TWM544631U - Supporting structure for load board of probing card - Google Patents

Description

Probe card carrier support structure

This creation relates to a support structure, and more particularly to a probe card carrier support structure.

As electronic products are becoming more sophisticated and multi-functional, the wafers of integrated circuits in electronic products tend to be complex, and the operating frequency of the wafers is also greatly increased for use in electronic products in higher frequency bands. The current wafers are becoming more and more complex, and the number of pins required for testing is increasing, so the number of probes of the probe card is also greatly increased, and the stress generated by the probe is not negligible.

In the prior art, the vertical probe card includes three components to form a vertical bond, as shown in FIG. 1, the probe head 100, a substrate 102 disposed under the probe head 100, and a support probe head. 100 and printed circuit board 104 of carrier 102. The carrier 102 is usually connected to the printed circuit board 104 through the solder ball 106, and the probe head 100 is fixed to the printed circuit board 104 by the fixing member 108 to be aligned with the carrier 102.

When the probe head 100 contacts the object to be tested (for example, a wafer) for signal test, excessive reaction force causes deformation of the printed circuit board 104, and even if a support plate (not shown) is provided at the bottom of the printed circuit board 104, it cannot be effectively reduced. Deformation of printed circuit board 104. Moreover, the flatness of the surface of the carrier 102 causes the probe head 100 to be assembled on the carrier 102 to create an excessive gap 110, resulting in a probe. The probe of the head 100 is biased in alignment and causes the solder ball 106 to be deformed by pressure. Therefore, it is necessary to propose a new type of support structure to solve the above problems.

One of the aims of the present invention is to provide a probe card carrier supporting structure, which can effectively reduce the deformation of the printed circuit board by the supporting device, improve the flatness of the surface of the carrier plate, and improve the deformation of the solder ball by the pressure.

In order to achieve the above object, a probe card carrier supporting structure in an embodiment of the present invention includes a circuit board having a first surface and a second surface opposite to the first surface, the circuit board including the first through An opening of the surface and the second surface; a carrier plate disposed on the circuit board, the carrier board includes a first area and a second area adjacent to the first area, the first area corresponding to the The first area of the circuit board is electrically connected to the first surface of the circuit board; a probe card is disposed on the carrier board, and corresponds to the opening and the first area; A support device is disposed on the second surface of the circuit board and passes through the opening, the support device contacting the first region of the carrier to support the circuit board, the carrier, and the probe card.

In one embodiment, the second region of the carrier is electrically connected to the first surface of the circuit board by a plurality of solder balls.

In an embodiment, the second region of the carrier is electrically connected to the first surface of the circuit board by a plurality of conductive bumps.

In an embodiment, the supporting device includes a support base, and a concave portion is fixed on the second surface of the circuit board; and a support member is disposed on the support base and fixed to the concave shape a region, the support member is aligned with the opening of the circuit board and the load The first area of the board supports the carrier and the probe card.

In one embodiment, the support is an adjustable support to adjust the gap between the carrier and the probe card.

In an embodiment, a cross-sectional shape of the support member is adapted to the opening of the circuit board and the geometry of the first region of the carrier.

In one embodiment, the cross-sectional shape is selected from the group consisting of a circle, a rectangle, a square, a polygon, and an ellipse.

In one embodiment, the probe card is electrically connected to the opposite side surface of the first region of the carrier, so that the probe card is electrically connected to the circuit board through the carrier.

In one embodiment, the probe card carrier support structure further includes a fixing structure disposed on the first surface of the circuit board for fixing the probe card to the circuit board.

100‧‧‧ probe head

102‧‧‧ Carrier Board

104‧‧‧Printed circuit board

106‧‧‧ solder balls

108‧‧‧Fixed parts

110‧‧‧ gap

200‧‧‧ boards

202‧‧‧ Carrier Board

204‧‧‧ Probe Card

206‧‧‧Support device

208a‧‧‧ first surface

208b‧‧‧ second surface

210‧‧‧ openings

212a‧‧‧First area

212b‧‧‧Second area

212c‧‧‧ third area

213‧‧‧ solder balls

214‧‧‧ probe

216‧‧‧ support

218‧‧‧Support

220‧‧‧ concave area

222‧‧‧Fixed structure

224‧‧‧ screws

SP‧‧‧ gap

DS‧‧‧ deformation

In order to more clearly illustrate the technical solutions in the present embodiment, the drawings used in the description of the embodiments will be briefly described below. FIG. 1 is a schematic view showing a support structure of a probe card carrier in the prior art.

2 is a schematic view showing a support structure of a probe card carrier in the present embodiment.

FIG. 3 is a schematic diagram showing the adjustment mechanism of the support structure of the probe card carrier in the present embodiment.

Referring to the drawings, wherein like reference numerals refer to the same elements or the like elements, the principles of the present invention are illustrated by the implementation in a suitable computing environment. The following description is based on the illustrated specific embodiment of the present invention, which should not be construed as limiting this creation not here. Other specific embodiments are detailed.

2 is a schematic view showing a support structure of a probe card carrier in the present embodiment. The probe card carrier support structure includes a circuit board 200, a carrier 202, a probe card 204, and a support device 206. The circuit board 200 is provided with a first surface 208a and a second surface 208b opposite the first surface 208a, the circuit board 200 including an opening 210 extending through the first surface 208a and the second surface 208b. The circuit board 200 is configured to transmit a test signal and receive the measured signal generated by the probe card 204 of the carrier 202.

As shown in FIG. 2, the carrier 202 is disposed on the circuit board 200. The carrier 202 includes a first area 212a and a second area 212b adjacent to the first area 212a. The first area 212a corresponds to The opening 210 of the circuit board 200 is electrically connected to the first surface 208a of the circuit board 200. The carrier 202 is configured to convert one of the probes 214 of the probe card 204 to form another pin configuration, for example, to convert the pitch of the smaller probe 214 into a larger carrier 202. Bit spacing. In an embodiment, the second region 212a of the carrier 202 is electrically connected to the first surface 208a of the circuit board 200 by a plurality of solder balls 213. In another embodiment, the second region 212a of the carrier 202 is electrically connected to the first surface 208a of the circuit board 200 by a plurality of conductive bumps.

As shown in FIG. 2, the probe card 204 is disposed on the carrier 202 and corresponds to the opening 210 and the first region 212a. In an embodiment, the probe card 204 is used to test a chip ( Not shown) or whether the circuit function of a plurality of dies on a wafer is normal. In one embodiment, the probe card 204 is electrically connected to the opposite side surface of the first region 212a of the carrier 202, so that the probe card 204 is electrically connected to the circuit board through the carrier 202. 200.

As shown in FIG. 2, the supporting device 206 is disposed on the second surface of the circuit board 200. The support device 206 contacts the first region 212a of the carrier 202 to support the circuit board 200, the carrier 202, and the probe card 204. As shown in FIG. 2, the support device 206 includes a support base 216 and a support member 218. The support base 216 is provided with a concave portion 220 that is fixed to the second surface 208b of the circuit board 200. The support member 218 is disposed on the support base 216 and is fixed to the concave portion 220. The support member 218 is aligned with the opening 210 of the circuit board 200 and the first region 212a of the carrier 202 to support the carrier 202. And the probe card 204. In one embodiment, a cross-sectional shape of the support member 218 is adapted to the opening 210 of the circuit board 200 and the geometry of the first region 212a of the carrier 202, wherein the cross-sectional shape is, for example, selected from a circular shape. A group of rectangles, squares, polygons, and ellipses. In one embodiment, the support member 218 is secured to the concave region 220 of the support seat 216 by screws or welding. The circuit board 200 is fixed to the support device 206 by screws or soldering. It should be noted that the present invention can also omit the arrangement of the concave region 220, and the support member 218 is disposed on the support base 216 so that the support member 218 does not interfere with the circuit board 200.

In FIG. 2, the probe card carrier support structure further includes a fixing structure 222 disposed on the first surface 208a of the circuit board 200 for fixing the probe card 204 to the circuit board 200. For example, the probe card 204 is fixed to the fixing structure 222 by screws (as shown in FIG. 2) or welded, and then the fixing structure 222 is disposed on the circuit board 200 by screws or welding.

According to the above, since the support member 218 of the supporting device 206 contacts the carrier 202, the deformation of the printed circuit board 200 due to the excessive reaction force of the probe card 204 can be effectively reduced, and the printed circuit board 200 can be prevented from being subjected to pressure distortion. Moreover, the support member 218 contacts the first region 212a of the carrier 202, and the first region 212a is separated from the plurality of solder balls 213 or conductive bumps of the second region. When the needle card 204 generates pressure on the carrier 202, most of the pressure applied by the solder ball 213 is absorbed by the support member 218, and the solder ball 212 is deformed by pressure to deform, so that the circuit board 200 and the carrier 202 are interposed. Electrical combination is better.

FIG. 3 is a schematic diagram showing the adjustment mechanism of the support structure of the probe card carrier in the present embodiment. As shown in FIGS. 1 and 3, the support member 218 is an adjustable support member for adjusting the gap SP between the carrier plate 202 and the probe card 204 (as shown in FIG. 2). In the embodiment of FIG. 3, when the flatness of the third region 212c of the carrier 202 is not good, the gap SP may be too large, and the support member 218 of the present supporting device 206 effectively positions the first region 212a of the carrier 202. The upward adjustment is performed to adjust the flatness of the carrier 202, that is, the distance between the third region 212c of the carrier 202 and the probe card 204 is effectively adjusted to avoid the alignment error of the probe 214 of the probe card 204. It is easy to form an accurate alignment with the third region 212c of the carrier 202. In other words, the support device 206 of the present invention effectively avoids the deformation amount DS (shown by a broken line) as shown in FIG. In an embodiment, the support member 218 is disposed on the support base 216 by an adjustable screw, so that the support member 218 is displacement-adjusted along the direction of force of the carrier 202 (for example, a vertical direction).

In summary, the probe card carrier supporting structure of the present invention effectively reduces the deformation of the printed circuit board, improves the flatness of the surface of the carrier board, and improves the deformation of the solder ball by the pressure.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

200‧‧‧ boards

202‧‧‧ Carrier Board

204‧‧‧ Probe Card

206‧‧‧Support device

208a‧‧‧ first surface

208b‧‧‧ second surface

210‧‧‧ openings

212a‧‧‧First area

212b‧‧‧Second area

212c‧‧‧ third area

213‧‧‧ solder balls

214‧‧‧ probe

216‧‧‧ support

218‧‧‧Support

220‧‧‧ concave area

222‧‧‧Fixed structure

224‧‧‧ screws

SP‧‧‧ gap

Claims (9)

A probe card carrier support structure includes: a circuit board having a first surface and a second surface opposite to the first surface, the circuit board including an opening extending through the first surface and the second surface; a carrier board disposed on the circuit board, the carrier board includes a first area and a second area adjacent to the first area, the first area corresponding to the opening of the circuit board, the second area Electrically connected to the first surface of the circuit board; a probe card disposed on the carrier and corresponding to the opening and the first area; and a supporting device disposed on the circuit board And passing through the opening on the second surface, the support device contacts the first region of the carrier to support the circuit board, the carrier, and the probe card. The probe card carrier support structure of claim 1, wherein the second region of the carrier is electrically connected to the first surface of the circuit board by a plurality of solder balls. The probe card carrier support structure of claim 1, wherein the second region of the carrier is electrically connected to the first surface of the circuit board by a plurality of conductive bumps. The probe card carrier support structure of claim 1, wherein the support device comprises: a support base, a concave area, the support base is fixed on the second surface of the circuit board; and A support member is disposed on the support base and fixed to the concave portion, the support member is aligned with the opening of the circuit board and the first region of the carrier to support the carrier and the probe card. The probe card carrier support structure according to claim 4, wherein the support member It is an adjustable support to adjust the gap between the carrier and the probe card. The probe card carrier support structure of claim 4, wherein a cross-sectional shape of the support member is adapted to an opening of the circuit board and a geometry of the first region of the carrier. The probe card carrier support structure according to claim 6, wherein the cross-sectional shape is selected from the group consisting of a circle, a rectangle, a square, a polygon, and an ellipse. The probe card carrier support structure of claim 1, wherein the probe card is electrically connected to the opposite side surface of the first region of the carrier, so that the probe card transmits the probe card The carrier is electrically connected to the circuit board. The probe card carrier support structure of claim 1, further comprising a fixing structure disposed on the first surface of the circuit board for fixing the probe card to the circuit board.