CN113640558B - Replaceable probe set and probe card - Google Patents
Replaceable probe set and probe card Download PDFInfo
- Publication number
- CN113640558B CN113640558B CN202110920598.6A CN202110920598A CN113640558B CN 113640558 B CN113640558 B CN 113640558B CN 202110920598 A CN202110920598 A CN 202110920598A CN 113640558 B CN113640558 B CN 113640558B
- Authority
- CN
- China
- Prior art keywords
- probe
- probes
- replaceable
- area
- needle sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Abstract
The invention discloses a replaceable probe set and a probe card, comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and probes, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probes, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device. The replaceable probe group can be adjusted in a self-adaptive mode according to the pad layout of the power chip to be tested, the probe group is detachably connected to the probe card, the probe card can be prevented from being replaced when the power chip to be tested with different pad layouts is tested, and the time and the economic cost for customizing the dynamic test probe card are reduced.
Description
Technical Field
The invention relates to the technical field of power device packaging test, in particular to a replaceable probe set and a probe card, and particularly relates to the replaceable probe set suitable for the probe card for testing dynamic parameters of a semiconductor device wafer.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
Because the current for testing the power chip is generally large, and a single probe can only bear limited current, a plurality of probes are required to be simultaneously inserted into the pad of the power chip. A conventional probe card is a PCB including probe sets for collecting currents of different probes. One probe card can only be used for testing one type of power chip, and the pad layouts of different power chips are different, so that the probe card needs to be customized for testing various power chips, and the time and economic cost are high. For a probe card suitable for wafer dynamic parametric testing of semiconductor devices, the cost for customization and replacement will be higher because of its more complex structure compared to conventional probe cards.
Disclosure of Invention
In order to solve the above problems, the present invention provides a replaceable probe set and a probe card, wherein the replaceable probe set can be adaptively adjusted according to the pad layout of power chips to be tested, and the probe set is detachably connected to the probe card, so that when testing power chips to be tested with different pad layouts, the probe card can be prevented from being replaced, and the time and economic cost for customizing a dynamic test probe card can be reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a replaceable probe set comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and probes, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probes, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device.
As an alternative embodiment, the replaceable probe set further comprises row pins, and each group of copper bars is provided with row pin mounting holes for connecting the row pins.
As an alternative embodiment, the multiple groups of copper bars are arranged into two or more layers with different layouts, and the row pins are connected with the copper bars on different layers.
As an alternative embodiment, the needle guard, the copper bar and the pin header are all encapsulated in the housing.
In an alternative embodiment, one end of the probe is arranged in the needle sleeve, and the other end of the probe is arranged on the tested device.
As an alternative embodiment, the number of probes is adaptively adjusted according to the device under test.
In an alternative embodiment, the copper bars are arranged in four groups, and four test signals of the probes are respectively led out.
In an alternative embodiment, the needle sleeve is provided with a jack matched with the probe at one side, and the depth of the jack is smaller than the length of the needle sleeve.
In a second aspect, the present invention provides a probe card comprising the replaceable probe set of the first aspect.
In a third aspect, the invention provides a system for testing dynamic parameters of a semiconductor device wafer, which comprises the probe card of the second aspect.
Compared with the prior art, the invention has the beneficial effects that:
reducing the time and economic cost of customizing a pin card, the present invention provides a replaceable probe set suitable for a dynamic parametric test probe card.
The probe set of the conventional probe card can not be directly replaced, so that the probe card needs to be integrally replaced and the position of the probe card needs to be readjusted when different chips are tested, and the operation is complicated. In order to solve the problem, the invention provides a replaceable probe group suitable for a dynamic parameter test probe card.
The replaceable probe set can be adjusted in a self-adaptive manner according to the pad layout of the power chip to be tested, one probe set corresponds to one power chip to be tested, and the probe set is detachably connected to the probe card, so that the probe card can be prevented from being replaced when the power chips to be tested with different pad layouts are tested, and the time and the economic cost for customizing the dynamic test probe card are reduced.
When testing various power chips, only the probe group is replaced, the probe card does not need to be replaced, the position of the probe card is fixed, and the position deviation error of the probe card is reduced.
Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is an overall structural diagram of a replaceable probe set provided in example 1 of the present invention;
fig. 2 is a diagram illustrating an internal structure of a replaceable probe set provided in embodiment 1 of the present invention;
FIG. 3 is a schematic view of a probe provided in example 1 of the present invention;
FIG. 4 is a schematic three-dimensional view of a pin header provided in embodiment 1 of the present invention;
fig. 5(a) -5(c) are schematic diagrams illustrating a copper bar layout of a first power chip according to embodiment 1 of the present invention;
fig. 6(a) -6(c) are schematic copper bar layouts of a second power chip according to embodiment 1 of the present invention;
the probe comprises a packaging shell 1, a packaging shell 2, a probe 3, a needle sleeve 4, a copper bar 5, a pin header 6 and a power chip.
The specific implementation mode is as follows:
the invention is further described with reference to the following figures and examples.
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and it should be understood that the terms "comprises" and "comprising", and any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
Example 1
As shown in fig. 1 and fig. 2, the present embodiment provides a replaceable probe set, which includes a package housing 1, a probe 2, a needle sheath 3, a copper bar 4, a pin header 5, and a power chip 6, wherein:
the packaging shell 1 is used for packaging one ends of the needle guard 3, the copper bar 4 and the row needle 5, and has the functions of mechanical support, protection isolation and cooling, so that the electrical connection of the independently packaged replaceable probe set is realized.
Preferably, the size of the package housing 1 is adapted to the layout of the copper bar 4, and in this embodiment, the length, the width, and the thickness of the package housing 1 are set to 40mm, and 3mm, respectively.
Preferably, the middle of the package shell 1 is provided with an opening, the opening is a probe assembly area and is also a test observation area, and the power chip is identified, positioned and monitored in the probe pricking position through the observation area by a CCD camera.
Preferably, the material of the package housing 1 is epoxy resin or other packaging materials.
As shown in fig. 3, the probe 2 includes a tip, an inclined arm, a horizontal arm, and a tail, the tip is inserted into a pad of the power chip 6, and the tail is inserted into the needle sheath 3.
Preferably, the size of the probe 2 needs to be designed according to the positions of the power chip 6 and the probe card, in this embodiment, the diameter of the probe tip is preferably set to be 6.0mils, the length of the inclined arm is 10-20 mm, the length of the horizontal arm is 2-5 mm, the angle alpha between the horizontal arm and the inclined arm is 90-120 degrees, and the curvature radius is 0.5-2 mm.
Preferably, the probes 2 are divided into four groups for leading out four test signals of SF, SS, G and GL.
Preferably, the number of the probes 2 can be determined according to the pad layout of the power chip and the rated parameters of the power chip.
Preferably, when the probe 2 is assembled with the needle sheath 3 and the copper bar 4, the position of the needle tip needs to be accurately adjusted, so that the levelness of the needle tip is kept within +/-0.2 mils, and the tolerance (Alignment) of the relative position of the needle tip is kept within +/-0.2 mils.
Preferably, the probe 2 material is come tungsten.
In this embodiment, the cross section of the outer shape of the needle sheath 3 is composed of an arc and a rectangle, one side of the needle sheath is provided with a jack suitable for the assembly of the probe 2, the aperture of the needle sheath 3 is suitable for the insertion of the needle tail of the probe 2, the depth of the jack is smaller than the length of the needle sheath 3, and the levelness of the central lines of different jacks is kept within +/-0.2 mils.
Preferably, the bottom surface of the needle sleeve 3 is flat, so as to facilitate the welding contact with the copper bar 4.
Preferably, the material of the needle sleeve 3 is copper.
In this embodiment, the copper bar 4 is divided into four groups, and is used for leading out four test signals of SF, SS, G, and GL of the probe;
preferably, every group copper bar all is equipped with row needle mounting hole, and row needle mounting hole is used for connecting row needle 5.
In this embodiment, the copper bar 4 is welded and fixed to the needle guard 3, a G signal is led out from the first area, an SS signal is led out from the second area, an SL signal is led out from the third area, and an SF signal is led out from the fourth area;
wherein the content of the first and second substances,
the first area is connected with the grid electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;
the second area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;
the third area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;
the fourth area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probe 2, and the number of the needles can be preferably set to 10-20 according to the rated current of the power chip.
Preferably, the position and number of the pin header mounting holes are determined by the pin header 5 for inserting one end of the pin header 5.
Preferably, the material of the copper bar 4 is copper.
In this embodiment, as shown in fig. 4, the pin header 5 has functions of mounting, fixing, and electrically connecting, and can be directly inserted into a pin header mounting hole reserved on a dynamic parameter test probe card, and the pin header layout of different probe sets corresponding to the same probe card is not changed, and is determined by the position of the reserved hole on the probe card.
In more embodiments, the layout and the outline of each group of copper bars 4 can be freely designed, the layout is not fixed, and the optimal design can be obtained according to the positions of the pins 5, the rated parameters of the power chip 6 and the pad layout; fig. 5(a) -5(c) and fig. 6(a) -6(c) show two different copper bar layouts designed for two SiC MOSFET chips with different pad layouts.
In more embodiments, the copper bar 4 can be designed into two or more layers with different layouts, and the electrical interconnection of the copper bar 4 on different layers is realized through the pin header 5, so that the power chip with the pad layout is suitable for a complicated power chip; if the pad layout on the surface of the power chip 6 is close, the adaptability to the chip layout can be improved by optimizing the layout of the probe and the copper bar, and the universality of the probe group to the layout of various chips is realized.
In further embodiments, there is also provided:
a probe card comprises the replaceable probe group.
A semiconductor device wafer dynamic parameter test system comprises the probe card.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (8)
1. A replaceable probe set, comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and a probe, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probe, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device;
the replaceable probe set further comprises row pins, each group of copper bars is provided with row pin mounting holes, and the row pin mounting holes are used for being connected with the row pins; the multiple groups of copper bars are arranged into two or more layers with different layouts, and the row pins are connected with the copper bars on different layers;
the probes are divided into four groups and used for leading out four test signals of SF, SS, G and GL;
the copper bar is fixedly welded with the needle sleeve, a G signal is led out from the first area, an SS signal is led out from the second area, a GL signal is led out from the third area, and an SF signal is led out from the fourth area;
the first area is connected with the grid electrode of the power chip through a needle sleeve and probes, and the number of the probes is 1-2;
the second area is connected with the source electrode of the power chip through a needle sleeve and probes, and the number of the probes is 1-2;
the third area is connected with the source electrode of the power chip through a needle sleeve and probes, and the number of the probes is 1-2;
the fourth area is connected with the source electrode of the power chip through a needle sleeve and a probe, and the number of the probes is set to be 10-20 according to the rated current of the power chip.
2. The interchangeable probe set of claim 1, wherein the needle guard, the copper bar, and the row of needles are encapsulated within a housing.
3. The replaceable probe set of claim 1, wherein one end of the probe is disposed within the sleeve and the other end of the probe is disposed on the device under test.
4. The replaceable probe set of claim 1, wherein the number of probes is adaptively adjusted according to the device under test.
5. The replaceable probe set of claim 1, wherein the copper bars are arranged in four groups, and the four groups are used for respectively leading out four test signals of the probe.
6. The replaceable probe set of claim 1, wherein the needle guard has a receptacle on one side for receiving the probe, the receptacle having a depth less than the length of the needle guard.
7. A probe card comprising the replaceable probe set of any one of claims 1-6.
8. A semiconductor device wafer dynamic parametric test system comprising the probe card of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110920598.6A CN113640558B (en) | 2021-08-11 | 2021-08-11 | Replaceable probe set and probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110920598.6A CN113640558B (en) | 2021-08-11 | 2021-08-11 | Replaceable probe set and probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113640558A CN113640558A (en) | 2021-11-12 |
| CN113640558B true CN113640558B (en) | 2022-06-14 |
Family
ID=78420887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110920598.6A Active CN113640558B (en) | 2021-08-11 | 2021-08-11 | Replaceable probe set and probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113640558B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491426A (en) * | 1994-06-30 | 1996-02-13 | Vlsi Technology, Inc. | Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations |
| US6392859B1 (en) * | 1999-02-14 | 2002-05-21 | Yazaki Corporation | Semiconductor active fuse for AC power line and bidirectional switching device for the fuse |
| US7180318B1 (en) * | 2004-10-15 | 2007-02-20 | Xilinx, Inc. | Multi-pitch test probe assembly for testing semiconductor dies having contact pads |
| CN203479851U (en) * | 2013-10-22 | 2014-03-12 | 武汉新芯集成电路制造有限公司 | Probe card |
| US9341649B1 (en) * | 2013-03-15 | 2016-05-17 | Johnstech International Corporation | On-center electrically conductive pins for integrated testing |
| JP2016169984A (en) * | 2015-03-11 | 2016-09-23 | 河村電器産業株式会社 | Poor connection detector |
| CN107293495A (en) * | 2016-03-31 | 2017-10-24 | 株洲中车时代电气股份有限公司 | A kind of power model and its manufacture method |
| CN109188034A (en) * | 2018-08-17 | 2019-01-11 | 北京索英电气技术有限公司 | A kind of measurement probe location adjusting device |
| CN110231501A (en) * | 2019-01-18 | 2019-09-13 | 全球能源互联网研究院有限公司 | A kind of probe card, the test equipment including probe card, test method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201392350Y (en) * | 2009-03-18 | 2010-01-27 | 上海华岭集成电路技术有限责任公司 | Probe card for anti-interference asynchronous trimming wafer test |
| CN202093062U (en) * | 2011-04-28 | 2011-12-28 | 上海依然半导体测试有限公司 | Power chip testing probe card |
| CN202256409U (en) * | 2011-08-17 | 2012-05-30 | 东莞利扬微电子有限公司 | Probe card and multi-chip test system using the same |
| CN103760391A (en) * | 2014-01-29 | 2014-04-30 | 上海华力微电子有限公司 | Internally-arranged multi-probe module and probe station with same |
| ITTO20150231A1 (en) * | 2015-04-24 | 2016-10-24 | St Microelectronics Srl | PROCEDURE FOR PRODUCING LEAD FRAME FOR CORRESPONDING ELECTRONIC COMPONENTS, COMPONENT AND IT PRODUCT |
| CN106896242B (en) * | 2015-12-18 | 2020-06-02 | 中芯国际集成电路制造(上海)有限公司 | Probe test connecting device |
| CN105675929B (en) * | 2016-02-26 | 2019-05-03 | 上海华力微电子有限公司 | A kind of probe card of the probe of compatible different size |
| CN206116354U (en) * | 2016-08-26 | 2017-04-19 | 中芯国际集成电路制造（天津）有限公司 | Probe card |
| CN206271667U (en) * | 2016-10-31 | 2017-06-20 | 广东利扬芯片测试股份有限公司 | A kind of probe card for being available for multi-point simultaneous-measurement |
| KR102605620B1 (en) * | 2018-09-13 | 2023-11-23 | 삼성전자주식회사 | Probe card inspection wafer, Probe card inspection system and probe card inspection method |
| CN110907799B (en) * | 2019-11-05 | 2022-02-01 | 长江存储科技有限责任公司 | Probe card, wafer testing device and wafer testing method |
| CN213843441U (en) * | 2020-06-22 | 2021-07-30 | 芯佰微电子（北京）有限公司 | Chip detection device |
-
2021
- 2021-08-11 CN CN202110920598.6A patent/CN113640558B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491426A (en) * | 1994-06-30 | 1996-02-13 | Vlsi Technology, Inc. | Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations |
| US6392859B1 (en) * | 1999-02-14 | 2002-05-21 | Yazaki Corporation | Semiconductor active fuse for AC power line and bidirectional switching device for the fuse |
| US7180318B1 (en) * | 2004-10-15 | 2007-02-20 | Xilinx, Inc. | Multi-pitch test probe assembly for testing semiconductor dies having contact pads |
| US9341649B1 (en) * | 2013-03-15 | 2016-05-17 | Johnstech International Corporation | On-center electrically conductive pins for integrated testing |
| CN203479851U (en) * | 2013-10-22 | 2014-03-12 | 武汉新芯集成电路制造有限公司 | Probe card |
| JP2016169984A (en) * | 2015-03-11 | 2016-09-23 | 河村電器産業株式会社 | Poor connection detector |
| CN107293495A (en) * | 2016-03-31 | 2017-10-24 | 株洲中车时代电气股份有限公司 | A kind of power model and its manufacture method |
| CN109188034A (en) * | 2018-08-17 | 2019-01-11 | 北京索英电气技术有限公司 | A kind of measurement probe location adjusting device |
| CN110231501A (en) * | 2019-01-18 | 2019-09-13 | 全球能源互联网研究院有限公司 | A kind of probe card, the test equipment including probe card, test method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113640558A (en) | 2021-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4060919B2 (en) | Electrical connection device, contact manufacturing method, and semiconductor test method | |
| CN201464507U (en) | Probe card and metal probe | |
| USRE44407E1 (en) | Space transformers employing wire bonds for interconnections with fine pitch contacts | |
| US6333635B1 (en) | Probe card for testing an integrated circuit chip | |
| KR20100052959A (en) | Interface structure for wafer test equipments | |
| KR20110049891A (en) | Test contact system for testing integrated circuits with packages having an array of signal and power contacts | |
| CN101189524A (en) | Probe card with stacked substrate | |
| US20020117729A1 (en) | Semiconductor integrated circuit device | |
| KR19990023042A (en) | Semiconductor device with test terminal and IC socket | |
| US6891384B2 (en) | Multi-socket board for open/short tester | |
| CN108666228A (en) | Semiconductor equipment and its detection device and manufacturing method | |
| KR101047537B1 (en) | Probe card | |
| US20020118029A1 (en) | Probe card and contactor | |
| CN113640558B (en) | Replaceable probe set and probe card | |
| CN110114683A (en) | Rectilinear ultralow leakage current probe card for DC parameter testing | |
| KR101123802B1 (en) | Semiconductor chip | |
| KR20100110069A (en) | Needle for semiconductor probe card | |
| KR100487557B1 (en) | Chip size probe card | |
| US8988092B2 (en) | Probing apparatus for semiconductor devices | |
| US20040080329A1 (en) | Flexible head probe for sort interface units | |
| US20230266361A1 (en) | Probe pin having improved gripping structure | |
| US7285973B1 (en) | Methods for standardizing a test head assembly | |
| GB2376353A (en) | Mounting for high frequency device packages for test and/or burn-in | |
| CN213813688U (en) | Test fixture for low-light-level microscope | |
| KR102420784B1 (en) | Connector for electrical connection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220812 Address after: Room 201, Scientific Research Building, South Side of North Ring Expressway, North of Mili Road, Huaiyin District, Jinan City, Shandong Province, 250000 Patentee after: Yuanshan (Jinan) Electronic Technology Co.,Ltd. Address before: 250061, No. ten, No. 17923, Lixia District, Ji'nan City, Shandong Province Patentee before: SHANDONG University |