicon chip, mention silicon chip, can obtain one side grinding and polishing product;
(5) remaining wax on load plate is wiped clean, evenly coat new bonding wax, again polished the facing down of silicon chip is attached on load plate, with the light silicon chip center of pressing of bamboo rod, the bubble of bonding wax layer is driven out of, after load plate is cooling, carry out second grinding, polishing, repeat above-mentioned steps (2)-step (4), can obtain Two sides milling and polishing product.
Pass through technique scheme, the beneficial effect of technical solutions of the utility model is: a kind of silicon chip grinding optical polish system, comprise firing equipment, vertical shaft plane milling grinding machine and silica single side polishing machine, described firing equipment comprises heated base and circular load plate, described load plate upper surface is smooth plane, is provided with bonding wax layer between described silicon chip and described load plate; Described vertical shaft plane milling grinding machine comprises the first frame and the first workbench, offers the circular chamber that a plurality of and described load plate matches on described the first workbench, above described the first frame, is provided with diamond disk; Adopt silicon chip grinding optical polish system provided by the utility model, by cooperatively interacting of firing equipment, vertical shaft plane milling grinding machine and silica single side polishing machine, in process of lapping, do not use abrasive sand, reduced the discharge of discarded object, also improved production efficiency simultaneously, improve yield rate, reduced production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the firing equipment of the disclosed a kind of silicon chip grinding optical polish system of the utility model embodiment;
Fig. 2 is the structural representation of the vertical shaft plane milling grinding machine of the disclosed a kind of silicon chip grinding optical polish system of the utility model embodiment;
Fig. 3 is the partial schematic diagram of the vertical shaft plane milling grinding machine of the disclosed a kind of silicon chip grinding optical polish system of the utility model embodiment;
Fig. 4 is the structural representation of the silica single side polishing machine of the disclosed a kind of silicon chip grinding optical polish system of the utility model embodiment;
Fig. 5 is the partial schematic diagram of the silica single side polishing machine of the disclosed a kind of silicon chip grinding optical polish system of the utility model embodiment.
Numeral and the represented corresponding component title of letter in figure:
1. firing equipment 11. base 12. load plate 2. vertical shaft plane milling grinding machines
21. first frame 22. first workbench 23. diamond disk 3. dioxies
SiClx single side polishing machine 31. second frame 32. second workbench
Fixing lasso 35. telescoping mechanism 4. silicon chips of platen 34. on 33.
6. polishing cloth.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of environmental protection that is beneficial to, and reduces waste discharge, enhance productivity and yield rate, and the silicon chip grinding optical polish system reducing production costs.
Embodiment,
As Figure 1-5, a kind of silicon chip grinding optical polish system, comprise firing equipment 1, vertical shaft plane milling grinding machine 2 and silica single side polishing machine 3, described firing equipment 1 comprises heated base 11 and circular load plate 12, described load plate 12 upper surfaces are smooth plane, between described silicon chip 4 and described load plate 12, be provided with bonding wax layer, by described bonding wax layer, described silicon chip 4 be fixed on to described load plate 12 upper surfaces.Load plate 12 adopts 1Cr17 ferritic stainless steel.
Described vertical shaft plane milling grinding machine 2 comprises the first frame 21 and the first workbench 22, on described the first workbench 22, offer circular chamber's (not shown) that a plurality of and described load plate 12 matches, above described the first frame 21, be provided with diamond disk 23, between described the first workbench 22 and described load plate 12, by magnetic, connect, by attracting each other, described load plate is firmly fixed on described the first workbench 22.
Described the first workbench 21 is circular table, is connected with rotatable driving mechanism, thereby drives the first workbench 21 to be rotated centered by the center of circle by driving mechanism on described the first central lower surface of workbench 21; Describedly for placing the circular chamber of load plate 12, be uniformly distributed in described the first workbench 21, the center of circle of described a plurality of circular chamber is positioned on same circle, and in the technical program, described circular chamber is 5, can also be other numbers.
Described silica single side polishing machine 3 comprises the second frame 31 and the second workbench 32, in described the second workbench 32 upper surfaces, be provided with polishing cloth 6, described polishing cloth 6 is polyurethane polishing cloth, in described the second frame 31, be equiped with platen 33, described upper platen 33 outsides are arranged with fixedly lasso 34, below described fixedly lasso 34, inner side is provided with the described load plate 12 matching with it, and described load plate 12 is between described fixedly lasso 34 and described polishing cloth 5; Described upper platen 33 is at least one; In the present embodiment technical scheme, described the second workbench 32 is circular table, and described upper platen 33 is 4, can also be other quantity, the specific embodiment be determined on a case-by-case basis, at this, the utility model is not limited in any way, and take and can realize the utility model as main.
Between platen 33 and described the second frame 31, be equiped with telescoping mechanism 35 on described, by the setting of telescoping mechanism 35, thereby drive upper platen 33 to move up and down.Described fixedly lasso 34 cross sections are the I shape of accumbency, and described fixedly lasso 34 upper ends and described upper platen 33 match, and lower end and described load plate 12 match.
The utility model also provides a kind of silicon chip grinding optical polish system processing technology, specifically comprises the steps:
(1) will need the silicon chip of grinding and polishing with bonding wax, to paste on the load plate having heated;
(2) after load plate is cooling, be put on vertical shaft plane milling grinding machine workbench, the silicon chip on load plate, is piled load plate upward on this platform, to start vertical shaft plane milling grinding machine after magnetic and grind (milling and grinding machine is to use 800# diamond disk);
(3) after grinding, when first surface is ground to after demand size, take off load plate and rinse silica flour well, be directly put into polishing on silica single side polishing machine, down, the silicon chip on load plate pressurizes 1.4kg/cm
2, throw and take off load plate after 35 minutes, with running water, silicon dioxide polishing solution is rinsed well, with gauze, wipe clean the surface of silicon chip on load plate;
(4) load plate with silicon chip is put on heated base and is heated together, to bonding wax, melt, with single-edge blade, insert between load plate and silicon chip, mention silicon chip, can obtain one side grinding and polishing product;
(5) remaining wax on load plate is wiped clean, evenly coat new bonding wax, again polished the facing down of silicon chip is attached on load plate, with the light silicon chip center of pressing of bamboo rod, the bubble of bonding wax layer is driven out of, after load plate is cooling, carry out second grinding, polishing, repeat above-mentioned steps (2)-step (4), can obtain Two sides milling and polishing product.
Adopt the technical program, vertical shaft plane milling grinding machine grinds 3000 yuan of/diamond disks that use, 200 days * 12 hours service life.With abrasive sand (2000#), need 200 days (12 hours) * 8kg * 28 yuan/kg=44800 unit.Single device work 200 days, can save 41800 yuan, is 6.7% of other technique abrasive sand costs, reduces by the solid waste of 1.6 tons simultaneously.
The time that vertical shaft plane milling grinding machine grinds one side is 20 minutes, and two-sided is 40 minutes, is a times of abrasive sand grinding efficiency.Silicon chip on load plate is through plane milling, and whole dish silicon chip is a plane, and the surface damage layer of milling is shallow, only have 3～5 μ, silica single side polishing machine can pressurize according to technological requirement, so the polishing time of one side is 35 minutes, two is 70 minutes, and same efficiency doubles.
In addition, adopt single-sided polishing, and have load plate carrying, so yield rate improves 2%.Owing to not using abrasive sand in technique, therefore grinding and polishing can be processed at the same space, and therefore, silicon chip grinding polishing does not have the requirement of cleaning shop to working environment.
Pass through technique scheme, the beneficial effect of technical solutions of the utility model is: a kind of silicon chip grinding optical polish system, comprise firing equipment 1, vertical shaft plane milling grinding machine 2 and silica single side polishing machine 3, described firing equipment 1 comprises heated base 11 and circular load plate 12, described load plate 12 upper surfaces are smooth plane, are provided with bonding wax layer between described silicon chip 4 and described load plate 12; Described vertical shaft plane milling grinding machine 2 comprises the first frame 21 and the first workbench 22, on described the first workbench 22, offers the circular chamber that a plurality of and described load plate 12 matches, and above described the first frame 22, is provided with diamond disk 23; Adopt silicon chip grinding optical polish system provided by the utility model, by cooperatively interacting of firing equipment 1, vertical shaft plane milling grinding machine 2 and silica single side polishing machine 3, in process of lapping, do not use abrasive sand, reduced the discharge of discarded object, also improved production efficiency simultaneously, improve yield rate, reduced production cost.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a silicon chip grinding optical polish system, it is characterized in that, comprise firing equipment, vertical shaft plane milling grinding machine and silica single side polishing machine, described firing equipment comprises heated base and circular load plate, described load plate upper surface is smooth plane, is provided with bonding wax layer between described silicon chip and described load plate;
Described vertical shaft plane milling grinding machine comprises the first frame and the first workbench, offers the circular chamber that a plurality of and described load plate matches on described the first workbench, above described the first frame, is provided with diamond disk.
2. silicon chip grinding optical polish system according to claim 1, it is characterized in that, described silica single side polishing machine comprises the second frame and the second workbench, in described the second workbench upper surface, be provided with polishing cloth, in described the second frame, be equiped with platen, described upper platen outside is arranged with fixedly lasso, and below described fixedly lasso, inner side is provided with the described load plate matching with it, and described load plate is between described fixedly lasso and described polishing cloth;
Described upper platen is at least one.
3. silicon chip grinding optical polish system according to claim 2, is characterized in that, described the first workbench is circular table, on described the first workbench central authorities lower surface, is connected with rotatable driving mechanism;
Described circular chamber is uniformly distributed on described the first workbench, and the center of circle of described a plurality of circular chamber is positioned on same circle.
4. silicon chip grinding optical polish system according to claim 3, is characterized in that, described the second workbench is circular table, and described upper platen is 4.
5. silicon chip grinding optical polish system according to claim 4, is characterized in that, is equiped with telescoping mechanism on described between platen and described the second frame.
6. silicon chip grinding optical polish system according to claim 5, is characterized in that, described fixedly lasso cross section is the I shape of accumbency, and described fixedly lasso upper end and described upper platen match, and lower end and described load plate match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320712728.8U CN203527228U (en) | 2013-11-12 | 2013-11-12 | Silicon wafer grinding optical polishing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320712728.8U CN203527228U (en) | 2013-11-12 | 2013-11-12 | Silicon wafer grinding optical polishing system |
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| CN203527228U true CN203527228U (en) | 2014-04-09 |
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| CN201320712728.8U Expired - Fee Related CN203527228U (en) | 2013-11-12 | 2013-11-12 | Silicon wafer grinding optical polishing system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625940A (en) * | 2013-11-12 | 2015-05-20 | 昆山科尼电子器材有限公司 | Silicon wafer grinding and optical polishing system and machining technology thereof |
| CN104907929A (en) * | 2015-06-30 | 2015-09-16 | 吉林大学 | Auxiliary tool for clamping end surfaces of columnar workpieces during finishing process and application thereof |
| CN108527130A (en) * | 2018-06-04 | 2018-09-14 | 佛山市同鑫智能装备科技有限公司 | A kind of stainless steel cell phone rear cover processing method |
-
2013
- 2013-11-12 CN CN201320712728.8U patent/CN203527228U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625940A (en) * | 2013-11-12 | 2015-05-20 | 昆山科尼电子器材有限公司 | Silicon wafer grinding and optical polishing system and machining technology thereof |
| CN104907929A (en) * | 2015-06-30 | 2015-09-16 | 吉林大学 | Auxiliary tool for clamping end surfaces of columnar workpieces during finishing process and application thereof |
| CN108527130A (en) * | 2018-06-04 | 2018-09-14 | 佛山市同鑫智能装备科技有限公司 | A kind of stainless steel cell phone rear cover processing method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 Termination date: 20171112 |
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| CF01 | Termination of patent right due to non-payment of annual fee |