WO2010077597A3 - Wafer taping - Google Patents

Wafer taping Download PDF

Info

Publication number
WO2010077597A3
WO2010077597A3 PCT/US2009/066961 US2009066961W WO2010077597A3 WO 2010077597 A3 WO2010077597 A3 WO 2010077597A3 US 2009066961 W US2009066961 W US 2009066961W WO 2010077597 A3 WO2010077597 A3 WO 2010077597A3
Authority
WO
WIPO (PCT)
Prior art keywords
tape
region
substrate
pressure
applying
Prior art date
Application number
PCT/US2009/066961
Other languages
French (fr)
Other versions
WO2010077597A2 (en
WO2010077597A4 (en
Inventor
Steve Deming
Jeffrey Birkmeyer
David W. Schneider
Andreas Bibl
Original Assignee
Fujifilm Dimatix, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix, Inc. filed Critical Fujifilm Dimatix, Inc.
Priority to JP2011540800A priority Critical patent/JP5756022B2/en
Priority to CN2009801562910A priority patent/CN102308373A/en
Publication of WO2010077597A2 publication Critical patent/WO2010077597A2/en
Publication of WO2010077597A3 publication Critical patent/WO2010077597A3/en
Publication of WO2010077597A4 publication Critical patent/WO2010077597A4/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A method for applying tape to a substrate can include positioning a tape proximate and substantially parallel to a surface of a substrate. A pressure source can be configured to apply pressure to a region of tape smaller than the surface in both an x direction and y direction, the x and y directions being parallel to the surface and perpendicular to one another. For example, the pressure source can be a stream of fluid such as air. Pressure can be applied to a side of the tape opposite the surface in a region smaller than the surface to cause the tape to adhere to the substrate opposite the region. The region can be moved relative to the substrate in an outward radial direction while applying the pressure. The region can be moved such that no unadhered region of tape is enclosed by any adhered region of tape.
PCT/US2009/066961 2008-12-08 2009-12-07 Wafer taping WO2010077597A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011540800A JP5756022B2 (en) 2008-12-08 2009-12-07 Wafer taping
CN2009801562910A CN102308373A (en) 2008-12-08 2009-12-07 Wafer taping

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12079708P 2008-12-08 2008-12-08
US61/120,797 2008-12-08

Publications (3)

Publication Number Publication Date
WO2010077597A2 WO2010077597A2 (en) 2010-07-08
WO2010077597A3 true WO2010077597A3 (en) 2010-09-16
WO2010077597A4 WO2010077597A4 (en) 2010-11-04

Family

ID=42310483

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/066961 WO2010077597A2 (en) 2008-12-08 2009-12-07 Wafer taping

Country Status (4)

Country Link
JP (1) JP5756022B2 (en)
KR (1) KR101612048B1 (en)
CN (2) CN105590885A (en)
WO (1) WO2010077597A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6319766B2 (en) * 2014-07-30 2018-05-09 リンテック株式会社 Adhesive sheet sticking method and sticking device
JP2020167284A (en) * 2019-03-29 2020-10-08 株式会社ディスコ Tape sticking method
JP7561486B2 (en) * 2019-06-18 2024-10-04 株式会社ディスコ Tape application method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118288A (en) * 1997-06-05 1999-01-12 Texas Instr Inc <Ti> Method and device for sticking wafer to wafer tape
JP2007221034A (en) * 2006-02-20 2007-08-30 Fujitsu Ltd Film sticking apparatus and method therefor and manufacturing method of semiconductor device
JP2008042016A (en) * 2006-08-08 2008-02-21 Nitto Denko Corp Holding method of semiconductor wafer, and semiconductor wafer holding structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0287545A (en) * 1988-09-24 1990-03-28 Nitto Denko Corp Tape bonding process of semiconductor wafer
JPH0621220A (en) * 1992-07-03 1994-01-28 Seiko Epson Corp Wafer pasting apparatus
JP4496737B2 (en) * 2003-09-03 2010-07-07 東レ株式会社 Separation membrane forming apparatus and method
JP4143623B2 (en) * 2005-04-26 2008-09-03 Ｎｅｃエンジニアリング株式会社 Tape applicator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118288A (en) * 1997-06-05 1999-01-12 Texas Instr Inc <Ti> Method and device for sticking wafer to wafer tape
JP2007221034A (en) * 2006-02-20 2007-08-30 Fujitsu Ltd Film sticking apparatus and method therefor and manufacturing method of semiconductor device
JP2008042016A (en) * 2006-08-08 2008-02-21 Nitto Denko Corp Holding method of semiconductor wafer, and semiconductor wafer holding structure

Also Published As

Publication number Publication date
KR20110104014A (en) 2011-09-21
WO2010077597A2 (en) 2010-07-08
CN102308373A (en) 2012-01-04
JP5756022B2 (en) 2015-07-29
JP2012511264A (en) 2012-05-17
CN105590885A (en) 2016-05-18
WO2010077597A4 (en) 2010-11-04
KR101612048B1 (en) 2016-04-12

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