CN209182374U - A kind of wafer test probe - Google Patents
A kind of wafer test probe Download PDFInfo
- Publication number
- CN209182374U CN209182374U CN201822015288.6U CN201822015288U CN209182374U CN 209182374 U CN209182374 U CN 209182374U CN 201822015288 U CN201822015288 U CN 201822015288U CN 209182374 U CN209182374 U CN 209182374U
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- probe
- wafer
- test probe
- test
- tests
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Abstract
It is cambered surface the utility model discloses one end that a kind of wafer test probe includes: the test probe, the other end is cerioid；Wafer carries out communication connection by the test probe and printed circuit board；The curved end of the test probe is connected with the wafer；The cerioid end of the test probe is connected with the printed circuit board.
Description
Technical field
The utility model relates to chip testing fields more particularly to a kind of wafer to test probe.
Background technique
During chip production, need to guarantee that the various functions of chip meet design requirement by means of testing.And core
Built-in testing can be divided into two class testings again, and the first kind is the test before die package, and the second class is the test behind die package.This its
In, the first class testing needs to be tested using probe card (probe card), and the second class is needed using support plate
(loadboard) it is tested.
The Vertrical probe clasp of the current comparative maturity of Fig. 1 tests structure, when being tested using probe card described above, print
It needs to be interconnected using probe between circuit board processed and wafer, which is the main bottleneck currently tested, wherein to wafer
Degree of injury, contact resistance and the current-carrying capability of protrusion are to measure the main indicator of probe quality.And probe when due to test
The increase of frequency of exposure, causes probe to speckle with foul, it is also necessary to which timing is cleared up.
Based on the technical problem present on, this application provides the technical solutions for solving the above technical problem.
Summary of the invention
The purpose of the utility model is to provide a kind of wafers to test probe, and the one end for testing probe is radially arranged
It is connected as cambered surface, solves the problems, such as to damage wafer protrusion in various degree in the prior art.
The technical scheme that the utility model is provided is as follows:
A kind of wafer test probe, comprising: one end of the test probe is cambered surface, and the other end is cerioid；Wafer is logical
It crosses the test probe and printed circuit board carries out communication connection；The curved end of the test probe is contacted with the wafer
Connection；The cerioid end of the test probe is connected with the printed circuit board.
Specifically, one end in the application probe is communicated with substrate, the other end is attached with wafer to be tested, is led to
The electric loop in substrate setting is crossed, the connecting test between tester table realizes the test for wafer；In this application will
It is set to cambered surface connection, solves the problems, such as to damage wafer protrusion in various degree in the prior art.
Preferably, comprising: it is in imploded arcs that one end of the test probe, which is cambered surface setting, and along the diameter of the test probe
To.
Specifically, being cambered surface setting by the one end for testing probe, and it is concave arc, on the one hand can reduces falling into for dust,
Simultaneously carry out hygienic cleaning maintenance it is more convenient, there is no the dead angles that can not be cleared up；On the other hand, it is arranged to concave arc, not
Change the length of probe, technics comparing is simple.
Preferably, comprising: protrusion is set in the wafer, and matches splice grafting with the imploded arcs of one end of the test probe
Touching, and carry out communication connection.
Preferably, the diameter of the imploded arcs of one end of the test probe is greater than the diameter of the protrusion of wafer setting.
Specifically, in order to realize carried out between wafer and probe it is good contact, the diameter of its concave arc is arranged to greatly
In the diameter of wafer protrusion, the Position Design that probe is contacted with wafer is the semicircle of indent；It on the one hand can in contact projection
To connect well, the good electrical interconnection of the two is realized, while will not damage the protrusion；Size can be according to the ruler of protrusion
It is very little to be adjusted, here with no restrictions；On the other hand facilitate test.
Preferably, comprising: the cerioid of the other end of the test probe forms centrum, and the tap web of centrum is described in
Test the radial direction of probe.
Preferably, comprising: set on the tap web and the printed circuit board of the centrum of the other end of the test probe
Calibrating terminal is set to connect one to one.
Specifically, being provided with multiple testing weld pads on substrate, centrum and the pad of the other end of probe setting will be tested
Carry out point-to-point connection.
A kind of wafer provided by the utility model tests probe, has the beneficial effect that:
The utility model is improved the structure of probe when being tested using probe card, and setting one end is indent
Just, solve in the prior art is to measure probe quality to the degree of injury, contact resistance and current-carrying capability of wafer protrusion to arc
The problem of main indicator.
The utility model solves in the prior art the increase of probe frequency of exposure when due to test, causes probe to speckle with dirty
Object, it is also necessary to the problem of timing is cleared up.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to above-mentioned characteristic, the skill of probe card
Art feature, advantage and its implementation are further described.
Fig. 1 is the structural schematic diagram for the probe card that the prior art is used to test wafer；
Fig. 2 is the structural schematic diagram of the utility model test probe one embodiment；
Fig. 3 is the global schematic diagram of the utility model test probe；
Fig. 4 is the utility model test probe one end globoidal structure schematic diagram；
Fig. 5 is the utility model test probe other end cerioid structural schematic diagram.
Drawing reference numeral explanation:
1. printed circuit board, 2. substrates, 3. connectors, 4. probes, 5. wafers, 6. protrusions.
Specific embodiment
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, attached drawing will be compareed below
Illustrate specific embodiment of the present utility model.It should be evident that the accompanying drawings in the following description is only the one of the utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings, and obtains other embodiments.
To make simplified form, part relevant to the utility model is only schematically shown in each figure, they are simultaneously
Its practical structures as product is not represented.
This application provides a kind of wafers to test probe as shown in Figure 2, comprising: and one end of the test probe is cambered surface,
The other end is cerioid；Wafer carries out communication connection by the test probe and printed circuit board；The arc of the test probe
Face end is connected with the wafer；The cerioid end of the test probe and the printed circuit board carry out contact company
It connects.
Specifically, with reference to shown in Fig. 2-5；Probe in embodiments herein is Vertrical probe, one end of probe with
Substrate (that is to say printing board PCB) is communicated, and the other end is attached with wafer to be tested, also that is, passing through this
The probe of application communicates wafer and substrate, by the electric loop being arranged in substrate, connects and surveys between tester table
The test for wafer is realized in examination；In the prior art when contact due to probe with wafer, due to the technology of probe end face design
Problem causes the different degrees of destruction for the protrusion in wafer, therefore is set in the application and connects for cambered surface,
It solves the problems, such as to damage wafer protrusion in various degree in the prior art.
Preferably, comprising: it is in imploded arcs that one end of the test probe, which is cambered surface setting, and along the diameter of the test probe
To.
Specifically, with reference to shown in Fig. 3-4；It is cambered surface setting by the one end for testing probe, and is concave arc, on the one hand can subtracts
Few dust is fallen into, while carrying out that hygienic cleaning maintenance is more convenient, and there is no the dead angles that can not be cleared up；On the other hand, it is arranged
At concave arc, there is no the length for changing probe, technics comparing is simple.
Preferably, comprising: protrusion is set in the wafer, and matches splice grafting with the imploded arcs of one end of the test probe
Touching, and carry out communication connection.
Preferably, the diameter of the imploded arcs of one end of the test probe is greater than the diameter of the protrusion of wafer setting.
Specifically, with reference to shown in Fig. 2-5；In order to realize carried out between wafer and probe it is good contact, by its concave arc
Diameter be set greater than the diameter of wafer protrusion, the Position Design that probe is contacted with wafer is the semicircle of indent；On the one hand
It can be very good to connect in contact projection, realize the good electrical interconnection of the two, while the protrusion will not be damaged；Size
It can be adjusted according to the size of protrusion, here with no restrictions；On the other hand facilitate test.
Preferably, comprising: the cerioid of the other end of the test probe forms centrum, and the tap web of centrum is described in
Test the radial direction of probe.
Preferably, comprising: set on the tap web and the printed circuit board of the centrum of the other end of the test probe
Calibrating terminal is set to connect one to one.
Specifically, being provided with multiple testing weld pads on substrate, centrum and the pad of the other end of probe setting will be tested
Carry out point-to-point connection.
It should be noted that above-described embodiment can be freely combined as needed.The above is only the utility model
Preferred embodiment, it is noted that for those skilled in the art, do not departing from the utility model principle
Under the premise of, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of wafer tests probe characterized by comprising one end of the test probe is cambered surface, and the other end is polygonal
Shape；Wafer carries out communication connection by the test probe and printed circuit board；The curved end of the test probe and the crystalline substance
Member is connected；The cerioid end of the test probe is connected with the printed circuit board.
2. wafer as described in claim 1 tests probe characterized by comprising one end of the test probe is cambered surface
Setting is in imploded arcs, and along the radial direction of the test probe.
3. wafer as claimed in claim 2 tests probe characterized by comprising in the wafer, protrusion is set, and with institute
The imploded arcs cooperation contact of one end of test probe is stated, and carries out communication connection.
4. wafer as claimed in claim 3 tests probe, which is characterized in that the imploded arcs of one end of the test probe it is straight
Diameter is greater than the diameter of the protrusion of wafer setting.
5. the wafer as described in claim 1-4 is any tests probe characterized by comprising described to test the another of probe
The cerioid at end forms centrum, and the tap web of centrum is along the radial direction of the test probe.
6. wafer as claimed in claim 5 tests probe characterized by comprising the vertebra of the other end of the test probe
The tap web of body connects one to one with setting calibrating terminal on the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822015288.6U CN209182374U (en) | 2018-12-03 | 2018-12-03 | A kind of wafer test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822015288.6U CN209182374U (en) | 2018-12-03 | 2018-12-03 | A kind of wafer test probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209182374U true CN209182374U (en) | 2019-07-30 |
Family
ID=67375306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822015288.6U Active CN209182374U (en) | 2018-12-03 | 2018-12-03 | A kind of wafer test probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209182374U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514881A (en) * | 2019-09-09 | 2019-11-29 | 上海泽丰半导体科技有限公司 | A kind of novel probe platform and PCB test method |
| CN115308456A (en) * | 2022-09-29 | 2022-11-08 | 深圳市道格特科技有限公司 | Vertical probe and probe card |
-
2018
- 2018-12-03 CN CN201822015288.6U patent/CN209182374U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514881A (en) * | 2019-09-09 | 2019-11-29 | 上海泽丰半导体科技有限公司 | A kind of novel probe platform and PCB test method |
| CN115308456A (en) * | 2022-09-29 | 2022-11-08 | 深圳市道格特科技有限公司 | Vertical probe and probe card |
| CN115308456B (en) * | 2022-09-29 | 2023-03-10 | 深圳市道格特科技有限公司 | Vertical probe and probe card |
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