TWM572991U - A probe device with stacking spring - Google Patents

Abstract

An elastic probe device comprising an insulating substrate and a set of probes having signal contacts, the probes being adhered to the contacts on the insulating substrate and perpendicular to the insulating substrate, The probes are stacked up to a desired height with a long module and a circular module, wherein the elongated modules are stacked at different angles to form a set of resilient probe devices.

Description

Elastic probe device

This creation is about a flexible probe device, especially one that can be used to assist in the precision measurement of semiconductor wafers. The probe head can be contacted on the semiconductor wafer test points evenly and accurately for fast and accurate testing. A probe device that effectively increases the efficiency of semiconductor wafer testing.

In recent years, the semiconductor industry has developed rapidly and the process technology has advanced by leaps and bounds. At this stage, the channel length has been developed to the latest 7 nm process, and the integrated circuit (IC) is getting smaller and smaller, and the number of pins is increasing. In order to extract wafer signals from tiny dense semiconductor wafer pads or bumps to maintain accurate test operation of the semiconductor wafer, precise probe devices are often required for effective direct contact with the measured Semiconductor wafer pads or bumps to increase test efficiency.

As shown in FIG. 1, it is a conventional semiconductor wafer test probe device. The probe device includes a probe card 10a. The probe card 10a is provided with a line on which a set of probes 11a are disposed. The tip of the set of probes 11a directly contacts the semiconductor wafer pad or bump 12a, and the wafer signal is extracted onto the probe card 10a for testing.

The conventional semiconductor wafer testing probe device uses a manual method to place tens to hundreds of probes according to the position of the semiconductor wafer pad or bump to be tested, and the probe is placed on the probe card. In this way, the probe directly contacts the semiconductor wafer pad or the bump, and the wafer signal is taken out for testing. Such a probe device is manually fabricated, and the probe is bulky, so the wafer miniaturization and the high number of pins cannot be satisfied. At the same time, the probe is elasticized. It is made of high-strength metal, such as tungsten or nickel. The metal is not very good in dielectric properties, which is easy to cause test error or scratch the semiconductor wafer pad. Or bumps.

The present invention provides an elastic probe device comprising an insulating substrate, a set of tens to tens of thousands of probes having through-hole contacts on the insulating substrate, the contacts being based on the semiconductor wafer under test The pads or bumps are arranged in a corresponding position. The probes are adhered to the contacts of the insulating substrate and perpendicular to the insulating substrate. The probes are stacked with the elongated module and the circular module to the required position. Height, wherein the elongated modules are stacked vertically at different angles to form a set of resilient probe devices.

The present invention provides an elastic probe device, the probes are electroplated using various composite conductive materials, and the components are copper, nickel, gold, palladium, tin, etc., because they contain various materials, the probes have both It has high conductivity, high rigidity and high negligence. At the same time, the probe is perpendicular to the object to be tested, so that the probe head and the measured object have the largest contact area, effectively reducing the contact resistance and heat value. Further, The probe is vertically stacked at different angles from the long module and the circular module, thereby forming a set of elastic probes. The probe structure of this form has uniform torque, no offset or deformation when pressed. The tip of the needle and the measured object are accurately aligned, and the overall coplanarity is good, and the probe is exposed by micro-image. The light forming method is electroplated, and the volume is small, and the measurement points which are finer and finer can be measured.

10a‧‧‧ probe card

11a‧‧‧Probe

12a‧‧‧Semiconductor wafer pads or bumps

10‧‧‧Insert substrate

11‧‧‧Contacts

12‧‧‧ probe

13‧‧‧Circular module

14‧‧‧Long strip module

15‧‧‧Circular module

16‧‧‧Long strip module

Figure 1 is a perspective view of a conventional semiconductor wafer test probe device.

Figure 2 is a perspective view of the creation.

Figure 3 is an exploded perspective view of the probe of the present invention.

Referring to FIG. 2 and FIG. 3, the present invention provides an elastic probe device, which includes an insulating substrate 10 having a plurality of through-hole contacts 11 on the insulating substrate 10. Depending on the position of the solder pads or bumps to be tested, a probe 12 is adhered to each of the contacts 11, and the probe 12 is perpendicular to the insulating substrate 10, and the probe 12 is a long strip module. The bottom layer of the probe 12 is a circular module 13 which is electroplated on the contact 11 by a micro-image exposure forming method, and the long-shaped module 14 is formed. Electroplated and stacked on the circular module 13 by micro-image exposure forming, the circular module 15 is electroplated and stacked on the elongated module 14 by micro-image exposure forming, and the long-shaped module 16 is exposed by lithography. The forming method is electroplated and stacked on the circular module 15, and the elongated module 16 forms a 90 degree angle difference with the elongated module 14, so that the height required for stacking to the probe 12 is repeated, and the above steps form a A set of flexible probe devices.

Claims (3)

An elastic probe device comprising: an insulating substrate having a signal input and output contact; a set of probes adhered to the insulating substrate, the probe having a plurality of elongated modules and Round module. The flexible probe device of claim 1, wherein the long module of the probe and the circular module are stacked in a cross-sectional manner perpendicular to the direction of the insulating substrate, and are stacked and connected to the insulating substrate from bottom to top. The signal is output to the contacts to form the probe body. The elastic probe device according to claim 1, wherein the long module of the probe is stacked at different angles, and the adjacent strip modules are at an angle of 90 degrees, thereby forming a probe. Flexibility.