CN105621877A

CN105621877A - Dividing method of brittle substrate

Info

Publication number: CN105621877A
Application number: CN201510802163.6A
Authority: CN
Inventors: 曾山浩
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2014-11-25
Filing date: 2015-11-19
Publication date: 2016-06-01
Anticipated expiration: 2035-11-19
Also published as: CN105621877B; KR20160062693A; JP6413693B2; JP2016098152A; TWI653201B; TW201630836A

Abstract

The invention relates to a dividing method of a brittle substrate. The method divides the brittle substrate along a groove line not equipped with a crack. A gap is formed in the initial point (N1) of the edge (EG) of the brittle substrate (11) by crashing a tool nose into the edge (EG). A first trench line (TL) is formed from the initial point (N1) and a terminal point (N3) by moving the tool nosing crashing into the initial point (N1), and is formed in such a way of acquiring a crack-free state. A crack, with the gap as an initial point, extends from the initial point (N1) to the terminal point (N3) by applying stress to the brittle substrate (11). Thus, the brittle substrate (11) is cut off along the first trench line (TL).

Description

The cutting-off method of brittle base

Technical field

The present invention relates to the cutting-off method of a kind of brittle base.

Background technology

In the manufacture of the electrical equipment such as flat-panel display panel or solar battery panel, it is often necessary to the brittle bases such as glass substrate are cut off. First on substrate, form line, secondly cut off substrate along this line. Line can be formed by using point of a knife mechanicalness that substrate is processed. Slided on substrate by point of a knife or roll and on substrate, form the groove caused by plastic deformation, and being simultaneously formed immediately below with vertical slight crack at this groove. Thereafter, implement to be called that the stress cutting off step gives. From there through making before the described complete through-thickness of vertical slight crack and then cutting off substrate.

The step of cut-out substrate is relatively large number of is carry out soon after the step forming line at substrate. But, it was also proposed that form the step of line and cut off the step being processed substrate between step.

The such as technology according to International Publication the 2002/104078th, at organic EL (electroluminescence, electroluminescent) display manufacture method in, installing before top pressure closure, form line on the glass substrate for each region becoming each organic el display. Therefore, can avoid in becoming the top pressure closure of problem and contacting of glass cutter when arranging and forming line after top pressure closure on the glass substrate.

Additionally, such as technology according to International Publication the 2003/006391st, in the manufacture method of display panels, 2 glass substrates are fitted after forming line. It is possible to cut off in step at 1 time cut off by 2 brittle bases simultaneously.

[prior art literature]

[patent documentation]

[patent documentation 1] International Publication the 2002/104078th

[patent documentation 2] International Publication the 2003/006391st

Summary of the invention

[problem that invention is intended to solve]

According to described conventional technology, the processing to brittle base is to carry out after forming line, is given by stress thereafter and carries out cutting off step. This mean brittle base is added man-hour along line entirety already have vertical slight crack. Thus, work in-process surprisingly produces the further stretching, extension in a thickness direction of this vertical slight crack, and thus work in-process should likely separate by brittle base integrally. In addition, when being namely easy to the procedure of processing not carrying out substrate between forming step and the cut-out step of substrate of line, generally needing conveyance or keeping substrate after the forming step of line and before the cut-out step of substrate, now substrate is also unexpectedly cut off sometimes.

For solving described problem, present inventor develops cut-out technology alone. According to this technology, it is initially formed the line not having the position that brittle base is cut off by crackled trench line as regulation in underface. By being formed with trench line and position that brittle base is cut off by regulation. Thereafter, as long as the underface maintaining trench line is absent from the state of slight crack, then the cut-out along trench line it is not likely to produce. By using this state, it is possible to the prespecified position cut off by brittle base, and it is prevented from brittle base accidental amputation before the time point that should cut off.

As it has been described above, trench line is more difficult to produce the cut-out along it compared with common line. This situation mean prevent accidental amputation in useful, mean must carry out being suitable to for carrying out intentional cut-out its special handling but then. For simplifying the cutting-off method of brittle base, preferably this process is relatively easy to.

The present invention is the person of completing for solution problem above, its object is to provide a kind of cutting-off method that simple step can be utilized to carry out the brittle base along the cut-out not having crackled trench line in underface.

[solving the technological means of problem]

The cutting-off method of brittle base has steps of. Prepare to be provided with the brittle base on the surface with edge. Secondly, point of a knife is made point of a knife move on brittle base to brittle base pressing one side by one side. The step that point of a knife moves is made to include: by making point of a knife knock the step of the edge of brittle base and the position on edge and starting point formation breach; And make utilization form the step of breach by one side and knock the point of a knife of starting point and make point of a knife move from the teeth outwards to pressing one side on the surface of brittle base and on the surface of brittle base, produce plastic deformation, another location thus from starting point to surface and terminal form the step of the 1st trench line. Forming the step of the 1st trench line is carry out in the way of the state that links and flawless state at the direction continuity from above intersected with the 1st trench line obtaining the underface brittle base at the 1st trench line. Secondly, make the slight crack being starting point with breach stretch from starting point to terminal by brittle base is applied stress, thus cut off brittle base along the 1st trench line.

[effect of invention]

According to the present invention, use the breach formed at the edge of brittle base as the opportunity making slight crack stretch along the 1st trench line. This breach only knocks the edge of brittle base by the point of a knife moved when initially forming 1 trench line and is formed. It is possible to utilize simple step to carry out the cut-out of brittle base along the 1st trench line.

Accompanying drawing explanation

Fig. 1 is the flow chart of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Fig. 2 is the top view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Fig. 3 (A)��(C) is the diagrammatic partial sectional view of the step of the cutting-off method of the brittle base sequentially representing embodiments of the present invention 1 on the visual field along the line III-III of Fig. 2.

Fig. 4 is the general profile chart of the line IVA-IVA along Fig. 2, and (A) indicates that the figure of the composition of the trench line under flawless state, and (B) is the sectional view of state representing under the identical visual field and being formed immediately below with slight crack line at trench line.

Fig. 5 is the top view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Fig. 6 is the side view of the composition of scriber being diagrammatically denoted by the cutting-off method of the brittle base of embodiments of the present invention 1 using.

Fig. 7 (A) is the front view of the composition being diagrammatically denoted by the stitch marker of Fig. 6 and pin, and (B) is the magnified partial view of Fig. 7 (A).

Fig. 8 is the sectional view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Fig. 9 is the sectional view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Figure 10 is the side view schematically under the visual field corresponding with the arrow X of Fig. 9.

Figure 11 is the sectional view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Figure 12 is the sectional view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 1.

Figure 13 is the top view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 2.

Figure 14 is the top view of a step of the cutting-off method of the brittle base being suddenly diagrammatically denoted by embodiments of the present invention 3.

Figure 15 is the top view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 3.

Figure 16 is the top view of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 3.

Figure 17 (A)��(D) is the top partial view diagram of a step of the cutting-off method of the brittle base being diagrammatically denoted by embodiments of the present invention 4.

Figure 18 (A) is the diagrammatic partial sectional view of the line XVIIIA-XVIIIA along Figure 17 (A), (B) it is the diagrammatic partial sectional view of line XVIIIB-XVIIIB along Figure 17 (B), (C) it is the diagrammatic partial sectional view of line XVIIIC-XVIIIC along Figure 17 (C), and (D) is the diagrammatic partial sectional view of the line XVIIID-XVIIID along Figure 17 (D).

Figure 19 (A) is the side view of the composition of scriber being diagrammatically denoted by the cutting-off method of the brittle base of embodiments of the present invention 5 using, and (B) is and the upward view of the point of a knife under corresponding for the arrow XIX visual field of Figure 19 (A).

Figure 20 (A) is the side view of the composition of the scriber used in the cutting-off method of the brittle base of the variation being diagrammatically denoted by embodiments of the present invention 5, and (B) is and the upward view of the point of a knife under corresponding for the arrow XX visual field of Figure 20 (A).

Detailed description of the invention

Hereinafter, illustrate based on the graphic cutting-off method to the brittle base of the embodiments of the present invention. It addition, same or equivalent part to be enclosed identical reference number in below figure formula, and do not repeat its explanation.

(embodiment 1)

Fig. 1 is the flow chart of the cutting-off method of the glass substrate 11 (brittle base) being diagrammatically denoted by present embodiment. Fig. 2 is the top view being diagrammatically denoted by after step S20 (Fig. 1) state soon. Fig. 3 (A)��(C) is the diagrammatic partial sectional view sequentially representing step under the visual field along the line III-III of Fig. 2.

First glass substrate 11 (Fig. 1: step S10) is prepared. Glass substrate 11 includes upper surface SF1 (surface) and the lower surface SF2 with edge EG. Additionally, glass substrate 11 has the thickness direction DT vertical with upper surface SF1. Additionally, prepare the scriber with the stitch marker 51R being provided with point of a knife. Hereafter the detailed content of scriber is described.

Secondly, by the movement of the stitch marker 51R shown in arrow M1 (Fig. 3 (A)), and make the point of a knife of this stitch marker 51R be contacted with the edge EG of upper surface SF1 of glass substrate 11. Secondly, point of a knife is made point of a knife move (Fig. 1: step S20) on glass substrate 11 to pressing one side on glass substrate 11 by one side. Hereinafter, this step is illustrated.

First, by the movement of the stitch marker 51R shown in arrow M2 (Fig. 3 (B)), and point of a knife is made to knock the edge EG of glass substrate 11. Thus, the position on edge EG and starting point N1 (Fig. 2) form breach CP (Fig. 3 (C)) (Fig. 1: step S20C).

Secondly, the point of a knife knocking starting point N1 by forming the step of breach CP as described is pressed by one side on the upper surface SF1 of glass substrate 11, one side, as Suo Shi arrow M3 (Fig. 3 (C)), makes the stitch marker 51R being provided with point of a knife move on upper surface SF1. Thus, the upper surface SF1 of glass substrate 11 produces plastic deformation. Its result, is formed with trench line TL (the 1st trench line) (Fig. 1: step S20T) from starting point N1 to the another location upper surface SF1 and terminal N3.

With reference to Fig. 4 (A), formed the step of trench line TL by obtain trench line TL underface glass substrate 11 with the trench line TL direction DC continuity from above intersected carry out in the way of the state that links and flawless state. Under flawless state, although utilize and be plastically deformed trench line TL, but do not form the slight crack along this trench line TL. Thus, even if glass substrate 11 is applied bending moment, it is not easy to produce the cut-out along trench line TL. For obtaining flawless state, as long as not making the load that point of a knife presses on glass substrate 11 become excessive. It addition, Fig. 4 (B) represents the comparative example of Fig. 4 (A), and represent and be formed with trench line TL and along this trench line TL state to the slight crack extended immediately below it and slight crack line CL.

By the forming step of repeatedly described trench line TL, and the trench line of desired quantity can be obtained. Fig. 2 illustrates the situation being formed with 3 trench line TL.

With reference to Fig. 5, next carries out cutting off step. Specifically, make to stretch with the breach CP slight crack being starting point from starting point N1 to terminal N3 by glass substrate 11 is applied stress, thus along trench line TL breaking glass substrate 11 (Fig. 1: step S30). Cut off step to carry out repeatedly according to the quantity of trench line TL. It addition, hereafter the more detailed method cutting off step is described.

By above step along trench line TL breaking glass substrate 11.

With reference to Fig. 6 and Fig. 7, next the detailed content of the scriber 50R with described stitch marker 51R is carried out following description.

Glass substrate 11 mobile is rule relative to glass substrate 11 relative property by scriber 50R by being installed on scribe head (not shown). Scriber 50R has stitch marker 51R, bearing 52R and pin 53. Stitch marker 51R has substantially discoid shape, and its diameter is typically for number about mm. Stitch marker 51R is able to be held in bearing 52R via pin 53 rotatably around rotating shaft RX.

Stitch marker 51R has the peripheral part PF being provided with point of a knife. Peripheral part PF is circular extension around rotating shaft RX. As shown in peripheral part PF such as Fig. 7 (A), visual rank is risen steeply in crest line shape, thus constitute the point of a knife comprising crest line with inclined plane. On the other hand, in microscope rank, the crest line at stitch marker 51R part (relatively 2 chain lines of Fig. 7 (B) are on the lower) the peripheral part PF actually acted on by invading in glass substrate 11 has fine surface configuration MS. Surface configuration MS is (Fig. 7 (B)) under forward sight, it is preferable that in the curve shape with limited radius of curvature.

Stitch marker 51R uses the hard materials such as superhard alloy, sintered diamond, polycrystalline diamond or single-crystal diamond to be formed. In the viewpoint of the surface roughness reducing described crest line and inclined plane, stitch marker 51R entirety also can be made up of single-crystal diamond.

It follows that the using method of scriber 50R is illustrated. By making the point of a knife of scriber 50R move (with reference to Fig. 6) on the surface SF1 of glass substrate 11, and carry out being formed the line of trench line TL (Fig. 3 (C)). Now, load F point of a knife applied has composition Fi in parallel for the thickness direction DT vertical component Fp with glass substrate 11 and the face parallel with upper surface SF1. The direction of advance DB of the stitch marker 51R caused by the rolling (arrow RT) of stitch marker 51R is identical with the direction of composition Fi in face. In other words, the formation direction of trench line TL is identical with the direction of composition Fi in face.

It follows that the cut-out step being particularly suited for present embodiment is carried out following description.

With reference to Fig. 8, by the upper surface SF1 of glass substrate 11 across sark 81 with microscope carrier 80 to in the way of, will be formed with the glass substrate 11 (Fig. 2) of trench line TL and be positioned on microscope carrier 80 across sark 81. The material that the material that sark 81 comprises relatively glass substrate 11 and microscope carrier 80 is more easily deformed.

Prepare with reference to Fig. 9 and Figure 10 to cut off bar 85. Cut off bar 85 as shown in Figure 10 as, it is preferable that there is shape prominent in the way of the surface can press glass substrate 11 locally, there is the shape of substantially V shape in Fig. 10. As shown in Figure 9, this ledge linearly extends.

Secondly, cut-out bar 85 is made to be contacted with a part of lower surface SF2 for glass substrate 11. In this contact portion face SF2 from the table below in a thickness direction (longitudinal direction of Fig. 9) and breach CP to leave to part SF2C.

Secondly, as shown in arrow CT1, described contact portion extends along trench line TL, and towards to close to the side of part SF2C. When described initial contact, or the extension of the contact portion by continuing thereafter, and produce to cut off bar 85 be contacted with in lower surface SF2 with trench line TL to part and from breach CP to the state left of part.

With reference to Figure 11, as shown in arrow CT2 as described in, contact portion arrival is to part SF2C. In other words, cut off bar 85 and first trench line TL is applied stress by described step, breach CP is applied stress thereafter and then also simultaneously. Made slight crack stretch (the arrow PR with reference to Figure 12) from breach CP along trench line TL by this stress.

The cut-out (Fig. 5) of glass substrate 11 is carried out by above cut-out step.

According to present embodiment, use the breach CP formed on the edge EG of glass substrate 11 as making slight crack along the trench line TL opportunity stretched. This breach CP utilizes the point of a knife moved when initially forming trench line TL to knock the edge EG of glass substrate 11 and formed. Thus available simple step carries out the cut-out of glass substrate 11 along trench line TL.

Additionally, in the formation of breach CP, the point of a knife that uses stitch marker 51R, the point of a knife namely rotated. Thus, compared with the situation of the point of a knife fixed used as diamond point, the damage suffered by point of a knife when point of a knife knocks the edge EG of glass substrate 11 can be suppressed.

(embodiment 2)

With reference to Figure 13, in the present embodiment, carry out being formed HR between high load region and as the step of a part of trench line TL and form between low load region LR as the step of a part of trench line TL. Between high load region, HR is formed at the INTRM intermediate point N2 from starting point N1 to starting point N1 and between terminal N3. Between low load region, LR is formed at from till INTRM intermediate point N2 N3 to terminal. Forming the load in the step of LR, point of a knife applied between low load region, lower than forming the load used in the step of HR between high load region.

It addition, as the composition except described, due to roughly the same with the composition of described embodiment 1, therefore identical or corresponding key element enclosed identical symbol, and does not repeat its explanation.

According to present embodiment, trench line TL utilize the plastic deformation caused by high load capacity to be formed from HR between the breach CP part extended and high load region. Thus, with the plastic deformation utilized caused by the underload used in LR between low load region and compared with forming all situations of trench line TL, it is easy to produce slight crack from breach CP to trench line TL. Thus in cutting off step (Fig. 8��Figure 12), it is possible to produce more effectively with the breach CP slight crack being opportunity. Thereby, it is possible to carry out the stretching, extension using this slight crack more effectively along trench line TL breaking glass substrate 11.

Additionally terminal N3 leaves from the edge EG of glass substrate 11 in fig. 2, but terminal N3 may be alternatively located on the edge EG of glass substrate 11 (on the edge on the right of the surface SF1 of glass substrate 11 in the example of Fig. 2).

(embodiment 3)

With reference to Figure 14, first pass through the method roughly the same with embodiment 1, be formed with the trench line TL till its starting point is attended by breach CP and extends to terminal towards direction DL.

With reference to Figure 15, secondly one side makes point of a knife pressing on the upper surface SF1 of glass substrate 11 by applying load, and one side makes point of a knife move towards direction DM on upper surface SF1. On the upper surface SF1 of glass substrate 11, thus produce plastic deformation, thus being formed with trench line TM (the 2nd trench line) between T1 and T6. The formation of trench line TM is identical with method illustrated by trench line TL (Fig. 4 (A)) in embodiment 1, carries out in the way of trench line TM obtains flawless state.

Put between T1 and some T2, put between T3 and T4 and be formed with between high load region between some T5 and T6 HR and be used as a part of trench line TM. It is formed with between low load region LR between some T2 and T3, between some T4 and T5 and is used as a part of trench line TM. Forming the load in the step of HR, point of a knife applied between high load region, higher than forming the load used in the step of LR between low load region. Between high load region, HR intersects with trench line TL. Additionally the forming method of trench line TM can use the method identical with the forming method of trench line TL.

Secondly, by the cut-out step identical with embodiment 1, and make slight crack stretch along trench line TL with breach CP for starting point. Thus along trench line TL breaking glass substrate 11 (Figure 16). It is cut to opportunity, slight crack only HR stretching, extension between the high load region in trench line TM with this. Its result, is formed with slight crack line CL along a part of trench line TM. Specifically, by cutting off and in part between newly generated limit and the one in a pair INTRM intermediate point on this limit, between high load region, HR is formed with slight crack line CL.

It addition, by cut off and in part between newly generated limit and the another one in a pair INTRM intermediate point on this limit, even if HR is also difficult to form slight crack line CL between high load region. Its reason is in that, slight crack exists direction dependence along the stretching, extension easness of slight crack line CL. Speculate the distribution due to the internal stress produced when glass substrate 11 is rule of the direction dependence.

Between high load region in HR, as Suo Shi Fig. 4 (B), glass substrate 11, in the underface of trench line TM, disconnects successional link because of slight crack line CL on the direction DC intersected with the bearing of trend of trench line TM. Herein " successional link ", the link not cut off by slight crack is in other words referred to. It addition, when successional link opened as described above, the part of glass substrate 11 also can contact via the slight crack of slight crack line CL each other.

Secondly, by the cut-out step identical with embodiment 1, glass substrate 11 applying stress, thus slight crack stretches along LR between low load region with slight crack line CL for starting point. Thus, along trench line TM breaking glass substrate 11. That is, except the cut-out along described trench line TL, the cut-out along trench line TM is also carried out.

According to present embodiment, the effect roughly the same with embodiment 1 can be obtained. Furthermore it is possible to specified the position of breaking glass substrate 11 by trench line TL and the trench line TM that intersects with it.

(embodiment 4)

With reference to Figure 17 (A) and Figure 18 (A), first, the shearing device of the glass substrate 11 of present embodiment is illustrated.

Shearing device has scriber 50R, carrier 70, cuts off roller 61 and help roll 62. Carrier 70 one side make the upper surface SF1 of glass substrate 11 expose one side by glass substrate 11 towards direction CV transport. Scriber 50R is fixed on scribe head (not shown), by contacting with the glass substrate 11 utilizing carrier 70 to move, the upper surface SF1 of glass substrate 11 is rule.

Cutting off roller 61 is the component carrying out cutting off step and pressing the lower surface SF2 of glass substrate 11 locally. Help roll 62 is to the roller being contacted with glass substrate 11 in the way of pressing on lower surface SF2 on opposing face and upper surface SF1 by available cut-out roller 61. In the way of glass substrate 11 can being made stably to bend by cutting off the pressing of roller 61, it is arranged in the position different from cutting off roller 61, it is preferable that to configure in the way of cutting off roller in rotating shaft direction (longitudinal direction of Figure 17 (A)) at the upper help roll 62 of plane figure (Figure 17 (A)).

It addition, for being prone to observation figure in Figure 17 (A) and Figure 18 (A), and utilize 2 chain lines to schematically show carrier 70. Also identical in other figs..

It follows that the cutting-off method utilizing described shearing device is carried out following description.

Along with glass substrate 11 is transported to conveyance direction CV by carrier 70 to the movement of conveyance direction CV. Thus, the point of a knife of the stitch marker 51R that scriber 50R has knocks upper surface SF1 from the edge EG of glass substrate 11. Knocked by this and be formed with breach CP at the edge EG of glass substrate 11.

Knock point of a knife on upper surface SF1 by the glass substrate 11 movement to conveyance direction CV, and relative to glass substrate 11 upper surface SF1 relative property to being that rightabout moves with conveyance direction CV. The moving direction of the point of a knife relative property relative to upper surface SF1 is the direction corresponding with direction DB (Figure 17 (A)). In this moves, on upper surface SF1, it is formed with the position with breach CP by point of a knife is applied load as HR between the high load region of the trench line TL of starting point.

With reference to Figure 17 (B) and Figure 18 (B), so that after conveyance glass substrate 11, make the load that point of a knife is applied less than the load in HR between high load region, thus initially form LR between the low load region of trench line TL.

With reference to Figure 17 (C) and Figure 18 (C), by so that conveyance glass substrate 11 and carrying out utilize and cut off applying being provided with between the high load region of breach CP the stress of HR of roller 61 and help roll 62. Thus, slight crack stretches from breach CP, and its result, between high load region, HR is formed with slight crack line CL. In Figure 18 (C), slight crack line CL is at the through glass substrate 11 of thickness direction and till arriving lower surface SF2.

With reference to Figure 17 (D) and Figure 18 (D), by so that conveyance glass substrate 11 and starting with cut off roller 61 and help roll 62 the stress of LR between low load region is applied. Till slight crack stretches, from described slight crack line CL, the part being stressed applying until between low load region LR. Hereinafter, along with the conveyance carrying out glass substrate 11, and slight crack stretches in LR between low load region.

When slight crack stretches, LR between low load region is made to extend by utilizing scriber 50R to form LR between low load region. Thus, the terminal of a trench line TL is away from starting point, and one side carries out the cut-out of glass substrate 11 according to the trench line TL length extended. Namely the successional cut-out of glass substrate 11 is carried out.

According to present embodiment, it is possible to use and carry out seriality ground breaking glass substrate 11 with the breach CP slight crack stretched for opportunity. Thereby, it is possible to the not breaking glass substrate 11 by the restriction of length of glass substrate 11.

Additionally, different from HR between high load region, and between low load region in LR, slight crack is difficult to extend to the part being not yet subject to utilizing the stress cutting off roller 61 to apply. Thus, in the continuous cutting-off step shown in Figure 18 (D), can prevent slight crack from arriving point of a knife or and then exceeding the position of point of a knife and stretch. Thereby, it is possible to stably carry out the successional cut-out of glass substrate 11.

(embodiment 5)

With reference to Figure 19 (A) and (B), damage when point of a knife knocks the edge EG of glass substrate 11 does not become special problem, it is possible to use there is the scriber 50 (Figure 19 (A) and (B)) of fixing point of a knife.

It is mobile and glass substrate 11 is rule relative to glass substrate 11 relative property that scriber 50 is installed on scribe head (not shown) by utilization. Scriber 50 has point of a knife 51 and handle 52. Point of a knife 51 is held in handle 52.

Point of a knife 51 is provided with end face SD1 (the 1st face) and surrounds multiple of end face SD1. These multiple bread are containing side SD2 (the 2nd face) and side SD3 (the 3rd face). End face SD1, side SD2 and SD3 are towards mutually different direction, and mutually adjacent. Point of a knife 51 has the summit at end face SD1, side SD2 and SD3 interflow, is made up of the jut PP of point of a knife 51 this summit. Additionally, side SD2 and SD3 forms the crest line of the sidepiece PS constituting point of a knife 51. Sidepiece PS is that wire extends from jut PP. Additionally, sidepiece PS is crest line as mentioned above, therefore there is the convex form extended in wire.

Point of a knife 51 is preferably diamond point. Namely preferred point of a knife 51 is made up of diamond. In this situation, it is possible to easily make hardness higher and make surface roughness less. More preferably point of a knife 51 is made up of single-crystal diamond. In crystallography, and then preferably end face SD1 is that { 001} face, each of side SD2 and SD3 is { 111} face. In this situation, although side SD2 and SD3 has different direction, but it is the crystal plane of equivalence mutually in crystallography.

It addition, be used as not for the diamond of monocrystalline, for instance, it is possible to use utilize the polycrystalline diamond that CVD (ChemicalVaporDeposition, chemical vapour deposition (CVD)) method synthesizes. Or, it is possible to use the polycrystalline diamond being sintered when not comprising iron family element etc. in conjunction with material by fine-grain graphite or non-graphite shape carbon, or make, in conjunction with material, the sintered diamond that diamond particles combines by iron family element etc.

Handle 52 axially AX extends. Point of a knife 51 is preferably arranged on handle 52 in the way of the normal direction of end face SD1 is approximately along direction of principal axis AX.

In using the formation of trench line TL of scriber 50, the point of a knife 51 being pressed is made to slide towards direction DB on upper surface SF1. Direction DB be with by the direction in opposite direction on from jut PP along the sidepiece PS direction projection extended to upper surface SF1, correspond roughly to by direction of principal axis AX to the direction in opposite direction of projection on upper surface SF1.

It addition, in need not forming breach CP at the edge EG of glass substrate 11 when such as forming trench line TM (Figure 15), point of a knife 51 also can slide to direction DB opposite direction DA. In this situation, point of a knife moving direction on the upper surface SF1 of glass substrate 11 is set on the contrary (being and direction DM opposite direction in fig .15).

Scriber 50R and scriber 50 are used separately also dependent on trench line. Especially, in embodiment 3, it is possible to carried out the formation of trench line TL by scriber 50R, on the other hand, carry out being not accompanied by the formation of the trench line TM knocked of point of a knife by scriber 50.

With reference to Figure 20 (A) and (B), it is possible to use scriber 50v is used as modified embodiment of the present embodiment. The point of a knife 51v of scriber 50v is in having summit and the cone shape of taper seat SC. The jut PPv of point of a knife 51v is made up of summit. The sidepiece PSv of point of a knife is constituted from summit along the imaginary line (dotted line of Figure 20 (B)) extended on taper seat SC. Thus, sidepiece PSv has the convex form extended in wire.

The cutting-off method of the brittle base of described each embodiment special can be applied to glass substrate goodly, but brittle base also can be made up of the material except glass. Such as the material except glass, it is possible to use pottery, silicon, compound semiconductor, sapphire or quartz.

[explanation of symbol]

N1 starting point

N2 INTRM intermediate point

N3 terminal

EG edge

CL slight crack line

CP breach

SF1 upper surface (surface)

Between HR high load region

SF2 lower surface

Between LR low load region

TL trench line (the 1st trench line)

TM trench line (the 2nd trench line)

11 glass substrates (brittle base)

50,50R, 50v scriber

51,51v point of a knife

51R stitch marker

52 handles

52R bearing

53 pins

61 cut off roller

62 help rolls

70 carriers

80 microscope carriers

81 sarks

85 cut off bar

Claims

1. a cutting-off method for brittle base, comprising:

Prepare to be provided with the step of the brittle base on the surface with edge; And

Point of a knife is made described point of a knife step of movement on described brittle base to described brittle base pressing one side by one side; And make the step that described point of a knife moves include:

By making described point of a knife knock the step of the described edge of described brittle base and the position on described edge and starting point formation breach; And

To utilize, by one side, the step forming described breach and knock the described point of a knife of described starting point and make described point of a knife move on said surface to pressing one side on the described surface of described brittle base and on the described surface of described brittle base, produce plastic deformation, thus from described starting point to the another location described surface and the step forming the 1st trench line terminal; And the step forming described 1st trench line is to be formed in the way of the state that links and flawless state at the direction continuity from above intersected with described 1st trench line obtaining the described brittle base in underface at described 1st trench line; And the cutting-off method of this brittle base and then comprise the steps:

Make the slight crack being starting point with described breach stretch from described starting point to described terminal by described brittle base is applied stress, thus cut off described brittle base along described 1st trench line and cut off.

2. the cutting-off method of brittle base according to claim 1, wherein making the step that described point of a knife moves is use to have the stitch marker of peripheral part around rotating shaft and carry out, and described point of a knife is arranged on described peripheral part.

3. the cutting-off method of brittle base according to claim 1, the step being formed with described 1st trench line includes:

To the INTRM intermediate point between described starting point and described terminal, the step of a part as described 1st trench line is formed between high load region from described starting point; And

To described terminal, the step of a part as described 1st trench line is formed between low load region from described INTRM intermediate point; And the load in the step between the described low load region of formation, described point of a knife applied, lower than the load used in the step formed between described high load region.

4. the cutting-off method of brittle base according to claim 2, the step being formed with described 1st trench line includes:

5. the cutting-off method of brittle base according to any one of claim 1 to 4, wherein and then comprise the steps:

Utilize applying load to make described point of a knife move on said surface to pressing one side on the described surface of described brittle base at point of a knife by one side, and on the described surface of described brittle base, produce plastic deformation, be consequently formed the 2nd trench line; And the step forming described 2nd trench line is to carry out in the way of the state that links and flawless state at the direction continuity from above intersected with described 2nd trench line obtaining the described brittle base in underface at described 2nd trench line; And the step forming described 2nd trench line includes:

As the step of a part for described 2nd trench line between formation low load region; And

As the step of a part for described 2nd trench line between formation high load region; And the load in the step between the described high load region of formation, described point of a knife applied, higher than the load used in the step formed between described low load region, intersect with described 1st trench line between described high load region; The cutting-off method of this brittle base and then include:

Make slight crack only stretch between the described high load region in described 2nd trench line with the step along the described 1st trench line described brittle base of cut-out for opportunity, thus form the step of slight crack line along a part for described 2nd trench line; And

Make slight crack stretch along between described low load region with described slight crack line for starting point by described brittle base is applied stress, thus cut off the step of described brittle base along described 2nd trench line.

6. the cutting-off method of brittle base according to any one of claim 1 to 4, wherein in the step cutting off described brittle base along described 1st trench line, when described slight crack stretches, described 1st trench line is made to extend by forming the step of described 1st trench line.