CN105593398B - In或In合金溅射靶及其制造方法 - Google Patents

In或In合金溅射靶及其制造方法 Download PDF

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Publication number
CN105593398B
CN105593398B CN201480054518.1A CN201480054518A CN105593398B CN 105593398 B CN105593398 B CN 105593398B CN 201480054518 A CN201480054518 A CN 201480054518A CN 105593398 B CN105593398 B CN 105593398B
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China
Prior art keywords
alloy
sputtering targets
layers
target
backing plate
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CN201480054518.1A
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English (en)
Chinese (zh)
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CN105593398A (zh
Inventor
陆田雄也
梅本启太
张守斌
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication of CN105593398A publication Critical patent/CN105593398A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN201480054518.1A 2013-12-09 2014-12-04 In或In合金溅射靶及其制造方法 Active CN105593398B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-253986 2013-12-09
JP2013253986A JP5773335B2 (ja) 2013-12-09 2013-12-09 Ｉｎ又はＩｎ合金スパッタリングターゲット及びその製造方法
PCT/JP2014/082180 WO2015087788A1 (ja) 2013-12-09 2014-12-04 Ｉｎ又はＩｎ合金スパッタリングターゲット及びその製造方法

Publications (2)

Publication Number Publication Date
CN105593398A CN105593398A (zh) 2016-05-18
CN105593398B true CN105593398B (zh) 2017-07-25

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ID=53371093

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CN201480054518.1A Active CN105593398B (zh) 2013-12-09 2014-12-04 In或In合金溅射靶及其制造方法

Country Status (4)

Country Link
JP (1) JP5773335B2 (ja)
CN (1) CN105593398B (ja)
TW (1) TWI557236B (ja)
WO (1) WO2015087788A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6350969B2 (ja) * 2015-07-06 2018-07-04 三菱マテリアル株式会社 Ｉｎ又はＩｎ合金スパッタリングターゲット及びその製造方法
JP6202131B1 (ja) * 2016-04-12 2017-09-27 三菱マテリアル株式会社 銅合金製バッキングチューブ及び銅合金製バッキングチューブの製造方法
CN111441021A (zh) * 2020-05-25 2020-07-24 先导薄膜材料（广东）有限公司 一种旋转靶的制备方法及其喷涂设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0780634A (ja) * 1993-09-08 1995-03-28 Sanyo Special Steel Co Ltd ろう付け方法
CN1880492A (zh) * 2005-06-15 2006-12-20 三井金属矿业株式会社 溅射靶制造用焊接合金及使用其制造的溅射靶
JP2010024474A (ja) * 2008-07-16 2010-02-04 Sumitomo Metal Mining Co Ltd インジウムターゲットの製造方法
JP2012224910A (ja) * 2011-04-19 2012-11-15 Jx Nippon Mining & Metals Corp 積層構造体及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593082A (en) * 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0780634A (ja) * 1993-09-08 1995-03-28 Sanyo Special Steel Co Ltd ろう付け方法
CN1880492A (zh) * 2005-06-15 2006-12-20 三井金属矿业株式会社 溅射靶制造用焊接合金及使用其制造的溅射靶
JP2010024474A (ja) * 2008-07-16 2010-02-04 Sumitomo Metal Mining Co Ltd インジウムターゲットの製造方法
JP2012224910A (ja) * 2011-04-19 2012-11-15 Jx Nippon Mining & Metals Corp 積層構造体及びその製造方法

Also Published As

Publication number Publication date
JP2015113474A (ja) 2015-06-22
TW201529863A (zh) 2015-08-01
WO2015087788A1 (ja) 2015-06-18
JP5773335B2 (ja) 2015-09-02
CN105593398A (zh) 2016-05-18
TWI557236B (zh) 2016-11-11

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