TWI697068B - Substrate cutting apparatus - Google Patents

Abstract

A substrate cutting apparatus includes a scribing unit for forming a scribe line on a substrate, a conveying unit including a clamping module for holding the substrate and a supporting table for supporting the substrate, the conveying unit for conveying the substrate to the scribing unit, an interval measuring unit for measuring an interval between the clamping module and the supporting table, and a control unit moving the clamping module toward or away from the supporting table based on the interval between the clamping module and the supporting table measured by the interval measuring unit.

Description

Substrate cutting device

The invention relates to a substrate cutting device, which is used for cutting a substrate.

Generally, a liquid crystal display panel for a flat panel display, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmissive projection substrate, a reflective projection substrate, etc. use a unit glass panel (hereinafter referred to as "unit substrate"), the unit The glass panel is obtained by cutting a brittle precursor glass panel (hereinafter referred to as "substrate") such as glass to a predetermined size.

The process of cutting the substrate includes a scribing process in which a scribing wheel made of a material such as diamond is pressed and moved along a predetermined line of the substrate to be cut to form a scribing line.

One of the main considerations in the scribing process for forming scribe lines on the substrate is the flatness of the substrate. In order to form a scribe line with a certain cutting depth on the substrate, the uniform flatness of the substrate should be maintained. Therefore, it is necessary to propose a solution to prevent deformation of the substrate while uniformly maintaining the flatness of the substrate.

【Prior Art Literature】

【Patent Literature】

Korean Published Patent No. 10-2003-0069195

In order to solve the above problems, the object of the present invention is to provide a substrate cutting device It can adjust the position of the substrate and transfer the substrate according to the flatness of the support table supporting the substrate, thereby preventing the deformation of the substrate, and forming a scribe line with a certain cutting depth on the substrate.

In order to achieve the above object, the present invention provides a substrate cutting device, including: a scribing unit for forming a scribing line on a substrate; a transfer unit for transferring the substrate to the scribing unit, the transfer unit including: Clamping module, the transfer unit includes: a clamping module for holding the substrate and a supporting table for supporting the substrate; an interval measuring unit for measuring the clamping module and the support The interval of the stage; and, the control unit controls the clamping module to the direction adjacent to the supporting stage or the interval between the clamping module and the supporting stage measured by the interval measuring unit Move away from the support table.

The transfer unit further includes a support rod having a plurality of the clamping modules, and the plurality of clamping modules are movably disposed on the support rod in the length direction of the support rod to adjust The interval between the plurality of clamping modules.

The clamping module includes: a clamp body connected to the support rod; and a pair of clamping members, which are provided on the clamp body for holding the substrate, and the interval measuring unit is provided on the clamp body .

A lifting module for lifting the clamping module is provided between the clamping module and the support rod to correspond to the unevenness of the surface of the supporting platform.

The interval measuring unit includes: an unevenness detection head, which moves along the surface of the support table together with the clamping module; an unevenness detection component, which is provided on the unevenness detection head and contacts the surface of the support table, Moving along the unevenness on the surface of the support table; and, a position detection device for detecting the position of the unevenness detection member.

An elastic member is connected to the unevenness detecting member.

The portion of the unevenness detecting member that is in contact with the surface of the support table is provided with a friction reducing member.

The position detection device includes: a reference part provided on one of the unevenness detection head and the unevenness detection part; and a sensing part provided on the other of the unevenness detection head and the unevenness detection part , For sensing displacement relative to the reference component.

The interval measuring unit includes: a bump detection head that moves along the surface of the support table together with the clamping module; and a distance detection device that is provided on the bump detection head for detecting the distance detection device The distance from the support table, the distance detection device includes: a light emitting section that emits light toward the support table; and a light receiving section that is spaced apart from the light emitting section at a predetermined interval for receiving Light reflected from the support table.

The support table includes a plurality of conveyor belts spaced apart from each other to support the substrate.

In the substrate cutting device in the embodiment of the present invention, the clamping module holding the substrate can be raised or lowered along the unevenness of the surface of the support table, so the position of the substrate can be adjusted along the unevenness of the support table. Thereby, it is possible to prevent the substrate S from being deformed such as warpage or sagging due to the unevenness on the surface of the support table.

10‧‧‧ First transfer unit

11‧‧‧Supporting table

111‧‧‧Pulley

12‧‧‧Clamping module

121‧‧‧Clamp body

122‧‧‧Clamping parts

13‧‧‧support rod

14‧‧‧ First rail

15‧‧‧ First board

18‧‧‧Guide

19‧‧‧lift module

20‧‧‧Second transfer unit

21‧‧‧Transfer conveyor belt

211‧‧‧Pulley

24‧‧‧ Second rail

25‧‧‧Second board

26‧‧‧Mobile device

30‧‧‧Dash unit

31‧‧‧The first frame

32‧‧‧The first scribing head

33‧‧‧Second frame

34‧‧‧The second scribing head

35‧‧‧ Scribing wheel support department

351‧‧‧Scribe wheel

40‧‧‧Interval measuring unit

41‧‧‧Bump detection head

42‧‧‧Concave and convex detection parts

421‧‧‧ Friction reducing parts

43‧‧‧Position detection device

431‧‧‧ benchmark parts

432‧‧‧sensing parts

44‧‧‧Bump detection head

45‧‧‧Distance detection device

451‧‧‧Lighting Department

452‧‧‧Light Collection Department

90‧‧‧Control unit

S‧‧‧Substrate

1 and 2 are schematic diagrams schematically showing a substrate cutting device in an embodiment of the present invention.

3 is a schematic diagram schematically showing an example of an interval measuring unit of a substrate cutting device in an embodiment of the present invention.

4 is a schematic diagram showing another example of the interval measuring unit of the substrate cutting device in the embodiment of the present invention Example schematic.

5 to 9 are schematic views sequentially showing the operation processes of the first transfer unit, the scribing unit, and the second transfer unit of the substrate cutting device in the embodiment of the present invention.

The substrate cutting device in the embodiments of the present invention will be described below with reference to the drawings.

The object cut by the substrate cutting device in the embodiment of the present invention may be a bonded substrate formed by bonding a first substrate and a second substrate. For example, the first substrate includes thin-film transistors, and the second substrate may include color filters. Contrary to this, the first substrate may include a color filter, and the second substrate may include a thin film transistor.

Hereinafter, the bonded substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is referred to as a first surface, and the surface of the second substrate exposed to the outside is referred to as a second surface.

In addition, the transfer direction of the substrate to be subjected to the dicing process is defined as the Y-axis direction, and the direction perpendicular to the substrate transfer direction (Y-axis direction) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-Y plane on which the substrate is placed is defined as the Z-axis direction. The directions of the X-axis, Y-axis, and Z-axis are shown in FIGS. 1 to 9.

As shown in FIGS. 1 and 2, the substrate cutting device in the embodiment of the present invention includes: a scribing unit 30; a first transfer unit 10, which transfers the substrate S (refer to FIGS. 6 to 9) to the scribing unit 30; The second transfer unit 20 transfers the substrate S from the scribing unit 30 to the subsequent process; the control unit 90 controls the components of the substrate cutting device (see FIGS. 3 and 4 ).

The scribing unit 30 forms scribing lines in the X-axis direction on the first surface and the second surface of the substrate S, respectively.

The scribing unit 30 includes: a first frame 31 that extends in the X-axis direction; the first scribing The thread head 32 is provided on the first frame 31 so as to be movable in the X-axis direction; the second frame 33 is extended in the X-axis direction parallel to the first frame 31 under the first frame 31; The second scribing head 34 is provided on the second frame 33 so as to be movable in the X-axis direction.

The first housing 31 is provided with a plurality of first scribing heads 32 in the X-axis direction, and the second housing 33 is provided with a plurality of second scribing heads 34 in the X-axis direction. A space through which the substrate S passes is formed between the first frame 31 and the second frame 33. The first frame body 31 and the second frame body 33 can be separately manufactured and assembled, or can be formed integrally.

The first scribing head 32 and the second scribing head 34 are opposite to each other in the Z-axis direction. The first scribing head 32 and the second scribing head 34 are also provided with a scribing wheel support 35 for maintaining the scribing wheel 351. The scribing wheel 351 provided on the first scribing head 32 and the scribing wheel 351 provided on the second scribing head 34 are opposed to each other in the Z-axis direction.

The pair of scribing wheels 351 presses the first surface and the second surface of the substrate S, respectively. In a state where the pair of scribing wheels 351 pressurize the first surface and the second surface of the substrate S, respectively, the first scribing head 32 and the second scribing head 34 move in the X-axis direction relative to the substrate S, so that A scribe line is formed on the first surface and the second surface of the substrate S in the X-axis direction.

Furthermore, the first scribing head 32 and the second scribing head 34 are movable relative to the first frame 31 and the second frame 33 in the Z-axis direction, respectively. For this, the first scribing head 32 provided in the first frame 31 and/or the second scribing head 34 provided in the second frame 33 and the first frame 31 and the second frame 33 may be provided There are linear moving devices such as actuators operated by air or oil pressure, linear motors operated by electromagnetic interaction, or ball screw devices.

As the first scribing head 32 and the second scribing head 34 move in the Z-axis direction relative to the first frame 31 and the second frame 33, respectively, the pair of scribing wheels 351 can pressurize the substrate S or move away from the substrate Plate S. Furthermore, the pressure applied to the substrate S by the pair of scribing wheels 351 can be adjusted by adjusting the degree to which the first scribing head 32 and the second scribing head 34 move in the Z-axis direction. Further, the cutting depth of the substrate S by the pair of scribing wheels 351 is adjusted by the movement of the first scribing head 32 and the second scribing head 34 in the Z-axis direction.

The first transfer unit 10 includes: a supporting table 11 for supporting the substrate S; a clamping module 12 for holding the rear end of the substrate S supported on the supporting table 11; a supporting bar 13 which is connected to the clamping mold The group 12 is connected and extended in the X-axis direction; the first guide rail 14 is connected to the support bar 13 and extended in the Y-axis direction; the first plate 15 is disposed adjacent to the scribing unit 30 and is used for floating the substrate S or adsorbing the substrate S The substrate S is supported.

The first plate 15 may float the substrate S or adsorb the substrate S. For example, a plurality of grooves (not shown) connected to the gas supply source and the vacuum source may be formed on the surface of the first plate 15. When gas is supplied from the gas supply source to the plurality of grooves of the first plate 15, the substrate S may float from the first plate 15. Furthermore, when the gas is sucked through the plurality of grooves of the first plate 15 under the negative pressure formed by the vacuum source, the substrate S may be adsorbed to the first plate 15.

In a state where the substrate S floats from the first plate 15, the substrate S can move without friction with the first plate 15. In addition, in the process of forming a scribe line on the first surface and the second surface of the substrate S, the substrate S is adsorbed and fixed to the first plate 15.

For example, the support table 11 may include a plurality of conveyor belts spaced apart in the X-axis direction. As another example, the support table 11 may be a conveyor belt having an area larger than the entire area of the substrate S. If the support table 11 includes a conveyor belt, the support table 11 is supported by a plurality of pulleys 111, and at least one of the plurality of pulleys 111 may be a driving pulley provided with a driving force to rotate the support table 11.

Between the support rod 13 and the first guide rail 14 can be provided by air or hydraulic Linear actuators, linear motors operating according to electromagnetic interaction, or ball screw devices, etc., as long as the support rod 13 can move in the Y-axis direction relative to the first guide rail 14, the linear motion device can be provided in any position One location. Thus, as the support rod 13 moves in the Y-axis direction by the linear movement device while the clamp module 12 is holding the substrate S, the substrate S can be transferred in the Y-axis direction. At this time, the plurality of conveyor belts 11 rotate in synchronization with the movement of the clamping module 12, and the substrate S can be stably supported.

The clamping module 12 can press the rear end of the substrate S to maintain the substrate S. In another example, the clamping module 12 includes a vacuum hole connected to a vacuum source to attract the substrate S. For example, as shown in FIGS. 3 and 4, the clamping module 12 includes: a clamp body 121 connected to the support rod 13; and a pair of clamp members 122 provided on the clamp body 121 for holding the substrate S. The pair of clamping members 122 are opposed to each other in the Z-axis direction, and move closer to each other with the substrate S therebetween, so that the excess portion of the substrate S is held by the pair of clamping members 122.

A plurality of clamping modules 12 may be provided along the support rod 13 in the X-axis direction. The clamping module 12 can move in the X-axis direction along with the guide 18 extending along the support rod 13. To this end, a linear movement device such as an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw device may be provided between the clamping module 12 and the guide 18. The support rod 13 can be moved relative to the guide 18 in the X-axis direction, and the linear movement device can be provided at any position. Therefore, the plurality of clamping modules 12 are moved in the X-axis direction by corresponding linear moving devices, so that the interval between the plurality of clamping modules 12 can be adjusted. Thus, the plurality of clamp modules 12 are appropriately provided corresponding to the width of the substrate S, so that the substrate S can be stably held.

A lifting module 19 that moves the clamping module 12 in the Z-axis direction may be provided between the clamping module 12 and the support rod 13. The lifting module 19 may be an actuator operated by air pressure or oil pressure, A linear movement device such as a linear motor or a ball screw device that operates based on electromagnetic interaction. Here, as long as the clamping module 12 can be moved relative to the support rod 13 in the Z-axis direction, the linear movement device can be provided at any position. When the substrate S is fed into or out of the support table 11, the clamping module 12 is raised by the lifting module 19, thereby preventing interference between the clamping module 12 and the substrate S.

In addition, the lifting module 19 can raise or lower the clamping module 12 according to the interval between the clamping module 12 and the support table 11, whereby the substrate S can be raised and lowered according to the flatness of the support table 11.

In order to measure the interval between the clamping module 12 and the support table 11, the substrate cutting device in the embodiment of the present invention may include an interval measuring unit 40. In addition, the control unit 90 controls the lifting module 19 based on the interval between the clamping module 12 and the support table 11 measured by the interval measuring unit 40, so that the clamping module 12 is raised or lowered.

The interval measuring unit 40 may be installed in the clamping module 12. Specifically, the interval measuring unit 40 may be disposed on the clamp body 121 of the clamping module 12. Since the interval measuring unit 40 is provided on the clamp body 121 adjacent to the pair of clamping members 122 holding the substrate S, the interval between the clamping module 12 and the support table 11 can be measured more accurately.

However, the present invention is not limited to the above structure, as long as the interval between the clamping module 12 and the support table 11 can be measured, the installation position of the interval measuring unit 40 is not limited.

As shown in FIG. 3, the interval measuring unit 40 includes: a concave-convex detection head 41, which is provided on the clamping module 12, and moves along the surface of the support table 11 together with the clamping module 12, and a concave-convex detection member 42, which is provided on The unevenness detection head 41 can move along the unevenness on the surface of the support table 11; the position detection device 43 is used to measure the position of the unevenness detection member 42 in the Z-axis direction.

In order to measure the interval between the clamping module 12 and the support table 11, the unevenness detection component 42 maintains contact with the surface of the support table 11. When the unevenness detection head 41 moves, the unevenness detection member 42 moves along the Z-axis direction along the unevenness on the surface of the support table 11. The concavo-convex detection member 42 is slidably provided in the concavo-convex detection head 41 in the Z-axis direction so that the concavo-convex detection member 42 moves along the Z-axis direction along the concavo-convex surface of the support table 11.

For example, the unevenness detection member 42 may be connected to an elastic material such as a spring so that the unevenness detection member 42 moves along the Z-axis direction along the unevenness on the surface of the support table 11. The unevenness detecting member 42 may be closely attached to the surface of the support base 11 according to an elastic material.

The end of the unevenness detecting member 42 that is in contact with the surface of the support table 11 is provided with a friction reducing member 421 such as a ball or a roller. The friction reducing member 421 can perform a rolling motion in a state of contacting the surface of the support table 11. In another example, the friction reducing member 421 may be flexible plastic, resin, or the like.

The position detection device 43 is connected to the control unit 90, and information about the position and displacement of the unevenness detection member 42 measured by the position detection device 43 is transmitted to the control unit 90.

The position detection device 43 includes a reference member 431 attached to the uneven detection member 42 and a sensing member 432 provided on the uneven detection head 41 and opposed to the reference member 431 to sense relative displacement with the reference member 431. As another example, the reference member 431 may be provided on the unevenness detection head 41, and the sensing member 432 may be attached to the unevenness detection member 42. This position detecting device 43 uses the interaction of the reference member 431 and the sensing member 432 to measure the position and displacement of the unevenness detecting member 42.

As an example, the reference part 431 may have a ruler with a predetermined scale, and the sensing part 432 may include a camera that photographs the ruler. At this time, the relative position between the reference member 431 and the sensing member 432 is measured based on the image of the ruler captured by the sensing member 432, and the position of the unevenness detecting member 42 is measured based on the measured relative position.

As another example, the reference part 431 may include a reflective surface whose reflection angle changes according to the position, and the sensing part 432 may include a light emitting sensor that emits light toward the reflective surface and a light receiving sensor that receives light reflected by the reflective surface. At this time, the relative position between the reference member 431 and the sensing member 432 is measured by measuring the reflection angle of the light reflected by the reflection surface, and the position of the unevenness detection member 42 is measured based on the measured relative position.

According to the above structure, in the state where the end of the unevenness detection member 42 is in contact with the surface of the support table 11, the unevenness detection head 41 moves along the surface of the support table 11, and the unevenness detection member 42 along the surface of the support table 11 along the Z axis direction mobile.

As the unevenness detecting member 42 moves, the relative position between the reference member 431 and the sensing member 432 changes. Based on this relative position change, the displacement of the unevenness detecting member 42 can be measured.

Such displacement of the unevenness detecting member 42 means the size of unevenness on the surface of the support table 11. Thus, the interval measuring unit 40 obtains the information about the unevenness of the surface of the support table 11 based on the displacement of the unevenness detecting member 42.

The process of detecting the unevenness of the surface of the support table 11 by the interval measuring unit 40 may be performed before the process of the clamping module 12 grasping the rear end of the substrate S and transferring it to the scribing unit 30. As another example, after the interval measuring unit 40 detects the unevenness on the surface of the support table 11, the gripping module 12 grips the rear end of the substrate S and transfers it to the scribing unit 30, while the control unit 90 performs The process of adjusting the position of the substrate S in the Z-axis direction by raising or lowering the unevenness of the surface of the support table 11 by clamping the module 12.

The control unit 90 controls the lifting module 19 along the irregularities on the surface of the supporting table 11, so that the clamping module 12 moves up and down corresponding to the irregularities on the surface of the supporting table 11. Thus, the clamped module 12 The held substrate S rises or falls along the irregularities on the surface of the support table 11.

The clamping module 12 can be raised or lowered along the unevenness of the surface of the support table 11, so the position of the substrate S can be adjusted along the unevenness of the support table 11. Thereby, the substrate S can be prevented from being deformed such as warpage or sagging due to the unevenness on the surface of the support table 11.

As shown in FIG. 4, as another example of the interval measuring unit 40, the interval measuring unit 40 includes: an unevenness detection head 44, which is disposed on the clamping module 12 and the clamping module 12 to move along the surface of the supporting table 11; The distance detection device 45, which is provided on the unevenness detection head 44, detects the distance between it and the support table 11. The distance detection device 45 can immediately measure the distance between the distance detection device 45 itself and the support table 11 when the bump detection head 44 moves, and measure the surface of the support table 11 through the change in the distance between the distance detection device 45 and the support table 11 Bump.

The distance detection device 45 includes a light-emitting portion 451 that emits light toward the surface of the support table 11 and a light-receiving portion 452 that is provided at a predetermined distance from the light-emitting portion 451 and receives light reflected by the support table 11. The above-mentioned distance detection device 45 outputs the electric signal formed according to the imaging position of the light emitted from the light-emitting portion 451 and emitted by the support table 11 to the control unit 90 to detect the distance between itself and the support table 11.

According to the above structure, when the unevenness detection head 44 moves along the surface of the support table 11, the distance detection device 45 measures the distance between itself and the support table 11. Thus, the interval measuring unit 40 detects the unevenness of the surface of the support table 11 based on the distance between itself and the support table 11 measured by the distance detection device 45.

The process of detecting the unevenness of the surface of the support table 11 by the interval measuring unit 40 may be performed before the process of the clamping module 12 grasping the rear end of the substrate S and transferring it to the scribing unit 30. As another example, after the interval measuring unit 40 detects the unevenness on the surface of the support table 11, the clamping module 12 can During the process of transferring the rear end of the substrate S to the scribing unit 30, the control unit 90 simultaneously performs the ascending and descending of the support module 11 along the surface of the supporting module 11 to clamp the module 12 to adjust the substrate S in the Z-axis direction The process of location.

The control unit 90 controls the lifting module 19 along the irregularities on the surface of the supporting table 11 so that the clamping module 12 moves up and down corresponding to the irregularities on the surface of the supporting table 11, that is, the surface of the supporting table 11 is concave, then the clamping module 12 Ascending; the surface of the support table 11 is convex, and the module clamping module 12 is lowered. As a result, the substrate S held by the clamp module 12 rises or falls along the irregularities on the surface of the support table 11.

The clamping module 12 can be raised or lowered along the unevenness of the surface of the support table 11, so the position of the substrate S can be adjusted according to the unevenness of the support table 11. Thereby, the substrate S can be prevented from being deformed such as warpage or sagging due to the unevenness on the surface of the support table 11.

In addition, the second transfer unit 20 includes: a second plate 25, which is provided adjacent to the scribing unit 30, and is used to float the substrate S or the suction substrate S to support the suction substrate S; the transfer conveyor 21 is adjacent to the second plate 25 and Installation; a moving device 26, which is used to reciprocate the second plate 25 and the transfer conveyor 21 in the Y-axis direction. The function of the moving device 26 is to reciprocate the second plate 25 and the transfer conveyor 21 in the Y-axis direction along the second guide rail 24 extending in the Y-axis direction. As the moving device 26, a linear moving device such as an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw device can be applied.

The second plate 25 and the transfer conveyor 21 can move together in the Y-axis direction. That is, the second plate 25 and the transfer conveyor 21 can move together in a direction (Y-axis direction) parallel to the transfer direction of the substrate S.

When the scribing unit 30 forms the scribing lines on the first surface and the second surface of the substrate S, the second plate 25 can move to the first plate 15 and the first scribing head 32 and the second scribing head 34 can be positioned. Between the first plate 15 and the second plate 25. When the scribing unit 30 forms the scribing lines on the first surface and the second surface of the substrate S, respectively, the second plate 25 moves toward the first plate 15, for example, the second plate 25 moves toward the first plate 15 in the Y-axis direction So that the substrate S is stably supported by the first plate 15 and the second plate 25.

There may be a plurality of transfer conveyors 21, and the plurality of transfer conveyors 21 may be spaced apart in the X-axis direction. Each transfer conveyor belt 21 is supported by a plurality of pulleys 211, and at least one of the plurality of pulleys 211 is a drive pulley that provides a driving force for rotating the transfer conveyor belt 21.

The second plate 25 may float the substrate S or adsorb the substrate S. For example, a plurality of grooves (not shown) connected to the gas supply source and the vacuum source may be formed on the surface of the second plate 25. When gas is supplied from the gas supply source to the plurality of grooves of the second plate 25, the substrate S may float from the second plate 25. In addition, when the gas is sucked through the plurality of grooves of the second plate 25 under the negative pressure formed by the vacuum source, the substrate S may be adsorbed to the second plate 25.

During the transfer of the substrate S to the second plate 25, gas is supplied to the groove portion of the second plate 25, whereby the substrate S can move without friction with the second plate 25.

In addition, in the process of forming a scribe line on the first surface and the second surface of the substrate S, the substrate S may be adsorbed and fixed to the second plate 25.

Furthermore, after the scribe lines are formed on the first surface and the second surface of the substrate S, respectively, the second plate 25 moves away from the first plate 15 in a state where the substrate S is attracted to the first plate 15 and the second plate 25. For example, the second plate 25 moves away from the first plate 15 in the Y-axis direction, whereby the substrate S can be divided based on the scribe line.

Furthermore, during the transfer of the substrate S from the second plate 25 to the subsequent process, gas is supplied from the gas common source to the plurality of grooves of the second plate 25, whereby the substrate S can float from the second plate 25, thereby The substrate S and the second plate 25 move without friction.

Hereinafter, the operation of the substrate cutting device in the embodiment of the present invention will be described with reference to FIGS. 5 to 9.

As shown in FIG. 5, before the substrate S is fed into the support table 11, a process of detecting irregularities on the surface of the support table 11 is performed. For this reason, by moving the support rod 13 in the Y-axis direction, the clamping module 12 and the interval measuring unit 40 can move in the Y-axis direction along the surface of the support table 11. In the above process, the interval between the clamping module 12 and the support table 11 can be measured. In addition, the control unit 90 can detect the unevenness of the surface of the support table 11 based on the interval between the clamping module 12 and the support table 11.

In addition, in order to detect the unevenness on the surface of the support table 11, the clamping module 12 and the interval measuring unit 40 can move along the support bar 13 in the X-axis direction. In addition, after the process of detecting irregularities on the surface of the support table 11, the clamp module 12 and the interval measuring unit 40 move along the support rod 13 in the X-axis direction and move to a position that does not interfere with the transfer of the substrate S.

As shown in FIG. 6, the substrate S is transferred to the scribing unit 30 by the first transfer unit 10. At this time, the substrate S floats from the first plate 15 under the action of the gas sprayed from the first plate 15.

In addition, as shown in FIG. 7, in a state where the first plate 15 is fixed, the second plate 25 moves in the Y-axis direction toward the first plate 15. As a result, the gap between the first plate 15 and the second plate 25 is reduced, and the substrate S is stably supported by the first plate 15 and the second plate 25.

After that, the substrate S is transferred to the scribing unit 30. At this time, the substrate S floats from the first plate 15 and the second plate 25 by the gas supplied to the first plate 15 and the second plate 25 from the gas supply source.

Furthermore, as shown in FIG. 8, the substrate S is transferred onto the first plate 15 and the second plate 25, and the substrate S is attracted to the first plate 15 and the second plate 25. At this time, the scribing heads 351 and the scribing wheels 351 of the scribing head 34 contact the substrate S and move in the X-axis direction to form an X-axis scribing line on the substrate S.

Furthermore, as shown in FIG. 9, after the X-axis cutting line is formed on the substrate S, the scribing wheel 351 of the scribing head 32 and the scribing head 34 moves away from the substrate S in the Z-axis direction. After that, in a state where the substrate S is attracted by the first plate 15 and the second plate 25, the second plate 25 moves away from the first plate 15, for example, the second plate 25 moves away from the first plate 15 in the Y-axis direction During the movement, the substrate S is divided along the X-axis cutting line.

Then, the substrate S divided along the X-axis cutting line is transferred to the subsequent process by the transfer conveyor 21.

Furthermore, in the process of cutting the substrate S, that is, the process of dividing the substrate S after being scribed, the clamping module 12 holding the rear end of the substrate S is along the irregularities of the support table 11 measured in advance or measured in real time , Is raised or lowered by the lifting module 19. Thus, the position of the substrate S held by the clamp module 12 can be adjusted along the unevenness of the support table 11. Therefore, it is possible to prevent the substrate S from being deformed such as warpage or sagging due to the unevenness on the surface of the support table 11.

Although the examples illustrate the preferred embodiments of the present invention, the scope of the present invention is not limited to such specific embodiments, and can be appropriately changed within the scope described in the scope of the patent application.

11‧‧‧Supporting table

12‧‧‧Clamping module

121‧‧‧Clamp body

122‧‧‧Clamping parts

13‧‧‧support rod

18‧‧‧Guide

19‧‧‧lift module

40‧‧‧Interval measuring unit

41‧‧‧Bump detection head

42‧‧‧Concave and convex detection parts

421‧‧‧ Friction reducing parts

43‧‧‧Position detection device

431‧‧‧ benchmark parts

432‧‧‧sensing parts

90‧‧‧Control unit

Claims (10)

A substrate cutting device includes: a scribing unit for forming a scribing line on a substrate; a transfer unit for transferring the substrate to the scribing unit, the transfer unit includes a clamping module for holding the substrate And a supporting table for supporting the substrate; an interval measuring unit for measuring the interval between the clamping module and the supporting table; and a control unit for the clamping module measured by the interval measuring unit The interval between the group and the support platform is controlled, and the clamping module is controlled to move toward the support platform or away from the support platform. The substrate cutting device according to claim 1, wherein: the transfer unit further includes a support rod, the support rod has a plurality of the clamping modules, and the plurality of the clamping modules are located on the support rod The support rod is movably arranged in the longitudinal direction to adjust the interval between the plurality of clamping modules. The substrate cutting device according to claim 2, wherein the clamping module includes: a clamp body connected to the support rod; and a pair of clamping members provided on the clamp body to hold the clamp In the substrate, the interval measuring unit is provided in the clamp body. The substrate cutting device according to claim 2, wherein: a lifting module for lifting the clamping module corresponding to the unevenness of the surface of the support table is provided between the clamping module and the support rod . The substrate cutting device according to claim 1, wherein the interval measuring unit includes: an unevenness detection head that moves along the surface of the support table together with the clamping module; unevenness A detection component, which is provided on the concave-convex detection head, contacts the surface of the support table and moves along the irregularities of the surface of the support table; and a position detection device for detecting the position of the concave-convex detection component. The substrate cutting device according to claim 5, wherein an elastic member is connected to the unevenness detecting member. The substrate cutting device according to claim 5, wherein a portion of the unevenness detecting member that is in contact with the surface of the support table is provided with a friction reducing member. The substrate cutting device according to claim 5, wherein the position detection device includes: a reference part provided on one of the unevenness detection head and the unevenness detection part; and a sensing part provided on the The other of the concave-convex detection head and the concave-convex detection member is used to sense the displacement relative to the reference member. The substrate cutting device according to claim 1, wherein the interval measuring unit includes: an unevenness detection head that moves along the surface of the support table together with the clamping module; and a distance detection device, which is provided at The concavo-convex detection head is used to detect the distance between the distance detection device and the support table, and the distance detection device includes: a light-emitting portion that emits light toward the support table; and a light-receiving portion, which The light emitting sections are provided at predetermined intervals to receive light reflected from the support table. The substrate cutting device according to claim 1, wherein the support table includes a plurality of conveyor belts spaced apart from each other to support the substrate.

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