TWM527545U - Ball grid array testing apparatus - Google Patents

Abstract

The present utility model provides a ball grid array testing apparatus, including: a socket, which is used for supporting a device under test to receive a testing signal from the device under test; a load board; and a fin substrate, which is disposed between the socket and the load board, wherein the fin substrate is electrically connected with the socket and the load board for receiving the testing signal transmitted from the socket to fan out the testing signal. The device to be tested is a BGA electronic device having a plurality of tin balls at its bottom. A distance between the tin balls can be smaller than 0.4 mm.

Description

Ball gate array test device

The present invention relates to a ball gate array testing device, and more particularly to a ball grid array testing device that can be used for ball gate array electronic components having a ball pitch of 0.4 millimeters (mm) or less.

Referring to Figure 1, a conventional ball gate array testing device 10 is shown. The ball gate array testing device 10 is used to test a component under test 20, such as an integrated circuit. The ball gate array testing device 10 includes a test socket 11 and a printed circuit board 12, wherein the test socket 11 is assembled on the printed circuit board 12 and electrically connected to the printed circuit board 12. In use, the device under test 20 is placed on the test socket 11, and the test signal sent by the device under test 20 is transmitted to the printed circuit board 12 via the test socket 11, thereby performing analysis and measurement of various signals. .

Please refer to FIG. 2 and FIG. 3, which respectively show the structure of the outer layer and the inner layer of the ball gate array of the ball grid array testing device 10 of FIG. As shown in FIG. 2, the ball gate array of the ball grid array testing device 10 includes a plurality of transmission end point arrays composed of a contact pad P and a transmission hole V, wherein the transmission end points include at least one signal transmission end S and Ground terminal G. When the ball grid array testing device 10 is used to test a component to be tested with a ball pitch of 0.4 mm, the test signal of the device to be tested 20 is transmitted to the test device due to limitations in process technology. When the circuit board 12 is printed, the test signal cannot pass outside the ball gate array of the ball gate array testing device 10. The layer fan out the test signal. Therefore, as shown in Fig. 3, the ball grid array test apparatus 10 must be provided with a trace 13 in the inner layer of the ball gate array to smoothly fan out the test signal. In addition, the thickness of the trace 13 in the inner layer of the ball gate array of the ball gate array testing device 10 is limited by the distance from the adjacent contact pad P. Therefore, in the inner layer of the ball gate array of the ball gate array testing device 10, the test signal is fanned out using the thinner trace 13 and then transmitted through a wider trace 14, thereby causing the characteristic group to be discontinuous. The problem has happened.

Moreover, when the ball gate array testing device 10 is used to test the device under test 20 having a ball pitch of less than 0.4 mm, the test element 20 transmits a test signal to the printed circuit board 12, whether by the ball gate. The outer or inner layer of the ball gate array of the array test device 10 cannot fan out the test signal. Therefore, the conventional ballast array test apparatus 10 cannot be used to test an element to be tested having a pitch of less than 0.4 mm. For example, when the ball spacing is less than 0.35 mm, the inner layer needs to remove the contact pad P to smoothly fan out the signal, but the impedance discontinuity problem still occurs. Therefore, when the ball pitch is less than 0.35 mm, the ball gate array test device 10 cannot be used.

In view of the above, it is necessary to provide a ball grid array testing device to solve the problems of the prior art.

In order to solve the above technical problem, the purpose of the present invention is to provide a ball gate array testing device, which is provided with the fin substrate in the ball gate array testing device of the present invention, so that the ball grid array testing device can achieve a measuring ball spacing of less than 0.4. The effect of the millimeter's component to be tested. Moreover, since the ball grid array testing device can smoothly fan out the test signal of the device to be tested with a ball pitch of less than 0.4 mm through the arrangement of the fin substrate, whether it is in the ball gate array test Any trace of the inner layer or the outer layer of the device can be fanned out, especially the inner layer design The structure maintains the same line width, thereby avoiding the problem of characteristic impedance discontinuity due to the use of two different line width structures in the same trace as described in the prior art.

In order to achieve the above object, the present invention provides a ball gate array testing device, comprising: a test socket for carrying a component to be tested to receive a test signal emitted by the device to be tested; a load board; and a fin substrate; Between the test socket and the load board, the fin substrate is electrically connected to the test socket and the load board for receiving the test signal transmitted by the test socket, and fanning out the test signal.

The present invention also provides a ball gate array testing device, comprising: a test socket for carrying a test component to receive a test signal emitted by the device under test, the component to be tested is a ball gate array component having a plurality of conductive a spherical body having a distance of not more than 0.4 mm; a load board; and a fin substrate disposed between the test socket and the load board, wherein the fin substrate is electrically connected to the test socket and the load board, The test signal transmitted by the test socket is received, and the test signal is fanned out.

In a preferred embodiment of the present invention, the fin substrate is provided with at least one application circuit for receiving the test signal fanned out by the fin substrate.

In a preferred embodiment of the present invention, the fin substrate includes at least one transmission hole, and the fin substrate is soldered to the load board by a solder ball at a position of the transmission hole, and the application circuit receives the fin substrate fan. After the test signal is output, the test signal passes through the transmission hole and is transmitted to the load board via the solder ball.

In a preferred embodiment of the present invention, the ball gate array testing device further includes a coaxial cable connected between the fin substrate and the load board, and the application circuit receives the test signal after the fin substrate is fanned out. The test signal is transmitted to the load board via the coaxial cable.

In a preferred embodiment of the present invention, the ball grid array testing device further includes a coaxial cable connected between the fin substrate and an external instrument, and the application circuit receives the test signal after the fin substrate is fanned out. The test signal is transmitted to the external instrument via the coaxial cable.

In one preferred embodiment of the present invention, the application circuit includes a T-type bias, a relay, or an AC coupler.

In one of the preferred embodiments of the present invention, the fin substrate is electrically connected to the load board by using a ball.

In one preferred embodiment of the present invention, the conductive balls are less than 0.4 mm apart.

In one preferred embodiment of the present invention, the conductive sphere is a ball.

10, 100, 200, 300, 400‧‧‧ ball gate array test device

11, 110, 210, 310, 410‧‧‧ test seats

12, 120, 220, 320, 420‧‧‧ load boards

130, 230, 330, 430‧‧‧ fin substrates

140, 240‧‧‧ solder balls

150, 250, 350, 450‧‧‧ application circuits

232‧‧‧Transmission hole

360, 460‧‧‧ coaxial cable

470‧‧‧External instruments

20‧‧‧Device under test

13‧‧‧Wiring

14‧‧‧Wiring

V‧‧‧ transmission hole

P‧‧‧Contact pads

G‧‧‧ Grounding terminal

S‧‧‧Transport

1 shows a conventional ball gate array test device; FIGS. 2 and 3 respectively show the structure of the outer layer and the inner layer of the ball gate array of the ball gate array test device of FIG. 1; FIG. 4 shows a structure. A schematic diagram of a ball gate array testing device according to a first preferred embodiment of the present invention; FIG. 5 is a schematic view showing a ball gate array testing device according to a second preferred embodiment of the present invention; and FIG. 6 shows a A perspective view of a ball gate array testing device of a third preferred embodiment created; Figure 7 is a perspective view showing a ballast array test apparatus according to a fourth preferred embodiment of the present invention.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail below.

Referring to Figure 4, there is shown a schematic diagram of a ballast array test apparatus 100 in accordance with a first preferred embodiment of the present invention. The ball gate array testing device 100 includes a test socket 110, a printed circuit board 120, and a fin substrate 130, wherein the printed circuit board 120 is a load board. . The test socket 110 is configured to carry a device under test 20 (such as an integrated circuit) to receive a test signal from the device under test 20 . The device under test 20 is a Ball Grid Array (BGA) electronic component having a plurality of conductive balls (not shown) on the bottom surface thereof. The conductive sphere is preferably a spheroid and has a pitch of 0.4 mm or less. The test socket 110 is assembled on one side of the fin substrate 130, and the other surface of the fin substrate 130 is soldered to the load board 120 by a plurality of solder balls 140. That is, the fin substrate 130 is disposed between the test socket 110 and the load board 120. It should be noted that the outer surface of the fin substrate 130 is similar to the outer structure of the ball gate array of the conventional ball gate array testing device 10 (as shown in FIG. 2), including A plurality of transmission endpoint arrays consisting of contact pads and transmission apertures, wherein the transmission endpoints comprise at least one signal transmission terminal and a ground terminal. Therefore, when the ballast array test device 100 is used to test the device under test 20, the test socket 110 receives the test signal from the device under test 20, and the test signal is transmitted through the corresponding transmission end point on the fin substrate 130. The test signal is fanned out by the fin substrate 130.

As shown in FIG. 4 , the fin substrate 130 is provided with at least one application circuit 150 for receiving the test signal fanned out by the fin substrate 130 . The application circuit 150 includes a T-type bias (Bias Tee), a relay, or an AC Coupling, and the like. After receiving the test signal fanned out by the fin substrate 130, the application circuit 150 can control the test signal to be transmitted to the load board 120 or an external instrument to perform analysis and measurement of various signals, and the specific implementation details are detailed. As described later. Furthermore, a loopback is designed on the fin substrate 130 so that the test signal fanned out through the fin substrate 130 can be tested by using a specific application circuit as a loop to achieve the characteristics. The group is resistant to continuous, high-speed signal transmission and improves the efficiency and accuracy of the integrated circuit.

Referring to Figure 5, there is shown a schematic diagram of a ballast array test apparatus 200 in accordance with a second preferred embodiment of the present invention. The ball gate array testing device 200 includes a test socket 210 for carrying a device under test 20, a load board 220, and a fin substrate 230. The fin substrate 230 is disposed on the test socket 210 and the load board 220. between. When the ballast array test device 200 is used to test the device under test 20, the test socket 210 receives the test signal from the device under test 20, and transmits the test signal to the corresponding signal through the corresponding transmission terminal on the fin substrate 230. The test signal is fanned out by the fin substrate 230 , and then the test signal fanned out by the fin substrate 230 is received by the application circuit 250 disposed on the fin substrate 230 . A transmission via 232 for transmitting a signal is disposed on the fin substrate 230. The fin substrate 230 is soldered to the load plate 220 by a solder ball 240 at the position of the transfer hole 232. After the application circuit 250 receives the test signal fanned out by the fin substrate 230, the test signal passes through the transmission hole 232 and is transmitted to the load board 220 via the solder ball 240 to perform analysis and measurement of various signals.

Please refer to FIG. 6, which shows a third preferred embodiment according to the present invention. A schematic view of a ball gate array testing device 300. The ball gate array testing device 300 includes a test socket 310 for carrying a device under test 20, a load board 320, and a fin substrate 330. The fin substrate 330 is disposed on the test socket 310 and the load board 320. between. When the ballast array test device 300 is used to test the device under test 20, the test socket 310 receives the test signal from the device under test 20, and transmits the test signal to the corresponding transmission terminal on the fin substrate 330. In the fin substrate 330, the test signal is fanned out by the fin substrate 330, and then the test signal fanned out by the fin substrate 330 is received by the application circuit 350 disposed on the fin substrate 330. As shown in FIG. 6, the ball grid array testing device 300 further includes a coaxial cable 360 connected between the fin substrate 330 and the load board 320. After the application circuit 350 receives the test signal fanned out by the fin substrate 330, the test signal is transmitted to the load board 320 via the coaxial cable 360 to perform analysis and measurement of various signals.

Please refer to FIG. 7, which shows a perspective view of a ballast array testing device 400 according to a fourth preferred embodiment of the present invention. The ball gate array testing device 400 includes a test socket 410 for carrying a device under test 20, a load board 420, and a fin substrate 430. The fin substrate 430 is disposed on the test socket 410 and the load board 420. between. When the ballast array test device 400 is used to test the device under test 20, the test socket 410 receives the test signal from the device under test 20, and transmits the test signal to the corresponding signal transmission terminal on the fin substrate 430. In the fin substrate 430, the test signal is fanned out by the fin substrate 430, and then the test signal fanned out by the fin substrate 430 is received by the application circuit 450 disposed on the fin substrate 430. As shown in FIG. 7, the ball grid array testing device 400 further includes a coaxial cable 460 connected between the fin substrate 330 and an external instrument 470. After the application circuit 450 receives the test signal fanned out by the fin substrate 430, the test signal is transmitted to the external instrument 470 via the coaxial cable 460 to perform various signals. Analysis and measurement.

In summary, with the advancement of technology, the integrated circuit tends to develop toward a small size, and accordingly the packaged size tends to be miniaturized. Therefore, by providing the fin substrate in the ball gate array testing device of the present invention, the ball gate array testing device can realize the effect of measuring the device to be tested with a ball pitch of less than 0.4 mm. It can be understood that since the process technology of the fin substrate is different from the process of the general printed circuit board, the pitch of the ball on the fin substrate can be made very small, so when the ball grid array test device is used for testing the ball grid When the pitch is less than 0.4 mm, the fin substrate can smoothly fan out the test signal. Moreover, since the ball grid array testing device can smoothly fan out the test signal of the device to be tested with a ball pitch of less than 0.4 mm through the arrangement of the fin substrate, whether it is in the ball gate array test Any trace of the inner layer of the device or the outer layer can be fanned out, especially the inner layer is designed to maintain the same line width structure, thus avoiding the use of two different in the same trace as described in the prior art. The structure of the line width causes a problem that the characteristic impedance is discontinuous.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

100‧‧‧ Ball Gate Array Tester

110‧‧‧ test seat

120‧‧‧ load board

130‧‧‧Fin substrate

140‧‧‧ solder balls

150‧‧‧Application Circuit

20‧‧‧Device under test

Claims (14)

A ball gate array testing device includes: a test socket for carrying a component to be tested to receive a test signal emitted by the component to be tested; a load board; and a fin substrate disposed on the test socket and the load board The fin substrate is electrically connected to the test socket and the load board for receiving the test signal transmitted by the test socket, and fanning out the test signal. The ball gate array testing device of claim 1, wherein the fin substrate is provided with at least one application circuit for receiving the test signal fanned out by the fin substrate. The ball gate array testing device of claim 2, wherein the fin substrate comprises at least one transmission hole, and the fin substrate is soldered to the load plate by a solder ball at the position of the transmission hole, the application circuit After receiving the test signal fanned out by the fin substrate, the test signal passes through the transmission hole and is transmitted to the load board via the solder ball. The ball gate array testing device of claim 2, wherein the ball grid array testing device further comprises a coaxial cable connected between the fin substrate and the load board, the application circuit receiving the fin substrate fanout After the test signal, the test signal is transmitted to the load board via the coaxial cable. The ball gate array testing device of claim 2, wherein the ball grid array testing device further comprises a coaxial cable connected between the fin substrate and an external instrument, the application circuit receiving the fin substrate fanout After the test signal, the test signal is transmitted to the external instrument via the coaxial cable. The ball gate array test apparatus of claim 2, wherein the application circuit comprises a T-type bias, a relay, or an AC coupler. The ball gate array testing device of claim 1, wherein the fin substrate is electrically connected to the load board by using a ball. A ball gate array testing device includes: a test socket for carrying a test component to receive a test signal emitted by the device under test, the component to be tested is a ball gate array component having a plurality of conductive balls, the conductive The distance between the spheres is not more than 0.4 mm; a load board; and a fin substrate disposed between the test socket and the load board, wherein the fin substrate is electrically connected to the test socket and the load board for receiving the The test signal transmitted by the test socket and fanned out the test signal. The ball gate array testing device of claim 8, wherein the fin substrate is provided with at least one application circuit for receiving the test signal fanned out by the fin substrate. The ball gate array testing device of claim 9, wherein the fin substrate comprises at least one transmission hole, and the fin substrate is soldered to the load plate by a solder ball at a position of the transmission hole, the application circuit After receiving the test signal fanned out by the fin substrate, the test signal passes through the transmission hole and is transmitted to the load board via the solder ball. The ball gate array testing device of claim 9, wherein the ball grid array testing device further comprises a coaxial cable connected between the fin substrate and the load board, the application circuit receiving the fin substrate fanout After the test signal, the test signal is transmitted to the load board via the coaxial cable. The ball gate array testing device of claim 9, wherein the ball gate array testing device further comprises a coaxial cable connected between the fin substrate and an external instrument, the application circuit receiving the fin substrate fanout After the test signal, the test signal is transmitted to the external instrument via the coaxial cable. The ball gate array test apparatus of claim 9, wherein the application circuit comprises a T-type bias, a relay, or an AC coupler. The ball gate array testing device of claim 8, wherein the fin substrate is electrically connected to the load board by using a ball.