KR200274849Y1 - The socket connecting structure of dut for testing the device - Google Patents

Abstract

The present invention relates to a socket coupling structure of a DUT for testing a device. The lead of the socket is inserted into a pattern hole of a scrambled PCB and soldered to form a DUT by combining the socket and the scrambled PCB, and then soldered to the scrambled PCB of the DUT. It consists of connecting the female connector and the male connector soldered to the universal board, combining the DUT and the universal board, and the electrical signal of the device mounted in the socket is tested through the lead of the socket. After going through the pattern and the female connector, it is transferred to the universal board through the male connector.

The present invention prevents the bending of the socket lead, improves the reliability of the device test by making the coupling stable, and enables the test of the BGA (BALL GRID ARRAY) type device, and the new universal board even if the device type is changed. Only DUT can be manufactured and mounted on the same universal board without manufacturing, thus reducing cost and providing socket coupling structure of DUT for device test.

Description

DE SUTET CONNECTING STRUCTURE OF DUT FOR TESTING THE DEVICE}

The present invention relates to a socket coupling structure of a DUT for testing a device.

In general, when a device is manufactured, it is tested to detect a bad device.

In this process, the DUT (DEVICE UNDER TEST) board serves as the interface between the SORTER MACHINE, which automatically handles the device, and the test system that actually tests the device.

To test the device by coupling the socket to the DUT board, a technique is needed to reliably couple the socket to the DUT board.

Related technologies include Korean Patent Application No. 10-2001-0004776 (Semiconductor Device Test Socket), Korean Patent Application No. 10-2000-0028648 (DUT Board with IC Socket), Korean Utility Model Application 20-2001-0014981 (Mother for Memory Test Module socket coupling structure of the board), Korean Patent Application No. 10-1999-0034933 (test board for semiconductor memory modules) and the like are known.

The DUT board and socket coupling structure for testing a conventional device is composed of a DUT PCB 21, an epoxy 22, and a receptacle pin 23, as shown in FIGS. 1 and 2, and a receptacle pin 23 ) Is a hole in which the lead 11 of the socket 10 is inserted, and a lower part is a pin.

Holes are made in the DUT PCB 21 and the epoxy 22 to insert the receptacle pins 23, and then solder and fix them.The leads 11 of the socket 10 are inserted into the receptacle pins one-to-one, so that the DUT board and the socket are inserted. This is to be combined.

However, this coupling structure cannot be used due to the operator's carelessness when the socket is replaced due to the operator's carelessness, and wear of the socket lead is repeatedly inserted into the receptacle pin. There are a lot of errors that determine the error as bad, and there is a problem that the BGA type device cannot be used.

In addition, when the device type is changed, the DUT board also had to be newly manufactured according to the device type.

In order to solve the above problems, the present invention can prevent the bending of the socket lead, improve the reliability of the device test by making the coupling stable, and can test the BGA type device, even if the device type is changed. The goal is to provide a socket coupling structure of the DUT for device testing that eliminates the need for a universal board.

1 is a perspective view showing a coupling structure of a conventional DUT board and a socket

2 is a cross-sectional view showing a coupling structure of a conventional DUT board and a socket

Figure 3 is a perspective view showing a socket coupling structure of the DUT for testing the device of the present invention

4 is a cross-sectional view taken along the line A-A 'in the socket coupling structure of the DUT of FIG.

5 is a plan view of the universal board shown in FIG.

Figure 6a is a front view showing a state before coupling of the DUT and the universal board shown in FIG.

6b is a front view showing a state after coupling of the DUT and the universal board shown in FIG.

* Explanation of symbols for main parts of the drawings

10: socket 11: lead

20: DUT Board 21: DUT PCB

22 epoxy 23 receptacle pin

30: socket 31: lead

40: DUT 41: Scramble PCB

42: female connector 43: pattern hole

51: universal board 52: mail connector

The present invention relates to a socket coupling structure of a DUT for testing a device.

The socket coupling structure of the DUT for testing the device of the present invention,

The lead 31 of the socket 30 is inserted into the pattern hole 43 of the scramble PCB 41 and soldered to form a DUT 40 by combining the socket and the scramble PCB, and then soldered to the scramble PCB of the DUT. The female connector 42 is coupled to the male connector 52 soldered to the universal board 51, and is configured by combining the DUT and the universal board.

For testing, the electrical signals of the devices mounted in the sockets are passed through the socket leads, through the scrambled PCB pattern and the female connector, and then through the male connector to the universal board.

Hereinafter, the socket coupling structure of the DUT for the device test of the present invention will be described in detail with reference to the drawings.

Figure 3 is a perspective view showing a socket coupling structure of the DUT of the present invention.

Coupling structure of the present invention consists of a combination of the DUT and the universal board coupled to the socket and scrambled PCB.

Under the socket 30, a lead 31 is inserted into the pattern hole 43 of the scrambled PCB 41.

For example, the number of leads is arranged in one row, but divided into three rows on the left and right sides.

The pattern hole 43 is formed in the upper part of the scramble PCB 41 according to the lead number and arrangement | positioning of a socket.

The scramble PCB 41 makes holes so that the female connector 42 can be inserted in the lower left and right, inserts the female connector into each of the holes, and then solders and fixes the leads of the female connector.

Then, the lead 31 of the socket 30 is inserted into the pattern hole of the scrambled PCB 41, and then soldered from the opposite side to tightly fix the socket and the scrambled PCB to form the DUT 40.

The socket is fastened by inserting the male connector 52 of the universal board 51 into the female connector 42 of the DUT fixed with the scrambled PCB.

In this way, the device to be tested is mounted and tested on the socket in which the DUT and the universal board, in which the socket is fixed to the scramble PCB, are combined.

In the combined state as described above, when the device to be tested is mounted in the socket 30, the electrical signal of the device passes through the lead of the socket, through the pattern of the scrambled PCB, and finally through the female connector and the mail connector. It will be electrically connected to the board to test the good or bad of the device.

The present invention can prevent the bending of the socket lead, improve the reliability of the device test by making the coupling stable, and also test the BGA type device, and the DUT without producing a new universal board even if the device type is changed. Only a new one can be mounted on the same universal board, thus reducing the cost and providing a socket coupling structure of the DUT for device testing.

Claims (2)

In the socket coupling structure of the DUT to test the device, The lead 31 of the socket 30 is inserted into the pattern hole 43 of the scramble PCB 41 and soldered to form a DUT 40 by combining the socket and the scramble PCB, and then soldered to the scramble PCB of the DUT. A female connector 42 is connected to the universal connector 51 and the male connector 52 is soldered to the DUT and the universal board. In the socket coupling structure of the DUT to test the device, The lead 31 of the socket 30 is inserted into the pattern hole 43 of the scramble PCB 41 and soldered to form a DUT 40 by combining the socket and the scramble PCB, and then soldered to the scramble PCB of the DUT. The female connector 42 and the male connector 52 soldered to the universal board 51 are connected to each other, and the DUT and the universal board are connected to each other. The socket coupling structure of the DUT for testing the device, which is structured through the lead, the scrambled PCB pattern and the female connector, and then the male connector is transferred to the universal board.