CN213813688U

CN213813688U - Test fixture for low-light-level microscope

Info

Publication number: CN213813688U
Application number: CN202022727035.9U
Authority: CN
Inventors: 龚超; 陈红军
Original assignee: Nexchip Semiconductor Corp
Current assignee: Nexchip Semiconductor Corp
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-07-27
Anticipated expiration: 2030-11-23

Abstract

The utility model discloses a test fixture for shimmer microscope, include: a substrate; the connector is positioned on the substrate and is provided with a test slot for inserting a circuit board with a component to be tested; the connector pin is connected with the connector at one end and connected with the substrate at the other end; and the pin header is positioned on the substrate and is adapted to the connector pins. According to the utility model provides a test fixture can peg graft the circuit board that the centre gripping has the element of awaiting measuring, simple structure has reduced the expense cost moreover to a very big extent, has improved work efficiency.

Description

Test fixture for low-light-level microscope

Technical Field

The utility model relates to an integrated circuit failure test technique, in particular to a test fixture for shimmer microscope.

Background

Currently, in the analysis of wafer production failure process, a micro-optical microscope (for EMMI/OBIRCH/Thermal testing) is widely used for positioning the failure position. At present, two working modes of a common machine equipment are Frontside and Backside respectively according to the upper part or the lower part of a test lens element, wherein the Backside mode prevents a large block of metal above each layer of a wafer from intercepting a signal below the wafer because a detection signal is directly observed from the back of the wafer, so that the machine equipment is widely applied to various tests.

However, in the Backside mode test process, the external power supply of the micro-light microscope platform is connected to the tested element mainly in the following ways: for example, the diced wafer die is connected to a circuit Board with pin headers, such as a COB (chip on Board) Board, by means of pressure welding, and then the circuit Board is inserted into a mother Board SOCKET and led out through leads. Or, for example, the component to be tested is fixed on the circuit board without the Pin arrangement structure by pressure welding, and then the male SOCKET is embedded, so as to perform the subsequent micro-light microscope test, then in this way, because the circuit board does not have the Pin arrangement structure, in order to make the circuit board in good contact with the SOCKET below, the spring pins need to be introduced on the SOCKET and correspond to the Pin point positions on the circuit board one by one, and simultaneously, because the spring pins exist, a cover plate needs to be added above the circuit board to offset the circuit board deformation caused by the spring pins, for example, in the case of 400Pin COB, because each spring Pin has about 10 g-20 g of upward force, the whole board is subjected to about 4 Kg-8 Kg of upward force, therefore, because the existence of the cover plate, the machine microscope exceeds the normal working distance of 15mm, so that the micro-light microscope cannot normally perform the observation at the same time during the test.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art's defect, the utility model provides a test fixture for shimmer microscope, test fixture can peg graft the circuit board that the centre gripping has the element that awaits measuring, simple structure has reduced the cost moreover in very big degree, has improved work efficiency.

To achieve the above and other objects, the present invention provides a test fixture for a micro-optical microscope, comprising: the method comprises the following steps: a substrate; the connector is positioned on the substrate and is provided with a test slot for inserting a circuit board with a component to be tested; the connector pin is connected with the connector at one end and connected with the substrate at the other end; and the pin header is positioned on the substrate and is adapted to the connector pins.

In one embodiment, the connector extends from the substrate by a distance of 3-10 mm.

In one embodiment, the number of the connector pins comprises 20-50.

In one embodiment, the distance between the connector pins is 1-6 mm.

In one embodiment, the substrate has a thickness of 1-5 mm, a length of 100mm + -10 um, and a width of 100mm + -10 um.

In one embodiment, the connector has a height of 8-15 mm and a width of 10-18 mm.

In one embodiment, the circuit board includes: the circuit board body is provided with an opening at the middle position for fixing the element to be tested by pressure welding; the golden finger is positioned at the edge of the circuit board body and is used for being inserted into the test slot; and the metal wire is positioned on the circuit board body and connected with the golden finger, and the metal wire surrounds the opening part.

In one embodiment, the gold finger is composed of a plurality of surface gold-plated conductive contact pieces, and the distance between two adjacent surface gold-plated conductive contact pieces is 2-4 mm.

In one embodiment, each surface gold-plated conductive contact has a length of 4-8 mm and a width of 2-4 mm.

In one embodiment, the substrate is a printed circuit board.

The utility model discloses in, the utility model provides a test fixture for shimmer microscope, it has the connector of test slot through setting up on the base plate, and design the golden finger on the edge of the circuit board that has the element to be measured, this test slot of pegging graft, thereby when settling this test fixture on shimmer microscope's workstation, can carry out corresponding failure test to the element to be measured, this standard ization operation has improved work efficiency, avoided using public version SOCKET because the volume is too big and can't observe this major defect under the microscope in real time, and compare with using mother set SOCKET, this link of row needle has been reduced to the circuit board and need implant, make the circuit board preparation simpler, reduce expense in very big degree, and the work efficiency is improved simultaneously.

Drawings

FIG. 1 shows an exemplary block diagram of a test fixture for a micro-light microscope provided by the present invention.

Fig. 2 shows a schematic structural diagram of the circuit board provided by the present invention, wherein a block portion led out by a dotted line is a partially enlarged schematic diagram.

Fig. 3 shows a top view of the test fixture with the circuit board plugged in.

Figure 4 shows a cross-sectional schematic of a test fixture with a circuit board plugged in.

Figure 5 shows a cross-sectional schematic view of a test socket in a connector.

Fig. 6 shows a schematic structural diagram of the device under test during testing.

Description of the symbols

100. A test fixture for a micro-light microscope; 10. a substrate; 20. a connector; 21. testing the slot; 30. a connector pin; 40. arranging needles; 200. a device under test; 300. a circuit board; 310. a circuit board body; 301. opening a hole in the middle; 320. a golden finger; 330. a metal wire.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

In the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second," if any, are used for descriptive and distinguishing purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 1 to fig. 6, the utility model provides a test fixture 100 can be used for fixing the centre gripping to the circuit board 300 that has the component 200 of awaiting measuring, thereby when settling this test fixture 100 on micro light microscope 400's workstation, can be to the component 200 of awaiting measuring, for example, carry out corresponding failure test for the wafer die, the weak light that sends out when the detectable and positioning current of the detectivity based on micro light microscope 400 high sensitivity passes through the chip inner assembly, can detect the produced leakage current visible light of this component 200 defect of awaiting measuring from this, the analysis ESD, Latch up, junction leak, the family lectorage, oxide cure leak and so on fault category.

As shown in fig. 2, the circuit Board 300 is, for example, a COB (chip on Board) Board, which includes: the circuit board body 310 with the opening 301, the gold finger 320 and the metal wire 330 are disposed in the middle. The middle opening 301 of the Circuit Board body 310 may be configured to fix the dut 200 by pressure welding, and the Circuit Board body 310 is, for example, a square Board, such as a square Printed Circuit Board (PCB), and the length and width of the Circuit Board body 310 are, for example, 64.7 ± 10 um.

As shown in FIG. 2, the golden finger 320 is located the edge of circuit board body 310, golden finger 320 is used for pegging graft in the utility model provides a test fixture 100's test slot 21 is last to will come from micro light microscope 400 board external power supply to be connected to the component 200 that awaits measuring on, golden finger 320 comprises the conductive contact piece of a plurality of surface gilding, and the interval between the conductive contact piece of two adjacent surface gilding is 2 ~ 4mm, for example 3.03mm, and the length of the conductive contact piece of every surface gilding is 4 ~ 8mm, for example is 5mm, and the width is 2 ~ 4mm, for example 2 mm.

As shown in fig. 2, the metal wires 330 are disposed on the circuit board body 310, the metal wires 330 include multiple groups and are respectively connected to the gold fingers 320, and the metal wires 330 surround the opening portions 301, so as to facilitate subsequent bonding and fixing operations on the device 200 to be tested.

Referring to fig. 3 to 5, the test fixture 100 for the micro-optical microscope includes a substrate 10, a connector 20, connector pins 30, and pins 40, the test fixture 100 sets the connector 20 with a test slot 21 on the substrate 10, designs a gold finger 330 on the edge of a circuit board 300 with a device 200 to be tested, plugs the test slot 21, and performs a failure test on the device 200 to be tested through the standardized operation.

As shown in fig. 3 and 4, the substrate 10 may be, for example, a PCB, and serves as a carrier for electrical connection of electronic components, and has excellent reliability and testability, and the thickness of the substrate 10 is, for example, 1 to 5mm, for example, 2mm and 3mm, the length is, for example, 100mm ± 10um, for example, 100mm, and the width is, for example, 100mm ± 10um, for example, 100mm, based on ensuring that the circuit board 300 having the device 200 to be tested has a sufficient test area and test environment. When testing the device 200, one end of the substrate 10, for example, one end in the width direction, is placed on the stage of the micro-light microscope 400 to fix the same.

As shown in fig. 3 and 4, the connector 20 is located on the substrate 10, and further, may be partially located on the substrate 10, the connector 20 extends from the other end of the substrate 10, for example, in the width direction, by a distance of 3 to 10mm, for example, 5mm, so as to ensure that the device 200 to be tested on the circuit board 300, to which the connector 20 is plugged, is within a range covered by a test lens in the micro-light microscope 400, the height of the connector 20 is 8 to 15mm, for example, 10mm, the width is 10 to 18mm, for example, 15.7mm, and further, the length is 50 to 80mm, and the size of the connector is controllable, so as to avoid influence on a test result due to an excessively large volume.

As shown in fig. 5, the connector 20 has a test slot 21 for plugging the circuit board 300 with the device 200 to be tested, specifically, the test slot 21 has a plurality of contact ports for plugging the gold fingers 320 at the edge of the circuit board 300, so as to connect the external power source from the micro light microscope 400 to the device 200 to be tested through the gold fingers 320, the shape of the test slot 21 is not particularly limited, and any card slot capable of plugging the gold fingers 320 should be covered in the scope of the present invention.

As shown in fig. 3 and 4, one end of the connector pin 30 is connected to the connector 20, and the other end is connected to the substrate 10, so as to electrically connect the connector 20 to the substrate 10, the number of the connector pins 30 is plural, and may correspond to the number of the contact ports in the test socket 21, for example, may include 20 to 50, for example, 30, and the distance between each connector pin is 1 to 6mm, for example, 2.54 mm.

As shown in fig. 3 and 4, the pin header 40 is located on the substrate 10 to facilitate the insertion of an external power line, so as to provide a voltage for performing the failure analysis test operation, and the pin header 40 is not particularly limited and may be a commercially available pin header.

As shown in fig. 1 to fig. 6, when performing a test operation of the device 200 to be tested, the trace design circuit board 300 is provided, the device 200 to be tested is fixed to the middle opening 301 of the circuit board 300 by pressure welding, the position of the gold finger 320 of the circuit board 300 with the device 200 to be tested is inserted into the test slot 21 of the test fixture 100, and finally the test fixture 100 is fixed to the stage of the micro-light microscope 400 and connected to an external power source, the micro-light microscope 400 is started, and the device 200 to be tested is subjected to a failure analysis test.

To sum up, the utility model provides a test fixture for shimmer microscope, it has the connector of test slot through setting up on the base plate, and design the golden finger on the edge of the circuit board that has the element to be tested, this test slot of pegging graft, thereby when settling this test fixture on shimmer microscope's workstation, can carry out corresponding failure test to the element to be tested, this standard ization operation has improved work efficiency, avoided using public version SOCKET because the volume is too big and can't observe this major defect under the microscope in real time, and compare with using mother set SOCKET, this link of row needle has been reduced the circuit board and need implant, make COB preparation simpler, reduce expense in very big degree, and the work efficiency is improved simultaneously.

The above description is only a preferred embodiment of the present application and the explanation of the applied technical principle, and it should be understood by those skilled in the art that the scope of the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above technical features (but not limited to) having similar functions disclosed in the present application. Besides the technical features described in the specification, other technical features are known to those skilled in the art, and further description of the other technical features is omitted here in order to highlight the innovative features of the present invention.

Claims

1. A test fixture for a micro-light microscope, comprising:

a substrate;

the connector is positioned on the substrate and is provided with a test slot for inserting a circuit board with a component to be tested;

the connector pin is connected with the connector at one end and connected with the substrate at the other end;

and the pin header is positioned on the substrate and is adapted to the connector pins.

2. The test fixture for a micro-optical microscope as claimed in claim 1, wherein the connector protrudes from the substrate by a distance of 3-10 mm.

3. The test fixture for the micro-optical microscope as claimed in claim 1, wherein the number of the connector pins comprises 20 to 50.

4. The test fixture for a micro-optical microscope as claimed in claim 1, wherein the distance between the connector pins is 1-6 mm.

5. The test fixture for a micro-optical microscope as claimed in claim 1, wherein the substrate has a thickness of 1-5 mm, a length of 100mm ± 10um, and a width of 100mm ± 10 um.

6. The test fixture for a micro-optical microscope as claimed in claim 1, wherein the connector has a height of 8 to 15mm and a width of 10 to 18 mm.

7. The test fixture for a micro light microscope of claim 1, wherein the circuit board comprises:

the circuit board body is provided with an opening at the middle position for fixing the element to be tested by pressure welding;

the golden finger is positioned at the edge of the circuit board body and is used for being plugged into the test slot;

and the metal wire is positioned on the circuit board body and connected with the golden finger, and the metal wire surrounds the opening part.

8. The test fixture for the micro-optical microscope as claimed in claim 7, wherein the gold finger is composed of a plurality of surface gold-plated conductive contact pieces, and the distance between two adjacent surface gold-plated conductive contact pieces is 2-4 mm.

9. The test fixture for a micro-optical microscope as claimed in claim 8, wherein each of the gold-plated conductive contact pads has a length of 4 to 8mm and a width of 2 to 4 mm.

10. The test fixture for the micro-optical microscope as claimed in any one of claims 1 to 9, wherein the substrate is a printed circuit board.