CN105657962A - 一种多层pcb电路板 - Google Patents
一种多层pcb电路板 Download PDFInfo
- Publication number
- CN105657962A CN105657962A CN201610182877.6A CN201610182877A CN105657962A CN 105657962 A CN105657962 A CN 105657962A CN 201610182877 A CN201610182877 A CN 201610182877A CN 105657962 A CN105657962 A CN 105657962A
- Authority
- CN
- China
- Prior art keywords
- layer
- plane
- signals layer
- ground plane
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008054 signal transmission Effects 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 206010019233 Headaches Diseases 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 231100000869 headache Toxicity 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610182877.6A CN105657962B (zh) | 2016-03-28 | 2016-03-28 | 一种多层pcb电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610182877.6A CN105657962B (zh) | 2016-03-28 | 2016-03-28 | 一种多层pcb电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105657962A true CN105657962A (zh) | 2016-06-08 |
CN105657962B CN105657962B (zh) | 2018-05-18 |
Family
ID=56494502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610182877.6A Active CN105657962B (zh) | 2016-03-28 | 2016-03-28 | 一种多层pcb电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105657962B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107592728A (zh) * | 2017-09-26 | 2018-01-16 | 郑州云海信息技术有限公司 | 一种pcb布局布线的方法和结构 |
CN108834302A (zh) * | 2018-06-29 | 2018-11-16 | 郑州云海信息技术有限公司 | 一种多层pcb板及服务器 |
CN110611991A (zh) * | 2019-09-18 | 2019-12-24 | 贵州航天控制技术有限公司 | 一种弹上刚挠结合印制板及其设计方法 |
CN113056090A (zh) * | 2021-03-18 | 2021-06-29 | 山东英信计算机技术有限公司 | 一种复用pcb叠板及服务器 |
CN113535636A (zh) * | 2021-06-30 | 2021-10-22 | 成都中微达信科技有限公司 | 一种计算装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1388737A (zh) * | 2001-05-30 | 2003-01-01 | 神达电脑股份有限公司 | 抑制电磁波干扰的电路板及压制方法 |
US20050225955A1 (en) * | 2004-04-09 | 2005-10-13 | Hewlett-Packard Development Company, L.P. | Multi-layer printed circuit boards |
US20050231124A1 (en) * | 2004-03-09 | 2005-10-20 | Jin-Hyun Choi | Stacked structure display device |
CN201119256Y (zh) * | 2007-11-13 | 2008-09-17 | 北京七星华创电子股份有限公司 | 质量流量控制装置 |
CN201976340U (zh) * | 2011-03-22 | 2011-09-14 | 上海欣丰卓群电路板有限公司 | 一种阻抗电路板 |
CN102271455A (zh) * | 2010-06-03 | 2011-12-07 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
CN202262021U (zh) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | 六层电路板和电子终端 |
CN203951671U (zh) * | 2014-06-04 | 2014-11-19 | 广州中海达卫星导航技术股份有限公司 | 一种具有良好电磁兼容性能的pcb结构 |
CN204350437U (zh) * | 2015-01-28 | 2015-05-20 | 吴江市东风电子有限公司 | 多层电路板 |
CN105430871A (zh) * | 2015-12-02 | 2016-03-23 | 北京浩瀚深度信息技术股份有限公司 | Pcb和隔离pcb中高噪声电源的方法 |
-
2016
- 2016-03-28 CN CN201610182877.6A patent/CN105657962B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1388737A (zh) * | 2001-05-30 | 2003-01-01 | 神达电脑股份有限公司 | 抑制电磁波干扰的电路板及压制方法 |
US20050231124A1 (en) * | 2004-03-09 | 2005-10-20 | Jin-Hyun Choi | Stacked structure display device |
US20050225955A1 (en) * | 2004-04-09 | 2005-10-13 | Hewlett-Packard Development Company, L.P. | Multi-layer printed circuit boards |
CN201119256Y (zh) * | 2007-11-13 | 2008-09-17 | 北京七星华创电子股份有限公司 | 质量流量控制装置 |
CN102271455A (zh) * | 2010-06-03 | 2011-12-07 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
CN201976340U (zh) * | 2011-03-22 | 2011-09-14 | 上海欣丰卓群电路板有限公司 | 一种阻抗电路板 |
CN202262021U (zh) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | 六层电路板和电子终端 |
CN203951671U (zh) * | 2014-06-04 | 2014-11-19 | 广州中海达卫星导航技术股份有限公司 | 一种具有良好电磁兼容性能的pcb结构 |
CN204350437U (zh) * | 2015-01-28 | 2015-05-20 | 吴江市东风电子有限公司 | 多层电路板 |
CN105430871A (zh) * | 2015-12-02 | 2016-03-23 | 北京浩瀚深度信息技术股份有限公司 | Pcb和隔离pcb中高噪声电源的方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107592728A (zh) * | 2017-09-26 | 2018-01-16 | 郑州云海信息技术有限公司 | 一种pcb布局布线的方法和结构 |
CN107592728B (zh) * | 2017-09-26 | 2019-03-12 | 郑州云海信息技术有限公司 | 一种pcb布局布线的方法和结构 |
WO2019062209A1 (zh) * | 2017-09-26 | 2019-04-04 | 郑州云海信息技术有限公司 | 一种pcb布局布线的方法和结构 |
US20200137880A1 (en) * | 2017-09-26 | 2020-04-30 | Zhengzhou Yunhai Information Technology Co., Ltd. | Method and structure for layout and routing of pcb |
US10869386B2 (en) | 2017-09-26 | 2020-12-15 | Zhengzhou Yunhai Information Technology Co., Ltd. | Method and structure for layout and routing of PCB |
CN108834302A (zh) * | 2018-06-29 | 2018-11-16 | 郑州云海信息技术有限公司 | 一种多层pcb板及服务器 |
CN110611991A (zh) * | 2019-09-18 | 2019-12-24 | 贵州航天控制技术有限公司 | 一种弹上刚挠结合印制板及其设计方法 |
CN113056090A (zh) * | 2021-03-18 | 2021-06-29 | 山东英信计算机技术有限公司 | 一种复用pcb叠板及服务器 |
CN113535636A (zh) * | 2021-06-30 | 2021-10-22 | 成都中微达信科技有限公司 | 一种计算装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105657962B (zh) | 2018-05-18 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A multilayer PCB circuit board Effective date of registration: 20230112 Granted publication date: 20180518 Pledgee: Industrial Bank Putian branch, Limited by Share Ltd. Pledgor: PUTIAN HANJIANG YD PCB Co.,Ltd. Registration number: Y2023350000018 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180518 Pledgee: Industrial Bank Putian branch, Limited by Share Ltd. Pledgor: PUTIAN HANJIANG YD PCB Co.,Ltd. Registration number: Y2023350000018 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |