TWM558360U - Image testing device of semiconductor - Google Patents

Abstract

The present utility model relates to an image testing device of a semiconductor, including a test head, a prober and at least an image capture card. The test head comprises a load board and a plurality of test cards inserted on the load board. The prober comprises an interface board, a probe card and a plurality of probes. Wherein, at least an image capture card is inserted on at least a connecting board, which includes a first end and a second end. The first end is electrically connected to the load board, and the second end is electrically connected to the interface board. As such, the image capture card can be replaced with ease, and the frequency bandwidth can be broadened while signal being transmitted as well. Moreover, the present utility model is provided with flexible system disposition, matching different number of sites in device under test to obtain the best test efficiency.

Description

Semiconductor component image test device

The present invention relates to a semiconductor component image testing device, and more particularly to a semiconductor component image testing device suitable for wafer testing.

In general, the semiconductor component image testing device includes a test head, a needle measuring machine, and an image capture card for obtaining sensing information and reaction results obtained after the semiconductor component is subjected to illumination test. In the prior art, the image capture card is usually inserted into the test head along with its circuit board like other test cards to form an image capture module. However, if there is an image transmission problem or an image capture error, the test head must be opened to investigate the problem from the inside, so it takes time and effort to disassemble and cause the convenience to be low. In addition, if an abnormality occurs in the image capture card, the image capture card is embedded and soldered on the circuit board, so it needs to be replaced together with the circuit board, so that the maintenance cost is increased, and unnecessary waste. Furthermore, the conventional technology has a large size of the test head, so there are institutional and space limitations. Under this framework, the user will not be able to select a specific light source supply device in accordance with the requirements of the product, thereby reducing the system. flexibility.

Because of this, the author is based on the spirit of active creation, thinking about a semiconductor component image testing device that can solve the above problems, and finally completing the creation after several research experiments.

The main purpose of this creation is to provide a semiconductor component image testing device. By means of an external bridge structure, the image capture card can be connected by means of an adapter board, which not only maintains high-speed image transmission and decoding during testing. And calculation, and can flexibly allocate the number of image capture modules for different products, and at the same time have the compatibility of different light source supply devices, effectively reducing the maintenance cost of the machine and the assembly and disassembly time.

In order to achieve the above object, the first type of semiconductor component image testing device of the present invention comprises a test head, a needle measuring machine, at least one image capturing card and at least one adapter plate. The test head includes a test carrier and a plurality of insertions. The test card provided on the test carrier includes a test panel, a probe card electrically connected to the test panel, and a plurality of probes.

The at least one image capture card is inserted into the at least one adapter plate, and the at least one adapter plate includes a first end portion and a second end portion, and the first end portion is electrically connected to the test carrier board. The second end is electrically connected to the test interface panel, which effectively improves the image capture card replacement mode and improves the test bandwidth during signal transmission.

In addition, the external bridge structure of the present invention is not required to be set by the adapter board, or can be realized only by the image capture card. Therefore, the second type of semiconductor component image test device of the present invention includes a test head and a needle. The test head includes at least one test carrier and a plurality of test cards inserted in the test carrier. The tester includes a test panel and a probe card electrically connected to the test panel. Multiple probes.

The at least one image capture card includes a first end portion and a second end portion. The first end portion is electrically connected to the test carrier board, and the second end portion is electrically connected to the test interface panel, thereby effectively improving the image capture card. Change the way and increase the test bandwidth when the signal is transmitted.

The first end portion may be cabled to the test carrier or may be directly inserted into the test carrier. In contrast, the second end portion may be connected to the test panel by a cable or directly inserted into the test panel. Thereby, different types of electrical connection relationships are formed through the first end portion and the second end portion to realize a plurality of combined external connection bridge structures.

Furthermore, the semiconductor device image testing device of the third type of the present invention comprises a test head, a needle measuring machine, at least one image capturing card and at least one adapter plate. The test head includes a test carrier and a plurality of insertions The test card of the test carrier includes a probe card and a plurality of probes.

The at least one image capture card is inserted into the at least one adapter plate, and the at least one adapter plate includes a first end portion and a second end portion, and the first end portion is electrically connected to the test carrier board. The second end is electrically connected to the probe card, which effectively improves the image capture card replacement mode and improves the test bandwidth during signal transmission.

In addition, the external bridge structure of the present invention is not required to be set by the adapter board, or can be realized only by the image capture card. Therefore, the fourth type of semiconductor component image test device of the present invention includes a test head and a needle. The test machine and the at least one image capture card comprise a test carrier and a plurality of test cards inserted in the test carrier. The needle tester comprises a probe card and a plurality of probes.

The at least one image capture card includes a first end portion and a second end portion. The first end portion is electrically connected to the test carrier board, and the second end portion is electrically connected to the probe card to effectively improve image capture. The card is replaced and the test bandwidth is increased when the signal is transmitted.

The first end portion may be cabled to the test carrier or may be directly inserted into the test carrier. Alternatively, the second end portion may be cabled to the probe card or directly inserted into the probe card. Thereby, different types of electrical connection relationships are formed through the first end portion and the second end portion to realize a plurality of combined external connection bridge structures.

With the above design, the creation has an image-removing module with excellent disassembly and assembly, which improves the situation in which the entire circuit board in the test head needs to be replaced when the image capturing component fails in the prior art, and has a flexible system. The configuration can be adjusted according to the different quantity to be tested of the product. In addition, the image capture module of the present invention is a single test end architecture, and the system maintenance only needs to be replaced for a single test end, and the maintenance cost is relatively low compared to the conventional module used for the dual test end.

In the first type or the second type of semiconductor element image testing device, the test interface panel can electrically connect the probe card through the spring pin tower. Therefore, when the signal output is not in the same plane, the test panel and the probe card are connected by the pin header structure of the spring pin tower due to the difficulty of implanting the needle.

The semiconductor component image testing device may further include a light source supply device, wherein the light source supply device may be an LED light source supply device or a tube diameter light source supply device. Therefore, according to different product requirements, the creation of the LED light source supply device or the tube diameter light source supply device can be selected to reduce the time course of the change.

The light source supply device may be disposed on the test head; or the light source supply device may be disposed on the needle tester. Thereby, according to the characteristic requirements of different light source supply devices, the grouping position can be selectively changed to improve the test quality.

The above image capture card can be communicated using the Mobile Industry Processor Interface (MIPI). In this way, the standard interface provided by the mobile industry processor interface includes high performance, low power consumption and low electromagnetic interference, which will provide a large amount of image processing power and transmission efficiency.

In the first type to the fourth type of semiconductor element image test apparatus, the image capture card may have a logic processing chip and a demodulation circuit.

In the semiconductor device image testing device of the first type and the second type, the image capturing card may have a logic processing chip, and the test interface panel may have a demodulation circuit; or the image capturing card may have a The demodulation circuit, the test interface panel can have a logic processing chip.

In the semiconductor device image testing apparatus of the third type and the fourth type, the image capturing card may have a logic processing chip, and the probe card may have a demodulating circuit. Alternatively, the image capture card can have a demodulation circuit and the probe card can have a logic processing chip.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of the patent application of the present invention. Other purposes and advantages of this creation will be explained in the following description and illustration.

Please refer to FIG. 1 and FIG. 2 , which are respectively a structural diagram and a perspective view of a semiconductor component image testing device according to a first embodiment of the present invention. The figure shows a semiconductor component image testing device 1a comprising a test head 2, a needle measuring machine 3, a plurality of image capturing cards 4, and a plurality of adapter plates 41. The test head 2 includes a test carrier 21 and a plurality of test cards 221 to 228 inserted in the test carrier 21, and the test cards 221 to 228 may include a PE card and a device power supply card. Various types of interface cards, such as DPS card) and sequence test card (SEQ card), provide the necessary test procedures during the detection process.

On the other hand, the needle measuring machine 3 includes a test panel 31, a probe card 32 electrically connected to the test panel 31, and a plurality of probes 33 on the probe card 32, and a wafer 7 can be used. It is placed on one of the stages 34 in the needle measuring machine 3 to facilitate the testing of the wafer 7. In the present embodiment, the test interface panel 31 is electrically connected to the probe card 32 through a spring pin tower 5 (Pogo Tower), whereby when the signal output is not in the same plane, the implementation is more difficult due to the difficulty of implanting the needle. The test panel 31 and the probe card 32 are coupled by the pin header structure of the spring pin tower 5.

In addition, the image capture card 4 used in this creation is a transmission interface card of the Mobile Industry Processor Interface (MIPI), which has high performance, low power consumption and low electromagnetic interference. The image processing information and the transmission efficiency of the image data can be transmitted to the arithmetic processing unit via the optical fiber cable or wireless transmission for subsequent processing and analysis.

In this embodiment, the plurality of adapter plates 41 are disposed around the test carrier 21 and each of the adapter plates 41 is provided with a plurality of image capture cards 4 to construct a serial transfer structure. As shown in the figure, each of the adapter plates 41 includes a first end portion 411 and a second end portion 412. The first end portion 411 is directly inserted into the test carrier 21, and the second end portion 412 is directly inserted. It is disposed on the test interface panel 31, and the image capture card 4 is connected by the adapter board 41 by an external bridge structure, thereby effectively improving the image capture card 4 replacement manner, and the image can be flexibly deployed. Take the number of modules used, and at the same time have the compatibility of different light source supply devices, effectively reducing the maintenance cost of the machine and the assembly and disassembly time. In addition, through the direct bonding structure of the embodiment, the length of the trace between the test carrier 21 and the test panel 31 can be effectively shortened, and the test bandwidth during signal transmission can be improved.

Furthermore, the semiconductor element image testing device 1a of the present embodiment is provided with a light source supply device 6a. The light source supply device 6a is a tube diameter light source supply device and is disposed on the test head 2. The light source supply device 6a controls the start timing by a light source controller 61a, and focuses the light source on the wafer 7 through a long cylindrical hollow tube diameter 62a for testing the wafer 7. The actual receiving range of the image sensor for comprehensive image detection.

With the above test architecture, the author can construct high-performance test bandwidth and improve the problem of poor logic bandwidth and signal bandwidth in the past. The logic I/O bandwidth can be greatly improved; image test signal bandwidth Correspondingly, the length of the cable has been shortened. In addition, the modular image capture card 4 can be adjusted according to different test quantities of the product, and an appropriate number of image capture cards 4 are selected to improve the detection efficiency and make the production line scheduling more flexible.

Next, please refer to FIG. 3 , which is a structural diagram of a semiconductor component image testing device according to a second embodiment of the present invention. As shown in the drawing, a semiconductor component image testing device 1b is shown, which includes a test head 2, a needle measuring machine 3', a plurality of image capturing cards 4, and a plurality of adapter plates 41. The test head 2 is the same as the first embodiment, and includes a test carrier 21 and a plurality of test cards 221 to 228 inserted in the test carrier 21, and the test cards 221 to 228 may include a foot interface circuit card ( Various types of interface cards, such as PE card), device power supply card (DPS card), and sequence test card (SEQ card), provide the necessary test procedures during the detection process.

On the other hand, the needle measuring machine 3' includes a probe card 32 and a plurality of probes 33 on the probe card 32, and a wafer 7 can be placed on one of the stages 34 of the needle measuring machine 3'. On, it is convenient to test the wafer 7. In this embodiment, the needle measuring machine 3' discards the structure of the test medium panel 31 and the spring pin tower 5, and the signal is directly transmitted from the test carrier 21 to the probe card 32, so that the detection structure is simpler and simpler. It effectively reduces the distortion rate during signal transmission and improves the test bandwidth during signal transmission.

In addition, the image capture card 4 used in this creation is a transmission interface card of the Mobile Industry Processor Interface (MIPI), which has high performance, low power consumption and low electromagnetic interference. The image processing information and the transmission efficiency of the image data can be transmitted to the arithmetic processing unit via the optical fiber cable or wireless transmission for subsequent processing and analysis.

In this embodiment, the plurality of adapter plates 41 are disposed around the test carrier 21 and each of the adapter plates 41 is provided with a plurality of image capture cards 4 to construct a serial transfer structure. As shown in the figure, each of the adapter plates 41 includes a first end portion 411 and a second end portion 412. The first end portion 411 is directly inserted into the test carrier 21, and the second end portion 412 is different from the second end portion 412. The first embodiment is directly inserted into the probe card 32. Through the direct bonding structure, the length of the trace between the test carrier 21 and the probe card 32 can be effectively shortened, and the test bandwidth during signal transmission can be improved.

Furthermore, the semiconductor element image testing device 1b of the present embodiment is provided with a light source supply device 6a. The light source supply device 6a is a tube diameter light source supply device and is disposed on the test head 2. The light source supply device 6a controls the start timing by a light source controller 61a, and focuses the light source on the wafer 7 through a long cylindrical hollow tube diameter 62a for testing the wafer 7. The actual receiving range of the image sensor for comprehensive image detection.

Please refer to FIG. 4 and FIG. 5 , which are respectively structural diagrams of the semiconductor component image testing apparatus of the third embodiment and the fourth embodiment. As shown in the figure, the basic structures of the third embodiment and the fourth embodiment are the same as those of the second embodiment, and are not described herein again. The only difference is that the first of the adapter boards 41 of the third embodiment The end portion 411 is connected to the test carrier 21 by a cable, and the second end portion 412 of the adapter plate 41 is connected to the probe card 32 by a cable; the first end portion 411 of the adapter plate 41 of the fourth embodiment is The cable is connected to the test carrier 21, and the second end 412 of the adapter plate 41 is directly inserted into the probe card 32. With the above design, although the conduction mode of the cable as a trace will slightly affect the test bandwidth during signal transmission, it has the characteristics of low cost and high adaptability, and can provide between the test head 2 and the needle measuring machine 3'. The clearance fits to assist in providing fine-tuning space.

In addition, please refer to FIG. 6, which is a structural diagram of a semiconductor component image testing device according to a fifth embodiment of the present invention. The light source supply device 6e of the present embodiment is modified and modified by taking the structure of the first embodiment as an example. Therefore, the mode is not limited to the first embodiment, and may be implemented in the second embodiment to the fourth embodiment. In the example. As shown in the figure, the main structure of the semiconductor component image testing device 1e is the same as that of the first embodiment, except that the light source supply device 6e of the present embodiment is an LED light source supply device and is disposed in the needle measuring machine 3. The test panel 31 is accommodated in a space constructed by the adapter plate 41. The light source supply device 6e controls the start timing by a light source controller 61e to directly focus the light source onto the wafer 7. For testing the actual receiving range of the image sensor in the wafer 7, for comprehensive image detection. Therefore, according to different product requirements, the LED light source supply device or the pipe diameter light source supply device can be selected to reduce the time course of the change, and the group can be selectively changed according to the characteristics of different light source supply devices. Set the location to improve test quality.

Please refer to FIG. 7A and FIG. 7B , which are respectively a first internal circuit structure configuration diagram and a second internal circuit structure configuration diagram of the semiconductor component image testing device according to the first embodiment. As shown in FIG. 7A, in the configuration of the first embodiment, the first internal circuit configuration mode is such that a logic processing chip 4a and a demodulation circuit 4b are disposed in the image capturing card 4, which is A conventional method of image capture technology, the logic processing chip 4a uses Field-Programmable Gate Array (FPGA) technology, which has a reprogrammable chip to help establish image analysis processing. System interface. In addition, the demodulation circuit 4b employs a physical serial data communication layer (D-PHY), which includes a plurality of clock channels for satisfying the bandwidth requirement of high-resolution image transmission. However, in order to reserve the future bandwidth expandability, as shown in FIG. 7B, in the second internal circuit configuration, the demodulation circuit 4b located inside the image capture card 4 can also be moved forward to the test interface panel. 31, the logic processing chip 40a is disposed in the image capture card 40, and the demodulation circuit 310b is disposed in the test interface panel 310. With the configuration manner, the line space reserved by the image capture card 40 can be Ensure that there is enough bandwidth for image analysis and transmission in the future to maintain sufficient overall performance.

For the same reason, please refer to FIG. 8A and FIG. 8B , which are respectively a first internal circuit structure configuration diagram and a second internal circuit structure configuration diagram of the semiconductor component image testing device according to the second embodiment. As shown in FIG. 8A, in the configuration of the second embodiment, the first internal circuit configuration mode is such that a logic processing chip 4a and a demodulation circuit 4b are disposed in the image capturing card 4, which is A conventional method of image capture technology, the logic processing chip 4a uses Field-Programmable Gate Array (FPGA) technology, which has a reprogrammable chip to help establish image analysis processing. System interface. In addition, the demodulation circuit 4b employs a physical serial data communication layer (D-PHY), which includes a plurality of clock channels for satisfying the bandwidth requirement of high-resolution image transmission. However, in order to reserve the future bandwidth expandability, as shown in FIG. 8B, in the second internal circuit configuration, the demodulation circuit 4b located inside the image capture card 4 can also be moved forward to the test interface panel. 31, the logic processing chip 40a is disposed in the image capturing card 40, and the demodulation circuit 320b is disposed in the probe card 320. By the configuration manner, the line space reserved by the image capturing card 40 can be Ensure that there is enough bandwidth for image analysis and transmission in the future to maintain sufficient overall performance.

Please refer to FIG. 9 , which is a structural diagram of a semiconductor component image testing device according to a sixth embodiment of the present invention. The figure shows a semiconductor component image testing device 1f, the basic structure of which is the same as that of the first embodiment, except that the image capturing card 4 and the adapter plate 41 of the first embodiment are integrated into a single embodiment. The image capture card 8 of the type has a first end portion 81 and a second end portion 82. The first end portion 81 is directly inserted into the test carrier 21, and the second end portion 82 is directly inserted. It is disposed on the test interface panel 31. Through the above configuration, an image signal with a large transmission bandwidth is required, and the image signal can be directly transmitted to the image capture card 8 through a short path, and the image processing speed can be greatly improved, and the rest of the image processing speed can be greatly improved. The logical O/I test signal occupying a small transmission bandwidth can be transmitted to the test head 2 via the image capture card 8 for subsequent test procedures. Therefore, the embodiment can reduce the load of transmitting the test signal and provide a better test. The bandwidth is actually another configuration choice of the semiconductor element image test device 1f.

Similarly, please refer to FIG. 10 , which is a structural diagram of the semiconductor component image testing device according to the seventh embodiment of the present invention. The figure shows a semiconductor component image testing device 1g, the basic structure of which is the same as that of the second embodiment. In the embodiment, the needle measuring machine 3' discards the structure of the test panel 31 and the spring pin tower 5, and the signal It will be directly transmitted from the test carrier 21 to the probe card 32, which makes the detection architecture simpler and simpler, effectively reduces the distortion rate during signal transmission, and improves the test bandwidth during signal transmission. In addition, the difference is that the image capture card 4 and the adapter plate 41 of the second embodiment are integrated into a single image capture card 8 , which also has a first end portion 81 and a The second end portion 82 has a first end portion 81 that is directly inserted into the test carrier 21 and a second end portion 82 that is directly inserted into the probe card 32. Through the above configuration, the image signal with a larger transmission bandwidth needs to be directly transmitted to the image capture card 8 through a shorter path, and the image data is processed, and the rest occupy the logical O/I with a small transmission bandwidth. The test signal can be transmitted to the test head 2 via the image capture card 8 for subsequent test procedures. Therefore, the embodiment can reduce the load of transmitting the test signal and provide a better test bandwidth, which is a semiconductor component image test device. Another configuration option.

For the same reason, please refer to FIG. 11 and FIG. 12 , which are structural diagrams of the semiconductor component image testing device of the eighth embodiment and the ninth embodiment. A semiconductor component image testing device 1h and 1i are respectively shown in the figure, and the basic structures thereof are the same as those of the third embodiment and the fourth embodiment, respectively, except that in the eighth embodiment, the image of the third embodiment is used. The capture card 4 and the adapter plate 41 are integrated into a single type of image capture card 8, which also has a first end portion 81 and a second end portion 82. The first end portion 81 is connected by a cable connection test. The second end portion 82 is connected to the probe card 32 by a cable. In the ninth embodiment, the image capture card 4 and the adapter plate 41 of the fourth embodiment are integrated into a single image capture mode. The card 8 also has a first end portion 81 and a second end portion 82. The first end portion 81 is connected to the test carrier 21 by a cable, and the second end portion 82 is directly inserted into the probe card 32. . Through the above two configuration modes, the image signal with a larger transmission bandwidth needs to be directly transmitted to the image capturing card 8 through a shorter path to process the image data, and the rest occupy the logic O with a small transmission bandwidth. The /I test signal can be transmitted to the test head 2 via the image capture card 8 for subsequent test procedures. Therefore, the embodiment can reduce the load of transmitting the test signal, and the image processing speed can be greatly improved, and at the same time, the specification is better. The test bandwidth is combined with the required clearance between the test head 2 and the needle measuring machine 3', and the space for fine adjustment is assisted, which is another configuration choice of the semiconductor component image testing device 1h, 1i.

In addition, please refer to FIG. 13 , which is a structural diagram of a semiconductor component image testing device according to a tenth embodiment of the present invention. The light source supply device 6e of the present embodiment is modified and modified by taking the structure of the sixth embodiment as an example. Therefore, the mode is not limited to the sixth embodiment, and may be implemented in the seventh embodiment to the ninth embodiment. In the example. As shown in the figure, the main structure of the semiconductor component image testing device 1j is the same as that of the first embodiment, except that the light source supply device 6e of the present embodiment is an LED light source supply device and is disposed on the needle measuring machine 3. The test panel 31 is placed in a space constructed by the image capture card 8. The light source supply device 6e controls the start timing by a light source controller 61e to directly focus the light source to the wafer 7. In order to test the actual receiving range of the image sensor in the wafer 7, a comprehensive image inspection is performed. Therefore, according to different product requirements, the LED light source supply device or the pipe diameter light source supply device can be selected to reduce the time course of the change, and the group can be selectively changed according to the characteristics of different light source supply devices. Set the location to improve test quality.

Please refer to FIG. 14A, FIG. 14B and FIG. 14C, which are respectively a configuration diagram of the first, second and third internal circuit structures of the semiconductor component image testing device according to the sixth embodiment. As shown in FIG. 14A, in the configuration of the sixth embodiment, the first internal circuit configuration mode is such that a logic processing chip 8a and a demodulation circuit 8b are disposed in the image capturing card 8, which is A conventional method of image capture technology, the logic processing chip 8a uses Field-Programmable Gate Array (FPGA) technology, which has a reprogrammable chip to help establish image analysis processing. System interface. In addition, the demodulation circuit 8b employs a physical serial data communication layer (D-PHY), which includes a plurality of clock channels for satisfying the bandwidth requirement of high-resolution image transmission.

However, in order to reserve the future bandwidth expandability, as shown in FIG. 14B, in the second internal circuit configuration, the demodulation circuit 8b located inside the image capture card 8 can also be advanced to the test interface panel. 31, the logic processing chip 80a is disposed in the image capture card 80, and the demodulation circuit 310b is disposed in the test interface panel 310; similarly, as shown in FIG. 14C, in the third internal circuit configuration configuration, The logic processing chip 8a located inside the image capturing card 8 can be forwarded to the test interface panel 31, so that the demodulation circuit 800b is disposed in the image capturing card 800, and the logic processing chip 800a is disposed on the test interface panel. 3100. With the configuration, the line space reserved by the image capture card 80, 800 can ensure sufficient bandwidth for image parsing and transmission in the future, and maintain sufficient overall performance.

Similarly, referring to FIG. 15A, FIG. 15B and FIG. 15C, the first, second and third internal circuit configuration diagrams of the semiconductor component image testing device of the sixth embodiment of the present invention are shown. As shown in FIG. 15A, in the configuration of the seventh embodiment, the first internal circuit configuration mode is such that a logic processing chip 8a and a demodulation circuit 8b are disposed in the image capturing card 8, which is A conventional method of image capture technology, the logic processing chip 8a uses Field-Programmable Gate Array (FPGA) technology, which has a reprogrammable chip to help establish image analysis processing. System interface. In addition, the demodulation circuit 8b employs a physical serial data communication layer (D-PHY), which includes a plurality of clock channels for satisfying the bandwidth requirement of high-resolution image transmission.

However, in order to reserve the future bandwidth expandability, as shown in FIG. 14B, in the second internal circuit configuration, the demodulation circuit 8b located inside the image capture card 8 can also be advanced to the test interface panel. 31, the logic processing chip 80a is disposed in the image capturing card 80, and the demodulation circuit 80b is disposed in the probe card 320; similarly, as shown in FIG. 15C, in the third internal circuit configuration, The logic processing chip 8a located inside the image capturing card 8 can be forwarded to the test interface panel 31, so that the demodulation circuit 800b is disposed in the image capturing card 800, and the logic processing chip 800a is disposed on the probe card. 3200. With the configuration, the line space reserved by the image capture card 80, 800 can ensure sufficient bandwidth for image parsing and transmission in the future, and maintain sufficient overall performance.

The above-described embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1a~1j‧‧‧Semiconductor component image test device
2‧‧‧Test head
21‧‧‧Test carrier
221~228‧‧‧ test card
3,3'‧‧‧ needle measuring machine
31,310,3100‧‧‧Test panel
32,320,3200‧‧‧ probe card
33‧‧‧Probe
34‧‧‧ stage
4,40,8,80,800‧‧‧Image capture card
4a, 40a, 8a, 80a, 800a‧‧ ‧ logical processing wafer
4b, 310b, 320b, 8b, 80b, 800b‧‧‧ demodulation circuit
41‧‧‧Adapter plate
411,81‧‧‧First end
412, 82‧‧‧ second end
5‧‧‧Spring Pin Tower
6a, 6e‧‧‧Light source supply unit
61a, 61e‧‧‧Light source controller
62a‧‧‧ hollow pipe diameter
7‧‧‧ wafer

1 is a block diagram of a semiconductor element image testing apparatus according to a first embodiment of the present invention. Fig. 2 is a perspective view showing the semiconductor element image test apparatus of the first embodiment of the present invention. 3 is a structural diagram of a semiconductor element image testing apparatus according to a second embodiment of the present invention. 4 is a structural diagram of a semiconductor element image testing apparatus according to a third embodiment of the present invention. FIG. 5 is a structural diagram of a semiconductor element image testing apparatus according to a fourth embodiment of the present invention. Fig. 6 is a block diagram showing the semiconductor element image test apparatus of the fifth embodiment of the present invention. Fig. 7A is a first internal circuit configuration diagram of the semiconductor element image test apparatus of the first embodiment of the present invention. Fig. 7B is a second internal circuit configuration diagram of the semiconductor element image test apparatus of the first embodiment of the present invention. Fig. 8A is a first internal circuit configuration diagram of a semiconductor element image test apparatus according to a second embodiment of the present invention. Fig. 8B is a second internal circuit configuration diagram of the semiconductor element image test apparatus of the second embodiment of the present invention. Fig. 9 is a block diagram showing the semiconductor element image test apparatus of the sixth embodiment of the present invention. Fig. 10 is a block diagram showing the semiconductor element image test apparatus of the seventh embodiment of the present invention. Figure 11 is a block diagram showing the semiconductor element image test apparatus of the eighth embodiment of the present invention. Fig. 12 is a block diagram showing the semiconductor element image test apparatus of the ninth embodiment of the present invention. Fig. 13 is a block diagram showing the semiconductor element image test apparatus of the tenth embodiment of the present invention. Fig. 14A is a view showing a first internal circuit configuration of a semiconductor element image test apparatus according to a sixth embodiment of the present invention. Fig. 14B is a second internal circuit configuration diagram of the semiconductor element image test apparatus of the sixth embodiment of the present invention. Fig. 14C is a third internal circuit configuration diagram of the semiconductor element image test apparatus of the sixth embodiment of the present invention. Fig. 15A is a first internal circuit configuration diagram of a semiconductor element image test apparatus according to a seventh embodiment of the present invention. Fig. 15B is a second internal circuit configuration diagram of the semiconductor element image test apparatus of the seventh embodiment of the present invention. Fig. 15C is a third internal circuit configuration diagram of the semiconductor element image test apparatus of the seventh embodiment of the present invention.

Claims (18)

A semiconductor component image testing device includes: a test head, a needle measuring machine, at least one image capturing card, and at least one adapter plate, the test head includes a test carrier board and a plurality of plugged in the test carrier board The test card includes a test panel, a probe card electrically connected to the test panel, and a plurality of probes. The at least one image capture card is inserted into the at least one adapter board. The at least one adapter plate includes a first end portion and a second end portion. The first end portion is electrically connected to the test carrier board, and the second end portion is electrically connected to the test interface panel to effectively improve the image. The card is replaced and the test bandwidth is increased during signal transmission. A semiconductor component image testing device includes: a test head, a needle measuring machine, and at least one image capturing card, the test head includes a test carrier board and a plurality of test cards inserted in the test carrier board, the needle test The device includes a test panel, a probe card electrically connected to the test panel, and a plurality of probes. The at least one image capture card includes a first end and a second end. The end portion is electrically connected to the test carrier, and the second end is electrically connected to the test interface panel, thereby effectively improving the replacement mode of the image capture card and improving the test bandwidth during signal transmission. The semiconductor component image testing device of claim 1 or 2, wherein the second end is connected to the test panel by a cable or directly inserted into the test panel. The semiconductor component image testing device of claim 1 or 2, wherein the test panel is electrically connected to the probe card by a spring pin tower. A semiconductor component image testing device includes: a test head, a needle measuring machine, at least one image capturing card, and at least one adapter plate, the test head includes a test carrier board and a plurality of plugged in the test carrier board The test card includes a probe card and a plurality of probes. The at least one image capture card is inserted on the at least one transfer board, and the at least one transfer board includes a first The end portion and the second end portion are electrically connected to the test carrier board, and the second end portion is electrically connected to the probe card, thereby effectively improving the replacement mode of the image capture card and improving the signal The test bandwidth at the time of transmission. A semiconductor component image testing device includes: a test head, a needle measuring machine and at least one image capturing card, the test head includes a test carrier board and a plurality of test cards inserted in the test carrier board, the needle test The device includes a probe card and a plurality of probes. The at least one image capture card includes a first end and a second end. The first end is electrically connected to the test carrier. The two end portions are electrically connected to the probe card, which effectively improves the replacement mode of the image capture card and improves the test bandwidth when the signal is transmitted. The semiconductor component image testing device of claim 1, wherein the first end is connected to the test carrier by a cable or directly inserted into the test carrier. On the board. The semiconductor component image testing device of claim 5 or 6, wherein the second end is connected to the probe card by a cable or directly inserted into the probe card. The semiconductor component image testing device of claim 1, wherein the semiconductor component image testing device further comprises a light source supply device. The semiconductor component image testing device of claim 9, wherein the light source supply device is an LED light source supply device or a tube diameter light source supply device. The semiconductor component image testing device of claim 9, wherein the light source supply device is assembled on the test head. The semiconductor component image testing device of claim 9, wherein the light source supply device is assembled on the needle measuring machine. For example, the semiconductor component image testing device of claim 1, the second item, the fifth item or the sixth item, wherein the image capturing card uses the mobile industry processor interface for communication. The semiconductor component image testing device of claim 1, wherein the image capture card has a logic processing chip and a demodulation circuit. The semiconductor component image testing device of claim 1 or 2, wherein the image capture card has a logic processing chip, and the test interface panel has a demodulation circuit. The semiconductor component image testing device of claim 1 or 2, wherein the image capture card has a demodulation circuit, and the test interface panel has a logic processing chip. The semiconductor component image testing device of claim 5 or 6, wherein the image capture card has a logic processing chip, and the probe card has a demodulation circuit. The semiconductor component image testing device of claim 5 or 6, wherein the image capture card has a demodulation circuit, and the probe card has a logic processing chip.