CN105516553B - 摄像装置及摄像系统 - Google Patents

摄像装置及摄像系统 Download PDF

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Publication number
CN105516553B
CN105516553B CN201510633722.5A CN201510633722A CN105516553B CN 105516553 B CN105516553 B CN 105516553B CN 201510633722 A CN201510633722 A CN 201510633722A CN 105516553 B CN105516553 B CN 105516553B
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China
Prior art keywords
charge
pixel
mem
photoelectric converter
photographic device
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CN201510633722.5A
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Chinese (zh)
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CN105516553A (zh
Inventor
箕轮雅章
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/186—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors having arrangements for blooming suppression
    • H10F39/1865—Overflow drain structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Exposure Control For Cameras (AREA)
  • Focusing (AREA)
  • Automatic Focus Adjustment (AREA)
CN201510633722.5A 2014-10-07 2015-09-29 摄像装置及摄像系统 Active CN105516553B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014206281A JP6448289B2 (ja) 2014-10-07 2014-10-07 撮像装置及び撮像システム
JP2014-206281 2014-10-07

Publications (2)

Publication Number Publication Date
CN105516553A CN105516553A (zh) 2016-04-20
CN105516553B true CN105516553B (zh) 2019-05-03

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Country Status (3)

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US (1) US20160099268A1 (https=)
JP (1) JP6448289B2 (https=)
CN (1) CN105516553B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6537838B2 (ja) * 2015-01-30 2019-07-03 ルネサスエレクトロニクス株式会社 撮像素子
US9900539B2 (en) 2015-09-10 2018-02-20 Canon Kabushiki Kaisha Solid-state image pickup element, and image pickup system
JP6541523B2 (ja) 2015-09-11 2019-07-10 キヤノン株式会社 撮像装置、撮像システム、および、撮像装置の制御方法
JP6674219B2 (ja) 2015-10-01 2020-04-01 キヤノン株式会社 固体撮像装置及び撮像システム
KR102499854B1 (ko) * 2016-02-25 2023-02-13 주식회사 디비하이텍 격리 구조물 및 이를 포함하는 이미지 센서
KR102515664B1 (ko) * 2016-03-08 2023-03-29 삼성전자주식회사 Led 플리커 완화 기능을 가지는 이미지 센서 및 상기 이미지 센서를 포함하는 이미지 처리 시스템
JP6667431B2 (ja) * 2016-12-27 2020-03-18 キヤノン株式会社 撮像装置、撮像システム
JP2018160485A (ja) * 2017-03-22 2018-10-11 ソニーセミコンダクタソリューションズ株式会社 撮像素子、電子機器
JP2018160558A (ja) * 2017-03-23 2018-10-11 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および電子機器
JP2020017552A (ja) * 2018-07-23 2020-01-30 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
JP2020043413A (ja) * 2018-09-07 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
JP2020088293A (ja) * 2018-11-29 2020-06-04 キヤノン株式会社 光電変換装置、光電変換システム、移動体
CN114205543A (zh) 2020-09-18 2022-03-18 三星电子株式会社 图像传感器
US12495219B2 (en) 2020-09-18 2025-12-09 Samsung Electronics Co., Ltd. Image sensor
JP7534902B2 (ja) 2020-09-23 2024-08-15 キヤノン株式会社 光電変換装置、撮像装置、半導体装置及び光電変換システム
WO2023054230A1 (ja) * 2021-09-29 2023-04-06 株式会社 Rosnes 撮像装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101527311A (zh) * 2008-03-06 2009-09-09 佳能株式会社 图像感测装置和成像系统
CN101552279A (zh) * 2008-04-04 2009-10-07 佳能株式会社 光电转换器件、其设计和制造方法以及成像系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268242A (ja) * 2004-03-16 2005-09-29 Sanyo Electric Co Ltd 撮像装置および撮像装置駆動方法
JP4680552B2 (ja) * 2004-09-02 2011-05-11 富士フイルム株式会社 固体撮像素子の製造方法
JP4742602B2 (ja) * 2005-02-01 2011-08-10 ソニー株式会社 固体撮像装置及びその製造方法
JP4854216B2 (ja) * 2005-04-28 2012-01-18 キヤノン株式会社 撮像装置および撮像システム
JP4710660B2 (ja) * 2006-03-10 2011-06-29 株式会社ニコン 固体撮像素子及びこれを用いた電子カメラ
JP5076528B2 (ja) * 2007-02-06 2012-11-21 株式会社ニコン 光電変換部の連結／分離構造、固体撮像素子及び撮像装置
JP2009278241A (ja) * 2008-05-13 2009-11-26 Canon Inc 固体撮像装置の駆動方法および固体撮像装置
JP5509962B2 (ja) * 2010-03-19 2014-06-04 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
CN102222678A (zh) * 2011-06-22 2011-10-19 格科微电子（上海）有限公司 Cmos图像传感器及其形成方法
JP6172888B2 (ja) * 2012-01-18 2017-08-02 キヤノン株式会社 撮像装置および撮像システム
JP2013172210A (ja) * 2012-02-17 2013-09-02 Canon Inc 撮像装置
US9554115B2 (en) * 2012-02-27 2017-01-24 Semiconductor Components Industries, Llc Imaging pixels with depth sensing capabilities

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101527311A (zh) * 2008-03-06 2009-09-09 佳能株式会社 图像感测装置和成像系统
CN101552279A (zh) * 2008-04-04 2009-10-07 佳能株式会社 光电转换器件、其设计和制造方法以及成像系统

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JP2016076832A (ja) 2016-05-12
JP6448289B2 (ja) 2019-01-09
CN105516553A (zh) 2016-04-20
US20160099268A1 (en) 2016-04-07

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