CN105590885A - Wafer Taping - Google Patents
Wafer Taping Download PDFInfo
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- CN105590885A CN105590885A CN201610090152.4A CN201610090152A CN105590885A CN 105590885 A CN105590885 A CN 105590885A CN 201610090152 A CN201610090152 A CN 201610090152A CN 105590885 A CN105590885 A CN 105590885A
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- substrate
- band
- pressure
- region
- nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Abstract
The invention relates to a wafer taping. A method for applying tape to a substrate can include positioning a tape proximate and substantially parallel to a surface of a substrate. A pressure source can be configured to apply pressure to a region of tape smaller than the surface in both an x direction and y direction, the x and y directions being parallel to the surface and perpendicular to one another. For example, the pressure source can be a stream of fluid such as air. Pressure can be applied to a side of the tape opposite the surface in a region smaller than the surface to cause the tape to adhere to the substrate opposite the region. The region can be moved relative to the substrate in an outward radial direction while applying the pressure. The region can be moved such that no unadhered region of tape is enclosed by any adhered region of tape.
Description
The application is that application number is 200980156291.0, the applying date is on December 7th, 2009, inventionThe divisional application of the application for a patent for invention of title " wafer taping ".
Technical field
This description relate to for band being pasted to the equipment of substrate such as semiconductor wafer substrate, system andMethod.
Background technology
Thereby band can paste to protection surface, surface, and a side or the bilateral of band can comprise adhesive. For example,During the manufacture of semiconductor wafer substrate, can be by band protected avoiding of the surface of this substrate destroysSimultaneously in apparent surface's executable operations. In the time that apparent surface comprises the feature of fragility, such as microelectronics machineTool system (MEMS) structure, during adhesive tape, can only be bearing in outer edge by substrate ideallyOr near. Thereby the major part that the surface that band is rolled to substrate generally need to be supported to apparent surface is avoided by pastingThe power applying during band causes substrate crushing or disconnection.
Summary of the invention
In one aspect, system described herein, equipment and method comprise a kind of for band is labelled to substrateMethod, comprising: the surface that band is positioned to adjacent to and is arranged essentially parallel to substrate. Pressure can quiltBe applied in the region that is less than described surface of a side relative with described surface of described band, thereby causeDescribed band adheres to the substrate relative with described region. Described region along outward radial direction with respect to describedSubstrate moves, and exerts pressure simultaneously.
On the other hand, a kind ofly comprise supporting member for the equipment that band is labelled to substrate, described supporting member is joinedPut to keep substrate and band is remained adjacent to the surface of described substrate and with respect to described substrateFixing. Pressure source is configured to y direction, pressure is applied to described surface of being less than of described band in the x-directionRegion, described x and y direction are parallel to described surface and are perpendicular to one another. Motor is connected to describedHold part and described pressure source one or more and be configured to move with respect to described substrate described inRegion.
On the other hand, a kind ofly comprise for the system that band is labelled to substrate the substrate that is configured to keep substrateSupporting member. Configurable band is remained adjacent to and be arranged essentially parallel to described substrate with supporting memberSurface. This system can comprise the little of a side relative with described surface for pressure being applied to described bandIn the device in the region of described substrate. This system also can comprise the device for mobile described region.
Embodiment can comprise the one or more of following characteristics. Thereby described region can be moved band notAdhere to region not by with any adhesive area surround. Described band can adhere to the whole surface of substrate.Mobile described region can be along outside spirality, and this region can start to move near the center of substrateMoving. Mobile described region can comprise the described substrate of rotation and band. Described rotation can be in about 20 turning/Divide the speed between (rpm) and about 90rpm, and can regulate. Mobile described region also can be wrappedDraw together with respect to region described in substrate translation. Exert pressure and can comprise with respect to described band and described surfaceA relative side direct fluid, this fluid can be air. Exert pressure and can comprise with respect to described bandContact soccer star bearing. Institute's applied pressure can be in about 5.0 pounds/square inch (psi) with aboutBetween 40psi. The area in described region can be described substrate surperficial surface area approximatelyBetween 0.004% and about 10%. The surface that described band can be positioned at the described substrate of distance is about 0.5Millimeter and between about 3.0 millimeters.
In some embodiments, described supporting member is configurable to rotate described substrate around rotation.Described pressure source is configurable with along substantially along the direction translation perpendicular to described rotation. DescribedPressure source comprises nozzle, described nozzle arrangement with guiding liquid stream with respect to described band and described surperficial phaseA right side. The outlet of described nozzle can be positioned on that side relative with described surface of the described band of distanceBetween about 0.5 millimeter and about 3.0 millimeters. Filter deployment is to filter described liquid stream. Described bandSheet is positioned at apart between about 0.5 millimeter and about 3.0 millimeters of described substrate.
Brief description of the drawings
Figure 1A is the indicative icon that waits axonometric drawing of adhesive tape equipment.
Figure 1B is the indicative icon of the front view of the adhesive tape equipment of Figure 1A.
Fig. 1 C is the indicative icon of a part for the adhesive tape equipment of Figure 1A.
Fig. 1 D is the indicative icon of the plan view of band.
Fig. 2 is the flow chart for the method for substrate adhesive tape.
Fig. 3 is the indicative icon of fluid delivery system.
Fig. 4 be the adhesive tape equipment during the part for the process of substrate adhesive tape plane schematicallyDiagram.
Fig. 5 A and 5B are the indicative icons of the part of alternative adhesive tape equipment.
Fig. 6 is the flow chart for the method for substrate adhesive tape.
In each accompanying drawing, similarly Reference numeral refers to similar element.
Detailed description of the invention
A kind of adhesive tape equipment can comprise movably pressure source. This adhesive tape equipment also can comprise and being configured to bandBe positioned to the band adjacent to substrate surface. This pressure source can comprise this base that is less than that pressure is applied to bandMechanism on the region of plate. For example, this pressure source can comprise nozzle, be configured to by liquid conductance draw towardsBand, ball bearing, or some other suitable mechanisms. This adhesive tape equipment can comprise that being configured to rotation is somebody's turn to doThe rotor of substrate and be configured to radially above described band this pressure source of translation pressure arm. This pressureThereby source can helical adhere to all substrates or substrate by this band along abducentA part.
With reference to Figure 1A, adhesive tape equipment 100 can comprise scaffold 110. Support plate 114 can be connected toScaffold 110 and be configured to supporting rotor base portion 118. This rotor base portion 118 can be rotatablySupporting rotor 120 (referring to Figure 1B), it is configurable to rotate around rotation 124. Rotor base portion118 and the example of rotor 120 can comprise bearing or " turntable " (not shown), by JapanIKO/NipponThompsonCo., Ltd. manufactures. Rotor 120 is configurable with supporting substrates retainer 130With band supporting member 134.
Substrate holder 130 can supporting substrates 140. This substrate 140 can adopt for example semiconductor dieCircle, such as Silicon Wafer. This substrate can have upper surface 144 and basal surface 146 (referring to Fig. 1 C).Thereby this substrate holder 130 can adopt magnetic means to be mounted to rotor 120 promotes substrate holder130 change rapidly with another substrate holder (not shown). This quick-replaceable feature forThe adhesive tape substrate 140 of for example different size is all desirable. In some embodiments, substrate holder130 can be centered on rotation 124. This band supporting member 134 can be removably by band 150Be bearing in the side that substrate holder 130 is relative with rotor 120. This band supporting member 134 can beAdjustable, as discussed further below.
With reference to Fig. 1 D, it is porose 152 that band 150 can arrange, and for example, has the circle of interior diameter AHole, is greater than by the substrate 140 of adhesive tape. In some embodiments, aperture 136 is formed on substrate guarantorHold (referring to Figure 1B) in device 130, and in the time that substrate holder 130 is positioned on rotor 120, shouldBand supporting member 134 extends through aperture 146 and exceedes substrate holder 130, therefore allows band 150Remain on the fixed range of substrate holder 130 tops.
Band 150 can be by stretching out from substrate holder 130 alignment pin 154 (referring to Figure 1A and1B) locate with respect to substrate holder 130. Wherein some or all of alignment pin 154 can be assembledEnter the aligned recesses 156 (referring to Fig. 1 D) on band 150, make aperture 152 be positioned at substrate 140On. What in some embodiments, wherein some or all of alignment pin 154 can be against band 150Periphery P assembling. The configurable part that extends across aperture 152 with retainer belt 190 of band 150 (figure1C) adjacent to substrate 140, as further described. This band 150 can be configured to be with 190Remain fixing with respect to substrate 140.
With reference to Figure 1A and 1B, support plate 114 can support pressure arm sub-component 160, and it can comprise pressureThe arm of force 164, for positioning pressure applicator 168 in the side relative with substrate 140 with 190.In some embodiments, pressure applicator 168 is with respect to described band direct fluid. In this enforcement sideIn formula, pressure arm 164 can comprise nozzle 170. This nozzle 170 can be formed in pressure arm 164, allAs passed through mechanism. Selectively, this nozzle 170 can be formed as the structure separating, and is configured to be assembled to pressureThe arm of force 164 or be assemblied in pressure arm 164. For example, nozzle 170 can be machine-processed assembly parts, comprisesThreading (thread), is configured to coupling and is formed on the threading in pressure arm 164. Selectively, nozzle 170Can adopt the structure of separation, be configured to by compacting cooperation, frictional fit, be slidably matched, positioning screwNail, some combinations of these accessories or other suitable accessories and engage with pressure arm 164. Nozzle 170Can comprise the outlet 172 (Fig. 1 C) with diameter D. In some alternate embodiment, outlet 172 canThere is the shape outside circle, such as oval, square or some other suitable shapes.
Thereby pressure arm 164 can further be configured for fluid assembly parts 174 and engage with it. This fluidAssembly parts 174 can removably be connected to pressure arm 164, such as passing through the threaded accessory of tool, andAnd configurable to carry liquid, such as fluid under pressure, to nozzle 170. This liquid fittings 174 can wrapDraw together hangnail 175, be configured to flexible pipe 176 (Fig. 1 C) to be connected to accessory 174.
This pressure arm 164 can be supported by pressure arm supporting member 182. This pressure arm supporting member is configurable with canBy pressure arm actuator 186 along 184 translations of pressure arm rail. The example of this pressure arm actuator 186Comprise linear actuators, such as the IKO/NipponThompsonCo. by Japanese, those that Ltd. manufacturesActuator. This pressure arm actuator 186 can comprise motor, such as motor, such as electronically controlled motor.This pressure arm track 184 can support by support plate 114.
With reference to Fig. 1 C, liquid stream can flow (referring to arrow) by flexible pipe 176, assembly parts 174,Pressure arm 164 and nozzle 170. This pressure arm 164 be positioned at as shown in the figure nozzle with 190 tops-To-band apart from N place, itself then be positioned at the band of substrate 140 tops-extremely-substrate distance T place.
This nozzle-to-band can be by regulating this pressure arm supporting member 182 to be controlled apart from N. For example,This pressure arm 164 can be arranged on the minor axis (not shown) stretching out from pressure arm rail 184, pressure arm 164Position can be conditioned along minor axis. As another example, pad or distance piece (not shown) canBetween pressure arm 164 and pressure arm supporting member 182, insert or remove. As another example, motor is not (Illustrate) thus can extend vertically or retraction wall portion supporting member 182 regulates nozzles-to-band apart from N.As another example, nozzle-to-be with can be monitored apart from N, such as passing through sensor (not shown),This nozzle-can automatically be controlled apart from N to-band, such as by software and motor. This nozzle-To-band can be in about 0.5 millimeter (mm) and approximately between 3.0mm apart from N.
This band-extremely-substrate distance T can be controlled by accommodation zone ring bearing part 134, and it can wrapDraw together Fine adjustment knob (not shown). In some embodiments, band-extremely-substrate distance T can be monitored,Such as passing through sensor (not shown), this band supporting member 134 can automatically be controlled, such asBy software and motor. In some embodiments, band-to-substrate distance T can be in about 0.5mmAnd between about 3.0mm. This is with 190 upper surfaces 144 that can be positioned to be arranged essentially parallel to substrate.
Liquid stream 178 leaves outlet 172 and contact zones 190 as shown in the figure. Liquid stream 178 can be byPressure is applied to in the region R on 190, and this region is enough to cause being with 190 contact substrates 140, asBelow further discuss. Region R can relatively be less than overall substrate 140, and can be for exampleSurface area in substrate 140 about 0.004% and about 10% between. As further realityExample, for the substrate of diameter with 150 millimeters, this region can have about 1.0 millimeters with about 5.0Diameter between millimeter. In some embodiments, nozzle 170 can be configured to guide liquid stream 178Be substantially perpendicular to the upper surface 144 of substrate 140, as shown in Figure 1 C. In other embodiments,Nozzle 170 is configurable with for example 30 degree of the angle with respect to substrate 140 or miter angle degree guiding liquidBody stream 178. This angle can be for example leading edge or hangover angle. Namely, liquid stream 178 can leadAlong the direction perpendicular to the radius of substrate 140 or towards or with respect to the direction of rotation of substrate 140.
Fig. 2 is the schematic flow sheet for the method 200 of substrate 140 adhesive tapes. This substrate 140 can be arranged onOn rotor 120, such as on substrate holder 130 (step 210). This band being supported by band 150190 can be positioned to adjacent to substrate 140 (step 220). Rotor 220 can be around rotation 124Rotation (step 230). This rotation can be implemented as for example with about 20 revs/min (rpm) and about 90Rotating speed between rpm. Nozzle 170 can be positioned at is with 190 tops, such as along rotation 124(step 240). Before or after this location of nozzle 170 can be executed in and start rotor 120.Fluid can flow through nozzle 170 and can be guided on is with 190 places' (step 250). Nozzle 170Can be radially outwards from rotation 124 translations, such as perpendicular to rotation 124 (step 260).The speed of translation can be between about 25 millis m/min (mm/min) and about 45mm/min,Such as about 35mm/min. Rotating speed can change during translation, for example, thereby remains on along halfFootpath remains substantially constant (Fig. 4) by the tangential velocity of rotor 120 during such as radius R translation. ?After adhesive tape, substrate 140 can be with 190 and separate from band 150 around substrate 140 by cutting offOpen. Selectively, thus substrate 140 can be conducive to by being with 190 maintenances to connect this band 150Further treatment substrate 140 during process, for example, semiconductor fabrication or MEMS manufacture process.
With reference to Fig. 3, fluid system 300 can comprise fluid tank 310 by compression. At some embodimentsIn, fluid tank 310 by compression can adopt pressurized with fluid at some apogee (not shown), such asFluid feeder, for example, the feeder of compressed gas, then can be connected to fluid system 300 by fluid.In this embodiment, fluid tank 310 can be during using fluid system 300 little by little by compressionDepleted, this by compression fluid tank 310 can be replaced as required or be refilled. At some otherIn embodiment, fluid tank 310 by compression can be by pump or compressor (not shown) and by continuouslyGround or fill up discontinuously and pressurize. In the situation that fluid is liquid, pressure fluid case 310 can comprisePressing mechanism (not shown), such as barrier film or the piston of pressurization or elastic load, thereby applies pressureThe extremely fluid in fluid tank 310 by compression. Fluid in this fluid tank 310 by compression can be addedBe depressed between for example about 40 pounds/square inch (psi) and about 100psi. In some embodiments,Fluid in fluid tank 310 by compression can be compressed into about 100psi, and intermediate regulations device is not (Illustrate) thus can regulate pressure is that about 40psi is used by fluid system 300.
Fluid tank 310 by compression can be connected to optional filter assemblies 320 by fluid. This filterAssembly 320 can comprise bulky grain filter 330, comprises and is configured to from fluid capture or gets rid of relatively largeThe fluid sieve 334 of particle. It is 334 configurable to sift out relatively large particle from fluid that this fluid sieves. For example,Fluid sieve 334 openings that can have between about 0.5 micron and about 10 microns. In some enforcement sidesIn formula, the fluid in this fluid tank 310 by compression can be clean fluid, for example, does not haveOarse-grained fluid, such as clean air, such as clean dry air (CDA) or clean nitrogen, this streamBody sieve 334 can be omitted. This filter assemblies 320 also can comprise selectable fluid filter 340.This fluid filter 340 can be configured to remove relatively little particle from fluid. For example, fluid filter340 can remove the particle that is greater than about 0.003 micron, such as the particle that is greater than about 0.05 micron.Suitable filter can obtain from the PallCorporation of the EastHills in New York.
Fluid tank 310 can be connected to adjuster 350 by fluid, such as passing through optional filter assemblies320. Adjuster 350 can be configured to regulate pressure or the flow of the fluid that for example leaves adjuster 350.This adjuster 350 can adjust flux, pressure or the two. This adjuster 350 can be by adjuster controlDevice 354 processed is controlled, and its for example electrical or machinery is communicated with adjuster 350. In some embodiments,This adjustor controller 354 can adopt software control. This adjuster 350 can be connected to accessory by fluid174, such as passing through flexible pipe 176. This fluid accessories 174 can be connected to nozzle 170 by fluid, as above instituteState. Compressed fluid tank 310, filter assemblies 320 and adjuster 350 can pass through fluid systemPipeline 360 fluids are connected to each other. Flexible pipe 176 and fluid system pipeline 360 can be flexibility or non-Flexible and can comprise rubber tubing, copper pipe or some other suitable pipelines or pipeline groupClose.
Arrow in Fig. 3 illustrates the direction of liquid stream. Liquid can be from fluid tank 310 is mobile logical by compressionOverregulate device 350. From fluid tank 310 by compression flow through to the fluid of fluid conditioner 350 canWith optionally screened, filter or stand the two effect by selectable filter assemblies 320.Flow out adjuster 350 to the fluid of flexible pipe 176 for example can have approximately 5psi and about 40psi itBetween pressure, such as about 15psi. Fluid can flow through flexible pipe 176 to fluid accessories 174.Then fluid can flow through nozzle 170 and leave outlet 172.
In some alternate embodiment, liquor pump (not shown) can be configured to liquid pressing andPumping liquid is to liquid regulator 350. In the situation that fluid is air, fluid pump can adopt airCompressor reducer.
With reference to Fig. 4, during adhesive tape process, substrate 140 rotates around rotation 124, as bendingArrow shown in. The rotation of substrate 140 can be subject to the impact (Figure 1B) of the rotation of rotor 120. ShouldSubstrate 140 is shown in Figure 4 for dotted line because substrate 140 be hidden in supported by band 150 be with 190Below. This band 150 can rotate together with substrate 140, because this band can pass through alignment pin 154Be positioned on substrate holder 130.
This compression arm 164 is positioned at is as shown in the figure with 190 tops, nozzle 170 (referring to Fig. 1 C) locationBecome guiding liquid to being with 190 places. In Fig. 4, the liquid being directed to 190 places has caused being with 190A part 410 contact substrates 140. In the embodiment shown in Fig. 4, be with 190 to be included in and baseAdhesive in the adjacent side of plate 140, this part 410 is bonded to substrate 140. Border 420 as figureShown in stick portion 410 and between with 190 remainder. Nozzle path 430, is depicted as spiral shellRevolve shape dotted line, represent the path of nozzle 170. This spiral nozzle path 430 is by the rotation of rotor 120Form along the combination of the x direction translation shown in Fig. 4 with nozzle 170. By along with respect to being with 190To external spiral moving nozzle 170, be with 190 can be bonded to equably and smoothly substrate with substrate 140180, can reduce the foaming comprising compared with some additive methods, as discussed below.
Fig. 5 A and 5B are the indicative icons of the part of the alternate embodiment of adhesive tape equipment 100. PressThe arm of force 164 ' is positioned at is as shown in the figure with 190 tops. Pressure arm 164 ' comprises having diameter DBSphericalBearing 510. Bearing 510 is positioned in bearing bore 530. This bearing bore 530 is arranged so that bearing 510Can be along z direction translation certain distance. Due to chamber diameter DCBe approximately equal to or less than greatly bearing diameter DB，So bearing 510 can remain in pressure arm 164 '. Selectively, bearing 510 can adoptOther suitable modes keep, and allow bearing 510 rotate or roll. In some embodiments, bearing510 can remain on the fixing lateral position with respect to pressure arm 164 ' by bearing bore 520. Bearing bore530 can be connected to assembly parts 174 by fluid passage 177 fluids, then are connected to flexible pipe 176. ShouldPressure arm 164 ' and bearing 510 can be positioned on the distance N with 190 topsBPlace, is with 190 can be positioned onBand-extremely-substrate distance the T of substrate 140 topsBPlace.
In operation, bearing 510 can be by logical such as be maintained at liquid lower than the negative pressure of atmospheric pressureIn road 177, leave and be with 190. This negative pressure also can be referred to as vacuum or vacuum pressure, can be connected by fluidThe negative pressure box (not shown) that is connected to flexible pipe 176 causes. Negative pressure can keep by pump (not shown)In negative pressure box. Some air may leak through bearing 510 and according to the arrow stream shown in Fig. 5 AMoving.
For pressure is applied to and is with 190, negative pressure can be released, and bearing 510 can be allowed throughGravity and fall and apply power or pressure with respect to being with 190. This power or pressure in the R ' of region can be ledCause and be with 190 deflections and contact substrate 140. Comprise sticky in the side adjacent to substrate 140 with 190In the situation of mixture, be with 190 therefore can adhere to substrate 140. Bearing 510 can adopt with reference to Fig. 4Described mode moves being with on 190. The size of bearing 510 or weight can be configured to apply requiredPower or pressure. In some embodiments, malleation can be applied in by the fluid in fluid passage 177To bearing 510.
Fig. 6 is the method for substrate 140 adhesive tapes that can use with reference to the equipment described in Fig. 5 A and 5B600 schematic flow sheet. Substrate 140 can be arranged on rotor 120, such as at substrate holder 130Upper (step 610). This supporting by band 150 is with 190 can be positioned to adjacent to substrate 140 (stepRapid 620). Rotor 120 can rotate (step 630) around rotation 124. This rotation can exampleThe rotary speed of describing with respect to Fig. 2 now strictly according to the facts. Bearing 510 can be positioned at is with 190 tops, allAs along rotation 124 (step 640). This location of bearing 510 can rotate at rotor 120Before or after beginning, carry out. Fluid can flow through nozzle 170 and can be guided on is with 190 places(step 650). Bearing 510 can be radially from the outside translation of rotation 124, such as perpendicular to rotationAxis 124 (step 660). Bearing 510 can be by bearing bore 530 along lateral-supporting. The speed of translationCan be as described above with reference to FIG. 2. This speed can change during translation, for example, thereby alongRadius keeps the tangential velocity of rotor 120 for substantially constant during such as radius R translation.
As described in above with reference to Fig. 4, applying power along outside spiral way can be by preventing that air from comprisingWith 190 and substrate 140 between and be conducive to 190 evenly paste. Be not confined to anyIn the situation of particular theory, during adhesive tape, will be with 190 to paste to substrate 140 and can promote air outwards alsoAnd from be with 190 and substrate 140 between leave. This of air outwards actuated and can during adhesive tape, be with 190The not adhesion section situation of being surrounded by adhesion section with 190 under do not operated. Namely, for example,With reference to Fig. 4, air should not be trapped, as long as adhesion section 410 is radially outward expanded and do not surroundWith any not adhesion section of 190.
In some embodiments, the rotary speed of rotor 120 can be optimized for pressure arm 164 radiallyThereby the function minimization time of position. For example, can be at pressure source such as nozzle 170 or bearing510 and substrate 140 between there is relative velocity. This relative velocity can be the highest relativelySpeed, under this speed, is with 190 can paste equably reliably to substrate 140. Along with pressureRadially outward translation of arm 164, thus the rotary speed of rotor 120 can be conditioned maintenance maximal phase to speedDegree. For example, when pressure source such as nozzle 170 or bearing 510 are during along rotation 124 centering, turnThe rotary speed of son 120 can start from specific maximum speed. If the rotating speed of rotor 120 remains unchanged,Relative velocity between pressure source and rotor 120 increases along with radially outward translation of pressure arm 164 soAdd. Thereby the rotary speed of rotor 120 can reduce compensation along with radially outward translation of pressure arm 164Outward radial moves this effect.
In some embodiments, ideally, start the pressure source being centered on rotation 124,Such as nozzle 170 or bearing 510. Adopt in this way, in the time that adhesive tape starts, near rotationWith 190 and substrate 140 between air can be cleaned instead of hold back. The centering of pressure source canRealize by test and wrong way, use probe such as passing through, or can adopt optical mode to realize,Such as passing through to use laser. Centering can be realized manually or automatically, such as by software and motor.
In some embodiments, it is desirable to, start rotor 120 pressure being applied to before being with 190Rotation. In any particular theory in the situation that, near rotation 124, apply pressure unrestrictedPower simultaneously rotor 120 rotating can promote air from be with 190 and substrate 140 between discharge.Again in the situation that not being confined to any particular theory, this discharge of air can be by by revolvingThe inhomogeneities of centrifugal force that transduction causes, improvement by the pressure that caused by rotation or by some itsHe mechanism and be promoted.
In some alternate embodiment, for example, except movement (, rotation) this substrate 140 and mobile(for example, translation) this pressure applicator 168, only substrate 140 or only pressure applicator 168 canTo be moved, thereby the fixing relative motion that provides is provided miscellaneous part simultaneously. For example, substrate 140 canFix, pressure applicator 168 can be configured in the x-direction and edge is parallel to upper surface of base plate 144Surperficial vertical y direction (referring to Figure 1A and 4) mobile. Pressure applicator 168 is along x and y sideTo movement can realize by linear actuators (not shown) for example, realize edge such as linear actuatorsX direction moves with linear actuators and realizes and moving in the y-direction.
In the time that adhesive tape is less than the whole surface of substrate 140, such as in the time using endless belt 190, Ke YiliThink by near the inward flange with 190 or the region R of pressure is set along this edge. This regionR also can start outwards to start from inward flange, and radially moves inward, but air can more mayBe trapped in be with 190 and substrate 140 between. In the situation that not being subject to any particular theory restriction, inwardlyMotion, such as inside screw, more may by air entrapment be with 190 and substrate 140 between, because ofOrder about air for centrifugal force may trend towards radially outward direction, namely leave rotation 124.
In some cases, adhesive tape equipment 100 can comprise two linear actuators (not shown), not toolsThere is rotor 120. Linear actuators can be controlled, such as automatic control, and such as software control, therebyAlong spiral way movement pressure arm 164, as shown in Figure 4 all.
Permitted eurypalynous with 190 substrate 140 adhesive tapes that can be used for numerous species type. Relatively hard band190 can use relatively high pressure plaster to substrate 140, such as relatively high fluid pressure, thanRelatively not too hard is with 190. This substrate 140 can be semiconductor crystal wafer, such as have such asThe semiconductor crystal wafer of MEMS feature, on upper surface 144 and lower surface 146. Upper surface 144 canUse adhesive tape equipment 100 adhesive tapes, then lower surface 146 can use band roller or other prior device adhesive tapes,Because upper surface 144 is by being with 190 protections. Equally, because some embodiments do not need rotary plate 140,So adhesive tape equipment 100 can be used for except be shaped as wafer-shaped or except being shaped as circular adhesive tape orderMark.
Above-mentioned embodiment can provide some or all of following advantages, or does not have advantage. This substrateUpper surface can be by adhesive tape, and substrate is only bearing in the periphery of relative lower surface of this substrate or attached simultaneouslyPrevent from closely, thus or alleviate the feature on lower surface is caused to damage. Paste to the band of upper surface can be equalThereby even and successfully paste eliminate or prevent from bubbling carry or form wrinkle secretly in band. Air bubblesElimination or prevent from promoting uniform adhesive tape, instead of under vacuum environment adhesive tape. Namely, pasteIn the vacuum chamber that band can be realized instead of find time under normal barometric pressure state. Use liquid or bearing to pressPower can promote to be applied to the uniformity of pressure and the accuracy of pressure of band and substrate. Use fluid canEliminate or prevent the damage to the feature on the upper surface of substrate during paster. Use fluid also can helpChip between clean described band and substrate, otherwise it will be trapped during adhesive tape.
In whole description and claim use such as 'fornt', 'back', " on ", D score, " onSide ", the term of " below ", " beneath " is only exemplary purpose, in order to distinguish described here beSystem. Band. The all parts of substrate and other elements. Use this term do not imply band, substrate or appointThe specific guide of what miscellaneous part to. Similarly, with any horizontal or vertical term, each element is describedRelevant to described embodiment. In other embodiments, same or similar element can beExcept being directed in horizontal or vertical direction, as situation is determined.
Multiple embodiment of the present invention is described. But, be appreciated that do not depart from of the present inventionIn the situation of marrow and scope, can carry out various improvement. For example, pressure can use spring and be applied toBand, such as by spring pressure is applied to bearing, operates it, or some other pressure applicators.As another example, the relative motion between pressure applicator and substrate can be used linear actuators realExisting, pressure can be applied to the outside movement on substrate region can. As another example, pressureCan be applied to by the circular rings expanding outwardly, oval spiral, square spiral or some other radially toBand in the region that external schema, shape and path limit. As another example, pressure can adopt " it "The mode of word is applied to opposite side from a surperficial side of substrate. Therefore, other embodiment are in subsequentlyIn the scope of claim.
Claims (22)
1. for band being labelled to an equipment for substrate, comprising:
Supporting member, described supporting member is configured to keep substrate and band is remained adjacent to described substrateUpper surface and fixing with respect to described substrate;
Pressure source, described pressure source is configured to y direction, pressure is applied to the little of described band in the x-directionIn the region on described surface, described x and y direction are parallel to described surface and are perpendicular to one another;
Motor, described motor be connected to described supporting member and described pressure source one or more andBe configured to move described region with respect to described substrate,
Wherein, described equipment is configured under normal atmosphere state, band be pasted to described substrate, substrateUpper surface is by adhesive tape, and substrate only the periphery of the relative lower surface of this substrate or near be supported, itsMiddle pressure source comprises nozzle, and described nozzle arrangement is led with the side relative with described surface facing to described bandDrainage body stream.
2. equipment according to claim 1, wherein, described supporting member is configured to around rotating shaftLine rotates described substrate.
3. equipment according to claim 2, wherein, described pressure source be configured to substantially alongPerpendicular to the direction translation of described rotation.
4. equipment according to claim 1, wherein, the outlet of described nozzle is positioned at apart from instituteState between approximately 0.5 millimeter and approximately 3.0 millimeters of that side relative with described surface of band.
5. equipment according to claim 1, also comprises:
Be configured to filter the filter of described fluid stream.
6. equipment according to claim 1, wherein, described band is positioned at the described substrate of distance approximatelyBetween 0.5 millimeter and approximately 3.0 millimeters.
7. equipment according to claim 1, wherein, described nozzle arrangement is to be substantially perpendicular toThe described surface guiding fluid stream of described substrate.
8. equipment according to claim 1, wherein, the flow arrangement of stream is for by along perpendicular to instituteDirection or the edge of stating the radius of substrate guide towards the direction of substrate direction of rotation.
9. for band being labelled to a system for substrate, comprising:
Be configured to keep the substrate supporting part of substrate;
Be with supporting member, be configured to band to remain adjacent to and be arranged essentially parallel to the upper table of described substrateFace;
For the device of exerting pressure, pressure is applied to a side relative with described surface of described bandBe less than the region of described substrate, this device that is used for exerting pressure comprises nozzle, described in described nozzle faces towardThe upper surface guiding fluid stream of substrate; And
For the device in mobile described region,
Wherein, described system configuration is under normal atmosphere state, band is pasted to described substrate, and substrateUpper surface be configured to by adhesive tape, and substrate only the periphery of the relative lower surface of this substrate or near quiltSupporting.
10. system as claimed in claim 9, wherein, nozzle arrangement is to be substantially perpendicular to described baseThe described surface guiding fluid stream of plate.
11. systems as claimed in claim 9, wherein, the flow arrangement of stream is perpendicular to described by edgeThe direction of the radius of substrate or edge are towards the direction guiding of substrate direction of rotation.
12. 1 kinds for being labelled to band the method for substrate, comprising:
Band is positioned to adjacent to and is arranged essentially parallel to the surface of substrate;
By the side direct fluid stream relative with described surface facing to described band, pressure is applied to instituteState in the region that is less than described surface of a side relative with described surface of band, described substrate is only at this baseThe periphery of the relative lower surface of plate or near be supported; And
Move described region along outward radial direction with respect to described substrate, exert pressure simultaneously,
Wherein, the upper surface of substrate is by adhesive tape, and wherein under normal atmosphere state, band pasted to describedSubstrate.
13. methods according to claim 12, wherein, the not adhesive area of band not by withAny adhesive area is surrounded.
14. methods according to claim 12, wherein, described fluid is air.
15. methods according to claim 12, wherein, described pressure is in 5.0psi and 40psiBetween.
16. methods according to claim 12, wherein, mobile described region comprises described in rotationSubstrate and band.
17. methods according to claim 12, wherein, mobile described region comprises with respect to instituteState region described in substrate translation.
18. methods according to claim 17, wherein, described translation is along perpendicular to describedThe direction of the rotation of substrate.
19. methods according to claim 12, wherein, the area in described region is in described baseThe area of plate 0.004% and 10% between.
20. methods according to claim 12 wherein, are in apart from institute to described band locationState between approximately 0.5 millimeter and approximately 3.0 millimeters of substrate.
21. methods according to claim 12, wherein, guiding fluid stream comprises perpendicularIn the described surface guiding fluid stream of described substrate.
22. methods according to claim 12, wherein, the flow arrangement of stream be by along perpendicular toThe direction of the radius of described substrate or edge are towards the direction guiding of substrate direction of rotation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12079708P | 2008-12-08 | 2008-12-08 | |
| US61/120,797 | 2008-12-08 | ||
| CN2009801562910A CN102308373A (en) | 2008-12-08 | 2009-12-07 | Wafer taping |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801562910A Division CN102308373A (en) | 2008-12-08 | 2009-12-07 | Wafer taping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105590885A true CN105590885A (en) | 2016-05-18 |
Family
ID=42310483
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610090152.4A Pending CN105590885A (en) | 2008-12-08 | 2009-12-07 | Wafer Taping |
| CN2009801562910A Pending CN102308373A (en) | 2008-12-08 | 2009-12-07 | Wafer taping |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801562910A Pending CN102308373A (en) | 2008-12-08 | 2009-12-07 | Wafer taping |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5756022B2 (en) |
| KR (1) | KR101612048B1 (en) |
| CN (2) | CN105590885A (en) |
| WO (1) | WO2010077597A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6319766B2 (en) * | 2014-07-30 | 2018-05-09 | リンテック株式会社 | Adhesive sheet sticking method and sticking device |
| JP2020167284A (en) * | 2019-03-29 | 2020-10-08 | 株式会社ディスコ | Tape sticking method |
| JP2020205357A (en) * | 2019-06-18 | 2020-12-24 | 株式会社ディスコ | Tape attachment method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6129811A (en) * | 1997-06-05 | 2000-10-10 | Texas Instruments Incorporated | Method of adhering a wafer to a wafer tape |
| CN101026101A (en) * | 2006-02-20 | 2007-08-29 | 富士通株式会社 | Film bonding method, film bonding apparatus, and semiconductor device manufacturing method |
| CN101123175A (en) * | 2006-08-08 | 2008-02-13 | 日东电工株式会社 | Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287545A (en) * | 1988-09-24 | 1990-03-28 | Nitto Denko Corp | Tape bonding process of semiconductor wafer |
| JPH0621220A (en) * | 1992-07-03 | 1994-01-28 | Seiko Epson Corp | Wafer pasting apparatus |
| JP4496737B2 (en) * | 2003-09-03 | 2010-07-07 | 東レ株式会社 | Separation membrane forming apparatus and method |
| JP4143623B2 (en) | 2005-04-26 | 2008-09-03 | Ｎｅｃエンジニアリング株式会社 | Tape applicator |
-
2009
- 2009-12-07 JP JP2011540800A patent/JP5756022B2/en active Active
- 2009-12-07 WO PCT/US2009/066961 patent/WO2010077597A2/en active Application Filing
- 2009-12-07 CN CN201610090152.4A patent/CN105590885A/en active Pending
- 2009-12-07 KR KR1020117015926A patent/KR101612048B1/en active IP Right Grant
- 2009-12-07 CN CN2009801562910A patent/CN102308373A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6129811A (en) * | 1997-06-05 | 2000-10-10 | Texas Instruments Incorporated | Method of adhering a wafer to a wafer tape |
| CN101026101A (en) * | 2006-02-20 | 2007-08-29 | 富士通株式会社 | Film bonding method, film bonding apparatus, and semiconductor device manufacturing method |
| CN101123175A (en) * | 2006-08-08 | 2008-02-13 | 日东电工株式会社 | Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110104014A (en) | 2011-09-21 |
| JP5756022B2 (en) | 2015-07-29 |
| WO2010077597A2 (en) | 2010-07-08 |
| WO2010077597A3 (en) | 2010-09-16 |
| WO2010077597A4 (en) | 2010-11-04 |
| KR101612048B1 (en) | 2016-04-12 |
| CN102308373A (en) | 2012-01-04 |
| JP2012511264A (en) | 2012-05-17 |
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