TWI697068B - Substrate cutting apparatus - Google Patents
Substrate cutting apparatus Download PDFInfo
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- TWI697068B TWI697068B TW107140897A TW107140897A TWI697068B TW I697068 B TWI697068 B TW I697068B TW 107140897 A TW107140897 A TW 107140897A TW 107140897 A TW107140897 A TW 107140897A TW I697068 B TWI697068 B TW I697068B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
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- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明涉及一種基板切割裝置,用於切割基板。 The invention relates to a substrate cutting device, which is used for cutting a substrate.
通常,用於平板顯示器的液晶顯示面板、有機電致發光顯示器面板、無機電致發光顯示器面板、透射投影基板、反射投影基板等使用單元玻璃面板(以下稱為“單元基板”),所述單元玻璃面板是通過將如玻璃等脆性母體玻璃面板(以下稱為“基板”)切割成預定尺寸而獲得。 Generally, a liquid crystal display panel for a flat panel display, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmissive projection substrate, a reflective projection substrate, etc. use a unit glass panel (hereinafter referred to as "unit substrate"), the unit The glass panel is obtained by cutting a brittle precursor glass panel (hereinafter referred to as "substrate") such as glass to a predetermined size.
切割基板的工序包括劃片工序,所述劃片工序是沿著欲切割基板的預定線按壓並移動由如鑽石等材料製成的劃片輪來形成劃線。 The process of cutting the substrate includes a scribing process in which a scribing wheel made of a material such as diamond is pressed and moved along a predetermined line of the substrate to be cut to form a scribing line.
在基板上形成劃線的劃片工序主要考慮的事項之一是基板的平整度。為了在基板上形成具有一定的切割深度的劃線,應維持基板的均勻平整度。由此,需要提出在均勻維持基板平整度的同時防止基板變形的方案。 One of the main considerations in the scribing process for forming scribe lines on the substrate is the flatness of the substrate. In order to form a scribe line with a certain cutting depth on the substrate, the uniform flatness of the substrate should be maintained. Therefore, it is necessary to propose a solution to prevent deformation of the substrate while uniformly maintaining the flatness of the substrate.
【現有技術文獻】 【Prior Art Literature】
【專利文獻】 【Patent Literature】
韓國公開專利第10-2003-0069195號 Korean Published Patent No. 10-2003-0069195
為了解決上述問題,本發明的目的在於提供一種基板切割裝 置,可以根據支撐基板的支撐台的平整度來調整基板的位置並移送基板,從而防止基板的變形,並在基板上能夠形成具有一定切割深度的劃線。 In order to solve the above problems, the object of the present invention is to provide a substrate cutting device It can adjust the position of the substrate and transfer the substrate according to the flatness of the support table supporting the substrate, thereby preventing the deformation of the substrate, and forming a scribe line with a certain cutting depth on the substrate.
為了達到上述目的,本發明提供一種基板切割裝置,包括:劃線單元,用於在基板形成劃線;移送單元,用於將所述基板移送至劃線單元,所述移送單元,其包括:夾緊模組,所述移送單元包括:用於把持所述基板的夾緊模組及用於支撐所述基板的支撐台;間隔測量單元,用於測量所述夾緊模組與所述支撐台的間隔;及,控制單元,以由所述間隔測量單元測量的所述夾緊模組與所述支撐台的間隔為准,控制所述夾緊模組向鄰近所述支撐台的方向或向遠離所述支撐台的方向移動。 In order to achieve the above object, the present invention provides a substrate cutting device, including: a scribing unit for forming a scribing line on a substrate; a transfer unit for transferring the substrate to the scribing unit, the transfer unit including: Clamping module, the transfer unit includes: a clamping module for holding the substrate and a supporting table for supporting the substrate; an interval measuring unit for measuring the clamping module and the support The interval of the stage; and, the control unit controls the clamping module to the direction adjacent to the supporting stage or the interval between the clamping module and the supporting stage measured by the interval measuring unit Move away from the support table.
移送單元還包括支撐桿,所述支撐桿具有多個所述夾緊模組,多個所述夾緊模組在所述支撐桿的長度方向上可移動地設置於所述支撐桿,以調整多個所述夾緊模組之間的間隔。 The transfer unit further includes a support rod having a plurality of the clamping modules, and the plurality of clamping modules are movably disposed on the support rod in the length direction of the support rod to adjust The interval between the plurality of clamping modules.
夾緊模組包括:夾具本體,其連接於所述支撐桿;及一對夾緊部件,其設置於所述夾具本體,用於把持所述基板,所述間隔測量單元設置於所述夾具本體。 The clamping module includes: a clamp body connected to the support rod; and a pair of clamping members, which are provided on the clamp body for holding the substrate, and the interval measuring unit is provided on the clamp body .
夾緊模組與所述支撐桿之間設置有用於對應所述支撐台的表面的凹凸而升降所述夾緊模組的升降模組。 A lifting module for lifting the clamping module is provided between the clamping module and the support rod to correspond to the unevenness of the surface of the supporting platform.
間隔測量單元包括:凹凸檢測頭,其與所述夾緊模組一同順著所述支撐台的表面移動;凹凸檢測部件,其設置於所述凹凸檢測頭,與所述支撐台的表面接觸,沿著所述支撐台表面的凹凸移動;及,位置檢測裝置,用於檢測所述凹凸檢測部件的位置。 The interval measuring unit includes: an unevenness detection head, which moves along the surface of the support table together with the clamping module; an unevenness detection component, which is provided on the unevenness detection head and contacts the surface of the support table, Moving along the unevenness on the surface of the support table; and, a position detection device for detecting the position of the unevenness detection member.
凹凸檢測部件連接有彈性部件。 An elastic member is connected to the unevenness detecting member.
與所述支撐台的表面接觸的所述凹凸檢測部件的部分設置有降摩擦部件。 The portion of the unevenness detecting member that is in contact with the surface of the support table is provided with a friction reducing member.
位置檢測裝置包括:基準部件,其設置於所述凹凸檢測頭及所述凹凸檢測部件中的一個;及,感測部件,其設置於所述凹凸檢測頭及所述凹凸檢測部件中的另一個,用於感測相對於所述基準部件的位移。 The position detection device includes: a reference part provided on one of the unevenness detection head and the unevenness detection part; and a sensing part provided on the other of the unevenness detection head and the unevenness detection part , For sensing displacement relative to the reference component.
間隔測量單元包括:凹凸檢測頭,其與所述夾緊模組一同沿著所述支撐台的表面移動;及,距離檢測裝置,其設置於所述凹凸檢測頭上用於檢測所述距離檢測裝置與所述支撐台的距離,所述距離檢測裝置包括:發光部,其向所述支撐台射出光;及,收光部,其從所述發光部以預定間隔隔開而設置,用於接收從所述支撐台反射的光。 The interval measuring unit includes: a bump detection head that moves along the surface of the support table together with the clamping module; and a distance detection device that is provided on the bump detection head for detecting the distance detection device The distance from the support table, the distance detection device includes: a light emitting section that emits light toward the support table; and a light receiving section that is spaced apart from the light emitting section at a predetermined interval for receiving Light reflected from the support table.
支撐台包括相互隔開設置而支撐所述基板的多個傳送帶。 The support table includes a plurality of conveyor belts spaced apart from each other to support the substrate.
本發明實施例中的基板切割裝置中,把持基板的夾緊模組可以沿著支撐台表面的凹凸上升或下降,因此,基板的位置可以沿著支撐台的凹凸而被調整。由此,可以防止基板S因支撐台表面的凹凸而發生翹曲、下垂等變形。 In the substrate cutting device in the embodiment of the present invention, the clamping module holding the substrate can be raised or lowered along the unevenness of the surface of the support table, so the position of the substrate can be adjusted along the unevenness of the support table. Thereby, it is possible to prevent the substrate S from being deformed such as warpage or sagging due to the unevenness on the surface of the support table.
10‧‧‧第一移送單元 10‧‧‧ First transfer unit
11‧‧‧支撐台 11‧‧‧Supporting table
111‧‧‧帶輪 111‧‧‧Pulley
12‧‧‧夾緊模組 12‧‧‧Clamping module
121‧‧‧夾具本體 121‧‧‧Clamp body
122‧‧‧夾緊部件 122‧‧‧Clamping parts
13‧‧‧支撐桿 13‧‧‧support rod
14‧‧‧第一導軌 14‧‧‧ First rail
15‧‧‧第一板 15‧‧‧ First board
18‧‧‧導向件 18‧‧‧Guide
19‧‧‧升降模組 19‧‧‧lift module
20‧‧‧第二移送單元 20‧‧‧Second transfer unit
21‧‧‧移送傳送帶 21‧‧‧Transfer conveyor belt
211‧‧‧帶輪 211‧‧‧Pulley
24‧‧‧第二導軌 24‧‧‧ Second rail
25‧‧‧第二板 25‧‧‧Second board
26‧‧‧移動裝置 26‧‧‧Mobile device
30‧‧‧劃線單元 30‧‧‧Dash unit
31‧‧‧第一框體 31‧‧‧The first frame
32‧‧‧第一劃線頭 32‧‧‧The first scribing head
33‧‧‧第二框體 33‧‧‧Second frame
34‧‧‧第二劃線頭 34‧‧‧The second scribing head
35‧‧‧劃片輪支持部 35‧‧‧ Scribing wheel support department
351‧‧‧劃片輪 351‧‧‧Scribe wheel
40‧‧‧間隔測量單元 40‧‧‧Interval measuring unit
41‧‧‧凹凸檢測頭 41‧‧‧Bump detection head
42‧‧‧凹凸檢測部件 42‧‧‧Concave and convex detection parts
421‧‧‧降摩擦部件 421‧‧‧ Friction reducing parts
43‧‧‧位置檢測裝置 43‧‧‧Position detection device
431‧‧‧基準部件 431‧‧‧ benchmark parts
432‧‧‧感測部件 432‧‧‧sensing parts
44‧‧‧凹凸檢測頭 44‧‧‧Bump detection head
45‧‧‧距離檢測裝置 45‧‧‧Distance detection device
451‧‧‧發光部 451‧‧‧Lighting Department
452‧‧‧收光部 452‧‧‧Light Collection Department
90‧‧‧控制單元 90‧‧‧Control unit
S‧‧‧基板 S‧‧‧Substrate
圖1及圖2是概略表示本發明實施例中基板切割裝置的示意圖。 1 and 2 are schematic diagrams schematically showing a substrate cutting device in an embodiment of the present invention.
圖3是概略表示本發明實施例中基板切割裝置的間隔測量單元的一例的示意圖。 3 is a schematic diagram schematically showing an example of an interval measuring unit of a substrate cutting device in an embodiment of the present invention.
圖4是概略表示本發明實施例中基板切割裝置的間隔測量單元的另一 例示意圖。 4 is a schematic diagram showing another example of the interval measuring unit of the substrate cutting device in the embodiment of the present invention Example schematic.
圖5至圖9是依次表示本發明實施例中基板切割裝置的第一移送單元、劃線單元及第二移送單元的運行過程的示意圖。 5 to 9 are schematic views sequentially showing the operation processes of the first transfer unit, the scribing unit, and the second transfer unit of the substrate cutting device in the embodiment of the present invention.
以下參照附圖對本發明實施例中的基板切割裝置進行說明。 The substrate cutting device in the embodiments of the present invention will be described below with reference to the drawings.
被本發明實施例中的基板切割裝置切割的物件可以是第一基板及第二基板貼合而成的貼合基板。例如,第一基板具備薄膜電晶體,第二基板可以具備濾色器。也可以與此相反,第一基板可以具備濾色器,第二基板可以具備薄膜電晶體。 The object cut by the substrate cutting device in the embodiment of the present invention may be a bonded substrate formed by bonding a first substrate and a second substrate. For example, the first substrate includes thin-film transistors, and the second substrate may include color filters. Contrary to this, the first substrate may include a color filter, and the second substrate may include a thin film transistor.
以下,將貼合基板簡稱為基板,將暴露於外部的第一基板的表面稱為第一面,將暴露於外部的第二基板的表面稱為第二面。 Hereinafter, the bonded substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is referred to as a first surface, and the surface of the second substrate exposed to the outside is referred to as a second surface.
並且,將要進行切割工序的基板的移送方向定義為Y軸方向,將垂直於基板移送方向(Y軸方向)的方向定義為X軸方向。並且,將垂直於放置基板的X-Y平面的方向定義為Z軸方向。X軸、Y軸、Z軸方向如圖1至圖9所示。 In addition, the transfer direction of the substrate to be subjected to the dicing process is defined as the Y-axis direction, and the direction perpendicular to the substrate transfer direction (Y-axis direction) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-Y plane on which the substrate is placed is defined as the Z-axis direction. The directions of the X-axis, Y-axis, and Z-axis are shown in FIGS. 1 to 9.
如圖1及圖2所示,本發明實施例中的基板切割裝置包括:劃線單元30;第一移送單元10,其將基板S(參照圖6至圖9)移送至劃線單元30;第二移送單元20,其將基板S從劃線單元30移送至後續工序;控制單元90,用於控制基板切割裝置的構成部件(參照圖3及圖4)。
As shown in FIGS. 1 and 2, the substrate cutting device in the embodiment of the present invention includes: a scribing
劃線單元30在基板S的第一面及第二面分別形成X軸方向的劃線。
The
劃線單元30包括:第一框體31,其沿X軸方向延長;第一劃
線頭32,其可沿X軸方向移動地設置於第一框體31;第二框體33,其在第一框體31的下方與第一框體31平行地沿X軸方向延長;第二劃線頭34,其可沿X軸方向移動地設置於第二框體33。
The
第一框體31在X軸方向上設置有多個第一劃線頭32,第二框體33在X軸方向上設置有多個第二劃線頭34。第一框體31及第二框體33之間形成有供基板S通過的空間。第一框體31及第二框體33可以分別製作而組裝,或者一體形成。
The
第一劃線頭32及第二劃線頭34在Z軸方向互相對向設置。第一劃線頭32及第二劃線頭34還設置有用於維持劃片輪351的劃片輪支持部35。設置於第一劃線頭32的劃片輪351與設置於第二劃線頭34的劃片輪351在Z軸方向相互對向設置。
The
一對劃片輪351分別加壓於基板S的第一面及第二面。在一對劃片輪351分別加壓於基板S的第一面及第二面的狀態下,第一劃線頭32及第二劃線頭34相對於基板S沿X軸方向移動,從而可在基板S的第一面及第二面向X軸方向形成劃線。
The pair of
並且,第一劃線頭32及第二劃線頭34相對於第一框體31及第二框體33分別可沿Z軸方向移動。為此,設置在第一框體31的第一劃線頭32和/或設置在第二框體33的第二劃線頭34及第一框體31及第二框體33之間可以設置有通過空壓或油壓運行的致動器、根據電磁相互作用運行的線性馬達或滾珠螺桿裝置等直線移動設備。
Furthermore, the
隨著第一劃線頭32及第二劃線頭34相對於第一框體31及第二框體33分別沿Z軸方向移動,一對劃片輪351可以加壓於基板S或者遠離基
板S。並且,可以通過調整第一劃線頭32及第二劃線頭34沿Z軸方向移動的程度來調節一對劃片輪351施加於基板S的加壓力。並且,通過第一劃線頭32及第二劃線頭34沿Z軸方向移動來調節一對劃片輪351對基板S的切割深度。
As the
第一移送單元10包括:支撐台11,用於支撐基板S;夾緊模組12,用於把持被支撐於支撐台11上的基板S的後行端;支撐桿13,其與夾緊模組12連接並沿X軸方向延長;第一導軌14,其與支撐桿13連接並沿Y軸方向延長;第一板15,其鄰近劃線單元30設置而用於漂浮基板S或吸附基板S而支撐基板S。
The
第一板15可以漂浮基板S或吸附基板S。例如,第一板15的表面上可以形成有與氣體供給源及真空源連接的多個槽部(未圖示)。氣體從氣體供給源供給至第一板15的多個槽部時,基板S可從第一板15漂浮起來。並且,氣體受到由真空源形成的負壓通過第一板15的多個槽部被吸入時,基板S可以被吸附於第一板15。
The
在基板S從第一板15漂浮的狀態下,基板S可以與第一板15無摩擦地移動。並且,在基板S的第一面及第二面形成劃線的過程中,基板S被吸附固定於第一板15。
In a state where the substrate S floats from the
例如,支撐台11可以包括在X軸方向上隔開設置的多個傳送帶。另一例,支撐台11可以是一個面積大於基板S的整體面積的傳送帶。如果支撐台11包括傳送帶時,支撐台11被多個帶輪111支撐,多個帶輪111中的至少一個可以是具備旋轉支撐台11的驅動力的驅動帶輪。
For example, the support table 11 may include a plurality of conveyor belts spaced apart in the X-axis direction. As another example, the support table 11 may be a conveyor belt having an area larger than the entire area of the substrate S. If the support table 11 includes a conveyor belt, the support table 11 is supported by a plurality of
支撐桿13與第一導軌14之間可以設置有通過空壓或油壓運
行的致動器、根據電磁相互作用運行的線性馬達或滾珠螺桿裝置等直線移動裝置,在此,只要能夠使支撐桿13相對於第一導軌14沿Y軸方向移動,直線移動裝置可以設置在任一位置。由此,隨著在夾緊模組12把持基板S的狀態下支撐桿13通過直線移動裝置向Y軸方向移動,基板S可以向Y軸方向移送。此時,多個傳送帶11與夾緊模組12的移動同步而旋轉,可穩定地支撐基板S。
Between the
夾緊模組12可以加壓基板S的後行端而維持基板S。另一例,夾緊模組12具備與真空源連接的真空孔來吸附基板S。例如,圖3及圖4所示,夾緊模組12包括:夾具本體121,其與支撐桿13連接;一對夾緊部件122,其設置於夾具本體121用於把持基板S。一對夾緊部件122沿Z軸方向相對設置,在其之間隔著基板S相互靠近移動,從而基板S的多餘部分被一對夾緊部件122所把持。
The
夾緊模組12可以沿著支撐桿13沿X軸方向設置多個。夾緊模組12可以隨著沿支撐桿13延長的導向件18沿X軸方向移動。為此,夾緊模組12與導向件18之間可以設置有通過空壓或油壓運行的致動器、根據電磁相互作用運行的線性馬達或滾珠螺桿裝置等直線移動裝置,在此,只要能夠使支撐桿13相對於導向件18沿X軸方向移動,直線移動裝置可以設置在任一位置。因此,多個夾緊模組12分別通過相應的直線移動裝置沿X軸方向移動,從而可以調整多個夾緊模組12之間的間隔。由此,多個夾緊模組12適當對應於基板S的寬度而設置,從而可以穩定地把持基板S。
A plurality of clamping
夾緊模組12與支撐桿13之間可以設置有向Z軸方向移動夾緊模組12的升降模組19。升降模組19可以是通過空壓或油壓運行的致動器、
根據電磁相互作用運行的線性馬達或滾珠螺桿裝置等直線移動裝置,在此,只要能夠使夾緊模組12相對於支撐桿13沿Z軸方向移動,直線移動裝置可以設置在任一位置。當基板S送入支撐台11或從支撐台11送出時,夾緊模組12被升降模組19上升,由此,可以防止夾緊模組12與基板S之間的干涉。
A
並且,升降模組19可以根據夾緊模組12與支撐台11之間的間隔上升或下降夾緊模組12,由此,基板S可以根據支撐台11的平整度進行升降。
In addition, the
為了測量夾緊模組12與支撐台11之間的間隔,本發明實施例中的基板切割裝置可以包括間隔測量單元40。並且,控制單元90以由間隔測量單元40測量的夾緊模組12與支撐台11之間的間隔為准來控制升降模組19,使得夾緊模組12上升或下降。
In order to measure the interval between the clamping
間隔測量單元40可以設置於夾緊模組12。具體地,間隔測量單元40可以設置於夾緊模組12的夾具本體121。因間隔測量單元40設置於鄰接於把持基板S的一對夾緊部件122的夾具本體121,可以更準確地測量夾緊模組12與支撐台11之間的間隔。
The
但是,本發明不限於上述結構,只要可以測量夾緊模組12與支撐台11之間的間隔,間隔測量單元40的設置位置則不受限制。
However, the present invention is not limited to the above structure, as long as the interval between the clamping
如圖3所示,間隔測量單元40包括:凹凸檢測頭41,其設置於夾緊模組12,與夾緊模組12一同順著支撐台11的表面移動;凹凸檢測部件42,其設置於凹凸檢測頭41,可以沿著支撐台11表面的凹凸移動;位置檢測裝置43,用於測量凹凸檢測部件42在Z軸方向上的位置。
As shown in FIG. 3, the
為了測量夾緊模組12與支撐台11之間的間隔,凹凸檢測部件
42維持接觸於支撐台11表面的狀態。在凹凸檢測頭41移動時,凹凸檢測部件42沿著支撐台11表面的凹凸沿Z軸方向移動。凹凸檢測部件42可沿Z軸方向滑動地設置於凹凸檢測頭41,使得凹凸檢測部件42沿著支撐台11表面的凹凸沿Z軸方向移動。
In order to measure the interval between the clamping
例如,凹凸檢測部件42可以與彈簧等彈性材料連接,使得凹凸檢測部件42沿著支撐台11表面的凹凸沿Z軸方向移動。凹凸檢測部件42可以根據彈性材料緊貼於支撐台11的表面。
For example, the
與支撐台11的表面接觸的凹凸檢測部件42的端部具備球或輥等降摩擦部件421。降摩擦部件421可以在接觸於支撐台11表面的狀態進行滾動運動。另一例,降摩擦部件421可以是柔性塑膠、樹脂等。
The end of the
位置檢測裝置43與控制單元90連接,由位置檢測裝置43測量的凹凸檢測部件42的位置及位移相關資訊傳遞至控制單元90。
The
位置檢測裝置43包括:基準部件431,其粘附於凹凸檢測部件42;感測部件432,其設置於凹凸檢測頭41並與基準部件431對向設置而感測與基準部件431的相對位移。另一例,基準部件431可以設置於凹凸檢測頭41,感測部件432可以貼附於凹凸檢測部件42。這種位置檢測裝置43利用基準部件431與感測部件432的相互作用來測量凹凸檢測部件42的位置及位移。
The
作為一例,基準部件431可以具有預定刻度的尺規,感測部件432可以包括拍攝尺規的攝像頭。這時,以由感測部件432拍攝的尺規的圖像為准來測量基準部件431與感測部件432之間的相對位置,以被測量的相對位置為准來測量凹凸檢測部件42的位置。
As an example, the
另一例,基準部件431可以根據位置包括反射角度變化的反射面,感測部件432可以包括向反射面發射光的發光感測器及接收由反射面反射的光的收光感測器。此時,通過測量由反射面反射的光的反射角度來測量基準部件431與感測部件432之間的相對位置,以被測量的相對位置為准測量凹凸檢測部件42的位置。
As another example, the
根據如上結構,在凹凸檢測部件42的端部接觸於支撐台11表面的狀態下凹凸檢測頭41沿著支撐台11表面移動,則凹凸檢測部件42沿著支撐台11表面的凹凸沿Z軸方向移動。
According to the above structure, in the state where the end of the
隨著凹凸檢測部件42的移動,基準部件431與感測部件432之間的相對位置會變化,以這種相對位置變化為准,可以測量凹凸檢測部件42的位移。
As the
這種凹凸檢測部件42的位移意味著支撐台11表面的凹凸的大小。由此,間隔測量單元40以凹凸檢測部件42的位移為准來獲知支撐台11表面的凹凸資訊。
Such displacement of the
間隔測量單元40檢測支撐台11表面的凹凸的過程可以在夾緊模組12把持基板S的後行端而向劃線單元30移送的過程之前執行。另一例,可以在間隔測量單元40檢測支撐台11表面的凹凸後,在夾緊模組12把持基板S的後行端而移送至劃線單元30的過程中,同時由控制單元90執行沿著支撐台11表面的凹凸上升或下降夾緊模組12而調整基板S在Z軸方向上的位置的過程。
The process of detecting the unevenness of the surface of the support table 11 by the
控制單元90沿著支撐台11表面的凹凸來控制升降模組19,使得夾緊模組12對應於支撐台11表面的凹凸而升降。由此,被夾緊模組12把
持的基板S沿著支撐台11表面的凹凸上升或下降。
The
夾緊模組12可以沿著支撐台11表面的凹凸上升或下降,因此,基板S位置可以沿著支撐台11的凹凸而被調整。由此,可以防止基板S因支撐台11表面的凹凸而發生翹曲、下垂等變形。
The
如圖4所示,作為間隔測量單元40的另一例,間隔測量單元40包括:凹凸檢測頭44,其設置於夾緊模組12與夾緊模組12一同沿著支撐台11的表面移動;距離檢測裝置45,其設置於凹凸檢測頭44檢測其與支撐台11之間的距離。距離檢測裝置45可以在凹凸檢測頭44移動時即時測量距離檢測裝置45自身與支撐台11之間的距離,通過距離檢測裝置45與支撐台11之間的距離的變化來測量支撐台11表面的凹凸。
As shown in FIG. 4, as another example of the
距離檢測裝置45包括:發光部451,其向支撐台11的表面射出光;收光部452,其與發光部451隔開預定距離而設置,用於接收被支撐台11反射的光。上述距離檢測裝置45將根據從發光部451射出後被支撐台11發射的光的成像位置形成的電訊號輸出至控制單元90,以檢測自身與支撐台11之間的距離。
The
根據如上結構,當凹凸檢測頭44沿著支撐台11的表面移動,則距離檢測裝置45就會測量自身與支撐台11之間的距離。由此,間隔測量單元40以由距離檢測裝置45測量的自身與支撐台11之間的距離為准來檢測支撐台11表面的凹凸。
According to the above structure, when the
間隔測量單元40檢測支撐台11表面的凹凸的過程可以在夾緊模組12把持基板S的後行端而向劃線單元30移送的過程之前執行。另一例,可以在間隔測量單元40檢測支撐台11表面的凹凸後,在夾緊模組12把
持基板S的後行端而移送至劃線單元30的過程中,同時由控制單元90執行沿著支撐台11表面的凹凸上升或下降夾緊模組12而調整基板S在Z軸方向上的位置的過程。
The process of detecting the unevenness of the surface of the support table 11 by the
控制單元90沿著支撐台11表面的凹凸來控制升降模組19,使得夾緊模組12對應於支撐台11表面的凹凸而升降,也即:支撐台11表面凹,則夾緊模組12上升;支撐台11表面凸,則模組夾緊模組12下降。由此,被夾緊模組12把持的基板S沿著支撐台11表面的凹凸上升或下降。
The
夾緊模組12可以沿著支撐台11表面的凹凸上升或下降,因此,基板S的位置可以根據支撐台11的凹凸進行調整。由此,可以防止基板S因支撐台11表面的凹凸而發生翹曲、下垂等變形。
The
另外,第二移送單元20包括:第二板25,其鄰接於劃線單元30而設置,用於漂浮基板S或吸附基板S而支撐吸附基板S;移送傳送帶21,與第二板25鄰接而設置;移動裝置26,其用於將第二板25及移送傳送帶21在Y軸方向往返移動。移動裝置26的作用是,沿著在Y軸方向延長的第二導軌24在Y軸方向往返移動第二板25及移送傳送帶21。作為移動裝置26可以適用通過空壓或油壓運行的致動器、根據電磁相互作用運行的線性馬達或滾珠螺桿裝置等直線移動設備。
In addition, the
第二板25與移送傳送帶21可以一同向Y軸方向移動。即,第二板25與移送傳送帶21可以一同向平行於基板S的移送方向的方向(Y軸方向)移動。
The
通過劃線單元30在基板S的第一面及第二面分別形成劃線時,第二板25可以向第一板15移動,第一劃線頭32及第二劃線頭34可以位
於第一板15與第二板25之間。通過劃線單元30在基板S的第一面及第二面分別形成劃線時,第二板25向第一板15移動,例如,第二板25在Y軸方向上向第一板15移動,使得基板S穩定地被第一板15及第二板25支撐。
When the
移送傳送帶21可以是多個,多個移送傳送帶21可以在X軸方向上隔開設置。各個移送傳送帶21被多個帶輪211所支撐,多個帶輪211中的至少一個是提供用於旋轉移送傳送帶21的驅動力的驅動帶輪。
There may be a plurality of
第二板25可以漂浮基板S或吸附基板S。例如,第二板25的表面上可以形成有與氣體供給源及真空源連接的多個槽部(未圖示)。氣體從氣體供給源供給至第二板25的多個槽部時,基板S可從第二板25漂浮起來。並且,氣體受到由真空源形成的負壓通過第二板25的多個槽部被吸入時,基板S可以被吸附於第二板25。
The
在基板S移送至第二板25的過程中,氣體被供應至第二板25的槽部,由此,基板S可以與第二板25無摩擦地移動。
During the transfer of the substrate S to the
並且,在基板S的第一面及第二面形成劃線的過程中,基板S可以被吸附固定於第二板25。
In addition, in the process of forming a scribe line on the first surface and the second surface of the substrate S, the substrate S may be adsorbed and fixed to the
並且,在基板S的第一面及第二面分別形成劃線後,在基板S吸附於第一板15及第二板25的狀態下,第二板25向遠離第一板15的方向移動,例如,第二板25向Y軸方向遠離第一板15而移動,由此,基板S可以以劃線為准被分割。
Furthermore, after the scribe lines are formed on the first surface and the second surface of the substrate S, respectively, the
再者,在基板S從第二板25移送至後續工序的過程中,氣體從氣體共給源供應至第二板25的多個槽部,由此,基板S可以從第二板25漂浮,從而基板S與第二板25無摩擦地移動。
Furthermore, during the transfer of the substrate S from the
以下,參照圖5至圖9對本發明實施例中的基板切割裝置的運行進行說明。 Hereinafter, the operation of the substrate cutting device in the embodiment of the present invention will be described with reference to FIGS. 5 to 9.
如圖5所示,在基板S被送入支撐台11之前,執行檢測支撐台11表面的凹凸的工序。為此,通過支撐桿13向Y軸方向的移動,夾緊模組12與間隔測量單元40可以沿著支撐台11的表面而向Y軸方向移動。在上述過程中,可以測量夾緊模組12與支撐台11之間的間隔。並且,控制單元90以夾緊模組12與支撐台11之間的間隔為准可以檢測出支撐台11表面的凹凸。
As shown in FIG. 5, before the substrate S is fed into the support table 11, a process of detecting irregularities on the surface of the support table 11 is performed. For this reason, by moving the
另外,為了檢測支撐台11表面的凹凸,夾緊模組12及間隔測量單元40可以沿著支撐桿13沿X軸方向移動。並且,在檢測支撐台11表面的凹凸的工序之後,夾緊模組12及間隔測量單元40沿著支撐桿13沿X軸方向移動,移動至不會干涉基板S的移送的位置。
In addition, in order to detect the unevenness on the surface of the support table 11, the
如圖6所示,基板S被第一移送單元10移送至劃線單元30。此時,基板S在從第一板15噴射的氣體的作用下而從第一板15漂浮。
As shown in FIG. 6, the substrate S is transferred to the
另外,如圖7所示,在第一板15固定的狀態下,第二板25朝向第一板15在Y軸方向上移動。由此,第一板15及第二板25之間的間隔縮小,基板S被第一板15及第二板25穩定支撐。
In addition, as shown in FIG. 7, in a state where the
之後,基板S向劃線單元30移送。此時,基板S在從氣體供給源供應至第一板15及第二板25的氣體的作用下從第一板15及第二板25漂浮。
After that, the substrate S is transferred to the
並且,如圖8所示,基板S被移送至位於第一板15及第二板25上,則基板S被第一板15及第二板25吸附。此時,劃線頭32、劃線頭34的劃片輪351分別接觸於基板S之後在X軸方向移動,從而在基板S形成X軸劃線。
Furthermore, as shown in FIG. 8, the substrate S is transferred onto the
再者,如圖9所示,在基板S上形成X軸切割線後,劃線頭32、劃線頭34的劃片輪351沿Z軸方向遠離基板S而移動。之後,在基板S被第一板15及第二板25吸附的狀態下,第二板25向遠離第一板15的方向移動,例如,第二板25向Y軸方向遠離第一板15而移動的過程中,基板S沿著X軸切割線被分割。
Furthermore, as shown in FIG. 9, after the X-axis cutting line is formed on the substrate S, the
並且,沿著X軸切割線被分割的基板S被移送傳送帶21傳遞至後續工序。
Then, the substrate S divided along the X-axis cutting line is transferred to the subsequent process by the
再者,在基板S被切割的工序中,即基板S被劃線後被分割的工序中,把持基板S的後行端的夾緊模組12沿著預先測量或即時測量的支撐台11的凹凸,被升降模組19上升或下降。由此,被夾緊模組12所把持的基板S的位置可以沿著支撐台11的凹凸被調整。因此,可以防止基板S因支撐台11表面的凹凸而發生翹曲、下垂等變形。
Furthermore, in the process of cutting the substrate S, that is, the process of dividing the substrate S after being scribed, the
雖然示例說明了本發明的優選實施例,然而本發明的範圍並不限於這樣的特定實施例,可在申請專利範圍所記載的範圍內進行適當變更。 Although the examples illustrate the preferred embodiments of the present invention, the scope of the present invention is not limited to such specific embodiments, and can be appropriately changed within the scope described in the scope of the patent application.
11‧‧‧支撐台 11‧‧‧Supporting table
12‧‧‧夾緊模組 12‧‧‧Clamping module
121‧‧‧夾具本體 121‧‧‧Clamp body
122‧‧‧夾緊部件 122‧‧‧Clamping parts
13‧‧‧支撐桿 13‧‧‧support rod
18‧‧‧導向件 18‧‧‧Guide
19‧‧‧升降模組 19‧‧‧lift module
40‧‧‧間隔測量單元 40‧‧‧Interval measuring unit
41‧‧‧凹凸檢測頭 41‧‧‧Bump detection head
42‧‧‧凹凸檢測部件 42‧‧‧Concave and convex detection parts
421‧‧‧降摩擦部件 421‧‧‧ Friction reducing parts
43‧‧‧位置檢測裝置 43‧‧‧Position detection device
431‧‧‧基準部件 431‧‧‧ benchmark parts
432‧‧‧感測部件 432‧‧‧sensing parts
90‧‧‧控制單元 90‧‧‧Control unit
Claims (10)
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KR10-2017-0157306 | 2017-11-23 | ||
KR1020170157306A KR102067983B1 (en) | 2017-11-23 | 2017-11-23 | Apparatus for cutting substrate |
??10-2017-0157306 | 2017-11-23 |
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TW201926514A TW201926514A (en) | 2019-07-01 |
TWI697068B true TWI697068B (en) | 2020-06-21 |
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TW107140897A TWI697068B (en) | 2017-11-23 | 2018-11-16 | Substrate cutting apparatus |
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KR (1) | KR102067983B1 (en) |
CN (1) | CN109824253B (en) |
TW (1) | TWI697068B (en) |
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JP7450350B2 (en) * | 2019-08-13 | 2024-03-15 | 株式会社ディスコ | cutting equipment |
KR102341796B1 (en) * | 2020-01-29 | 2021-12-21 | 주식회사 탑 엔지니어링 | Substrate cutting apparatus |
CN113735429B (en) * | 2021-08-24 | 2023-09-08 | 芜湖东旭光电科技有限公司 | Glass scribing and cutting device and cutting method thereof |
Citations (2)
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CN105990191A (en) * | 2015-03-16 | 2016-10-05 | 塔工程有限公司 | Substrate transporting stage, scribing apparatus and method for transporting substrate |
CN107117807A (en) * | 2016-12-01 | 2017-09-01 | 塔工程有限公司 | Scribing equipment |
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EP0999189B1 (en) * | 1998-11-05 | 2005-03-30 | Shin-Etsu Chemical Co., Ltd. | Process and apparatus for drawing a preform and for drawing an optical fibre from the drawn preform |
CN1486285B (en) | 2001-01-17 | 2013-01-16 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor |
KR20080057912A (en) * | 2006-12-21 | 2008-06-25 | 엘지디스플레이 주식회사 | Scribing apparatus |
KR20100091525A (en) * | 2009-02-10 | 2010-08-19 | 엘아이지에이디피 주식회사 | Polarizer transfer apparatus |
JP2011121817A (en) * | 2009-12-10 | 2011-06-23 | Seiko Instruments Inc | Method for cutting joined glass, method for manufacturing package, package, piezoelectric vibrator, oscillator, electronic equipment and radio-controlled clock |
US8557683B2 (en) * | 2011-06-15 | 2013-10-15 | Applied Materials, Inc. | Multi-step and asymmetrically shaped laser beam scribing |
KR20130041589A (en) * | 2011-10-17 | 2013-04-25 | 주식회사 에스에프에이 | Glass cutting system |
KR102310157B1 (en) * | 2015-03-16 | 2021-10-12 | 주식회사 탑 엔지니어링 | Scribing apparatus |
-
2017
- 2017-11-23 KR KR1020170157306A patent/KR102067983B1/en active IP Right Grant
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CN105990191A (en) * | 2015-03-16 | 2016-10-05 | 塔工程有限公司 | Substrate transporting stage, scribing apparatus and method for transporting substrate |
CN107117807A (en) * | 2016-12-01 | 2017-09-01 | 塔工程有限公司 | Scribing equipment |
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CN109824253B (en) | 2021-07-06 |
CN109824253A (en) | 2019-05-31 |
TW201926514A (en) | 2019-07-01 |
KR20190059571A (en) | 2019-05-31 |
KR102067983B1 (en) | 2020-01-20 |
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