CN212848354U - Clamping device - Google Patents

Clamping device Download PDF

Info

Publication number
CN212848354U
CN212848354U CN202021791216.1U CN202021791216U CN212848354U CN 212848354 U CN212848354 U CN 212848354U CN 202021791216 U CN202021791216 U CN 202021791216U CN 212848354 U CN212848354 U CN 212848354U
Authority
CN
China
Prior art keywords
substrate
clamping member
actuator
driving force
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021791216.1U
Other languages
Chinese (zh)
Inventor
方圭龙
金贤正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Application granted granted Critical
Publication of CN212848354U publication Critical patent/CN212848354U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

An embodiment of the utility model provides a fixture device, it can include: a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft; a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; a support pad provided on the substrate support surface of the first chuck member or the substrate support surface of the second chuck member and contacting the substrate; and an actuator connected to the first clamp member via a driving force transmission member and a driving force transmission rod, and configured to be rotatable about the rotation shaft.

Description

Clamping device
Technical Field
The utility model relates to a clamping device that mode that constitutes with can centre gripping base plate.
Background
In general, in a process of manufacturing a display panel, a semiconductor, or the like, a substrate processing apparatus that performs a predetermined process on a substrate is used.
In a process of performing a predetermined process on a substrate by a substrate processing apparatus, a chucking apparatus for chucking a portion of the substrate is used in order to transfer the substrate or separate an edge trim (dummy portion) or cullet (ineffective area) from the substrate, which is removed without being used for a product.
The clamp device generally includes a pair of clamping members. In a state where the substrate is positioned between the pair of clamping members, the pair of clamping members are moved in directions adjacent to each other, whereby the substrate is sandwiched by the pair of clamping members.
On the other hand, the substrate processing apparatus needs to process a variety of substrates having a variety of thicknesses. However, the conventional jig device has a disadvantage that an additional work of changing the height of the entire jig device in accordance with the thickness of the substrate is required to stably hold the substrate every time the thickness of the substrate is changed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a clamp device that even also need not to carry out the additional operation that makes the whole height of clamp device and the corresponding change of substrate thickness just can stably get rid of the rim charge of substrate under the condition of substrate thickness change.
An embodiment of the present invention for achieving the above object provides a jig device, which may include: a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft; a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; a support pad provided on the substrate support surface of the first chuck member or the substrate support surface of the second chuck member and contacting the substrate; and an actuator connected to the first clamp member via the driving force transmission member and the driving force transmission rod, and configured to rotate the first clamp member about the rotation shaft.
The support pad may be formed of a material having a larger elastic force than the substrate.
Additionally, an embodiment of the present invention provides a clamping device, which may include: a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft; a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; an actuator connected to the first clamping member through a driving force transmission member and a driving force transmission rod; and a regulator that regulates a pressure inside the actuator so that the first surface of the substrate contacts the substrate supporting surface of the first clamping member when the substrate is positioned between the first clamping member and the second clamping member.
Additionally, an embodiment of the present invention provides a clamping device, which may include: a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft; a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; and an actuator connected to the first clamping member through the driving force transmission member and the driving force transmission rod, wherein the front end of the first clamping member facing the substrate can be bent.
Additionally, an embodiment of the present invention provides a clamping device, which may include: a first clamping member having a first substrate supporting surface for supporting the first surface of the substrate and rotatably connected to a first rotating shaft; a second clamping member having a second substrate supporting surface for supporting the second surface of the substrate; a driving force transmission lever rotatably connected to the first clamping member via a second rotating shaft; and an actuator that supplies a driving force to the first clamping member through the driving force transmission lever, and a center of the second rotation shaft is located closer to the first clamping member and the second clamping member than a center of the first rotation shaft in a state where the first substrate supporting surface and the second substrate supporting surface are in contact with each other.
Additionally, according to the utility model discloses an embodiment provides a fixture device, it can include: a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the first rotating shaft; a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; a base provided with a rotating shaft bracket supporting the first rotating shaft; a driving force transmission lever rotatably connected to the first clamping member via a second rotating shaft; an actuator that supplies a driving force to the first clamping member through a driving force transmission rod; and an actuator rotating shaft to which the actuator is rotatably supported, the extension line of the driving force transmitting rod passing through the center of the actuator rotating shaft or being located between the base and the center of the actuator rotating shaft.
The first surface of the substrate supported by the substrate supporting surface of the first clamping member may have a smaller supporting area than the second surface of the substrate supported by the substrate supporting surface of the second clamping member.
According to the present invention, since the pressure inside the first actuator is adjusted in accordance with the thickness of the substrate, the distance between the first substrate support surface of the first clamping member and the second substrate support surface of the second clamping member can be adjusted, and therefore, even when the thickness of the substrate is changed, it is not necessary to perform additional work for changing the overall height of the jig device in accordance with the thickness of the substrate, and the substrate can be stably held. Therefore, the number of working processes can be reduced, and a predetermined process for processing a substrate can be stably performed.
Drawings
Fig. 1 is a view schematically showing a jig device according to a first embodiment of the present invention.
Fig. 2 and 3 are schematic views showing an operating state of a clamping apparatus according to a first embodiment of the present invention.
Fig. 4 is a view schematically showing a jig device according to a second embodiment of the present invention.
Fig. 5 and 6 are diagrams schematically showing a jig device according to a third embodiment of the present invention.
Fig. 7 is a view schematically showing a chuck device according to a fourth embodiment of the present invention.
Fig. 8 and 9 are views schematically showing an operating state of a chuck device according to a fourth embodiment of the present invention.
Description of the reference numerals
50: a clamp device; 51: a base; 52: a clamping unit; 53: the drive unit 54: a posture maintaining unit.
Detailed Description
Hereinafter, a clamping apparatus according to an embodiment of the present invention will be described with reference to the drawings.
Hereinafter, a clamp apparatus 50 according to a first embodiment of the present invention will be described with reference to fig. 1 to 3.
The clamping device 50 of the first embodiment of the present invention includes a base 51, a clamping unit 52, and a driving unit 53.
The jig unit 52 is attached to the base 51 in an operable manner. The driving unit 53 is configured to operate the clamping unit 52.
The clamping unit 52 includes a first clamping member 521, a second clamping member 522, a connecting member 523, a first rotating shaft 524, and a second rotating shaft 525.
The first clamping member 521 is rotatably connected to the first rotating shaft 524. The second clamping member 522 is mounted to the base 51 with its position fixed.
The first clamping member 521 includes a first substrate support surface 5211 that supports the first surface of the substrate S. The second clamping member 522 includes a second substrate support surface 5221 that supports a second surface of the substrate S opposite the first surface of the substrate S.
In a state where the substrate S is positioned between the first clamping member 521 and the second clamping member 522, the first clamping member 521 is moved so as to be close to the second clamping member 522, whereby the substrate S can be supported (clamped) by the first substrate supporting surface 5211 of the first clamping member 521 and the second substrate supporting surface 5221 of the second clamping member 522.
A first support pad 526 is attached to the first substrate support surface 5211. The second substrate support surface 5221 is provided with a second support pad 527. The first support pad 526 and the second support pad 527 are formed of synthetic resin such as polyurethane. The first and second support pads 526 and 527 are portions that contact the substrate S, and function to absorb an impact generated when the first and second support pads 526 and 527 contact the substrate S. The first and second support pads 526 and 527 may have a greater elastic force than the substrate S. Therefore, the first and second support pads 526 and 527 can more stably hold the substrate S.
In particular, as shown in fig. 3, when the first and second clamping members 521 and 522 clamp a relatively thick substrate S, the substrate S is clamped in a state in which the first substrate support surface 5211 of the first clamping member 521 is inclined at a predetermined angle with respect to the first surface of the substrate S. In this case, since the area of the first surface of the substrate S in contact with the first clamping member 521 is small, the substrate S may not be properly supported. According to the embodiment of the present invention, since the first substrate support surface 5211 includes the first support pad 526 having a larger elastic force than the substrate S, even when the substrate S is held in a state where the first substrate support surface 5211 is inclined at a predetermined angle with respect to the first surface of the substrate S, the first support pad 526 elastically deforms so as to conform to the shape of the substrate S and is closely attached to the substrate S. Therefore, the substrate S can be stably held without being damaged without slipping or separating from the first support pad 526.
In particular, when the substrate S is a thin film glass plate, the substrate S can be prevented from being damaged by the cushioning force of the first support pad 526 and the second support pad 527.
The connecting member 523 is configured to connect the first clamping member 521 to the driving unit 53. The coupling member 523 is coupled to the first rotating shaft 524 and the second rotating shaft 525. The first clamping member 521 is connected to the first rotating shaft 524 and the second rotating shaft 525 through a connecting member 523. The connecting member 523 and the first clamping member 521 may be integrally manufactured or separately manufactured and then assembled. The connecting member 523 is rotatable about the first rotating shaft 524 together with the first clamping member 521.
The first rotating shaft 524 is a fixed shaft fixed to the base 51. The second rotating shaft 525 is a movable shaft that moves following the movement of the connecting member 523.
The base 51 may be provided with a pivot holder 513, and the first pivot 524 may be rotatably supported by the pivot holder 513.
The drive unit 53 includes a first actuator 531, a first drive force transmitting member 532, a first drive force transmitting rod 533, a fluid supply source 534, a regulator 535, a first line 536, a second line 537, a first valve 538, and a second valve 539.
The first actuator 531 functions to supply a driving force to the first clamping member 521. The first actuator 531 is connected to the base 51 through a first actuator rotation shaft 5313. The first actuator rotating shaft 5313 can be fixed to the base 51 by the first actuator rotating shaft bracket 515. The first actuator 531 may be provided with a rotating shaft block 5314 extending toward the first actuator rotating shaft 5313, and the rotating shaft block 5314 may be rotatably connected to the first actuator rotating shaft 5313.
Therefore, the first actuator 531 can rotate about the first actuator rotation shaft 5313 in the process of advancing or retracting the first driving force transmission rod 533.
A first driving force transmission member 532 is disposed in a reciprocatingly movable manner inside the first actuator 531. The first actuator 531 includes: a first port 5311 connected to the first line 536; and a second port 5312 connected to the second line 537.
The first valve 538 is configured to open or close a flow path connected from the fluid supply source 534 to the first port 5311 via the first line 536. The second valve 539 is configured to open or close a flow path connected from the fluid supply source 534 to the second port 5312 via a second line 537.
With this configuration, as fluid flows into the first actuator 531 through the first line 536 and the first port 5311, the first driving force transmission member 532 can move in a direction toward the clamp unit 52. Then, as the fluid flows into the first actuator 531 through the second line 537 and the second port 5312, the first driving force transmission member 532 can move in a direction away from the clamp unit 52. In this manner, the first driving force transmission member 532 can move according to the pressure inside the first actuator 531.
One end of the first driving force transmission rod 533 is connected to the first driving force transmission member 532, and the other end of the first driving force transmission rod 533 is connected to the connection member 523 via the first connection head 5331 and the second rotation shaft 525. The first driving force transmission lever 533 is rotatably connected to the first clamp member 521 via the second rotation shaft 525. Thus, the first driving force transmission member 532 is connected to the first clamping member 521 through the first driving force transmission rod 533, the first connection head 5331, the second rotation shaft 525, and the connection member 523. Thereby, the driving force of the first actuator 531 is supplied to the first clamping member 521 through the first driving force transmission member 532, the first driving force transmission rod 533, the first connection head 5331, the second rotation shaft 525, and the connection member 523.
The first driving force transmission member 532 is movable within the first actuator 531 by the pressure inside the first actuator 531, the first driving force transmission rod 533 is movable by the movement of the first driving force transmission member 532, and the connection member 523 and the first clamp member 521 are rotatable about the first rotation shaft 524 by the movement of the first driving force transmission rod 533.
The first clamping member 521 can move closer to the second clamping member 522 or move away from the second clamping member 522 while rotating about the first rotating shaft 524.
On the other hand, the first driving force transmission rod 533 can move in a direction away from or toward the base 51 while moving forward or backward. The base 51 may be provided with a first guide member 511 to guide the movement of the first driving force transmission lever 533 relative to the base 51. For example, the first guide assembly 511 may be constituted by a guide rail connected to the first driving force transmission lever 533.
The fluid supplied by the fluid supply source 534 may be a liquid or a gas. The driving unit 53 may be operated hydraulically or pneumatically.
The regulator 535 is configured to regulate the pressure of the fluid supplied to the inside of the first actuator 531. By the regulator 535, the pressure inside the first actuator 531 can be regulated. The regulator 535 can keep the internal pressure of the first actuator 531 constant. Further, the regulator 535 can regulate the internal pressure of the first actuator 531. The internal pressure of the first actuator 531 may be determined according to the thickness of the substrate S, and the angle between the first and second clamping members 521 and 522 and the lead-out angle of the first driving force transmission rod 533 may be determined according to the internal pressure of the first actuator 531.
When the substrate S is positioned between the first and second clamping members 521 and 522, the pressure inside the first actuator 531 is adjusted by the adjuster 535, whereby the first surface of the substrate S can be pressed in contact with the first substrate supporting surface 5211 of the first clamping member 521.
As shown in fig. 2 and 3, the position of the first driving force transmission member 532 inside the first actuator 531 can be adjusted as the pressure inside the first actuator 531 is adjusted by the adjuster 535. With the adjustment of the position of the first driving force transmission member 532, the rotational angle of the first clamp member 521 can be adjusted. As the rotation angle of the first clamping member 521 is adjusted, the separation distance between the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 can be adjusted. In this way, as the pressure inside the first actuator 531 is adjusted by the adjuster 535, the separation distance between the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 can be adjusted to correspond to the thickness of the substrate S.
On the other hand, as shown in fig. 3, as the thickness of the substrate S increases, the supporting area of the first surface of the substrate S supported on the first substrate supporting surface 5211 of the first clamping member 521 is smaller than the supporting area of the second surface of the substrate S supported on the second substrate supporting surface 5221 of the second clamping member 522.
According to the clamp device 50 of the first embodiment of the present invention, the pressure inside the first actuator 531 is adjusted corresponding to the thickness of the substrate S, so that the separation distance between the first substrate supporting surface 5211 of the first clamping member 521 and the second substrate supporting surface 5221 of the second clamping member 522 can be adjusted. Therefore, even when the thickness of the substrate S is changed, it is not necessary to perform an additional work of changing the overall height of the chucking device 50 in accordance with the thickness of the substrate S, and the substrate S can be stably chucked. Therefore, the number of working processes can be reduced. In addition, a predetermined process for the substrate S can be stably performed, or the substrate S can be stably transferred to a subsequent process.
Next, a clamping apparatus 50 according to a second embodiment of the present invention will be described with reference to fig. 4. The same portions as those described in the first embodiment of the present invention are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 4, according to the clamp apparatus 50 of the second embodiment of the present invention, the front end of the first clamping member 521 facing the substrate S may be bent.
The front end of the first clamping member 521 may be bent in a direction in which the substrate S enters between the first clamping member 521 and the second clamping member 522.
According to the clamp device 50 of the second embodiment of the present invention, in the process of the substrate S entering between the first clamping member 521 and the second clamping member 522, when the end of the substrate S collides with the front end of the first clamping member 521, the end of the substrate S is guided to the bent portion of the front end of the first clamping member 521, so that the substrate S can stably enter between the first clamping member 521 and the second clamping member 522. In addition, warpage or breakage of the substrate S can be prevented.
Next, a jig device 50 according to a third embodiment of the present invention will be described with reference to fig. 5 and 6. The same portions as those described in the first and second embodiments of the present invention are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 5, the extension line EL of the first driving-force transmitting rod 533 may pass through the center C5 of the first actuator rotating shaft 5313. As another example, the extension line EL of the first driving-force transmitting rod 533 may be located at least between the base 51 and the center C5 of the first actuator rotating shaft 5313.
As shown in fig. 6, in a state where the first substrate supporting surface 5211 of the first clamping member 521 and the second substrate supporting surface 5221 of the second clamping member 522 are in contact with each other, the center C2 of the second rotating shaft 525 is located closer to the first clamping member 521 and the second clamping member 522 than the center C1 of the first rotating shaft 524.
According to the third embodiment of the present invention, the clamping device 50 can prevent the brittle material substrate S from cracking, scratching, stamping, breaking, damaging, and the like, and the first clamping member 521 and the second clamping member 522 can prevent the substrate from slipping or breaking away from each other to clamp the substrate S more stably.
In addition, when the first and second clamping members 521 and 522 release the substrate S, the substrate S can be prevented from being lifted up following the movement of the first clamping member 521 in a state of being adhered to the first clamping member 521.
Next, a jig device 50 according to a fourth embodiment of the present invention will be described with reference to fig. 7 to 9. The same portions as those described in the first to third embodiments of the present invention are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 7 to 9, a clamp apparatus 50 according to a fourth embodiment of the present invention further includes a posture holding unit 54 that holds the first clamping member 521 in a state of being parallel to the second clamping member 522.
The clamping unit 52 further includes a third rotating shaft 528 and a fourth rotating shaft 529.
The first clamping member 521 is rotatably connected to the connecting member 523 via a third rotating shaft 528. Therefore, in a state where the link member 523 rotates about the first rotating shaft 524, the first clamping member 521 can rotate about the third rotating shaft 528 with respect to the link member 523 by the posture maintaining unit 54. Thereby, the posture of the first clamp member 521 can be horizontally maintained.
The first clamping member 521 is connected to the posture holding unit 54 through a fourth rotating shaft 529.
The third rotating shaft 528 and the fourth rotating shaft 529 are movable shafts that move in accordance with the movement of the first clamping member 521.
The posture holding unit 54 includes a second actuator 541, a second driving force transmission member 542, and a second driving force transmission rod 543.
The second actuator 541 functions to provide a driving force to the first clamping member 521. The second actuator 541 is connected to the base 51 through the second actuator rotation shaft 5413. The second actuator rotating shaft 5413 may be fixed to the base 51 by the second actuator rotating shaft bracket 516. The second actuator 541 may include a pivot block 5414 extending toward the second actuator pivot shaft 5413, and the pivot block 5414 may be rotatably connected to the second actuator pivot shaft 5413.
Therefore, the second actuator 541 can rotate about the second actuator rotation shaft 5413 in the process of advancing or retreating the second driving force transmission rod 543.
A second driving force transmission member 542 is disposed in a reciprocatingly movable manner inside the second actuator 541. The second actuator 541 includes: a first port 5411 connected to the first line 536; and a second port 5412 connected to a second line 537.
The first valve 538 is configured to open or close a flow path connected from the fluid supply source 534 to the first port 5411 via the first line 536. The second valve 539 is configured to open or close a flow path connected from the fluid supply source 534 to the second port 5412 via a second line 537.
With this configuration, the second driving force transmission member 542 can move in the direction toward the clamp unit 52 as the fluid flows into the interior of the second actuator 541 through the first line 536 and the first port 5411. Then, as the fluid flows into the second actuator 541 through the second line 537 and the second port 5412, the second driving force transmission member 542 can move in a direction away from the clamp unit 52. In this way, the second driving force transmission member 542 can move based on the pressure inside the second actuator 541.
One end of the second driving force transmission rod 543 is connected to the second driving force transmission member 542, and the other end of the second driving force transmission rod 543 is connected to the first clamping member 521 through the second connecting head 5431 and the fourth rotation shaft 529. The second driving force transmitting lever 543 is rotatably connected to the first clamping member 521 via a fourth rotating shaft 529. Thereby, the second driving force transfer member 542 is connected to the first clamp member 521 through the second driving force transfer lever 543, the second connection head 5431, and the fourth rotation shaft 529. Thereby, the driving force of the second actuator 541 is supplied to the first clamping part 521 through the second driving force transmission part 542, the second driving force transmission rod 543, the second connection head 5431, and the fourth rotation shaft 529.
The second driving force transmission member 542 is movable within the second actuator 541 in accordance with the pressure inside the second actuator 541. The second driving force transmission rod 543 can move by the movement of the second driving force transmission member 542. By the movement of the second driving force transmission lever 543, the first clamp member 521 can rotate about the third rotation shaft 528 with respect to the connection member 523 while rotating about the fourth rotation shaft 529. The posture of the first clamping member 521 is horizontally maintained by rotating the first clamping member 521 about the third rotating shaft 528 with respect to the connecting member 523 while rotating the first clamping member 521 about the fourth rotating shaft 529, whereby the first substrate supporting surface 5211 of the first clamping member 521 and the second substrate supporting surface 5221 of the second clamping member 522 can be parallel to each other.
On the other hand, the second driving force transmission rod 543 can move in a direction of moving away from or toward the base 51 while moving forward or backward. The base 51 may be provided with a second guide member 512 for guiding the movement of the second driving force transmission rod 543 with respect to the base 51. For example, the second guide assembly 512 may be constituted by a guide rail connected to the second driving force transmission rod 543.
The fluid supply 534 and the regulator 535 may be connected to the first actuator 531 and the second actuator 541. In this case, the first line 536 is connected to the first port 5311 of the first actuator 531 and the first port 5411 of the second actuator 541. The second line 537 is connected to the second port 5312 of the first actuator 531 and the second port 5412 of the second actuator 541.
Therefore, the regulator 535 is configured to regulate the pressure of the fluid supplied to the inside of the first actuator 531 and the pressure of the fluid supplied to the inside of the second actuator 541. The pressure inside the first actuator 531 and the pressure inside the second actuator 541 can be adjusted by the adjuster 535. The regulator 535 can keep the internal pressures of the first actuator 531 and the second actuator 541 constant. Further, the regulator 535 can regulate the internal pressures of the first actuator 531 and the second actuator 541. The internal pressures of the first and second actuators 531 and 541 can be determined according to the thickness of the substrate S.
When the substrate S is positioned between the first and second clamping members 521 and 522, the pressure inside the first actuator 531 and the pressure inside the second actuator 541 are adjusted by the adjuster 535, whereby the first surface of the substrate S can be pressed in contact with the first substrate support surface 5211 of the first clamping member 521 in a state of being horizontally held in the posture of the first substrate support surface 5211 of the first clamping member 521.
As shown in fig. 8 and 9, the position of the first driving force transmission member 532 inside the first actuator 531 can be adjusted as the pressure inside the first actuator 531 is adjusted by the adjuster 535. With the adjustment of the position of the first driving force transmission member 532, the rotational angle of the connecting member 523 can be adjusted. With the adjustment of the rotation angle of the connection member 523, the separation distance between the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 can be adjusted. In this way, as the pressure inside the first actuator 531 is adjusted by the adjuster 535, the separation distance between the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 can be adjusted to correspond to the thickness of the substrate S.
In addition, as the pressure inside the second actuator 541 is adjusted by the adjuster 535, the position of the second driving force transmission member 542 inside the second actuator 541 can be adjusted. With the adjustment of the position of the second driving force transmission member 542, the rotational angle of the first clamp member 521 can be adjusted. As the rotation angle of the first clamping member 521 is adjusted, the posture of the first substrate support surface 5211 of the first clamping member 521 can be horizontally maintained, and thus, a state in which the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 are parallel to each other can be maintained. As the pressure inside the second actuator 541 is adjusted by the adjuster 535 in this way, the first substrate support surface 5211 of the first clamping member 521 and the second substrate support surface 5221 of the second clamping member 522 are brought into a state of being parallel to each other, and a state in which the first surface and the second surface of the substrate S can be clamped more stably can be achieved.
When the pressure inside the first actuator 531 is adjusted, the pressure inside the second actuator 541 can be adjusted at the same time. At this time, the pressure adjustment inside the second actuator 541 is performed in conjunction with the pressure adjustment inside the first actuator 531. The pressure adjustment inside the first actuator 531 and the pressure adjustment inside the second actuator 541 can be performed in such a manner that the condition that the first clamping member 521 is parallel to the second clamping member 522 is satisfied while the first clamping member 521 is displaced relative to the second clamping member 522. In order to satisfy such conditions, specifications (inner diameter, length, position of the first port 5311, position of the second port 5312, angle of installation to the first clamp member 521, and the like) of the first actuator 531, specifications (outer diameter, thickness, and the like) of the first driving force transmission member 532, specifications (diameter, length, angle of installation to the first clamp member 521, and the like) of the first driving force transmission rod 533, specifications (inner diameter, length, position of the first port 5411, position of the second port 5412, angle of installation to the first clamp member 521, and the like) of the second actuator 541, specifications (outer diameter, thickness, and the like) of the second driving force transmission member 542, specifications (diameter, length, angle of installation to the first clamp member 521, and the like) of the second driving force transmission rod 543 may be designed.
On the other hand, as shown in fig. 9, as the thickness of the substrate S increases, the supporting area of the first surface of the substrate S supported on the first substrate supporting surface 5211 of the first clamping member 521 is smaller than the supporting area of the second surface of the substrate S supported on the second substrate supporting surface 5221 of the second clamping member 522.
According to the clamp device 50 of the fourth embodiment of the present invention, the pressure inside the first actuator 531 is adjusted corresponding to the thickness of the substrate S, so that the separation distance between the first substrate supporting surface 5211 of the first clamping member 521 and the second substrate supporting surface 5221 of the second clamping member 522 can be adjusted. Therefore, even when the thickness of the substrate S is changed, it is not necessary to perform an additional work of changing the overall height of the chucking device 50 in accordance with the thickness of the substrate S, and the substrate S can be stably chucked. Therefore, the number of working processes can be reduced. Further, by adjusting the pressure inside the second actuator 541, the posture of the first substrate support surface 5211 of the first clamp member 521 can be horizontally maintained. Therefore, even when the distance between the first substrate support surface 5211 of the first clamp member 521 and the second substrate support surface 5221 of the second clamp member 522 is adjusted, the posture of the first substrate support surface 5211 of the first clamp member 521 can be horizontally maintained, whereby the support area of the first surface of the substrate S supported on the first substrate support surface 5211 of the first clamp member 521 can be increased, and thus the substrate S can be more stably clamped.
The preferred embodiments of the present invention have been described by way of example, and the scope of the present invention is not limited to the specific embodiments, and may be modified as appropriate within the scope described in the claims.

Claims (7)

1. A clamp device, comprising:
a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft;
a second clamping member having a substrate supporting surface for supporting the second surface of the substrate;
a support pad provided on the substrate support surface of the first chuck member or the substrate support surface of the second chuck member and contacting the substrate; and
and an actuator connected to the first clamp member via a driving force transmission member and a driving force transmission rod, and configured to rotate the first clamp member about the rotation shaft.
2. The fixture apparatus of claim 1,
the support pad is formed of a material having a greater elastic force than the substrate.
3. A clamp device, comprising:
a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft;
a second clamping member having a substrate supporting surface for supporting the second surface of the substrate;
an actuator connected to the first clamping member through a driving force transmission member and a driving force transmission rod; and
a regulator that regulates a pressure inside the actuator to bring the first surface of the substrate into contact with the substrate supporting surface of the first clamping member when the substrate is positioned between the first clamping member and the second clamping member.
4. A clamp device, comprising:
a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the rotating shaft;
a second clamping member having a substrate supporting surface for supporting the second surface of the substrate; and
an actuator connected to the first clamping member through a driving force transmission member and a driving force transmission rod,
the first clamping member is bent toward a front end of the substrate.
5. A clamp device, comprising:
a first clamping member having a first substrate supporting surface for supporting the first surface of the substrate and rotatably connected to a first rotating shaft;
a second clamping member having a second substrate supporting surface for supporting the second surface of the substrate;
a driving force transmission lever rotatably connected to the first clamp member via a second rotating shaft; and
an actuator that provides a driving force to the first clamping member through the driving force transmission rod,
the center of the second rotation shaft is located closer to the first clamping member and the second clamping member than the center of the first rotation shaft in a state where the first substrate supporting surface and the second substrate supporting surface are in contact with each other.
6. A clamp device, comprising:
a first clamping member having a substrate supporting surface for supporting the first surface of the substrate and rotatably connected to the first rotating shaft;
a second clamping member having a substrate supporting surface for supporting the second surface of the substrate;
a base provided with a rotation shaft holder supporting the first rotation shaft;
a driving force transmission lever rotatably connected to the first clamp member via a second rotating shaft;
an actuator that provides a driving force to the first clamping member through the driving force transmission rod; and
an actuator rotating shaft to which the actuator is rotatably supported,
an extension line of the driving force transmission rod passes through a center of the actuator rotation shaft or is located between the base and the center of the actuator rotation shaft.
7. The jig device according to any one of claims 1 to 6,
the first surface of the substrate supported by the substrate supporting surface of the first clamping member has a smaller supporting area than the second surface of the substrate supported by the substrate supporting surface of the second clamping member.
CN202021791216.1U 2019-08-27 2020-08-25 Clamping device Active CN212848354U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0105115 2019-08-27
KR1020190105115A KR20210025286A (en) 2019-08-27 2019-08-27 Clamp device

Publications (1)

Publication Number Publication Date
CN212848354U true CN212848354U (en) 2021-03-30

Family

ID=70768061

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021791216.1U Active CN212848354U (en) 2019-08-27 2020-08-25 Clamping device

Country Status (3)

Country Link
KR (1) KR20210025286A (en)
CN (1) CN212848354U (en)
TW (1) TWM592602U (en)

Also Published As

Publication number Publication date
KR20210025286A (en) 2021-03-09
TWM592602U (en) 2020-03-21

Similar Documents

Publication Publication Date Title
KR102081825B1 (en) Board Holding Hand and Board Carrying Device
US7292427B1 (en) Pin lift chuck assembly for warped substrates
US8142260B2 (en) Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
US9138854B2 (en) Polishing apparatus
US20080293341A1 (en) Methods and apparatus for using a rolling backing pad for substrate polishing
JP2014526979A (en) Alignment device
JP2006222190A (en) Wafer aligner
KR20210151347A (en) Glass mounting device and method
CN212848354U (en) Clamping device
CN213259062U (en) Clamping device
KR101593900B1 (en) Lens processing device
KR20170022873A (en) Apparatus and method for sticking sheet
JP2007142220A (en) Chuck device for work
KR20190115702A (en) Apparatus for cutting substrate
CN213622238U (en) Substrate transfer unit and scribing device provided with same
JP4808111B2 (en) Work chuck device
TWI453858B (en) Device for supporting workpiece
JP4853239B2 (en) Wafer holding device
KR20150018192A (en) Auto knurling machine exchanging knurling tool
KR102304576B1 (en) Dummy removing unit and scribe apparatus including the same
JP2014003057A (en) Aligner apparatus
CN216890641U (en) Scribing device
JP5142328B2 (en) A ring table device that can move the flat ring and grip ring.
KR101741080B1 (en) robot hand for debonding work transort apparatus
JP2008114329A (en) Apparatus and method for polishing

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant