TWI770523B - IC test circuit board combination and IC test system - Google Patents

Abstract

An IC test circuit board assembly, which has: a first circuit board with at least one first electrical connection port to connect other components, and at least one IC carrying area to carry at least one IC chip and electrically connect with the at least one IC chip connection; and a second circuit board with at least one second electrical connection port and a plurality of external test pins; wherein, the at least one second electrical connection port is used to electrically connect with the at least one first electrical connection port connected, and the plurality of external test pins are used to provide at least one test signal contact of the IC chip.

Description

IC test circuit board combination and IC test system

The present invention relates to an IC test circuit board, in particular to an IC test circuit board combination that can avoid the whole test board being scrapped together due to IC damage.

IC test circuit board is an important test interface after IC packaging. After the wafer is cut, bonded, wire-bonded, etc., and then covered with plastic, ceramic, metal and other materials to form an IC chip, it is generally necessary to use an IC test circuit board to test whether the IC chip functions normally. During testing, the IC chip is attached to the IC test circuit board, and the IC test circuit board provides lead pins that are electrically connected to the main pins of the IC chip, so as to connect the input power and input interface signals and connect the IC chip. The output signal is brought out for testing.

A commonly used IC test circuit board is to directly solder an IC chip to the IC test circuit board. However, this is not feasible for chips such as display driver chips with hundreds or thousands of pins and very small pin pitches. Because even if the IC chip is welded to the IC test circuit board through the expensive ultra-fine metal wire spot welding process, during the welding process, if the IC chip is damaged, the entire IC test circuit board will be scrapped together.

Therefore, there is an urgent need in the art for a novel IC test circuit board structure.

The main purpose of the present invention is to provide an IC test circuit board assembly, which can divide the IC test circuit board into two circuit boards, wherein the first circuit board carries the IC chip to be tested, and the second circuit board passes through A connecting means is electrically connected to the first circuit board and the second circuit board provides external test pins for testing, so that a chip with a large number of pins and a small pin spacing, such as a driver display chip, can Circuit boards with external test pins are electrically connected in a manner that facilitates separation.

To achieve the above purpose, an IC test circuit board assembly is proposed, which has:

a first circuit board having at least one first electrical connection port for connecting other components, and at least one IC carrying area for carrying at least one IC chip and electrically connecting with the at least one IC chip; and

a second circuit board with at least one second electrical connection port and a plurality of external test pins;

Wherein, the at least one second electrical connection port is used for electrical connection with the at least one first electrical connection port, and the plurality of external test pins are used for providing at least one test signal connection of the IC chip point.

In a possible embodiment, the pins of the first electrical connection port may be arranged in one or more rows.

In one embodiment, the shape of the pins of the first electrical connection port is a gold finger shape.

In a possible embodiment, the IC chip may be an LCD driver IC chip or an OLED driver IC chip.

In one embodiment, the electrical connection between the IC chip and the first circuit board is to use ultra-fine metal wires to connect the pins on the IC chip to the bearing area of the first circuit board.

In a possible embodiment, the metal wire is electrically connected to the contact point of the bearing area by means of high temperature welding or conductive glue.

In one embodiment, the first circuit board and the second circuit board are electrically connected by means of a mechanical socket.

In a possible embodiment, between the first circuit board and the second circuit board, a plurality of metal wires are connected to the first electrical connection port and the second electrical connection port by means of soldering or conductive glue .

In a possible embodiment, the first circuit board and the second circuit board are connected by making the first electrical connection port and the second electrical connection port be a male connector and a female connector or They are electrically connected by a female connector and a male connector respectively.

In order to achieve the above object, the present invention further provides an IC testing system, which includes a testing machine and at least one IC testing circuit board assembly as described above, wherein the testing machine is used for at least one of the IC testing circuit board assemblies Provide test conditions and measure the output signals generated by the test conditions to determine whether an IC chip to be tested is normal.

In order to enable your examiners to further understand the structure, features, purposes, and advantages of the present invention, drawings and detailed descriptions of preferred embodiments are attached as follows.

The principle of the present invention is to divide the IC test circuit board into two circuit boards, wherein the first circuit board carries the IC chip to be tested, and the second circuit board is electrically connected to the first circuit board through a connecting means and The second circuit board provides external test pins for testing, so that a chip with a large number of pins and a small pin spacing, such as a driver display chip, can be easily separated from the circuit board that provides external test pins for testing. Electrical connections.

Please refer to FIG. 1 , which is a schematic diagram of an embodiment of the IC test circuit board assembly of the present invention. As shown in FIG. 1, an IC test circuit board assembly 100 has a first circuit board 110 and a second circuit board 120, wherein the first circuit board 110 has at least one first electrical connection port 111 for connecting other components, and The at least one IC carrying area 112 is used to carry at least one IC die 130 and be electrically connected with the at least one IC die 130 . The pins in the first electrical connection port 111 can be in one or more rows, and the shape can be a gold finger or other shapes that are easy to be electrically connected; and the second circuit board 120 has at least one second electrical connection port 121 and a plurality of an external test pin 122.

The IC chip 130 can be an LCD driver IC chip or an OLED driver IC chip, and the electrical connection between the IC chip 130 and the first circuit board 110 can use ultra-fine metal wires to connect the pins on the IC chip 130 to the first circuit board. The bearing area 112 of the bearing area 110, and the metal wire can be electrically connected to the contact point of the bearing area 112 by means of high temperature welding, conductive glue, etc.

In addition, there may be various electrical connection methods between the first circuit board 110 and the second circuit board 120:

1. By means of a mechanical socket: the first electrical connection port 111 on the first circuit board 110 is a mechanical socket port, and the second electrical connection port 121 on the second circuit board 120 is a metal pin port and its internal contains pin contacts so that said metal pin port can be inserted into said mechanical socket port;

2. Connect the first electrical connection port 111 and the second electrical connection port 121 with a plurality of metal wires by means of soldering or conductive glue; and

3. The first electrical connection port 111 and the second electrical connection port 121 are respectively a male connector and a female connector or are respectively a female connector and a male connector.

In actual operation, since the first circuit board 110 and the second circuit board 120 can be easily disassembled, the second circuit board 120 provided with a plurality of external test pins 122 will not be damaged when the IC chip 130 is damaged. be damaged, that is, the split design of the present invention enables the connection between the wafer 130 and the second circuit board 120 to be disassembled in a lossless manner, thereby reducing testing costs.

According to the above description, the present invention further provides an IC testing system. Please refer to FIG. 2 , which shows a block diagram of an embodiment of the IC testing system of the present invention. As shown in FIG. 2 , an IC testing system 200 includes at least one IC testing circuit board 210 and a testing machine 220 , wherein the IC testing circuit board 210 is realized by the combination of the IC testing circuit board 100 in FIG. 1 , and the testing machine 220 is used to provide test conditions for at least one IC test circuit board 210 and measure the output signal of at least one IC test circuit board 210 to determine whether the IC chip to be tested is normal.

In this way, the above has completely and clearly explained the technical solution of the present invention; and, from the above, it can be known that the present invention has the following advantages:

The IC test circuit board assembly of the present invention can be divided into two circuit boards by dividing the IC test circuit board, wherein the first circuit board carries the IC chip to be tested, and the second circuit board is connected to the first circuit board through a connecting means The circuit board is electrically connected and the second circuit board provides external test pins for testing, so that chips with a large number of pins and small pin spacing, such as driver display chips, can be connected to the circuit board that provides external test pins for testing. Electrically connected in a manner that facilitates separation, so that the second circuit board will not be affected in the event of damage to the IC chip.

It must be emphasized that the above-mentioned disclosure in this case is a preferred embodiment, and any partial changes or modifications originating from the technical ideas of this case and easily inferred by those who are familiar with the art are within the scope of the patent of this case. category of rights.

To sum up, regardless of the purpose, means and effect of this case, it shows that it is completely different from the conventional technology, and its first invention is practical, and it does meet the patent requirements of the invention. Society is to pray for the best.

100: IC Test Board Assembly 110: First circuit board 110 111: The first electrical connection port 112: IC carrying area 120: Second circuit board 121: The second electrical connection port 122: External test pin 130: IC chip 200: IC Test System 210: IC Test Board 220: Test machine

FIG. 1 is a schematic diagram illustrating an embodiment of an IC test circuit board assembly of the present invention. FIG. 2 is a block diagram illustrating an embodiment of the IC testing system of the present invention.

100: IC Test Board Assembly

110: First circuit board 110

111: The first electrical connection port

112: IC carrying area

120: Second circuit board

121: The second electrical connection port

122: External test pin

130: IC chip

Claims (9)

An IC test circuit board assembly, which has: a first circuit board with at least one first electrical connection port to connect other components, and at least one IC carrying area to carry at least one IC chip and electrically connect with the at least one IC chip connection; and a second circuit board with at least one second electrical connection port and a plurality of external test pins; wherein, the electrical connection between the IC chip and the first circuit board uses ultra-thin metal wires to connect all the The pins on the IC chip are connected to the bearing area of the first circuit board; wherein, the at least one second electrical connection port is used for electrical connection with the at least one first electrical connection port, and the A plurality of external test pins are used for providing at least one test signal contact of the IC chip. The IC test circuit board assembly as claimed in claim 1, wherein the pins of the first electrical connection port are arranged in one or more rows. The IC test circuit board assembly as claimed in claim 1, wherein the pin shape of the first electrical connection port is a gold finger shape. The IC test circuit board assembly as described in claim 1, wherein the IC chip is an LCD driver IC chip or an OLED driver IC chip. The IC test circuit board assembly as claimed in claim 1, wherein the metal wires are electrically connected to the contact points of the bearing area by means of high-temperature soldering or conductive glue. The IC test circuit board assembly as described in claim 1, wherein the first circuit board and the second circuit board are electrically connected by means of a mechanical socket. The IC test circuit board assembly as claimed in claim 1, wherein the first circuit board and the second circuit board are connected to the first circuit board by a plurality of metal wires by means of soldering or conductive glue an electrical connection port and the second electrical connection port. The IC test circuit board assembly as claimed in claim 1, wherein the first electrical connection port and the second electrical connection port are connected between the first circuit board and the second circuit board by making the first electrical connection port and the second electrical connection port respectively It is electrically connected in the form of a male connector and a female connector or a female connector and a male connector respectively. An IC testing system, comprising a testing machine and at least one IC testing circuit board combination as described in any one of the claims 1 to 8, wherein the testing machine is used for at least one of the ICs The test circuit board assembly provides test conditions and measures the output signals generated by the test circuit board assembly to determine whether an IC chip to be tested is normal.

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