JP2020167284A - Tape sticking method - Google Patents
Tape sticking method Download PDFInfo
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- JP2020167284A JP2020167284A JP2019066729A JP2019066729A JP2020167284A JP 2020167284 A JP2020167284 A JP 2020167284A JP 2019066729 A JP2019066729 A JP 2019066729A JP 2019066729 A JP2019066729 A JP 2019066729A JP 2020167284 A JP2020167284 A JP 2020167284A
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- Prior art keywords
- tape
- work piece
- injection nozzle
- fluid injection
- holding
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000012530 fluid Substances 0.000 claims abstract description 88
- 238000002347 injection Methods 0.000 claims abstract description 69
- 239000007924 injection Substances 0.000 claims abstract description 69
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000007599 discharging Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000002265 prevention Effects 0.000 description 2
- 244000309466 calf Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
Description
本発明は、テープ貼着方法に関する。 The present invention relates to a tape application method.
ウェーハを切削ブレードで切削する切削加工では、リングフレームの開口にウェーハを配置しリングフレームとウェーハとをテープで一体化させてワークセットを形成し、分割されたチップをテープで支持してチップがバラバラにならないようにしている。しかし、ワークセットを形成したとき、ウェーハとテープとの間に気泡が入ることがあり、気泡が分割予定ラインの直下にできた状態のワークセットのウェーハを切削ブレードで切削すると、カーフに大きなチッピングが発生するという問題がある。そのため、ワークセットはウェーハとテープとの間に気泡がないように特許文献１に開示のような方法でテープマウントしている。 In the cutting process of cutting a wafer with a cutting blade, the wafer is placed in the opening of the ring frame, the ring frame and the wafer are integrated with tape to form a work set, and the divided chips are supported by the tape to support the chips. I try not to fall apart. However, when the work set is formed, air bubbles may enter between the wafer and the tape, and when the wafer of the work set with the air bubbles formed directly under the planned division line is cut with a cutting blade, a large chipping is applied to the calf. There is a problem that occurs. Therefore, the work set is tape-mounted by a method as disclosed in Patent Document 1 so that there are no air bubbles between the wafer and the tape.
また、例えばウェーハの研削加工を行うときには、デバイス保護を目的としてデバイスが形成されている側の面に保護テープを貼着する。その際にも、保護テープとウェーハとの間に気泡が入っていると、ウェーハを均等な厚みで研削することができなくなるという問題がある。また、特許文献２に示すようにバンプ付きウェーハのバンプが形成される面に保護テープを貼着する場合は、保護テープとウェーハとの間に気泡が入りやすいという特徴がある。 Further, for example, when grinding a wafer, a protective tape is attached to the surface on the side where the device is formed for the purpose of protecting the device. Even at that time, if air bubbles are contained between the protective tape and the wafer, there is a problem that the wafer cannot be ground with an uniform thickness. Further, as shown in Patent Document 2, when the protective tape is attached to the surface of the bumped wafer on which the bumps are formed, there is a feature that air bubbles easily enter between the protective tape and the wafer.
上記のように、ウェーハとテープとの間に気泡が入らないようにテープを貼着するのは時間がかかり困難である。また、気泡が入った場合には、貼着したテープを剥離してもう一度テープを貼着する必要があり、剥離したテープを廃棄することになり不経済である。
従って、ウェーハへのテープの貼着においては、テープを貼着した後に、より効率的かつ経済的にテープとウェーハとの間に気泡がない状態にするという解決すべき課題がある。
As described above, it is time-consuming and difficult to attach the tape so that air bubbles do not enter between the wafer and the tape. Further, when air bubbles enter, it is necessary to peel off the attached tape and attach the tape again, which is uneconomical because the peeled tape is discarded.
Therefore, in attaching the tape to the wafer, there is a problem to be solved that, after the tape is attached, there is no air bubble between the tape and the wafer more efficiently and economically.
本発明は、被加工物の一方の面にテープを貼着するテープ貼着方法であって、被加工物の一方の面全面を覆うようにテープを貼着するテープ貼着工程と、該テープを貼着した被加工物の他方の面をスピンナテーブルの保持面で保持する保持工程と、該保持面の中心上方に配置される流体噴射ノズルから、該保持面に保持された被加工物に貼着した該テープの表面に向かって流体を噴射させ、該保持面の中心を軸に該スピンナテーブルを高速回転させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させる気泡抜き工程と、を備えたテープ貼着方法である。 The present invention is a tape sticking method for sticking a tape to one surface of a work piece, a tape sticking step of sticking the tape so as to cover the entire surface of one side of the work piece, and the tape. From the holding step of holding the other surface of the workpiece to which the tape is attached by the holding surface of the spinner table and the fluid injection nozzle arranged above the center of the holding surface, to the workpiece held on the holding surface. A fluid is jetted toward the surface of the attached tape, the spinner table is rotated at high speed around the center of the holding surface, and air bubbles intervening between the workpiece and the tape are formed into the covering. This is a tape sticking method including a bubble removing step of discharging from the outer periphery of the work piece.
また、本発明は、被加工物の一方の面にテープを貼着するテープ貼着方法であって、被加工物の一方の面全面を覆うようにテープを貼着するテープ貼着工程と、該スピンナテーブルの保持面で該テープを保持し該保持面が該テープを介して被加工物を保持する保持工程と、該保持面の中心上方に配置される流体噴射ノズルから、該保持面が該テープを介して保持する被加工物の他方の面に向かって流体を噴射させ、該保持面の中心を軸に該スピンナテーブルを高速回転させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させる気泡抜き工程と、を備えたテープ貼着方法である。 Further, the present invention is a tape sticking method for sticking a tape to one surface of a work piece, which comprises a tape sticking step of sticking a tape so as to cover the entire surface of one side of the work piece. From the holding step of holding the tape on the holding surface of the spinner table and the holding surface holding the work piece via the tape, and the fluid injection nozzle arranged above the center of the holding surface, the holding surface is formed. A fluid is sprayed toward the other surface of the work piece to be held via the tape, the spinner table is rotated at high speed around the center of the holding surface, and the work piece is interposed between the work piece and the tape. This is a tape sticking method including a bubble removing step of discharging the bubbles from the outer periphery of the work piece.
上記テープ貼着方法においては、該流体噴射ノズルを水平移動させる水平移動手段を備え、該気泡抜き工程は、該水平移動手段によって、該流体噴射ノズルを該保持面の中心を通り該保持面の径方向に水平移動させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させることが望ましい。 The tape sticking method includes a horizontal moving means for horizontally moving the fluid injection nozzle, and in the bubble removing step, the fluid injection nozzle is passed through the center of the holding surface by the horizontal moving means and is connected to the holding surface. It is desirable to move the work piece horizontally in the radial direction and discharge the air bubbles intervening between the work piece and the tape from the outer periphery of the work piece.
上記の気泡抜き工程は、該流体噴射ノズルをエア源に連通させ、該流体噴射ノズルからエアを噴射させてもよいし、該流体噴射ノズルをエア源と水供給源とに連通させ、該流体噴射ノズルから水とエアとの混合流体を噴射させてもよい。 In the above-mentioned bubble removing step, the fluid injection nozzle may be communicated with an air source to inject air from the fluid injection nozzle, or the fluid injection nozzle may be communicated with an air source and a water supply source to communicate the fluid. A mixed fluid of water and air may be injected from the injection nozzle.
本発明では、被加工物とテープとの境に入った気泡を被加工物の外周から抜いているので、従来のようにテープマウントをし直す必要がなく、気泡が入ったときに貼着していたテープを廃棄しないで利用することができ、経済的である。
また、テープを張りなおす時間を削減することができるため、時間的コストの削減という効果をもたらす。
In the present invention, since the air bubbles that have entered the boundary between the work piece and the tape are removed from the outer periphery of the work piece, it is not necessary to remount the tape as in the conventional case, and the air bubbles are attached when the air bubbles enter. It is economical because the tape can be used without discarding it.
In addition, since the time for reapplying the tape can be reduced, the effect of reducing the time cost is brought about.
１ 気液除去装置について
図１に示す気泡除去装置１は、テープＴが貼着された状態でスピンナテーブル２に保持されている被加工物Ｗに対して、流体噴射ノズル４０から流体を噴射させて被加工物Ｗと被加工物Ｗに貼着されているテープＴとの間に介在している気泡を取り除く装置である。
気泡除去装置１は、例えば、被加工物Ｗの加工の前後に、被加工物Ｗがスピンナテーブル２に保持されている状態でスピンナテーブル２を回転させながら、エアや水やそれらの混合物等を噴きつけて被加工物Ｗの上面や下面を洗浄する所謂スピンナ洗浄装置としての機能を有していてもよいし、あるいは、そのような他の用途を有していなく、被加工物ＷとテープＴとの間に生じた気泡を取り除くために特別に用いられる装置であってもよい。以下、気泡除去装置１の構成について詳述する。
1 Gas-liquid removing device The bubble removing device 1 shown in FIG. 1 injects fluid from a fluid injection nozzle 40 onto a workpiece W held on a spinner table 2 with a tape T attached. This is a device for removing air bubbles intervening between the work piece W and the tape T attached to the work piece W.
For example, before and after processing the work piece W, the bubble removing device 1 rotates the spinner table 2 while the work piece W is held by the spinner table 2 to remove air, water, a mixture thereof, and the like. It may have a function as a so-called spinner cleaning device that sprays and cleans the upper surface and the lower surface of the workpiece W, or does not have such other uses, and the workpiece W and the tape. It may be a device specially used to remove air bubbles generated between the T and the T. Hereinafter, the configuration of the bubble removing device 1 will be described in detail.
図１、図２、及び図３に示すように、気泡除去装置１には、円板形状のスピンナテーブル２が備えられている。スピンナテーブル２には吸引部２０と吸引部２０を囲繞する枠体２１とが備えられており、吸引部２０の上面は、被加工物Ｗが保持される保持面２０ａとなっている。また、吸引部２０は図示しない吸引源に接続されており、被加工物Ｗが保持面２０ａの上に載置された状態で、吸引源により生み出される吸引力を保持面２０ａに伝達することによって、保持面２０ａに被加工物Ｗを吸引保持することができる。
スピンナテーブル２の枠体２１の下端にはスピンドル２３が連結されており、スピンドル２３には、スピンドル２３をＺ軸方向の回転軸２５を軸として回転させるモータ２２がロータリージョイント２４を介して接続されている。図示しない電源から電力が供給されてモータ２２がスピンドル２３を回転軸２５を軸として回転駆動させると、これに伴ってスピンナテーブル２が回転軸２５を軸として回転することとなる。
As shown in FIGS. 1, 2, and 3, the bubble removing device 1 is provided with a disk-shaped spinner table 2. The spinner table 2 is provided with a suction portion 20 and a frame body 21 surrounding the suction portion 20, and the upper surface of the suction portion 20 is a holding surface 20a on which the workpiece W is held. Further, the suction unit 20 is connected to a suction source (not shown), and the suction force generated by the suction source is transmitted to the holding surface 20a in a state where the workpiece W is placed on the holding surface 20a. The workpiece W can be sucked and held on the holding surface 20a.
A spindle 23 is connected to the lower end of the frame 21 of the spinner table 2, and a motor 22 for rotating the spindle 23 about the rotation shaft 25 in the Z-axis direction is connected to the spindle 23 via a rotary joint 24. ing. When electric power is supplied from a power source (not shown) and the motor 22 drives the spindle 23 to rotate around the rotating shaft 25, the spinner table 2 rotates about the rotating shaft 25 accordingly.
図１、図２、及び図３に示すように、気泡除去装置１には、ケーシング１２が備えられている。ケーシング１２は、スピンナテーブル２を囲繞するようにＺ軸方向に延ばして配設された外周板１２０と、同じくスピンナテーブル２を囲繞するように外周板１２０の内側に配設された内周板１２２と、外周板１２０の下端と内周板１２２の下端とを連結する底板１２１と、によって構成されており、ケーシング１２の内部には、外周板１２０と内周板１２２と底板１２１とによって囲繞された凹形状の空間が形成されている。
また、ケーシング１２の上方には天板１０が配設されており、ケーシング１２と天板１０とは、図１に示すように、＋Ｙ方向側において直方体形状の薄板である連結部材１１を介して連結されている。
なお、ケーシング１２の底板１２１には、図示しない排出口が配設されており、被加工物ＷとテープＴとの間に生じた気泡Ｂを取り除く際に用いられるエアや水等が、排出口からケーシング１２の外部に排出されることとなる。
As shown in FIGS. 1, 2, and 3, the bubble removing device 1 is provided with a casing 12. The casing 12 includes an outer peripheral plate 120 extending in the Z-axis direction so as to surround the spinner table 2, and an inner peripheral plate 122 arranged inside the outer peripheral plate 120 so as to surround the spinner table 2. It is composed of a bottom plate 121 that connects the lower end of the outer peripheral plate 120 and the lower end of the inner peripheral plate 122, and is surrounded by the outer peripheral plate 120, the inner peripheral plate 122, and the bottom plate 121 inside the casing 12. A concave space is formed.
Further, a top plate 10 is arranged above the casing 12, and as shown in FIG. 1, the casing 12 and the top plate 10 are interposed via a connecting member 11 which is a rectangular parallelepiped thin plate on the + Y direction side. It is connected.
A discharge port (not shown) is provided on the bottom plate 121 of the casing 12, and air, water, or the like used for removing air bubbles B generated between the workpiece W and the tape T is discharged. Will be discharged to the outside of the casing 12.
図１、図２、及び図３に示すように、ケーシング１２の外周板１２０と内周板１２２との間には、例えば、Ｚ軸方向に昇降可能な飛散防止カバー１３が配設されている。飛散防止カバー１３は、スピンナテーブル２を囲繞するようにＺ軸方向に延設された側面カバー１３０と、飛散防止カバー１３が昇降移動する際にスピンナテーブル２を通過させる開口１３３と、開口１３３から側面カバー１３０の方向に向かうに従って下方へと傾斜するように形成された円錐台の側面の形状をなす環状の傾斜板１３２と、側面カバー１３０と傾斜板１３２とを連結する環状の底面カバー１３１と、を備えている。 As shown in FIGS. 1, 2, and 3, for example, a shatterproof cover 13 that can be raised and lowered in the Z-axis direction is arranged between the outer peripheral plate 120 and the inner peripheral plate 122 of the casing 12. .. The shatterproof cover 13 includes a side cover 130 extending in the Z-axis direction so as to surround the spinner table 2, an opening 133 through which the spinner table 2 is passed when the shatterproof cover 13 moves up and down, and an opening 133. An annular inclined plate 132 having the shape of a side surface of a truncated cone formed so as to incline downward toward the side cover 130, and an annular bottom cover 131 connecting the side cover 130 and the inclined plate 132. , Is equipped.
図１、図２、及び図３に示すように、例えば、図示しない昇降手段を用いて側面カバー１３０を＋Ｚ方向に上昇させることによって、ケーシング１２、連結部材１１、及び天板１０によって囲繞されている空間と気泡除去装置１の外部の空間とを仕切ることができる。これにより、例えば、スピンナテーブル２に保持された被加工物Ｗに向けて噴射されたエアや水等の流体が被加工物Ｗに当たって反射したとき、流体を側面カバー１３０によって受け止めることができ、気泡除去装置１の外部へと流体が飛散するのを防止できる。
また、反射した流体を底面カバー１３１の下面１３１ｂ及び傾斜板１３２の下面１３２ｂで受け止めて、ケーシング１２の下方に配設されている図示しない排出口へと導くことによって、流体をケーシング１２の外部へと効率よく排出することができる。
As shown in FIGS. 1, 2 and 3, for example, by raising the side cover 130 in the + Z direction using an elevating means (not shown), the side cover 130 is surrounded by the casing 12, the connecting member 11, and the top plate 10. It is possible to partition the existing space from the space outside the bubble removing device 1. As a result, for example, when a fluid such as air or water jetted toward the workpiece W held on the spinner table 2 hits the workpiece W and is reflected, the fluid can be received by the side cover 130, and bubbles can be received. It is possible to prevent the fluid from scattering to the outside of the removing device 1.
Further, the reflected fluid is received by the lower surface 131b of the bottom cover 131 and the lower surface 132b of the inclined plate 132, and is guided to a discharge port (not shown) arranged below the casing 12 to guide the fluid to the outside of the casing 12. It can be discharged efficiently.
図１、図２、及び図３に示すように、ケーシング１２の内部における、スピンナテーブル２の上方には流体噴射ノズル４０が備えられており、流体噴射ノズル４０の下端には噴射口４１が配設されている。
ケーシング１２の内部には、流体噴射ノズル４０を水平方向に移動させる水平移動手段５が備えられている。水平移動手段５には、水平方向に延設されたアーム５０と、Ｚ軸方向に立設された筒状の軸部５１とが配設されており、アーム５０の一端には流体噴射ノズル４０の側部が、アーム５０の他端には軸部５１が、それぞれ連結されている。軸部５１はＺ軸方向の回転軸５５を有しており、軸部５１の下端には、軸部５１を回転軸５５を軸として回転駆動させるモータ５２が接続されている。
モータ５２によって駆動されて軸部５１が回転軸５５を軸として回転すると、アーム５０が旋回して、これに伴い流体噴射ノズル４０がスピンナテーブル２の上方を水平移動する構成となっている。
As shown in FIGS. 1, 2, and 3, a fluid injection nozzle 40 is provided above the spinner table 2 inside the casing 12, and an injection port 41 is arranged at the lower end of the fluid injection nozzle 40. It is installed.
Inside the casing 12, a horizontal moving means 5 for moving the fluid injection nozzle 40 in the horizontal direction is provided. The horizontal moving means 5 is provided with an arm 50 extending in the horizontal direction and a tubular shaft portion 51 erected in the Z-axis direction, and a fluid injection nozzle 40 is provided at one end of the arm 50. A shaft portion 51 is connected to the side portion of the arm 50 and to the other end of the arm 50. The shaft portion 51 has a rotation shaft 55 in the Z-axis direction, and a motor 52 for rotationally driving the shaft portion 51 around the rotation shaft 55 is connected to the lower end of the shaft portion 51.
When the shaft portion 51 is driven by the motor 52 and rotates about the rotating shaft 55, the arm 50 rotates, and the fluid injection nozzle 40 moves horizontally above the spinner table 2 accordingly.
流体噴射ノズル４０にはジョイント６０が配設されており、流体噴射ノズル４０はジョイント６０を介してエア流路６１に接続されている。エア流路６１はエア源６に接続しており、また、エア流路６１にはエア流路開閉バルブ６２が配設されている。エア流路開閉バルブ６２の開閉操作を行うことによって、エア源６と流体噴射ノズル４０とが連通されている状態と、両者が連通されていない状態とを切り替えることができる。
同様に、流体噴射ノズル４０は、ジョイント７０及び水路７１を介して水源７に接続されており、水路７１には水路開閉バルブ７２が配設されている。水路開閉バルブ７２を開閉操作することによって、水源７と流体噴射ノズル４０とが連通されている状態と、両者が連通されていない状態とを切り替えることができる。
A joint 60 is arranged in the fluid injection nozzle 40, and the fluid injection nozzle 40 is connected to the air flow path 61 via the joint 60. The air flow path 61 is connected to the air source 6, and the air flow path 61 is provided with an air flow path opening / closing valve 62. By opening and closing the air flow path opening / closing valve 62, it is possible to switch between a state in which the air source 6 and the fluid injection nozzle 40 are in communication with each other and a state in which both are not in communication.
Similarly, the fluid injection nozzle 40 is connected to the water source 7 via the joint 70 and the water channel 71, and the water channel opening / closing valve 72 is arranged in the water channel 71. By opening and closing the water channel opening / closing valve 72, it is possible to switch between a state in which the water source 7 and the fluid injection nozzle 40 are in communication with each other and a state in which both are not in communication.
なお、気泡除去装置１には、気泡除去手段１に備える上記のような各種の機構を電気的に制御する制御手段３が備えられている。 The bubble removing device 1 is provided with a control means 3 for electrically controlling various mechanisms as described above provided in the bubble removing means 1.
２ テープ貼着方法
本発明のテープ貼着方法は、被加工物ＷにテープＴを貼着するテープ貼着工程と、被加工物Ｗをスピンナテーブル２の上に保持する保持工程と、気泡除去装置１を用いて被加工物ＷとテープＴとの間に生じた気泡を取り除く気泡抜き工程とを備えている。以下、テープ貼着方法について、工程ごとに説明する。
2 Tape sticking method The tape sticking method of the present invention includes a tape sticking step of sticking the tape T to the work piece W, a holding step of holding the work piece W on the spinner table 2, and bubble removal. The apparatus 1 is provided with a bubble removing step of removing air bubbles generated between the workpiece W and the tape T. Hereinafter, the tape attaching method will be described for each step.
［テープ貼着工程］
まず、図４（ａ）に示すように、例えば、交差する複数の分割予定ラインＬが一方の面Ｗａに形成され、かつ、分割予定ラインＬによって区画された各々の領域にデバイスＤが形成されている被加工物Ｗの一方の面Ｗａに、一方の面Ｗａの全面を覆うようにテープＴを貼着する。
また、テープ貼着工程においては、図４（ｂ）に示すように、例えば、後に切削加工等の実施が予定されている被加工物Ｗ１に対して、被加工物Ｗ１をデバイスＤが形成されている側の面Ｗ１ａを上にして環状のリングフレームＦの開口の中央に載置して、被加工物Ｗの裏面Ｗ１ｂとリングフレームＦの裏面ＦｂとにダイシングテープＴ１を貼着することも考えられる。
[Tape application process]
First, as shown in FIG. 4A, for example, a plurality of intersecting scheduled division lines L are formed on one surface Wa, and a device D is formed in each region partitioned by the scheduled division lines L. A tape T is attached to one surface Wa of the workpiece W so as to cover the entire surface of the one surface Wa.
Further, in the tape attaching step, as shown in FIG. 4B, for example, a device D is formed on the workpiece W1 with respect to the workpiece W1 scheduled to be cut later. It is also possible to place the dicing tape T1 on the back surface W1b of the workpiece W and the back surface Fb of the ring frame F by placing it in the center of the opening of the annular ring frame F with the surface W1a on the side facing up. Conceivable.
なお、以下では、テープ貼着工程において、図４（ａ）に示すように、被加工物Ｗの一方の面ＷａにテープＴを貼着した場合を想定して、保持工程、気泡除去工程について説明するが、本発明の実施可能な形態はこれに限定されるものではない。 In the following, as shown in FIG. 4A, the holding step and the bubble removing step are described on the assumption that the tape T is stuck on one surface Wa of the workpiece W in the tape sticking step. As described above, the feasible embodiments of the present invention are not limited thereto.
［保持工程］
テープＴを被加工物Ｗの一方の面Ｗａに貼着した後、図１、図２（ａ）及び図２（ｂ）に示すように、被加工物Ｗの他方の面Ｗｂがスピンナテーブル２の保持面２０ａに当接するように、すなわち、被加工物Ｗに貼着されているテープＴの上面Ｔａが露出するように、被加工物Ｗをスピンナテーブル２の上に載置する。スピンナテーブル２の保持面２０ａの上に被加工物Ｗが載置されている状態で、図示しない吸引源が発揮する吸引力を保持面２０ａに伝達することによって保持面２０ａに被加工物Ｗが吸引保持される。
[Holding process]
After the tape T is attached to one surface Wa of the workpiece W, the other surface Wb of the workpiece W is the spinner table 2 as shown in FIGS. 1, 2 (a) and 2 (b). The work piece W is placed on the spinner table 2 so as to abut on the holding surface 20a of the work piece, that is, so that the upper surface Ta of the tape T attached to the work piece W is exposed. In a state where the workpiece W is placed on the holding surface 20a of the spinner table 2, the workpiece W is transferred to the holding surface 20a by transmitting the suction force exerted by a suction source (not shown) to the holding surface 20a. It is sucked and held.
その後、モータ２２を用いてスピンドル２３を駆動させて、スピンドル２３を回転軸２５を軸として回転させることによって、スピンナテーブル２が回転軸２５を軸として高速回転する。これにより、スピンナテーブル２に保持されている被加工物Ｗが回転軸２５を軸として高速回転する。 After that, the spindle 23 is driven by the motor 22 to rotate the spindle 23 about the rotation shaft 25, so that the spinner table 2 rotates at a high speed about the rotation shaft 25. As a result, the workpiece W held on the spinner table 2 rotates at high speed about the rotation shaft 25.
［気泡抜き工程］
次いで、図２（ａ）に示すように、流体噴射ノズル４０の噴射口４１からスピンナテーブル２に保持された被加工物Ｗに貼着されているテープＴの上面Ｔａに向けてエアと水との混合流体Ｒを噴射する。
なお、混合流体Ｒを噴射する際には、エア流路開閉バルブ６２及び水路開閉バルブ７２が開いており、エア源６及び水源７がそれぞれ流体噴射ノズル４０に連通されている。エア源６からエア流路６１を通じて流体噴射ノズル４０に送られたエアと、水源７から水路７１を通じて同じく流体噴射ノズル４０に送られた水とが、流体噴射ノズル４０の内部において混ざり合い、混合流体Ｒとして噴射口４１からテープＴの上面Ｔａに向けて噴射される。
[Bubble removal process]
Next, as shown in FIG. 2A, air and water are formed from the injection port 41 of the fluid injection nozzle 40 toward the upper surface Ta of the tape T attached to the workpiece W held on the spinner table 2. The mixed fluid R of the above is injected.
When injecting the mixed fluid R, the air flow path opening / closing valve 62 and the water channel opening / closing valve 72 are open, and the air source 6 and the water source 7 are communicated with the fluid injection nozzle 40, respectively. The air sent from the air source 6 to the fluid injection nozzle 40 through the air flow path 61 and the water also sent from the water source 7 to the fluid injection nozzle 40 through the water channel 71 are mixed and mixed inside the fluid injection nozzle 40. The fluid R is injected from the injection port 41 toward the upper surface Ta of the tape T.
流体噴射ノズル４０の噴射口４１から、回転軸２５を軸として高速回転しているテープＴの上面Ｔａに向けて混合流体Ｒを噴射しながら、図１、図２（ａ）、及び図２（ｂ）に示すように、モータ５２を用いてアーム５０を回転軸５５を軸として旋回させることによって、アーム５０に連結された流体噴射ノズル４０を水平方向に移動させて、被加工物ＷとテープＴとの間に介在している気泡Ｂを被加工物Ｗの外周から排出する。
なお、テープＴの上面Ｔａにあたって反射し、スピンナテーブル２の側方へと向かう混合流体Ｒの水滴は、飛散防止カバー１３の側面カバー１３０の内側面１３０ａ、傾斜板１３２の下面１３２ｂ、及び底面カバー１３１の下面１３１ｂに付着して、例えば、側面カバー１３０に沿って下方へと流れ落ちていく。そして、図示しない排出口から気泡除去装置１の外部へと排出される。
FIGS. 1, 2 (a), and 2 (A), while injecting the mixed fluid R from the injection port 41 of the fluid injection nozzle 40 toward the upper surface Ta of the tape T rotating at high speed about the rotation shaft 25. As shown in b), the fluid injection nozzle 40 connected to the arm 50 is moved in the horizontal direction by rotating the arm 50 about the rotation shaft 55 by using the motor 52, and the workpiece W and the tape are moved. The air bubbles B interposed between the T and the work piece W are discharged from the outer periphery of the work piece W.
The water droplets of the mixed fluid R that are reflected by the upper surface Ta of the tape T and head toward the side of the spinner table 2 are the inner side surface 130a of the side surface cover 130 of the scattering prevention cover 13, the lower surface 132b of the inclined plate 132, and the bottom surface cover. It adheres to the lower surface 131b of 131 and flows down along, for example, the side cover 130. Then, it is discharged to the outside of the bubble removing device 1 from a discharge port (not shown).
このとき、例えば、図１に示すように、スピンナテーブル２に保持されている被加工物Ｗが回転軸２５を軸として高速回転している状態で、流体噴射ノズル４０を保持面２０ａの円周の真上の点Ｐ１に位置付けて、混合流体Ｒの噴射を開始する。そして、アーム５０を回転軸５５を軸として旋回させることによって、アーム５０に接続されている流体噴射ノズル４０を、スピンナテーブル２の中心Ｏの真上の点Ｐ０を通過するように、点Ｐ１とは異なる保持面２０ａの円周の真上の点Ｐ２に移動させる。そして、流体噴射ノズル４０が点Ｐ２に到達したら、モータ５２を電気的に制御して、アーム５０を回転軸５５を軸として逆回転させることにより、点Ｐ２に位置付けられている流体噴射ノズル４０を、点Ｐ０を経由して点Ｐ１に移動させる。このようにして、流体噴射ノズル４０から混合流体Ｒを噴射させながら、点Ｐ０を経由した点Ｐ１と点Ｐ２との間の往復移動させることによって、被加工物ＷとテープＴとの間に介在している気泡Ｂを被加工物Ｗの円の外周へと排出して取り除くことができる。 At this time, for example, as shown in FIG. 1, the fluid injection nozzle 40 is held at the circumference of the holding surface 20a while the workpiece W held on the spinner table 2 is rotating at high speed about the rotation shaft 25. Positioning at the point P1 directly above the above, the injection of the mixed fluid R is started. Then, by rotating the arm 50 about the rotation shaft 55, the fluid injection nozzle 40 connected to the arm 50 is passed through the point P0 directly above the center O of the spinner table 2 with the point P1. Moves to a point P2 just above the circumference of the different holding surface 20a. Then, when the fluid injection nozzle 40 reaches the point P2, the motor 52 is electrically controlled to rotate the arm 50 in the reverse direction around the rotation shaft 55, so that the fluid injection nozzle 40 positioned at the point P2 is rotated. , Move to point P1 via point P0. In this way, while injecting the mixed fluid R from the fluid injection nozzle 40, the mixed fluid R is reciprocated between the points P1 and P2 via the point P0, thereby intervening between the workpiece W and the tape T. The bubble B can be discharged to the outer circumference of the circle of the work piece W and removed.
また、例えば、図２（ａ）に示すように、流体噴射ノズル４０が点Ｐ０の付近、つまり回転中心に位置付けられている状態で、流体の噴射を開始するとともに、流体噴射ノズル４０を回転軸５５を軸として短い距離だけ往復移動させて、例えば、被加工物Ｗの中心Ｗｏの付近に位置している気泡Ｂを被加工物Ｗの外周方向へと移動させる。そして、時間の経過とともに、例えば、モータ５２を電気的に制御してアーム５０の旋回角度を大きくしていくことによって、図２（ｂ）に示すように、流体噴射ノズル４０の往復移動の片道の路程を大きくしていき、徐々に気泡Ｂを被加工物Ｗの円の外周へと追いやっていく。このように、流体噴射ノズル４０の移動距離を制御することによって、より効率的に気泡Ｂを被加工物Ｗの外側へと排出することができる。 Further, for example, as shown in FIG. 2A, when the fluid injection nozzle 40 is positioned near the point P0, that is, at the center of rotation, the fluid injection is started and the fluid injection nozzle 40 is rotated on the rotation axis. The bubble B located near the center Wo of the work piece W is moved in the outer peripheral direction of the work piece W by reciprocating the work piece W by a short distance about 55 as an axis. Then, with the passage of time, for example, by electrically controlling the motor 52 to increase the turning angle of the arm 50, as shown in FIG. 2 (b), the fluid injection nozzle 40 moves back and forth one way. The path of the air bubble B is gradually increased to the outer circumference of the circle of the workpiece W. By controlling the moving distance of the fluid injection nozzle 40 in this way, the bubbles B can be more efficiently discharged to the outside of the workpiece W.
さらには、例えば、モータ２２の電気的制御を行い、軸部５１の回転速度を制御して、アーム５０の旋回速度を制御することによって流体噴射ノズル４０の水平方向への移動速度を変化させてもよい。例えば、流体噴射ノズル４０の水平移動の速度を、時間の経過とともに遅くさせる、つまり流体噴射ノズル４０が被加工物Ｗの外周に近くなるほど遅くさせる、といった構成も考えられる。
また、流体噴射ノズル４０を往復移動させないで、点Ｐ０に位置づけ、流体の噴射を開始し、点Ｐ１または点Ｐ２のいずれかに向かって移動させることで、徐々に気泡Ｂを被加工物Ｗの円の外周へと追いやっていってもよい。
Further, for example, the motor 22 is electrically controlled, the rotation speed of the shaft portion 51 is controlled, and the turning speed of the arm 50 is controlled to change the moving speed of the fluid injection nozzle 40 in the horizontal direction. May be good. For example, it is conceivable to slow down the horizontal movement speed of the fluid injection nozzle 40 with the passage of time, that is, to slow down the fluid injection nozzle 40 as it gets closer to the outer circumference of the workpiece W.
Further, by positioning the fluid injection nozzle 40 at the point P0 without reciprocating the fluid injection nozzle 40, starting the fluid injection, and moving the fluid injection nozzle 40 toward either the point P1 or the point P2, the bubbles B are gradually moved to the workpiece W. It may be driven to the outer circumference of the circle.
上記のように、噴射口４１からテープＴの上面Ｔａに向けて混合流体Ｒを噴射させながら、流体噴射ノズル４０を適宜、水平移動させることによって、被加工物ＷとテープＴとの間に介在している気泡Ｂを効率的に被加工物Ｗの外周から排出することができる。
さらに、流体噴射ノズル４０の水平移動させない構成でもよい。この場合、流体噴射ノズル４０から噴射された流体が、被加工物Ｗの上面を中央から外周にむかって流れる際に、気泡で盛り上がったテープＴに流体が流れる力が加わることで、気泡Ｂを被加工物Ｗの外周へと移動させることができる。
As described above, while injecting the mixed fluid R from the injection port 41 toward the upper surface Ta of the tape T, the fluid injection nozzle 40 is appropriately moved horizontally to intervene between the workpiece W and the tape T. The bubbles B can be efficiently discharged from the outer periphery of the work piece W.
Further, the fluid injection nozzle 40 may not be moved horizontally. In this case, when the fluid injected from the fluid injection nozzle 40 flows from the center to the outer circumference on the upper surface of the workpiece W, the force of the fluid flowing to the tape T raised by the bubbles is applied to generate the bubbles B. It can be moved to the outer circumference of the work piece W.
上記の保持工程においては、図３（ａ）及び図３（ｂ）に示すように、スピンナテーブル２の保持面２０ａとテープＴとが当接するように、被加工物Ｗの他方の面Ｗｂが露出した状態で被加工物Ｗがスピンナテーブル２に保持されていてもよい。 In the above holding step, as shown in FIGS. 3A and 3B, the other surface Wb of the workpiece W is brought into contact with the holding surface 20a of the spinner table 2 and the tape T. The workpiece W may be held on the spinner table 2 in an exposed state.
かかる場合は、流体噴射ノズル４０の噴射口４１から、被加工物Ｗの他方の面Ｗｂに向けて上記と同様に混合流体Ｒを噴射する。例えば、図３（ａ）に示すように、流体噴射ノズル４０から被加工物Ｗの中心Ｗｏの付近に向かって混合流体Ｒを噴射して、被加工物ＷとテープＴとの間に介在している気泡Ｂを被加工物Ｗの円の外周方向に移動させる。そして、図３（ｂ）に示すように、被加工物Ｗの円の外周付近に位置している気泡Ｂを被加工物Ｗの外周から排除する。これにより、被加工物ＷとテープＴとの間に介在している気泡を効率的に被加工物Ｗの外周から排出することができる。 In such a case, the mixed fluid R is injected from the injection port 41 of the fluid injection nozzle 40 toward the other surface Wb of the workpiece W in the same manner as described above. For example, as shown in FIG. 3A, the mixed fluid R is injected from the fluid injection nozzle 40 toward the vicinity of the center W of the workpiece W, and is interposed between the workpiece W and the tape T. The bubble B is moved in the outer peripheral direction of the circle of the work piece W. Then, as shown in FIG. 3B, the bubbles B located near the outer circumference of the circle of the workpiece W are excluded from the outer circumference of the workpiece W. As a result, air bubbles interposed between the workpiece W and the tape T can be efficiently discharged from the outer periphery of the workpiece W.
なお、エア流路開閉バルブ６２と水路開閉バルブ７２とを適宜、開閉制御することによって、噴射口４１から、例えば、エアのみを噴射させることで気泡Ｂを除去する事も可能である。 By appropriately controlling the opening and closing of the air flow path opening / closing valve 62 and the water channel opening / closing valve 72, it is possible to remove the bubble B by injecting only air from the injection port 41, for example.
１ 気泡除去装置 １０：天板 １１：連結部材 １２：ケーシング
１２０：外周板 １２１：底板 １２２：内周板
１３：飛散防止カバー １３０：側面カバー １３１：底面カバー １３１ｂ：下面
１３２：傾斜板 １３２ｂ：下面 １３３：開口
２：スピンナテーブル ２０：吸引部 ２０ａ：保持面 ２１：枠体 ２２：モータ
２３：スピンドル ２４：ロータリージョイント ２５：回転軸
Ｏ：スピンナテーブルの中心 ３：制御手段 ４０：流体噴射ノズル ４１：噴射口
５：水平移動手段 ５０：アーム ５１：軸部 ５２：モータ ５５：回転軸
６：エア源 ６０：ジョイント ６１：エア流路 ６２：エア流路開閉バルブ
７：水源 ７０：ジョイント ７１：水路 ７２：水路開閉バルブ
Ｗ：被加工物 Ｗａ：一方の面 Ｗｂ：他方の面 Ｌ：分割予定ライン Ｄ：デバイス
Ｗ１：被加工物 Ｔ１：ダイシングテープ Ｆ：リングフレーム
Ｔ：テープ Ｔａ：テープの上面 Ｂ：気泡 Ｒ：混合流体
Ｐ０：保持面の中心の真上の点 Ｐ１、Ｐ２：保持面の円周の真上の点
1 Air bubble removal device 10: Top plate 11: Connecting member 12: Casing 120: Outer peripheral plate 121: Bottom plate 122: Inner peripheral plate 13: Scattering prevention cover 130: Side cover 131: Bottom cover 131b: Lower surface 132: Inclined plate 132b: Lower surface 133: Opening 2: Spinner table 20: Suction part 20a: Holding surface 21: Frame body 22: Motor 23: Spindle 24: Rotary joint 25: Rotating axis O: Spinner table center 3: Control means 40: Fluid injection nozzle 41: Injection port 5: Horizontal moving means 50: Arm 51: Shaft 52: Motor 55: Rotating shaft 6: Air source 60: Joint 61: Air flow path 62: Air flow path opening / closing valve 7: Water source 70: Joint 71: Water channel 72 : Water channel opening / closing valve W: Work piece Wa: One side Wb: The other side L: Scheduled division line D: Device W1: Work piece T1: Dying tape F: Ring frame T: Tape Ta: Top surface of tape B: Bubble R: Mixed fluid P0: Point directly above the center of the holding surface P1, P2: Point directly above the circumference of the holding surface
Claims (5)
被加工物の一方の面全面を覆うようにテープを貼着するテープ貼着工程と、
該テープを貼着した被加工物の他方の面をスピンナテーブルの保持面で保持する保持工程と、
該保持面の中心上方に配置される流体噴射ノズルから、該保持面に保持された被加工物に貼着した該テープの表面に向かって流体を噴射させ、該保持面の中心を軸に該スピンナテーブルを高速回転させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させる気泡抜き工程と、
を備えたテープ貼着方法。 It is a tape sticking method that sticks tape to one side of the work piece.
A tape application process in which the tape is applied so as to cover the entire surface of one surface of the work piece,
A holding step of holding the other surface of the work piece to which the tape is attached by a holding surface of a spinner table, and
A fluid injection nozzle arranged above the center of the holding surface ejects fluid toward the surface of the tape attached to the workpiece held on the holding surface, and the center of the holding surface is used as an axis. A bubble removing step in which the spinner table is rotated at a high speed to discharge air bubbles interposed between the work piece and the tape from the outer periphery of the work piece.
How to apply tape with.
被加工物の一方の面全面を覆うようにテープを貼着するテープ貼着工程と、
該スピンナテーブルの保持面で該テープを保持し該保持面が該テープを介して被加工物を保持する保持工程と、
該保持面の中心上方に配置される流体噴射ノズルから、該保持面が該テープを介して保持する被加工物の他方の面に向かって流体を噴射させ、該保持面の中心を軸に該スピンナテーブルを高速回転させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させる気泡抜き工程と、
を備えたテープ貼着方法。 It is a tape sticking method that sticks tape to one side of the work piece.
A tape application process in which the tape is applied so as to cover the entire surface of one surface of the work piece,
A holding step of holding the tape on the holding surface of the spinner table and holding the work piece through the tape.
A fluid injection nozzle arranged above the center of the holding surface injects fluid toward the other surface of the work piece held by the holding surface via the tape, and the center of the holding surface is used as an axis. A bubble removing step in which the spinner table is rotated at a high speed to discharge air bubbles interposed between the work piece and the tape from the outer periphery of the work piece.
How to apply tape with.
該気泡抜き工程は、該水平移動手段によって、該流体噴射ノズルを該保持面の中心を通り該保持面の径方向に水平移動させ、該被加工物と該テープとの間に介在している気泡を該被加工物の外周から排出させる請求項１又は２記載のテープ貼着方法。 A horizontal moving means for horizontally moving the fluid injection nozzle is provided.
In the bubble removing step, the fluid injection nozzle is horizontally moved in the radial direction of the holding surface through the center of the holding surface by the horizontal moving means, and is interposed between the workpiece and the tape. The tape attachment method according to claim 1 or 2, wherein air bubbles are discharged from the outer periphery of the work piece.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019066729A JP2020167284A (en) | 2019-03-29 | 2019-03-29 | Tape sticking method |
| KR1020200022209A KR20200115110A (en) | 2019-03-29 | 2020-02-24 | Tape sticking method |
| CN202010190519.6A CN111755373A (en) | 2019-03-29 | 2020-03-18 | Tape sticking method |
| TW109110249A TW202041384A (en) | 2019-03-29 | 2020-03-26 | Sticking method of adhesive film to create a state without air bubbles between the workpiece and the adhesive film |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2019066729A JP2020167284A (en) | 2019-03-29 | 2019-03-29 | Tape sticking method |
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| JP2020167284A true JP2020167284A (en) | 2020-10-08 |
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| JP2019066729A Pending JP2020167284A (en) | 2019-03-29 | 2019-03-29 | Tape sticking method |
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| JP (1) | JP2020167284A (en) |
| KR (1) | KR20200115110A (en) |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6235637A (en) * | 1985-08-09 | 1987-02-16 | Hitachi Ltd | Wafer pasting device |
| JPH0287545A (en) * | 1988-09-24 | 1990-03-28 | Nitto Denko Corp | Tape bonding process of semiconductor wafer |
| JP2010265404A (en) * | 2009-05-15 | 2010-11-25 | Fujitsu Ltd | Adhesion method and adhesion device |
| JP2012511264A (en) * | 2008-12-08 | 2012-05-17 | フジフィルム ディマティックス， インコーポレイテッド | Wafer taping |
| JP2018118880A (en) * | 2017-01-26 | 2018-08-02 | セントラル硝子株式会社 | Method for manufacturing laminated glass |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007079911A (en) | 2005-09-14 | 2007-03-29 | Jr East Mechatronics Co Ltd | Traveling expense settlement method utilizing ic card |
| JP2007281343A (en) | 2006-04-11 | 2007-10-25 | Disco Abrasive Syst Ltd | Wafer supporting method and wafer supporting apparatus |
-
2019
- 2019-03-29 JP JP2019066729A patent/JP2020167284A/en active Pending
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2020
- 2020-02-24 KR KR1020200022209A patent/KR20200115110A/en active Search and Examination
- 2020-03-18 CN CN202010190519.6A patent/CN111755373A/en active Pending
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6235637A (en) * | 1985-08-09 | 1987-02-16 | Hitachi Ltd | Wafer pasting device |
| JPH0287545A (en) * | 1988-09-24 | 1990-03-28 | Nitto Denko Corp | Tape bonding process of semiconductor wafer |
| JP2012511264A (en) * | 2008-12-08 | 2012-05-17 | フジフィルム ディマティックス， インコーポレイテッド | Wafer taping |
| JP2010265404A (en) * | 2009-05-15 | 2010-11-25 | Fujitsu Ltd | Adhesion method and adhesion device |
| JP2018118880A (en) * | 2017-01-26 | 2018-08-02 | セントラル硝子株式会社 | Method for manufacturing laminated glass |
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| KR20200115110A (en) | 2020-10-07 |
| TW202041384A (en) | 2020-11-16 |
| CN111755373A (en) | 2020-10-09 |
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