CN105675929B - A kind of probe card of the probe of compatible different size - Google Patents
A kind of probe card of the probe of compatible different size Download PDFInfo
- Publication number
- CN105675929B CN105675929B CN201610107841.1A CN201610107841A CN105675929B CN 105675929 B CN105675929 B CN 105675929B CN 201610107841 A CN201610107841 A CN 201610107841A CN 105675929 B CN105675929 B CN 105675929B
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- Prior art keywords
- probe
- snap
- gauge
- substrate
- snap ring
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Abstract
A kind of probe card of the probe of compatible different size, comprising: substrate, interval is arranged the electric conductor for be electrically connected with extraneous test equipment on substrate, electric conductor different from one end setting solder joint on the outside of substrate；Snap ring, the hard contact for being fixed at the inside of the substrate, and being arranged on snap ring are electrically connected with the solder joint of substrate；Probe snap-gauge, it is movable to be arranged on snap ring, and the probe being fixedly installed on probe snap-gauge is electrically connected with electric conductor.The probe card of the probe of the compatible different size of the present invention is during carrying out the electric performance test of different size wafer, only need to change the probe snap-gauge with respective numbers and spacing, the test of each wafer can be respectively completed, it is not only easy to operate, and reduce the replacement of substrate, reduce production cost.
Description
Technical field
The present invention relates to semiconductor test technical field more particularly to a kind of probe cards of the probe of compatible different size.
Background technique
It is well known that probe card is used for wafer-level test, effect is to realize the signal transmission of test equipment and wafer.
That is, contacting by the probe being arranged in the probe card with the metal gasket on chip to be measured, cooperate test equipment and related software
Complete automatic test.It is apparent that the spacing needs of the probe match with the spacing of the metal gasket, and in the probe card
The quantity of probe also needs to be arranged according to metal gasket quantity.
But the number of probes and spacing of existing probe card are fixedly installed, for different product wafers to be tested
Need replacing different probe cards.On the other hand, existing product wafer is many kinds of, and there are different for different product wafers
Metal gasket quantity or different metal gasket spacing, carry out wafer testing procedure in then need to buy corresponding specific quantity and
The probe card of spacing, to meet its test request.It is apparent that the frequent replacement of probe card not only adds routine work amount, drop
Low man efficiency, and significantly increase company's production cost.
Seek a kind of structure to be simple and convenient to operate, the probe card of the probe of compatible different size has become this field skill
Art personnel's one of the technical problems that are urgent to solve.
Therefore in view of the problems of the existing technology, this case designer relies on the experience for being engaged in the industry many years, actively studies
Improvement, then there is a kind of probe card of the probe of compatible different size of the invention.
Summary of the invention
The present invention be directed in the prior art, the number of probes and spacing of traditional probe card are fixedly installed, for not
Same product wafer to be tested needs replacing different probe cards, not only adds routine work amount, reduces man efficiency, and
The defects of significantly increasing company's production cost provides a kind of probe card of the probe of compatible different size.
Purpose to realize the present invention, the present invention provide a kind of probe card of the probe of compatible different size, the compatibility
The probe card of the probe of different size, comprising: substrate, interval setting with extraneous test equipment for being electrically connected on the substrate
Solder joint is arranged different from one end on the outside of substrate in electric conductor, the electric conductor；Snap ring, the snap ring are fixed at the substrate
Inside, and the hard contact being arranged on the snap ring is electrically connected with the solder joint of the substrate；Probe snap-gauge, the probe snap-gauge
It is movable to be arranged on the snap ring, and the probe being fixedly installed on the probe snap-gauge is electrically connected with the electric conductor.
Optionally, the substrate is annularly arranged, and spaced electric conductor is arranged in spoke type on the substrate, described
Solder joint is arranged in electric conductor at the inner ring of the substrate.
Optionally, the probe snap-gauge from the side of wafer to be tested it is movable be arranged on the snap ring.
Optionally, the mode of the movable setting of the probe snap-gauge and the snap ring is by the probe snap-gauge using slotting
The mode for entering formula is fixed in the snap ring.
Optionally, the mode of the movable setting of the probe snap-gauge and the snap ring is that the probe snap-gauge is used side
The mode of edge buckle is fixed in the snap ring.
Optionally, the mode of the movable setting of the probe snap-gauge and the snap ring is by the probe snap-gauge using rotation
The fixed mode of button is arranged in the snap ring.
Optionally, weld pad of the quantity and spacing for the probe being fixedly installed on the probe snap-gauge all in accordance with wafer to be tested
Quantity and spacing setting.
Optionally, by replacing the movable probe snap-gauge with probe being arranged on the snap ring, realizing has not
With the electric test of the wafer to be tested of weld pad quantity and spacing.
In conclusion the probe card of the probe of the compatible different size of the present invention is in the electric property for carrying out different size wafer
In test process, it is only necessary to replace the probe snap-gauge with respective numbers and spacing, the test of each wafer can be respectively completed, not only
It is easy to operate, and reduce the replacement of substrate, reduce production cost.
Detailed description of the invention
Fig. 1 show the probe card configuration schematic diagram of the probe of the compatible different size of the present invention；
Fig. 2 show the probe card configuration schematic diagram of the probe of compatible different size.
Specific embodiment
By the present invention will be described in detail create technology contents, construction feature, reached purpose and efficacy, below in conjunction with reality
It applies example and attached drawing is cooperated to be described in detail.
It is well known that probe card is used for wafer-level test, effect is to realize the signal transmission of test equipment and wafer.
That is, contacting by the probe being arranged in the probe card with the metal gasket on chip to be measured, cooperate test equipment and related software
Complete automatic test.It is apparent that the spacing needs of the probe match with the spacing of the metal gasket, and in the probe card
The quantity of probe also needs to be arranged according to metal gasket quantity.
But the number of probes and spacing of existing probe card are fixedly installed, for different product wafers to be tested
Need replacing different probe cards.On the other hand, existing product wafer is many kinds of, and there are different for different product wafers
Metal gasket quantity or different metal gasket spacing, carry out wafer testing procedure in then need to buy respective specific quantity and
Away from probe card, to meet its test request.It is apparent that the frequent replacement of probe card not only adds routine work amount, reduce
Man efficiency, and significantly increase company's production cost.
Fig. 1, Fig. 2 are please referred to, Fig. 1 show the probe card configuration schematic diagram of the probe of the compatible different size of the present invention.Fig. 2
It show the probe card configuration schematic diagram of the probe of compatible different size.The probe card of the probe of the compatible different size
1, comprising: substrate 11, the electric conductor for being electrically connected with extraneous test equipment (not shown) is arranged in interval on the substrate 11
111, solder joint (not shown) is arranged in one end different from 11 outside of substrate of the electric conductor 111；Snap ring 12, the snap ring 12 are fixed
The solder joint of the hard contact 121 for being arranged in the inside of the substrate 11, and being arranged on the snap ring 12 and the substrate 11 is electrically connected
It connects；Probe snap-gauge 13, the probe snap-gauge 13 is movable to be arranged on the snap ring 12, and fixation is set on the probe snap-gauge 13
The probe 131 set is electrically connected with the electric conductor 111.
As those skilled in the art, it is readily appreciated that ground, the quantity for the probe 131 being fixedly installed on the probe snap-gauge 13
Weld pad quantity and spacing with spacing all in accordance with wafer to be tested (not shown) are arranged.The movable setting of probe snap-gauge 13 exists
On the snap ring 12, probe snap-gauge 13 adaptable therewith can be replaced according to the weld pad quantity and spacing of wafer to be tested,
To complete the electric test of wafer.It is apparent that in order to adapt to the test of the wafer of different size, it is only necessary to carry out the probe card
The replacement of 1 probe snap-gauge 13, it is not only easy to operate, but also reduce the replacement of substrate 11, eliminate artificial stickup probe
Expense reduces production cost.
In order to more intuitively disclose the technical solution of the present invention, the beneficial effect of the present invention is highlighted, now in conjunction with specific implementation
It is illustrated for mode.In a specific embodiment, the component structure of the probe card, quantity and position setting and connection
Mode etc. is only to enumerate, and is not construed as the limitation to technical solution of the present invention.
Please continue to refer to Fig. 1, Fig. 2, the probe card 1 of the probe of the compatible different size, comprising:
Substrate 11, the electric conductor for being electrically connected with extraneous test equipment (not shown) is arranged in interval on the substrate 11
111, solder joint (not shown) is arranged in one end different from 11 outside of substrate of the electric conductor 111；
More specifically, the substrate 11 is annularly arranged, spaced electric conductor 111 is in spoke type on the substrate 11
Solder joint is arranged in arrangement, the electric conductor 111 at the inner ring of the substrate 11.
Snap ring 12, the snap ring 12 are fixed at the inside of the substrate 11, and the metal being arranged on the snap ring 12
Contact 121 is electrically connected with the solder joint of the substrate 11；
Probe snap-gauge 13, the probe snap-gauge 13 is movable to be arranged on the snap ring 12, and on the probe snap-gauge 13
The probe 131 of fixed setting is electrically connected with the electric conductor 111.
It is highly preferred that the probe snap-gauge 13 from the side of wafer to be tested (not shown) it is movable be arranged in the card
On ring 12, that is, it can ensure that the stability that the probe 131 being arranged on probe snap-gauge 13 is had an acupuncture treatment.
As specific embodiment, the probe snap-gauge 13 can be used it is arbitrarily devised, by the probe snap-gauge 13 with
The snap ring 12 carries out effectively fixed and good contact.The mode of the movable setting of the probe snap-gauge 13 and the snap ring 12
The probe snap-gauge 13 is fixed in the snap ring 12 using plug-type mode including but not limited to, or uses side
The mode of edge buckle is fixed in the snap ring 12, or is arranged in the snap ring 12 in such a way that knob is fixed.
Without limitation, the metal gasket spacing such as on the first wafer (not shown) is 100 μm, and by 12 metal gasket groups
At a standard block；Metal gasket spacing on second wafer (not shown) is 120 μm, and forms a mark by 20 metal gaskets
Quasi- unit.According to existing probe card, then need to buy that number of probes is 12, probe spacing is 100 microns and probe respectively
Two independent probes cards that quantity is 20, probe spacing is 120 μm.When the probe of the probe using the compatible different size of the present invention
Card 1, then only need replacing the probe snap-gauge 13 with respective numbers and spacing, can be respectively completed first wafer and described
The test of second wafer, it is not only easy to operate, but also reduce the replacement of substrate 11, reduce production cost.
In conclusion the probe card of the probe of the compatible different size of the present invention is in the electric property for carrying out different size wafer
In test process, it is only necessary to replace the probe snap-gauge with respective numbers and spacing, the test of each wafer can be respectively completed, not only
It is easy to operate, and reduce the replacement of substrate, reduce production cost.
Those skilled in the art, can be to this hair it will be appreciated that without departing from the spirit or scope of the present invention
It is bright to carry out various modifications and modification.Thus, if any modification or modification fall into the protection of the appended claims and equivalent
When in range, it is believed that the present invention covers these modifications and variations.
Claims (7)
1. a kind of probe card of the probe of compatible different size, which is characterized in that the probe of the probe of the compatible different size
Card, comprising:
Substrate, interval is arranged the electric conductor for being electrically connected with extraneous test equipment on the substrate, the electric conductor different from
Solder joint is arranged in one end on the outside of substrate；
Snap ring, the snap ring are fixed at the inside of the substrate, and the hard contact being arranged on the snap ring and the base
The solder joint of plate is electrically connected；
Probe snap-gauge, the probe snap-gauge is movable to be arranged on the snap ring, and the spy being fixedly installed on the probe snap-gauge
Needle is electrically connected with the electric conductor, by replacing the movable probe snap-gauge with probe being arranged on the snap ring, is realized
The electric test of wafer to be tested with different weld pad quantity and spacing.
2. the probe card of the probe of compatible different size as described in claim 1, which is characterized in that the substrate is annularly set
It sets, spaced electric conductor is arranged in spoke type on the substrate, and the electric conductor is set at the inner ring of the substrate
Set solder joint.
3. the probe card of the probe of compatible different size as described in claim 1, which is characterized in that the probe snap-gauge from
The side of wafer to be tested is movable to be arranged on the snap ring.
4. the probe card of the probe of compatible different size as claimed in claim 3, which is characterized in that the probe snap-gauge and institute
The mode for stating the movable setting of snap ring is to be fixed at the probe snap-gauge in the snap ring using plug-type mode.
5. the probe card of the probe of compatible different size as claimed in claim 3, which is characterized in that the probe snap-gauge and institute
The mode for stating the movable setting of snap ring is that the probe snap-gauge is fixed at the snap ring by the way of edge buckle
In.
6. the probe card of the probe of compatible different size as claimed in claim 3, which is characterized in that the probe snap-gauge and institute
The mode for stating the movable setting of snap ring is that the probe snap-gauge is arranged in the snap ring in such a way that knob is fixed.
7. the probe card of the probe of the compatibility different size as described in claim 1~6 any claim, which is characterized in that
The quantity and spacing for the probe being fixedly installed on the probe snap-gauge are arranged all in accordance with the weld pad quantity and spacing of wafer to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107841.1A CN105675929B (en) | 2016-02-26 | 2016-02-26 | A kind of probe card of the probe of compatible different size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107841.1A CN105675929B (en) | 2016-02-26 | 2016-02-26 | A kind of probe card of the probe of compatible different size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105675929A CN105675929A (en) | 2016-06-15 |
| CN105675929B true CN105675929B (en) | 2019-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610107841.1A Active CN105675929B (en) | 2016-02-26 | 2016-02-26 | A kind of probe card of the probe of compatible different size |
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| Country | Link |
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| CN (1) | CN105675929B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535519B (en) * | 2018-04-23 | 2020-11-24 | 上海华虹宏力半导体制造有限公司 | Semiconductor chip test probe card, test system and test method |
| CN108982931A (en) * | 2018-09-21 | 2018-12-11 | 京东方科技集团股份有限公司 | Probe unit, probe jig |
| CN110523644A (en) * | 2019-08-13 | 2019-12-03 | 江苏伊施德创新科技有限公司 | Detection device for electronic component |
| CN113640558B (en) * | 2021-08-11 | 2022-06-14 | 山东大学 | Replaceable probe set and probe card |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1779468A (en) * | 2004-11-19 | 2006-05-31 | 上海华虹Nec电子有限公司 | Wire-connected circular probe chunck basilar palte |
| CN1779467A (en) * | 2004-11-19 | 2006-05-31 | 上海华虹Nec电子有限公司 | Wire-connected circular probe chunck basilar plate |
| CN201392350Y (en) * | 2009-03-18 | 2010-01-27 | 上海华岭集成电路技术有限责任公司 | Probe card for anti-interference asynchronous trimming wafer test |
| CN201845028U (en) * | 2010-10-16 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Probe card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002296298A (en) * | 2001-04-02 | 2002-10-09 | Sony Corp | Probe card |
-
2016
- 2016-02-26 CN CN201610107841.1A patent/CN105675929B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1779468A (en) * | 2004-11-19 | 2006-05-31 | 上海华虹Nec电子有限公司 | Wire-connected circular probe chunck basilar palte |
| CN1779467A (en) * | 2004-11-19 | 2006-05-31 | 上海华虹Nec电子有限公司 | Wire-connected circular probe chunck basilar plate |
| CN201392350Y (en) * | 2009-03-18 | 2010-01-27 | 上海华岭集成电路技术有限责任公司 | Probe card for anti-interference asynchronous trimming wafer test |
| CN201845028U (en) * | 2010-10-16 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Probe card |
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| Publication number | Publication date |
|---|---|
| CN105675929A (en) | 2016-06-15 |
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