CN105549250B - 一种阵列基板、显示面板及其相应制备方法和显示装置 - Google Patents
一种阵列基板、显示面板及其相应制备方法和显示装置 Download PDFInfo
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Abstract
本发明的目的是提供一种阵列基板、显示面板及其相应制备方法和显示装置,以解决封框胶的下方的有机膜层在受高温、高压及高湿度的环境影响时,导致封框胶和所粘接的膜层之间的密封性变差的问题。所述阵列基板,包括衬底基板、依次形成于所述衬底基板之上的栅极保护层、有机膜层和绝缘层,所述阵列基板上形成有设置封框胶的凹槽结构,所述凹槽结构在垂直于基板的方向上由所述绝缘层向所述栅极保护层延伸,并暴露栅极保护层。
Description
技术领域
本发明涉及液晶显示领域,尤其涉及一种阵列基板、显示面板及其相应制备方法和显示装置。
背景技术
薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display,TFT-LCD)具有体积小、功耗低、无辐射、制造成本相对较低等特点,在当前的平板显示器市场占据了主导地位。
TFT-LCD包括阵列基板、彩膜基板以及二者之间的液晶。其中,阵列基板和彩膜基板通过封框胶对二者之间的液晶进行密封。阵列基板在设置封框胶的位置下方一般还依次包括有:绝缘层、有机膜层、栅极保护层以及栅极金属层等。
然而,当处于高温、高压及高湿度的环境条件时,有机膜层相对于其相邻的无机膜层或金属膜层存在的较大张应力差异,以及有机膜层自身在较高温度下由层间的间隙向外释放溶剂的过程均会导致有机膜层和其相邻膜层之间的粘附力变差,并最终会导致有机膜层的上方膜层与封框胶的部分区域发生分离,进而降低了封框胶的密封性能。
发明内容
本发明的目的是提供一种阵列基板、显示面板及其相应制备方法和显示装置,以解决封框胶的下方的有机膜层在受高温、高压及高湿度的环境影响时,导致封框胶和所粘接的膜层之间的密封性变差的问题。
本发明的目的是通过以下技术方案实现的:
本发明实施例提供一种阵列基板,包括衬底基板、依次形成于所述衬底基板之上的栅极保护层、有机膜层和绝缘层,所述阵列基板上形成有用于设置封框胶的凹槽结构,所述凹槽结构在垂直于基板的方向上由所述绝缘层向所述栅极保护层延伸,并暴露栅极保护层。
本实施例中,设置封框胶的位置形成凹槽结构,凹槽结构由绝缘层向栅极保护层延伸,封框胶直接与栅极保护层粘结,其下方不存在有机膜层,可以避免有机膜层在受环境影响时对封框胶和所粘接的膜层之间粘附力造成影响,使封框胶保持良好的密封性能。
优选的,所述凹槽结构的表面设置有透明电极,所述透明电极还覆盖邻近所述凹槽结构开口处的部分所述栅极绝缘层。
本实施例中,以透明电极覆盖凹槽结构,对凹槽结构的侧壁进行密封,可以进一步避免凹槽结构的侧壁的有机膜层受环境影响时导致封框胶和栅极保护层之间的密闭性变差的问题。
优选的,所述阵列基板还包括设置于所述栅极绝缘层与所述衬底基板之间的栅极金属层。
优选的,所述透明电极为氧化铟锡。
优选的,所述凹槽结构设置于所述阵列基板的非显示区内,并环绕所述阵列基板的显示区。
本发明实施例有益效果如下:设置封框胶的位置形成凹槽结构,凹槽结构由绝缘层向栅极保护层延伸,封框胶直接与栅极保护层粘结,其下方不存在有机膜层,可以避免有机膜层在受环境影响时对封框胶和所粘接的膜层之间粘附力造成影响,使封框胶保持良好的密封性能。
本发明实施例提供一种显示面板,包括所述的阵列基板,还包括与所述阵列基板相对设置的对向基板、及设置于所述对向基板与所述阵列基板之间的封框胶;
所述封框胶的一端设置于所述阵列基板的所述凹槽结构之内且端面粘接所述凹槽结构的底部表面,所述封框胶的另一端的端面粘接所述对向基板。
优选的,所述凹槽结构的侧壁与所述封框胶之间具有间隙。
优选的,所述对向基板为彩膜基板或封装基板。
本发明实施例有益效果如下:设置封框胶的位置形成凹槽结构,凹槽结构由绝缘层向栅极保护层延伸,封框胶直接与栅极保护层粘结,其下方不存在有机膜层,可以避免有机膜层在受环境影响时对封框胶和所粘接的膜层之间粘附力造成影响,使封框胶保持良好的密封性能。
本发明实施例提供一种显示装置,包括所述显示面板。
本发明实施例提供一种阵列基板的制备方法,包括:
在衬底基板上依次形成栅极保护层、有机膜层和绝缘层;
在用于设置封框胶的位置,通过构图工艺形成凹槽结构;其中,所述凹槽结构在垂直于基板的方向上由所述绝缘层向所述栅极保护层延伸,并暴露栅极保护层。
优选的,所述制备方法还包括在所述凹槽结构的表面设置透明电极,并使所述透明电极覆盖邻近所述凹槽结构开口处的部分所述栅极绝缘层。
优选的,在所述衬底基板上形成所述栅极保护层之前,还包括在所述衬底基板上形成栅极金属层。
本发明实施例提供一种显示面板的制备方法,采用本发明实施例提供的所述阵列基板进行制备,所述制备方法包括:
在所述阵列基板上的所述凹槽结构之内设置封框胶;
使所述对向基板和所述阵列基板通过所述封框胶粘结。
本发明实施例有益效果如下:设置封框胶的位置形成凹槽结构,凹槽结构由绝缘层向栅极保护层延伸,封框胶直接与栅极保护层粘结,其下方不存在有机膜层,可以避免有机膜层在受环境影响时对封框胶和所粘接的膜层之间粘附力造成影响,使封框胶保持良好的密封性能。
附图说明
图1为本发明实施例提供的一种阵列基板的结构示意图;
图2为本发明实施例提供的另一种阵列基板的结构示意图;
图3为本发明实施例提供的一种显示面板的局部结构示意图;
图4为本发明实施例提供的一种阵列基板的制备流程图;
图5为本发明实施例提供的另一种阵列基板的制备流程图;
图6为本发明实施例中,在阵列基板上依次形成栅极保护层、有机膜层和绝缘层的示意图;
图7为本发明实施例中,在阵列基板上依次形成凹槽结构的示意图;
图8为本发明实施例中,在阵列基板上依次形成透明电极的示意图;
图9为本发明实施例提供的一种显示面板的制备流程图;
图10为本发明实施例中,在阵列基板的凹槽结构形成封框胶的示意图;
图11为本发明实施例中,在阵列基板上形成对向基板的示意图。
具体实施方式
下面结合说明书附图对本发明实施例的实现过程进行详细说明。需要注意的是,自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。
参见图1,本发明实施例提供一种阵列基板,包括衬底基板1、依次形成于衬底基板1之上的栅极保护层2、有机膜层3和绝缘层4,衬底基板1上形成有用于设置封框胶5的凹槽结构6,凹槽结构6在垂直于基板的方向上由绝缘层4向栅极保护层2延伸,并暴露栅极保护层2。
需要说明的是,阵列基板一般分为显示区和非显示区,封框胶设置于阵列基板的非显示区,优选的,本发明实施例中的凹槽结构6设置于阵列基板的非显示区且环绕整个显示区。其中,凹槽结构6在垂直于阵列基板的截面图形可以为弧形、半圆弧形、正方形、长方形、梯形、以及倒梯形,在具体实施时,可根据需要进行灵活设置。优选的,凹槽结构6的截面图形为图1所示的长方形时,工序简单,易于制作。
本实施例中,设置封框胶5的位置形成凹槽结构6,使栅极保护层2暴露,封框胶的下方不存在有机膜层3,其直接与栅极保护层2相粘结,因而,即使有机膜层3在受到高温、高压以及高湿度的影响时,有机膜层较大的张应力差异使其与相邻的膜层的粘附力变差,也不会影响封框胶5与栅极保护层2的接触,从而可以使封框胶保持较好的密封性能。
为了避免凹槽结构6的侧壁的有机膜层3释放的气体影响封框胶5和栅极保护层2之间的粘接,优选的,参见图2,凹槽结构的表面还设置有透明电极7,透明电极7还覆盖邻近凹槽开口处的部分栅极绝缘层4。本实施例中,凹槽结构6表面设置的透明电极7可以对凹槽结构6的侧壁进行密封,可以进一步避免凹槽结构6的侧壁的有机膜层3受环境影响时导致封框胶5和栅极保护层2之间的粘结性变差的问题。透明电极7还覆盖邻近凹槽开口处的部分栅极绝缘层4,可以降低在凹槽结构的表面制作透明电极时对工艺的精度要求,并且起到更好的密封性能。
优选的,透明电极7的材料可以选择氧化铟锡。
优选的,阵列基板还包括设置于栅极绝缘层4与衬底基板1之间的栅极金属层。
本发明实施例有益效果如下:设置封框胶5的位置形成凹槽结构6,凹槽结构6由绝缘层4向栅极保护层2延伸,封框胶5直接与栅极保护层2粘结,其下方不存在有机膜层3,可以避免有机膜层3在受环境影响时对封框胶5和所粘接的膜层之间粘附力造成影响,使封框胶5保持良好的密封性能。
本发明实施例提供一种显示面板,如图3所示为本发明实施例提供的显示面板在设置封框胶处的剖面图,包括本发明实施例提供的阵列基板,还包括与阵列基板相对设置的对向基板8、及设置于对向基板8与阵列基板之间的封框胶5。封框胶5的一端设置于阵列基板的凹槽结构之内且端面粘接凹槽结构6的底部表面,封框胶5的另一端的端面粘接对向基板8。
优选的,封框胶5与凹槽结构6的侧壁之间具有间隙。本实施例中,封框胶5与凹槽结构6的侧壁之间具有间隙,可以避免在形成凹槽结构6时,在设置凹槽结构6的区域和其相邻区域的交界处,绝缘层4与有机膜层3形成的段差和有机膜层3与栅极保护层2形成的段差不在一个垂直方向上时,封框胶5涂覆在高低起伏的段差上,影响封框胶5与栅极保护层2的粘结性,进而影响显示面板的品质。
优选的,对向基板8为彩膜基板或封装基板。
本发明实施例有益效果如下:设置封框胶5的位置形成凹槽结构6,凹槽结构6由绝缘层4向栅极保护层2延伸,封框胶5直接与栅极保护层2粘结,其下方不存在有机膜层3,可以进一步避免凹槽结构6的侧壁的有机膜层3受环境影响时导致封框胶5和栅极保护层2之间的密闭性变差的问题。
本发明实施例提供一种显示装置,包括本发明实施例提供的显示面板。
参见图4,本发明实施例提供一种阵列基板的制备方法,包括:
401、在衬底基板上依次形成栅极保护层、有机膜层和绝缘层。
402、在用于设置封框胶的位置,通过构图工艺形成凹槽结构;其中,凹槽结构在垂直于基板的方向上由绝缘层向栅极保护层延伸,并暴露栅极保护层。
优选的,参见图5,本发明实施例提供另一种阵列基板的制备方法,包括:
501、在衬底基板上依次形成栅极保护层、有机膜层和绝缘层。
502、在用于设置封框胶的位置,通过构图工艺形成凹槽结构;其中,凹槽结构由绝缘层向栅极保护层延伸,并暴露栅极保护层。
503、在凹槽结构的表面设置透明电极,并使透明电极覆盖邻近凹槽结构开口处的部分栅极绝缘层。
优选的,在衬底基板上形成栅极保护层之前,还包括在衬底基板上形成栅极金属层。
为了更清楚的描述本发明中阵列基板的制备方法,以图2所示阵列基板为例,结合图6至图8详细说明如下:
步骤一,在衬底基板1上依次形成栅极保护层2、有机膜层3和绝缘层4,如图6所示。
具体的,可以根据栅极保护层2、有机膜层3和绝缘层4的具体材质灵活选择合适的制备方法依次在衬底基板1上依次形成栅极保护层2、有机膜层3和绝缘层4。
步骤二,在用于设置封框胶5的位置,通过构图工艺形成凹槽结构6,如图7所示,其中,凹槽结构6在垂直于基板的方向上由绝缘层4向栅极保护层2延伸,并暴露栅极保护层2。具体的,可以根据栅极保护层2、有机膜层3和绝缘层4的具体材质选择合适的构图工艺使凹槽结构由绝缘层4向栅极保护层2延伸,并暴露栅极保护层2。
步骤三,在凹槽结构6的表面设置透明电7极,并使透明电极7覆盖栅极绝缘层4,如图8所示。
参见图9,本发明实施例提供一种显示面板的制备方法,采用本发明实施例提供的阵列基板进行制备,制备方法包括:
901、在阵列基板上的凹槽结构之内设置封框胶;
902、使对向基板和阵列基板通过封框胶粘结。
下面以图2所示的阵列基板为例,对本发明实施例提供的显示面板的制作方法进行如下说明:
步骤一、在阵列基板上的凹槽结构6之内形成封框胶5,参见图10。
具体的,在凹槽结构6形成封框胶5时,使封框胶5与凹槽结构6的侧边具有间隙9。
步骤二、使对向基板8和阵列基板通过封框胶5粘结,形成显示面板,参见图11。
本发明实施例有益效果如下:设置封框胶5的位置形成凹槽结构6,凹槽结构6由绝缘层4向栅极保护层2延伸,封框胶5直接与栅极保护层2粘结,其下方不存在有机膜层3,可以避免有机膜层3在受环境影响时对封框胶5和所粘接的膜层之间粘附力造成影响,使封框胶5保持良好的密封性能。
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。
Claims (11)
1.一种阵列基板,包括衬底基板、依次形成于所述衬底基板之上的栅极保护层、有机膜层和绝缘层,其特征在于,所述阵列基板上形成有用于设置封框胶的凹槽结构,所述凹槽结构在垂直于基板的方向上由所述绝缘层向所述栅极保护层延伸,并暴露栅极保护层;所述凹槽结构的表面设置有透明电极,所述透明电极还覆盖邻近所述凹槽结构开口处的部分所述栅极绝缘层。
2.如权利要求1所述的阵列基板,其特征在于,所述阵列基板还包括设置于所述栅极绝缘层与所述衬底基板之间的栅极金属层。
3.如权利要求1所述的阵列基板,其特征在于,所述透明电极为氧化铟锡。
4.如权利要求1所述的阵列基板,其特征在于,所述凹槽结构设置于所述阵列基板的非显示区内,并环绕所述阵列基板的显示区。
5.一种显示面板,其特征在于,包括如权利要求1至4任一项所述的阵列基板,还包括与所述阵列基板相对设置的对向基板、及设置于所述对向基板与所述阵列基板之间的封框胶;
所述封框胶的一端设置于所述阵列基板的所述凹槽结构之内且端面粘接所述凹槽结构的底部表面,所述封框胶的另一端的端面粘接所述对向基板。
6.如权利要求5所述的显示面板,其特征在于,所述凹槽结构的侧壁与所述封框胶之间具有间隙。
7.如权利要求5所述的显示面板,其特征在于,所述对向基板为彩膜基板或封装基板。
8.一种显示装置,其特征在于,包括权利要求5至7任一项所述的显示面板。
9.一种阵列基板的制备方法,其特征在于,包括:
在衬底基板上依次形成栅极保护层、有机膜层和绝缘层;
在用于设置封框胶的位置,通过构图工艺形成凹槽结构;其中,所述凹槽结构在垂直于基板的方向上由所述绝缘层向所述栅极保护层延伸,并暴露栅极保护层;
还包括在所述凹槽结构的表面设置透明电极,并使所述透明电极覆盖邻近所述凹槽结构开口处的部分所述栅极绝缘层。
10.如权利要求9所述的方法,其特征在于,在所述衬底基板上形成所述栅极保护层之前,还包括在所述衬底基板上形成栅极金属层。
11.一种显示面板的制备方法,其特征在于,采用权利要求1至4任一项所述的阵列基板进行制备,所述制备方法包括:
在所述阵列基板上的所述凹槽结构之内设置封框胶;
使所述对向基板和所述阵列基板通过所述封框胶粘结。
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