TWM596457U - Substrate conveying unit and scribing apparatus including the same - Google Patents
Substrate conveying unit and scribing apparatus including the same Download PDFInfo
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- TWM596457U TWM596457U TW108215722U TW108215722U TWM596457U TW M596457 U TWM596457 U TW M596457U TW 108215722 U TW108215722 U TW 108215722U TW 108215722 U TW108215722 U TW 108215722U TW M596457 U TWM596457 U TW M596457U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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Abstract
Description
本新型涉及一種移送基板的基板移送單元及具備基板移送單元的劃線裝置。The present invention relates to a substrate transfer unit for transferring a substrate and a scribing device provided with the substrate transfer unit.
一般而言,在用於平板顯示器的液晶顯示面板、有機電致發光顯示器面板、無機電致發光顯示器面板、透射投影基板、反射投影基板等中使用從玻璃之類脆性母玻璃面板(以下,稱為“基板”)切割成預定尺寸的單位玻璃面板(以下,稱為“單位基板”)。In general, brittle mother glass panels such as glass are used in liquid crystal display panels for flat panel displays, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projection substrates, reflective projection substrates, etc. (hereinafter, referred to as Is a "substrate") cut into a unit glass panel of a predetermined size (hereinafter, referred to as "unit substrate").
將基板切割為單位基板的工藝包括沿成為基板的切割基準的切割計畫線使金剛石之類材質的劃線輪加壓於基板並移動而在基板形成劃線的劃線工藝。The process of cutting the substrate into unit substrates includes a scribing process in which a scribing wheel made of diamond or the like is pressed against the substrate along a cutting plan line that serves as a basis for cutting the substrate to form a scribing line on the substrate.
在這種劃線工藝中,在基板被帶支承的狀態下基板的後隨端被夾具裝置夾持後向劃線單元移送。In this scribing process, the trailing end of the substrate is clamped by the jig device in a state where the substrate is supported by the tape, and then transferred to the scribing unit.
夾具裝置一般而言具備一對夾緊部件。在基板位於一對夾緊部件之間的狀態下,隨著一對夾緊部件以彼此接近的方式移動,基板被一對夾緊部件夾持。The clamp device generally includes a pair of clamping members. In a state where the substrate is located between the pair of clamping members, as the pair of clamping members move close to each other, the substrate is clamped by the pair of clamping members.
另一方面,劃線裝置有時需要執行切割具有多種厚度的多種基板的工藝。但是,在以往的夾具裝置的情況下,存在每當基板的厚度變更時為了穩定地夾持基板而需要進行使夾具裝置整體高度與基板的厚度相對應的變更的追加性作業的缺點。On the other hand, the scribing device sometimes needs to perform a process of cutting various substrates having various thicknesses. However, in the case of the conventional jig device, there is a disadvantage that it is necessary to perform the additional work of changing the overall height of the jig device according to the thickness of the substrate in order to stably hold the substrate every time the thickness of the substrate changes.
本新型的目的在於提供一種即使在基板的厚度變更的情況下也無需進行使夾具裝置整體高度與基板的厚度相對應的變更的追加性作業,並能夠穩定地夾持基板的基板移送單元及具備基板移送單元的劃線裝置。An object of the present invention is to provide a substrate transfer unit capable of stably holding a substrate and providing a substrate transfer unit that does not require additional work to change the overall height of the jig device according to the thickness of the substrate even when the thickness of the substrate is changed Scribing device for substrate transfer unit.
用於達到上述目的的本新型的實施例提供一種基板移送單元可以包括:支承台,構成為支承基板;框架,設置於支承台的上方,並構成為向移送基板的方向移動;以及夾具裝置,安裝於框架,並構成為夾持基板,夾具裝置可以包括:第一夾緊部件,具有支承基板的第一面的基板支承面,並以能夠轉動的方式連接於轉動軸;第二夾緊部件,具有支承基板的第二面的基板支承面;以及致動器,通過驅動力傳遞部件及驅動力傳遞杆連接於第一夾緊部件,並構成為使第一夾緊部件以轉動軸為中心旋轉。An embodiment of the present invention for achieving the above object provides a substrate transfer unit that may include: a support table configured to support the substrate; a frame provided above the support table and configured to move in the direction of transferring the substrate; and a fixture device, Mounted on the frame and configured to clamp the substrate, the clamp device may include: a first clamping member having a substrate supporting surface that supports the first surface of the substrate, and rotatably connected to the rotating shaft; a second clamping member , A substrate supporting surface having a second surface supporting the substrate; and an actuator, connected to the first clamping member through a driving force transmission member and a driving force transmission rod, and configured such that the first clamping member is centered on the rotation axis Spin.
可以是,第一夾緊部件的朝向基板的前端為圓弧狀。The front end of the first clamping member facing the substrate may have an arc shape.
在框架可以安裝有多個夾具裝置,構成多個夾具裝置的多個致動器內部的壓力可以通過一個調節器來調節。A plurality of clamp devices may be installed on the frame, and the pressure inside the plurality of actuators constituting the plurality of clamp devices may be adjusted by one regulator.
可以是,在第一夾緊部件的基板支承面或第二夾緊部件的基板支承面附著有支承墊,支承墊由與基板相比具有大彈力的材料形成。A support pad may be attached to the substrate support surface of the first clamping member or the substrate support surface of the second clamping member, and the support pad is formed of a material having a larger elastic force than the substrate.
可以是,支承在第一夾緊部件的基板支承面上的基板的第一面的支承面積小於支承在第二夾緊部件的基板支承面上的基板的第二面的支承面積。The support area of the first surface of the substrate supported on the substrate support surface of the first clamping member may be smaller than the support area of the second surface of the substrate supported on the substrate support surface of the second clamping member.
另外,根據本新型的實施例提供一種基板移送單元可以包括:支承台,構成為支承基板;框架,設置於支承台的上方,並構成為向移送基板的方向移動;以及夾具裝置,安裝於框架,並構成為夾持基板,夾具裝置可以包括:第一夾緊部件,具有支承基板的第一面的基板支承面,並以能夠轉動的方式連接於第一轉動軸;第二夾緊部件,具有支承基板的第二面的基板支承面;第一致動器,通過第一驅動力傳遞部件及第一驅動力傳遞杆連接於第一夾緊部件,並構成為使第一夾緊部件以第一轉動軸為中心旋轉;以及姿態保持單元,以使第一夾緊部件的基板支承面與第二夾緊部件的基板支承面平行的方式,保持第一夾緊部件的姿態。In addition, an embodiment of the present invention provides that a substrate transfer unit may include: a support table configured to support the substrate; a frame provided above the support table and configured to move toward the direction of transferring the substrate; and a fixture device installed on the frame , And is configured to clamp the substrate, the clamp device may include: a first clamping member having a substrate supporting surface supporting the first surface of the substrate, and rotatably connected to the first rotating shaft; a second clamping member, A substrate supporting surface having a second surface supporting the substrate; the first actuator is connected to the first clamping member through the first driving force transmission member and the first driving force transmission rod, and is configured such that the first clamping member The first rotating shaft rotates around the center; and the posture holding unit maintains the posture of the first clamping member in such a manner that the substrate supporting surface of the first clamping member is parallel to the substrate supporting surface of the second clamping member.
第一驅動力傳遞杆可以通過第二轉動軸連接於第一夾緊部件,姿態保持單元可以包括第二致動器,第二致動器通過第二驅動力傳遞部件及第二驅動力傳遞杆連接於第一夾緊部件,並構成為使第一夾緊部件以與第一轉動軸及第二轉動軸隔開的第三轉動軸為中心旋轉。The first driving force transmission lever may be connected to the first clamping member through the second rotating shaft, and the posture holding unit may include a second actuator, and the second actuator passes through the second driving force transmission member and the second driving force transmission lever It is connected to the first clamping member and is configured to rotate the first clamping member about a third rotating shaft spaced apart from the first rotating shaft and the second rotating shaft.
可以是,第一致動器內部的壓力及第二致動器內部的壓力通過相同的調節器來調節。It may be that the pressure inside the first actuator and the pressure inside the second actuator are adjusted by the same regulator.
在框架可以安裝有多個夾具裝置,構成多個夾具裝置的多個致動器內部的壓力及多個第二致動器內部的壓力可以通過一個調節器來調節。A plurality of clamp devices may be installed on the frame, and the pressure inside the plurality of actuators constituting the plurality of clamp devices and the pressure inside the plurality of second actuators may be adjusted by one regulator.
另外,根據本新型的實施例提供一種劃線裝置可以包括上述的基板移送單元。In addition, according to an embodiment of the present invention, a scribing device may include the substrate transfer unit described above.
根據本新型的實施例的基板移送單元,對應於基板的厚度來調節第一致動器內部的壓力,從而能夠調節第一夾緊部件的第一基板支承面與第二夾緊部件的第二基板支承面之間的隔開距離。因此,即使在基板的厚度變更的情況下也無需進行使夾具裝置整體高度與基板的厚度對應的變更的追加性作業,並能夠穩定地夾持基板。因此,能夠減少作業工藝數量,能夠穩定地執行對基板的預定的處理工藝。另外,通過調節第二致動器內部的壓力,能夠將第一夾緊部件的第一基板支承面的姿態水平保持。因此,在調節了第一夾緊部件的第一基板支承面與第二夾緊部件的第二基板支承面之間的隔開距離的情況下,也能夠將第一夾緊部件的第一基板支承面的姿態水平保持,由此能夠增加支承在第一夾緊部件的第一基板支承面的基板的第一面的支承面積,由此,能夠更穩定地夾持基板。According to the substrate transfer unit of the embodiment of the present invention, the pressure inside the first actuator is adjusted according to the thickness of the substrate, so that the first substrate supporting surface of the first clamping member and the second of the second clamping member can be adjusted The separation distance between the supporting surfaces of the substrate. Therefore, even when the thickness of the substrate is changed, it is not necessary to perform an additional work of changing the overall height of the jig device according to the thickness of the substrate, and it is possible to stably hold the substrate. Therefore, the number of work processes can be reduced, and a predetermined processing process for the substrate can be stably executed. In addition, by adjusting the pressure inside the second actuator, the posture of the first substrate support surface of the first clamping member can be maintained horizontally. Therefore, even when the separation distance between the first substrate support surface of the first clamping member and the second substrate support surface of the second clamping member is adjusted, the first substrate of the first clamping member can also be adjusted By keeping the posture of the support surface horizontal, the support area of the first surface of the substrate supported on the first substrate support surface of the first clamping member can be increased, whereby the substrate can be held more stably.
以下,參照附圖,說明本新型的實施例的基板移送單元及具備基板移送單元的劃線裝置。Hereinafter, the substrate transfer unit and the scribing device provided with the substrate transfer unit of the embodiment of the present invention will be described with reference to the drawings.
通過本新型的實施例的具備基板移送單元的劃線裝置進行切割的物件可以是第一基板和第二基板粘連而成的粘連基板。例如,第一基板可以具備薄膜電晶體,第二基板可以具備濾色器。與此相反,第一基板可以具備濾色器,第二基板可以具備薄膜電晶體。以下,將粘連基板簡稱為基板,將向外部暴露的第一基板的表面稱為第一面,將向外部暴露的第二基板的表面稱為第二面。The object to be cut by the scribing device provided with the substrate transfer unit according to the embodiment of the present invention may be a bonded substrate formed by bonding a first substrate and a second substrate. For example, the first substrate may include a thin film transistor, and the second substrate may include a color filter. In contrast, the first substrate may include a color filter, and the second substrate may include a thin film transistor. Hereinafter, the adhesion substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is referred to as a first surface, and the surface of the second substrate exposed to the outside is referred to as a second surface.
另外,將移送要執行切割基板的工藝的基板的方向定義為Y軸方向,將與移送基板的方向(Y軸方向)垂直的方向定義為X軸方向。而且,將與放置基板的X-Y平面垂直的方向定義為Z軸方向。In addition, the direction in which the substrate to be subjected to the process of cutting the substrate is transferred is defined as the Y-axis direction, and the direction perpendicular to the direction in which the substrate is transferred (Y-axis direction) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-Y plane on which the substrate is placed is defined as the Z-axis direction.
如圖1及圖2所示,本新型的第一實施例的基板移送單元10可以包括:支承基板S的支承台11;夾持支承在支承台11上的基板S的後隨端的夾具裝置50;與夾具裝置50連接並沿X軸方向延伸的框架13;與框架13連接並沿Y軸方向延伸的第一導軌14;與劃線單元30相鄰佈置,並將基板S懸浮或吸附來支承的第一平板15;以及將夾具裝置50選擇性連接於支承台11的連接組件。As shown in FIGS. 1 and 2, the
第一平板15可以構成為能夠將基板S懸浮或吸附。例如,在第一平板15的表面可以形成與氣體供給源及真空源連接的多個狹縫。在從氣體供給源向第一平板15的多個狹縫供給氣體的情況下,基板S能夠從第一平板15懸浮。另外,在通過真空源形成的負壓下經由第一平板15的多個狹縫抽吸氣體的情況下,基板S能夠吸附於第一平板15。The first
在基板S從第一平板15懸浮的狀態下,基板S能夠與第一平板15無摩擦地移動。而且,在基板S的第一面及第二面形成劃線的過程中,基板S能夠吸附並固定於第一平板15。In a state where the substrate S is suspended from the first
支承台11能夠沿Y軸方向往復移動。隨著支承台11沿Y軸方向移動,支承在支承台11上的基板S能夠沿Y軸方向移動。支承台11可以由真空台、帶等能夠將基板S支承的同時水平移動的各種結構構成。The support table 11 can reciprocate in the Y-axis direction. As the support table 11 moves in the Y-axis direction, the substrate S supported on the support table 11 can move in the Y-axis direction. The support table 11 may be constituted by various structures capable of horizontally moving the substrate S while supporting the substrate S, such as a vacuum table or a belt.
支承台11可以由具有基板S整體面積以上面積的一個帶構成。在支承台11由帶構成的情況下,支承台11被多個滑輪111支承。多個滑輪111中至少一個可以是提供使支承台11旋轉的驅動力的驅動滑輪。The support table 11 may be constituted by one belt having an area equal to or greater than the entire area of the substrate S. When the support table 11 is composed of a belt, the support table 11 is supported by a plurality of
支承台11可以具有支承基板S的第一面或第二面的支承面。在支承台11的支承面可以形成有插入並容納夾具裝置50的容納部112。可以是多個容納部112對應於多個夾具裝置50沿X軸方向佈置。容納部112的數量可以與夾具裝置50的數量相同。容納部112可以以將支承台11沿Z軸方向貫穿的貫穿孔的形態形成。只是,本新型不限定於此,在支承台11厚的情況下,容納部112可以以不貫穿支承台11而在支承台11凹陷形成的槽形態形成。在容納部112以貫穿孔或凹陷槽的形態形成的情況下,能夠防止容納部112與基板S之間的干涉。The support table 11 may have a support surface that supports the first surface or the second surface of the substrate S. An
作為一例,夾具裝置50可以選擇性地容納於容納部112。即,夾具裝置50可以沿Z軸方向移動的同時容納於容納部112或者與容納部112隔開。作為其它例,夾具裝置50可以繼續保持容納於容納部112的狀態。As an example, the
作為其它例,如圖3所示,支承台11可以構成為氣體台。在此情況下,在基板S被夾具裝置50夾持並通過氣體台懸浮的狀態下,隨著夾具裝置50沿Y軸方向移動,基板S能夠沿Y軸方向移動。As another example, as shown in FIG. 3, the support table 11 may be configured as a gas table. In this case, in a state where the substrate S is clamped by the
在框架13與第一導軌14之間可以設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆之類直線移動機構。因此,在夾具裝置50夾持基板S的後隨端的狀態下,隨著框架13通過直線移動機構沿Y軸方向移動,能夠沿Y軸方向移送基板S。此時,支承台11能夠在與夾具裝置50的移動同步移動的同時穩定地支承基板S。Between the
另一方面,如圖4所示,具備本新型的第一實施例的基板移送單元10的劃線裝置可以包括:用於在基板S形成劃線的劃線單元30;將基板S向劃線單元30移送的基板移送單元10;將基板S從劃線單元30向後續工藝移送的基板傳送單元20;以及控制劃線裝置的構成要件的工作的控制單元(未圖示)。On the other hand, as shown in FIG. 4, the scribing device provided with the
劃線單元30構成為在基板S的第一面及第二面沿X軸方向分別形成劃線。The
劃線單元30可以包括:沿X軸方向延伸的第一支承架31;在第一支承架31以能夠沿X軸方向移動的方式設置的第一劃線頭32;在第一支承架31的下方與第一支承架31平行地沿X軸方向延伸的第二支承架33;以及在第二支承架33以能夠沿X軸方向移動的方式設置的第二劃線頭34。The
在第一支承架31可以沿X軸方向安裝有多個第一劃線頭32,在第二支承架33可以沿X軸方向安裝有多個第二劃線頭34。在第一支承架31與第二支承架33之間可以形成供基板S穿過的空間。第一支承架31及第二支承架33可以製造成獨立部件來組裝,或者可以製造成一體。A plurality of first
第一劃線頭32和第二劃線頭34可以沿Z軸方向彼此相對佈置。在第一劃線頭32及第二劃線頭34可以設置保持劃線輪351的輪架35。安裝於第一劃線頭32的劃線輪351和安裝於第二劃線頭34的劃線輪351可以沿Z軸方向彼此相對佈置。The
一對劃線輪351可以分別加壓於基板S的第一面及第二面。在一對劃線輪351分別加壓於基板S的第一面及第二面的狀態下,第一劃線頭32及第二劃線頭34對基板S沿X軸方向相對移動,由此能夠在基板S的第一面及第二面沿X軸方向形成劃線。The pair of
另一方面,第一劃線頭32及第二劃線頭34可以構成為分別相對於第一支承架31及第二支承架33能夠沿Z軸方向移動。為此,在第一劃線頭32及第二劃線頭34與第一支承架31及第二支承架33之間可以設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆之類直線移動機構。On the other hand, the
隨著第一劃線頭32及第二劃線頭34分別相對於第一支承架31及第二支承架33沿Z軸方向移動,一對劃線輪351加壓於基板S或者與基板S隔開。而且,通過調節第一劃線頭32及第二劃線頭34沿Z軸方向的移動的程度,能夠調節一對劃線輪351施加於基板S的加壓力。另外,通過第一劃線頭32及第二劃線頭34沿Z軸方向的移動,能夠調節一對劃線輪351對基板S的切削深度。As the
多個夾具裝置50可以沿著框架13沿X軸方向佈置。夾具裝置50可以設置成隨著沿框架13的延伸的導件18能夠沿X軸方向移動。為此,在夾具裝置50與導件18之間可以設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆之類直線移動機構。因此,隨著多個夾具裝置50通過直線移動機構沿X軸方向移動,能夠調節多個夾具裝置50之間的間隔。因此,多個夾具裝置50恰當地對應於基板S的寬度來佈置,從而能夠穩定地夾持基板S。隨著多個夾具裝置50通過直線移動機構沿X軸方向移動,多個夾具裝置50能夠分別對應於支承台11的多個容納部112而定位。The plurality of
在夾具裝置50與框架13之間可以具備使夾具裝置50沿Z軸方向移動的移動組件19。移動組件19可以適用在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆之類直線移動機構。在基板S向支承台11運進或從支承台11運出時,夾具裝置50通過移動組件19以與支承台11隔開的方式移動,由此,能夠防止夾具裝置50與基板S之間的干涉。Between the
夾具裝置50能夠在通過移動組件19沿Z軸方向移動的同時,容納於支承台11的容納部112或從容納部112脫離。The
在夾具裝置50以與支承台11隔開的方式移動的狀態下,夾具裝置50能夠與支承台11的容納部112隔開。因此,在基板S向支承台11的運進的過程中,能夠防止基板S與夾具裝置50之間的干涉。In a state where the
夾具裝置50通過移動組件19沿Z軸方向移動而能夠容納於支承台11的容納部112內。由此,能夠通過夾具裝置50在與支承台11的支承面相同的高度夾持基板S。The
基板傳送單元20可以包括:與劃線單元30相鄰佈置,並將基板S懸浮或吸附來支承的第二平板25;與第二平板25相鄰佈置的移送帶21;以及使第二平板25及移送帶21沿Y軸方向往復移動的移動裝置26。移動裝置26起到使第二平板25及移送帶21跟隨沿Y軸方向延伸的第二導軌24沿Y軸方向往復移動的作用。移動裝置26可以適用在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆之類直線移動機構。The
第二平板25和移送帶21可以構成為能夠一起沿Y軸方向移動。即,第二平板25和移送帶21可以構成為能夠沿與移送基板S的方向平行的方向(Y軸方向)一起移動。The second
在通過劃線單元30在基板S的第一面及第二面分別形成劃線時,第二平板25朝向第一平板15移動,由此,第一劃線頭32及第二劃線頭34能夠位於第一平板15與第二平板25之間。在通過劃線單元30在基板S的第一面及第二面分別形成劃線時,第二平板25朝向第一平板15移動,因此能夠將基板S穩定地支承於第一平板15及第二平板25。When the
移送帶21可以具備多個,多個移送帶21可以在X軸方向上彼此隔開。各個移送帶21被多個滑輪211支承,多個滑輪211中至少一個可以是提供使移送帶21旋轉的驅動力的驅動滑輪。The
第二平板25可以構成為能夠將基板S懸浮或吸附。例如,在第二平板25的表面可以形成與氣體供給源及真空源連接的多個狹縫。在從氣體供給源向第二平板25的多個狹縫供給氣體的情況下,基板S能夠從第二平板25懸浮。另外,在通過真空源形成的負壓下經由第二平板25的多個狹縫抽吸氣體的情況下,基板S能夠吸附於第二平板25。The second
在基板S向第二平板25移送的過程中,向第二平板25的狹縫供給氣體,由此,基板S能夠與第二平板25無摩擦地移動。While the substrate S is being transferred to the second
而且,於在基板S的第一面及第二面形成劃線的過程中,基板S能夠吸附並固定於第二平板25。Moreover, the substrate S can be adsorbed and fixed to the second
而且,在基板S的第一面及第二面分別形成劃線之後,在基板S吸附於第一平板15及第二平板25的狀態下,第二平板25以遠離第一平板15的方式移動,由此能夠將基板S以劃線為基準分割。Furthermore, after the scribe lines are formed on the first surface and the second surface of the substrate S, respectively, while the substrate S is attracted to the first
另一方面,在基板S從第二平板25向後續工藝移動的過程中,向第二平板25的狹縫供給氣體,由此,基板S能夠與第二平板25無摩擦地移動。On the other hand, during the movement of the substrate S from the second
如圖5至圖7所示,夾具裝置50包括底座51、夾緊單元52及驅動單元53。As shown in FIGS. 5 to 7, the
底座51在框架13以能夠分離的方式固定,由此,夾具裝置50能夠支承於框架13。在底座51以能夠工作的方式安裝有夾緊單元52。驅動單元53構成為使夾緊單元52工作。The
夾緊單元52包括第一夾緊部件521、第二夾緊部件522、連接部件523、第一轉動軸524及第二轉動軸525。The clamping
第一夾緊部件521與第一轉動軸524以能夠轉動的方式連接。第二夾緊部件522安裝於底座51而其位置被固定。The
第一夾緊部件521具備支承基板S的第一面的第一基板支承面5211。第二夾緊部件522具備支承與基板S的第一面相反的基板S的第二面的第二基板支承面5221。The
在基板S位於第一夾緊部件521與第二夾緊部件522之間的狀態下,第一夾緊部件521以與第二夾緊部件522接近的方式移動,由此能夠通過第一夾緊部件521的第一基板支承面5211及第二夾緊部件522的第二基板支承面5221支承(夾持)基板S。In a state where the substrate S is located between the
在第一基板支承面5211附著有第一支承墊526。在第二基板支承面5221具備第二支承墊527。第一支承墊526及第二支承墊527由聚氨酯等合成樹脂形成。第一支承墊526及第二支承墊527是與基板S接觸的部分,起到吸收當第一支承墊526及第二支承墊527與基板S接觸時產生的衝擊的作用。第一支承墊526及第二支承墊527可以與基板S相比具有大彈力。因此,第一支承墊526及第二支承墊527能夠更穩定地夾持基板S。A
尤其,如圖7所示,在第一夾緊部件521及第二夾緊部件522夾持相對厚的基板S的情況下,以第一夾緊部件521的第一基板支承面5211相對於基板S的第一面傾斜預定角度的狀態夾持基板S。在此情況下,由於與第一夾緊部件521接觸的基板S的第一面的面積小,從而可能沒有恰當地支承基板S。根據本新型的實施例,在第一基板支承面5211具備與基板S相比具有大彈力的第一支承墊526,因此,在以第一基板支承面5211相對於基板S的第一面傾斜預定角度的狀態夾持基板S的情況下,第一支承墊526也在以與基板S的形狀符合的方式彈性變形的同時緊貼於基板S。因此,能夠不從第一支承墊526滑移或脫離而無損傷地穩定地保持基板S。In particular, as shown in FIG. 7, when the
尤其,在基板S為薄膜玻璃板的情況下,通過第一支承墊526及第二支承墊527的緩衝力,能夠防止基板S的損傷。In particular, when the substrate S is a thin-film glass plate, the cushioning forces of the
連接部件523構成為將第一夾緊部件521連接於驅動單元53。連接部件523連接於第一轉動軸524及第二轉動軸525。第一夾緊部件521通過連接部件523連接於第一轉動軸524及第二轉動軸525。連接部件523及第一夾緊部件521可以製造成一體或單獨製造後組裝成一體。連接部件523可以與第一夾緊部件521一起以第一轉動軸524為中心轉動。The connecting
第一轉動軸524是固定於底座51的固定軸。第二轉動軸525是跟隨連接部件523的移動而移動的活動軸。The
在底座51可以安裝有轉動軸支架513,第一轉動軸524可以在轉動軸支架513以能夠旋轉的方式支承。A
驅動單元53包括第一致動器531、第一驅動力傳遞部件532、第一驅動力傳遞杆533、流體供給源534、調節器535、第一線路536、第二線路537、第一閥門538及第二閥門539。The driving
第一致動器531起到向第一夾緊部件521提供驅動力的作用。第一致動器531通過第一致動器轉動軸5313連接於底座51。第一致動器轉動軸5313通過第一致動器轉動軸支架515能夠固定於底座51。第一致動器531可以具備朝向第一致動器轉動軸5313延伸的轉動軸塊5314,轉動軸塊5314可以以能夠轉動的方式連接於第一致動器轉動軸5313。The
因此,在第一驅動力傳遞杆533前進或後退的過程中,第一致動器531能夠以第一致動器轉動軸5313為中心轉動。Therefore, during the forward or backward movement of the first driving
在第一致動器531的內部以能夠往復移動的方式佈置有第一驅動力傳遞部件532。第一致動器531具備:與第一線路536連接的第一埠5311;以及與第二線路537連接的第二埠5312。A first driving
第一閥門538構成為開放或關閉從流體供給源534經由第一線路536向第一埠5311相連的流路。第二閥門539構成為開放或關閉從流體供給源534經由第二線路537向第二埠5312相連的流路。The
根據這種結構,隨著流體經由第一線路536及第一埠5311向第一致動器531的內部流入,第一驅動力傳遞部件532能夠向朝向夾緊單元52的方向移動。而且,隨著流體經由第二線路537及第二埠5312向第一致動器531的內部流入,第一驅動力傳遞部件532能夠向遠離夾緊單元52的方向移動。如此,根據第一致動器531內部的壓力,第一驅動力傳遞部件532能夠移動。According to this configuration, as the fluid flows into the
第一驅動力傳遞杆533的一端連接於第一驅動力傳遞部件532,第一驅動力傳遞杆533的另一端通過第一連接頭5331及第二轉動軸525連接於連接部件523。第一驅動力傳遞杆533通過第二轉動軸525以能夠轉動的方式連接於第一夾緊部件521。由此,第一驅動力傳遞部件532通過第一驅動力傳遞杆533、第一連接頭5331、第二轉動軸525及連接部件523連接於第一夾緊部件521。由此,第一致動器531的驅動力通過第一驅動力傳遞部件532、第一驅動力傳遞杆533、第一連接頭5331、第二轉動軸525及連接部件523提供至第一夾緊部件521。One end of the first driving
根據第一致動器531內部的壓力,第一驅動力傳遞部件532能夠在第一致動器531內移動,通過第一驅動力傳遞部件532的移動,第一驅動力傳遞杆533能夠移動,通過第一驅動力傳遞杆533的移動,連接部件523及第一夾緊部件521能夠以第一轉動軸524為中心轉動。According to the pressure inside the
第一夾緊部件521能夠在以第一轉動軸524為中心轉動的同時,以與第二夾緊部件522接近的方式移動或以遠離第二夾緊部件522的方式移動。The
另一方面,第一驅動力傳遞杆533能夠在前進或後退的同時,向相對於底座51遠離或接近的方向移動。可以在底座51具備第一導向組件511,以引導第一驅動力傳遞杆533相對於底座51的移動。例如,第一導向組件511可以由與第一驅動力傳遞杆533連接的導軌構成。On the other hand, the first driving
通過流體供給源534供給的流體可以是液體或氣體。驅動單元53可以以液壓式或氣壓式工作。The fluid supplied by the
調節器535構成為調節向第一致動器531的內部供給的流體壓力。通過調節器535,能夠調節第一致動器531內部的壓力。通過調節器535,能夠將第一致動器531的內壓保持一定。另外,通過調節器535,能夠調節第一致動器531的內壓。第一致動器531的內壓可以根據基板S的厚度來決定,根據第一致動器531的內壓,可以決定第一夾緊部件521與第二夾緊部件522之間的角度及第一驅動力傳遞杆533的引出角度。The
在基板S位於第一夾緊部件521與第二夾緊部件522之間時,通過調節器535調節第一致動器531內部的壓力,由此基板S的第一面能夠接觸於第一夾緊部件521的第一基板支承面5211而被加壓。When the substrate S is located between the
如圖6及圖7所示,隨著通過調節器535調節第一致動器531內部的壓力,能夠調節第一驅動力傳遞部件532在第一致動器531內部的位置。隨著調節第一驅動力傳遞部件532的位置,能夠調節第一夾緊部件521的轉動角度。隨著調節第一夾緊部件521的轉動角度,能夠調節第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離。如此,隨著通過調節器535調節第一致動器531內部的壓力,能夠將第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離調節成與基板S的厚度對應。As shown in FIGS. 6 and 7, as the pressure inside the
另一方面,如圖7所示,隨著基板S的厚度增加,支承在第一夾緊部件521的第一基板支承面5211上的基板S的第一面的支承面積小於支承在第二夾緊部件522的第二基板支承面5221上的基板S的第二面的支承面積。On the other hand, as shown in FIG. 7, as the thickness of the substrate S increases, the support area of the first surface of the substrate S supported on the first
另一方面,在基板移送單元10具備多個夾具裝置50的情況下,構成多個夾具裝置50的多個第一致動器531內部的壓力可以通過一個調節器535調節。因此,由於多個第一致動器531能夠通過一個調節器535同時控制,因此能夠通過多個夾具裝置50均勻地夾持基板S。On the other hand, when the
根據本新型的第一實施例的基板移送單元,對應於基板S的厚度來調節第一致動器531內部的壓力,從而能夠調節第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離。因此,即使在基板S的厚度變更的情況下也無需進行使夾具裝置50整體高度與基板S的厚度對應的變更的追加性作業,並能夠穩定地夾持基板S。因此,能夠減少作業工藝數量。另外,能夠穩定地執行對基板S的預定的處理工藝,或者能夠將基板S向後續工藝穩定地移送。According to the substrate transfer unit of the first embodiment of the present invention, the pressure inside the
以下,參照圖8,說明本新型的第二實施例的基板移送單元。對與前述的本新型的第一實施例中說明的部分相同的部分,標注相同的附圖標記,省略對其的詳細說明。Hereinafter, the substrate transfer unit of the second embodiment of the present invention will be described with reference to FIG. 8. The same parts as those described in the first embodiment of the present invention described above are denoted by the same reference signs, and detailed descriptions thereof are omitted.
如圖8所示,根據本新型的第二實施例的基板移送單元,第一夾緊部件521的朝向基板S的前端可以為圓弧狀。As shown in FIG. 8, according to the substrate transfer unit of the second embodiment of the present invention, the front end of the
第一夾緊部件521的前端可以向基板S進入第一夾緊部件521與第二夾緊部件522之間的方向形成圓弧狀。The front end of the
根據本新型的第二實施例的基板移送單元,在基板S進入第一夾緊部件521與第二夾緊部件522之間的過程中,在基板S的端部碰撞於第一夾緊部件521的前端的情況下,基板S的端部被引導於第一夾緊部件521的前端的圓弧部,從而也能夠向第一夾緊部件521與第二夾緊部件522之間穩定地進入。另外,能夠防止基板S的翹曲或破損。According to the substrate transfer unit of the second embodiment of the present invention, when the substrate S enters between the
以下,參照圖9及圖10,說明本新型的第三實施例的基板移送單元。對與前述的本新型的第一及第二實施例中說明的部分相同的部分,標注相同的附圖標記,省略對其的詳細說明。Hereinafter, the substrate transfer unit of the third embodiment of the present invention will be described with reference to FIGS. 9 and 10. The same parts as those described in the first and second embodiments of the present invention described above are denoted by the same reference signs, and detailed descriptions thereof are omitted.
如圖9所示,第一驅動力傳遞杆533的延伸線EL可以經過第一致動器轉動軸5313的中心C5。作為其它例,第一驅動力傳遞杆533的延伸線EL可以至少位於底座51與第一致動器轉動軸5313的中心C5之間。As shown in FIG. 9, the extension line EL of the first driving
另外,如圖10所示,在第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221彼此接觸的狀態下,第二轉動軸525的中心C2與第一轉動軸524的中心C1相比位於更靠近第一夾緊部件521及第二夾緊部件522的位置。In addition, as shown in FIG. 10, in a state where the first
根據本新型的第三實施例的基板移送單元,能夠防止脆性材料基板S的裂開、刮痕、戳印、破碎、破損、損傷等,第一夾緊部件521及第二夾緊部件522能夠防止基板滑移或脫離而能夠更穩定地夾持基板S。According to the substrate transfer unit of the third embodiment of the present invention, cracking, scratching, stamping, crushing, breakage, damage, etc. of the brittle material substrate S can be prevented, and the
另外,在第一夾緊部件521及第二夾緊部件522釋放基板S時,能夠防止基板S以附著於第一夾緊部件521的狀態跟隨第一夾緊部件521的移動抬起。In addition, when the
以下,參照圖11至圖13,說明本新型的第四實施例的基板移送單元。對與前述的本新型的第一至第三實施例中說明的部分相同的部分,標注相同的附圖標記,省略對其的詳細說明。Hereinafter, the substrate transfer unit of the fourth embodiment of the present invention will be described with reference to FIGS. 11 to 13. The same parts as those described in the first to third embodiments of the present invention described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.
如圖11至圖13所示,根據本新型的第四實施例的基板移送單元,夾具裝置50還包括將第一夾緊部件521以與第二夾緊部件522平行的狀態保持的姿態保持單元54。As shown in FIGS. 11 to 13, according to the substrate transfer unit of the fourth embodiment of the present invention, the
夾緊單元52還包括第三轉動軸528及第四轉動軸529。The clamping
第一夾緊部件521通過第三轉動軸528以能夠轉動的方式連接於連接部件523。因此,在連接部件523以第一轉動軸524為中心旋轉的狀態下,第一夾緊部件521能夠通過姿態保持單元54相對於連接部件523以第三轉動軸528為中心旋轉。由此,能夠將第一夾緊部件521的姿態水平保持。The
第一夾緊部件521通過第四轉動軸529連接於姿態保持單元54。The
第三轉動軸528及第四轉動軸529是跟隨第一夾緊部件521的移動而移動的活動軸。The
姿態保持單元54包括第二致動器541、第二驅動力傳遞部件542及第二驅動力傳遞杆543。The
第二致動器541起到向第一夾緊部件521提供驅動力的作用。第二致動器541通過第二致動器轉動軸5413連接於底座51。第二致動器轉動軸5413可以通過第二致動器轉動軸支架516固定於底座51。第二致動器541可以具備朝向第二致動器轉動軸5413延伸的轉動軸塊5414,轉動軸塊5414可以以能夠轉動的方式連接於第二致動器轉動軸5413。The
因此,在第二驅動力傳遞杆543前進或後退的過程中,第二致動器541能夠以第二致動器轉動軸5413為中心轉動。Therefore, during the forward or backward movement of the second driving
在第二致動器541的內部以能夠往復移動的方式佈置有第二驅動力傳遞部件542。第二致動器541具備:與第一線路536連接的第一埠5411;以及與第二線路537連接的第二埠5412。A second driving
第一閥門538構成為開放或關閉從流體供給源534經由第一線路536向第一埠5411相連的流路。第二閥門539構成為開放或關閉從流體供給源534經由第二線路537向第二埠5412相連的流路。The
根據這種結構,隨著流體經由第一線路536及第一埠5411向第二致動器541的內部流入,第二驅動力傳遞部件542能夠向朝向夾緊單元52的方向移動。而且,隨著流體經由第二線路537及第二埠5412向第二致動器541的內部流入,第二驅動力傳遞部件542能夠向遠離夾緊單元52的方向移動。如此,基於第二致動器541內部的壓力,第二驅動力傳遞部件542能夠移動。According to this structure, as the fluid flows into the inside of the
第二驅動力傳遞杆543的一端連接於第二驅動力傳遞部件542,第二驅動力傳遞杆543的另一端通過第二連接頭5431及第四轉動軸529連接於第一夾緊部件521。第二驅動力傳遞杆543通過第四轉動軸529以能夠轉動的方式連接於第一夾緊部件521。由此,第二驅動力傳遞部件542通過第二驅動力傳遞杆543、第二連接頭5431及第四轉動軸529連接於第一夾緊部件521。由此,第二致動器541的驅動力通過第二驅動力傳遞部件542、第二驅動力傳遞杆543、第二連接頭5431及第四轉動軸529提供至第一夾緊部件521。One end of the second driving
根據第二致動器541內部的壓力,第二驅動力傳遞部件542能夠在第二致動器541內移動。通過第二驅動力傳遞部件542的移動,第二驅動力傳遞杆543能夠移動。通過第二驅動力傳遞杆543的移動,第一夾緊部件521能夠以第四轉動軸529為中心轉動的同時,相對於連接部件523以第三轉動軸528為中心轉動。第一夾緊部件521以第四轉動軸529為中心轉動的同時,相對於連接部件523以第三轉動軸528為中心轉動,由此第一夾緊部件521的姿態水平保持,由此,第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5211能夠彼此平行。According to the pressure inside the
另一方面,第二驅動力傳遞杆543能夠在前進或後退的同時,向相對於底座51遠離或接近的方向移動。可以在底座51具備第二導向組件512,以引導第二驅動力傳遞杆543相對於底座51的移動。例如,第二導向組件512可以由與第二驅動力傳遞杆543連接的導軌構成。On the other hand, the second driving
流體供給源534及調節器535可以連接於第一致動器531及第二致動器541。在此情況下,第一線路536連接於第一致動器531的第一埠5311及第二致動器541的第一埠5411。而且,第二線路537連接於第一致動器531的第二埠5312及第二致動器541的第二埠5412。The
因此,調節器535構成為調節向第一致動器531內部供給的流體的壓力及向第二致動器541內部供給的流體的壓力。通過調節器535,能夠調節第一致動器531內部的壓力及第二致動器541內部的壓力。通過調節器535,能夠將第一致動器531及第二致動器541的內壓保持一定。另外,通過調節器535,能夠調節第一致動器531及第二致動器541的內壓。第一致動器531及第二致動器541的內壓可以根據基板S的厚度來決定。Therefore, the
在基板S位於第一夾緊部件521與第二夾緊部件522之間時,通過調節器535調節第一致動器531內部的壓力及第二致動器541內部的壓力,由此能夠以第一夾緊部件521的第一基板支承面5211的姿態水平保持的狀態,基板S的第一面接觸於第一夾緊部件521的第一基板支承面5211而被加壓。When the substrate S is located between the
如圖12及圖13所示,隨著通過調節器535調節第一致動器531內部的壓力,能夠調節第一驅動力傳遞部件532在第一致動器531內部的位置。隨著調節第一驅動力傳遞部件532的位置,能夠調節連接部件523的轉動角度。隨著調節連接部件523的轉動角度,能夠調節第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離。如此,隨著通過調節器535調節第一致動器531內部的壓力,能夠將第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離調節成與基板S的厚度對應。As shown in FIGS. 12 and 13, as the pressure inside the
另外,隨著通過調節器535調節第二致動器541內部的壓力,能夠調節第二驅動力傳遞部件542在第二致動器541內部的位置。隨著調節第二驅動力傳遞部件542的位置,能夠調節第一夾緊部件521的轉動角度。隨著調節第一夾緊部件521的轉動角度,能夠將第一夾緊部件521的第一基板支承面5211的姿態水平保持,由此,能夠保持第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221彼此平行的狀態。如此,隨著通過調節器535調節第二致動器541內部的壓力,成為第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221彼此平行的狀態,能夠成為能夠更穩定地夾持基板S的第一面及第二面的狀態。In addition, as the pressure inside the
在調節第一致動器531內部的壓力時,能夠同時調節第二致動器541內部的壓力。此時,第二致動器541內部的壓力調節聯動於第一致動器531內部的壓力調節來執行。能夠以使得在第一夾緊部件521相對於第二夾緊部件522位移的同時滿足第一夾緊部件521平行於第二夾緊部件522的條件的方式,執行第一致動器531內部的壓力調節及第二致動器541的內部的壓力調節。為了滿足這種條件,可以設計第一致動器531的規格(內徑、長度、第一埠5311的位置、第二埠5312的位置、對第一夾緊部件521的設置角度等)、第一驅動力傳遞部件532的規格(外徑、厚度等)、第一驅動力傳遞杆533的規格(直徑、長度、對第一夾緊部件521的設置角度等)、第二致動器541的規格(內徑、長度、第一埠5411的位置、第二埠5412的位置、對第一夾緊部件521的設置角度等)、第二驅動力傳遞部件542的規格(外徑、厚度等)、第二驅動力傳遞杆543的規格(直徑、長度、對第一夾緊部件521的設置角度等)。When the pressure inside the
另一方面,如圖13所示,隨著基板S的厚度增加,支承在第一夾緊部件521的第一基板支承面5211上的基板S的第一面的支承面積小於支承在第二夾緊部件522的第二基板支承面5221上的基板S的第二面的支承面積。On the other hand, as shown in FIG. 13, as the thickness of the substrate S increases, the support area of the first surface of the substrate S supported on the first
另一方面,在基板移送單元10具備多個夾具裝置50的情況下,構成多個夾具裝置50的多個第一致動器531內部的壓力及多個第二致動器541內部的壓力可以通過一個調節器535調節。因此,由於多個第一致動器531能夠通過一個調節器535同時控制,能夠通過多個夾具裝置50均勻地夾持基板S。On the other hand, when the
根據本新型的第四實施例的基板移送單元,對應於基板S的厚度來調節第一致動器531內部的壓力,從而能夠調節第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離。因此,即使在基板S的厚度變更的情況下也無需進行使夾具裝置50整體高度與基板S的厚度對應的變更的追加性作業,並能夠穩定地夾持基板S。因此,能夠減少作業工藝數量。另外,通過調節第二致動器541內部的壓力,能夠將第一夾緊部件521的第一基板支承面5211的姿態水平保持。因此,在調節了第一夾緊部件521的第一基板支承面5211與第二夾緊部件522的第二基板支承面5221之間的隔開距離的情況下,也能夠將第一夾緊部件521的第一基板支承面5211的姿態水平保持,由此能夠增加支承在第一夾緊部件521的第一基板支承面5211上的基板S的第一面的支承面積,由此,能夠更穩定地夾持基板S。According to the substrate transfer unit of the fourth embodiment of the present invention, the pressure inside the
例示性說明了本新型的優選實施例,在本新型的範圍並不限定於這種特定實施例,可以在申請專利範圍中所記載的範疇內進行適當變更。The exemplary embodiment of the present invention has been exemplified, and the scope of the present invention is not limited to this specific embodiment, and can be appropriately changed within the scope described in the scope of the patent application.
10:基板移送單元 11:支承台 111:滑輪 112:容納部 13:框架 14:第一導軌 15:第一平板 18:導件 19:移動組件 20:基板傳送單元 21:移送帶 211:滑輪 24:第二導軌 25:第二平板 26:移動裝置 30:劃線單元 31:第一支承架 32:第一劃線頭 33:第二支承架 34:第二劃線頭 35:輪架 351:劃線輪 50:夾具裝置 51:底座 511:第一導向組件 512:第二導向組件 513:轉動軸支架 515:第一致動器轉動軸支架 516:第二致動器轉動軸支架 52:夾緊單元 521:第一夾緊部件 5211:第一基板支承面 522:第二夾緊部件 5221:第二基板支承面 523:連接部件 524:第一轉動軸 525:第二轉動軸 526:第一支承墊 527:第二支承墊 528:第三轉動軸 529:第四轉動軸 53:驅動單元 531:第一致動器 5311:第一埠 5312:第二埠 5313:第一致動器轉動軸 5314:轉動軸塊 532:第一驅動力傳遞部件 533:第一驅動力傳遞杆 5331:第一連接頭 534:流體供給源 535:調節器 536:第一線路 537:第二線路 538:第一閥門 539:第二閥門 54:姿態保持單元 541:第二致動器 5411:第一埠 5412:第二埠 5413:第二致動器轉動軸 5414:轉動軸塊 542:第二驅動力傳遞部件 543:第二驅動力傳遞杆 5431:第二連接頭 C1、C2、C5:中心 EL:延伸線 S:基板 10: substrate transfer unit 11: Support table 111: pulley 112: Accommodation Department 13: Frame 14: First rail 15: The first tablet 18: Guide 19: Mobile components 20: substrate transfer unit 21: Transfer belt 211: Pulley 24: Second rail 25: second tablet 26: Mobile device 30: scribe unit 31: The first support frame 32: The first underline head 33: Second support frame 34: Second underline head 35: Round frame 351: Scribing wheel 50: Fixture device 51: Base 511: the first guide assembly 512: second guide assembly 513: Rotating shaft bracket 515: First actuator rotating shaft bracket 516: Second actuator rotating shaft bracket 52: clamping unit 521: First clamping part 5211: First substrate support surface 522: second clamping part 5221: Second substrate support surface 523: connecting parts 524: first rotation axis 525: Second axis of rotation 526: First support pad 527: Second support pad 528: Third axis of rotation 529: Fourth axis of rotation 53: drive unit 531: First actuator 5311: First port 5312: Second port 5313: Rotating shaft of the first actuator 5314: Rotating shaft block 532: The first driving force transmission component 533: The first driving force transmission rod 5331: First connector 534: Fluid supply source 535: Regulator 536: First line 537: Second line 538: First valve 539: Second valve 54: attitude holding unit 541: Second actuator 5411: First port 5412: Second port 5413: Rotating shaft of the second actuator 5414: Rotating shaft block 542: Second driving force transmission part 543: Second driving force transmission lever 5431: Second connector C1, C2, C5: Center EL: extension line S: substrate
圖1是示出本新型的第一實施例的基板移送單元的俯視圖。 圖2是概略示出本新型的第一實施例的基板移送單元的側視圖。 圖3是概略示出本新型的第一實施例的基板移送單元的其它例的側視圖。 圖4是概略示出具備本新型的第一實施例的基板移送單元的劃線裝置的側視圖。 圖5是概略示出本新型的第一實施例的基板移送單元所具備的夾具裝置的圖。 圖6及圖7是概略示出本新型的第一實施例的基板移送單元所具備的夾具裝置的工作狀態的圖。 圖8是概略示出本新型的第二實施例的基板移送單元所具備的夾具裝置的圖。 圖9及圖10是概略示出本新型的第三實施例的基板移送單元所具備的夾具裝置的圖。 圖11是概略示出本新型的第四實施例的基板移送單元所具備的夾具裝置的圖。 圖12及圖13是概略示出本新型的第四實施例的基板移送單元所具備的夾具裝置的工作狀態的圖。 FIG. 1 is a plan view showing a substrate transfer unit of a first embodiment of the present invention. 2 is a side view schematically showing the substrate transfer unit according to the first embodiment of the present invention. 3 is a side view schematically showing another example of the substrate transfer unit according to the first embodiment of the present invention. 4 is a side view schematically showing a scribing device provided with the substrate transfer unit according to the first embodiment of the present invention. 5 is a diagram schematically showing a jig device included in the substrate transfer unit according to the first embodiment of the present invention. 6 and 7 are diagrams schematically showing the operating state of the clamp device included in the substrate transfer unit according to the first embodiment of the present invention. 8 is a diagram schematically showing a jig device included in the substrate transfer unit according to the second embodiment of the present invention. 9 and 10 are diagrams schematically showing a jig device included in the substrate transfer unit according to the third embodiment of the present invention. 11 is a diagram schematically showing a jig device included in a substrate transfer unit according to a fourth embodiment of the present invention. 12 and 13 are diagrams schematically showing the operating state of the jig device included in the substrate transfer unit according to the fourth embodiment of the present invention.
10:基板移送單元 10: substrate transfer unit
11:支承台 11: Support table
112:容納部 112: Accommodation Department
13:框架 13: Frame
14:第一導軌 14: First rail
50:夾具裝置 50: Fixture device
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190105117A KR20210025288A (en) | 2019-08-27 | 2019-08-27 | Substrate conveying unit and scribing apparatus including the same |
KR10-2019-0105117 | 2019-08-27 |
Publications (1)
Publication Number | Publication Date |
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TWM596457U true TWM596457U (en) | 2020-06-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108215722U TWM596457U (en) | 2019-08-27 | 2019-11-27 | Substrate conveying unit and scribing apparatus including the same |
Country Status (3)
Country | Link |
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KR (1) | KR20210025288A (en) |
CN (1) | CN213622238U (en) |
TW (1) | TWM596457U (en) |
-
2019
- 2019-08-27 KR KR1020190105117A patent/KR20210025288A/en not_active Application Discontinuation
- 2019-11-27 TW TW108215722U patent/TWM596457U/en not_active IP Right Cessation
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2020
- 2020-08-25 CN CN202021791101.2U patent/CN213622238U/en active Active
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KR20210025288A (en) | 2021-03-09 |
CN213622238U (en) | 2021-07-06 |
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