CN105473930B - Led模块 - Google Patents
Led模块 Download PDFInfo
- Publication number
- CN105473930B CN105473930B CN201480046784.XA CN201480046784A CN105473930B CN 105473930 B CN105473930 B CN 105473930B CN 201480046784 A CN201480046784 A CN 201480046784A CN 105473930 B CN105473930 B CN 105473930B
- Authority
- CN
- China
- Prior art keywords
- trace
- base portion
- led
- light
- flange connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000011253 protective coating Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000010287 polarization Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- -1 and in most cases Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361869367P | 2013-08-23 | 2013-08-23 | |
US61/869,367 | 2013-08-23 | ||
PCT/US2014/052336 WO2015027180A1 (fr) | 2013-08-23 | 2014-08-22 | Module de del |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105473930A CN105473930A (zh) | 2016-04-06 |
CN105473930B true CN105473930B (zh) | 2019-03-19 |
Family
ID=52484200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480046784.XA Expired - Fee Related CN105473930B (zh) | 2013-08-23 | 2014-08-22 | Led模块 |
Country Status (6)
Country | Link |
---|---|
US (3) | US9829159B2 (fr) |
EP (1) | EP3036473B1 (fr) |
JP (1) | JP6348595B2 (fr) |
CN (1) | CN105473930B (fr) |
TW (1) | TWM500362U (fr) |
WO (1) | WO2015027180A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3036473B1 (fr) * | 2013-08-23 | 2021-06-02 | Molex, LLC | Module de del |
US10663142B2 (en) * | 2014-03-31 | 2020-05-26 | Bridgelux Inc. | Light-emitting device with reflective ceramic substrate |
TW201631808A (zh) * | 2015-02-25 | 2016-09-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
KR102143400B1 (ko) | 2015-06-29 | 2020-08-11 | 몰렉스 엘엘씨 | 애플리케이션 특정 전자기기 패키징 시스템, 방법 및 디바이스 |
JP6880855B2 (ja) * | 2016-05-17 | 2021-06-02 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
US10596388B2 (en) | 2016-09-21 | 2020-03-24 | Epistar Corporation | Therapeutic light-emitting module |
KR102201820B1 (ko) * | 2019-01-30 | 2021-01-12 | 주식회사 창성시트 | 디스플레이 기판 |
US10753583B1 (en) * | 2019-02-26 | 2020-08-25 | PureEdge Lighting LLC | Angled LED strip connector |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007044472A2 (fr) * | 2005-10-07 | 2007-04-19 | Osram Sylvania Inc. | Del à dissipateur thermique transmetteur de lumière |
WO2011078217A1 (fr) * | 2009-12-25 | 2011-06-30 | 株式会社小糸製作所 | Unité de source de lumière, et luminaire pour véhicule |
Family Cites Families (27)
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US6215184B1 (en) * | 1998-02-19 | 2001-04-10 | Texas Instruments Incorporated | Optimized circuit design layout for high performance ball grid array packages |
JPWO2003030274A1 (ja) | 2001-09-27 | 2005-01-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
EP1590994B1 (fr) * | 2003-02-07 | 2016-05-18 | Panasonic Intellectual Property Management Co., Ltd. | Panneau de cablage à base métallique pour la retenue d'éléments électroluminescents, source électroluminescente, appareil d'éclairage, et appareil d'affichage |
JP4410721B2 (ja) | 2005-05-02 | 2010-02-03 | シチズン電子株式会社 | バルブ型led光源 |
US8661660B2 (en) * | 2005-09-22 | 2014-03-04 | The Artak Ter-Hovhanissian Patent Trust | Process for manufacturing LED lighting with integrated heat sink |
US7811842B2 (en) * | 2007-01-11 | 2010-10-12 | SemiLEDs Optoelectronics Co., Ltd. | LED array |
JP5145895B2 (ja) * | 2007-07-04 | 2013-02-20 | 東芝ライテック株式会社 | 照明装置 |
DE102007046639A1 (de) * | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Dreidimensionale bestückte elektrische Leiterplattenanordnungen, insbesondere LED-Beleuchtungseinrichtungen, und Verfahren zu deren Herstellung |
US8415703B2 (en) * | 2008-03-25 | 2013-04-09 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
JP2009301795A (ja) * | 2008-06-11 | 2009-12-24 | Fujifilm Corp | 照明装置および照明装置の製造方法 |
US7887384B2 (en) * | 2008-09-26 | 2011-02-15 | Bridgelux, Inc. | Transparent ring LED assembly |
US20100226139A1 (en) | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
JP5376404B2 (ja) * | 2009-09-09 | 2013-12-25 | 東芝ライテック株式会社 | 発光装置 |
JP2011216868A (ja) * | 2010-03-16 | 2011-10-27 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2011238802A (ja) | 2010-05-11 | 2011-11-24 | Panasonic Corp | 発光モジュール及びこれを備えた照明装置 |
JP2012084327A (ja) * | 2010-10-08 | 2012-04-26 | Sharp Corp | 照明装置及び液晶表示装置 |
JP4914998B1 (ja) * | 2010-11-17 | 2012-04-11 | 国立大学法人九州工業大学 | Ledモジュール装置及びその製造方法 |
WO2012090356A1 (fr) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | Dispositif électroluminescent, module électroluminescent et lampe |
JP5665184B2 (ja) * | 2011-01-14 | 2015-02-04 | 株式会社小糸製作所 | 照明装置 |
JP4887529B1 (ja) * | 2011-04-12 | 2012-02-29 | 国立大学法人九州工業大学 | Ledパッケージの製造方法 |
US20130051018A1 (en) * | 2011-08-23 | 2013-02-28 | Tyco Electronics Corporation | Metal clad circuit board |
JP5730711B2 (ja) * | 2011-08-25 | 2015-06-10 | シャープ株式会社 | 発光装置 |
EP2581469B1 (fr) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Solution d'activation aqueuse et procédé pour le dépôt autocatalytique de cuivre sur des substrats structurés directement par laser |
JP2013128013A (ja) * | 2011-12-16 | 2013-06-27 | Panasonic Corp | 立体回路基板の製造方法、立体回路基板、近接センサ及び発光装置 |
US20130161670A1 (en) * | 2011-12-23 | 2013-06-27 | Sheng-Yang Peng | Light emitting diode packages and methods of making |
US9170002B2 (en) | 2012-01-05 | 2015-10-27 | Molex, Llc | Holder and LED module using same |
EP3036473B1 (fr) * | 2013-08-23 | 2021-06-02 | Molex, LLC | Module de del |
-
2014
- 2014-08-22 EP EP14837781.5A patent/EP3036473B1/fr active Active
- 2014-08-22 WO PCT/US2014/052336 patent/WO2015027180A1/fr active Application Filing
- 2014-08-22 CN CN201480046784.XA patent/CN105473930B/zh not_active Expired - Fee Related
- 2014-08-22 JP JP2016536487A patent/JP6348595B2/ja not_active Expired - Fee Related
- 2014-08-22 US US14/913,627 patent/US9829159B2/en active Active
- 2014-08-25 TW TW103215158U patent/TWM500362U/zh not_active IP Right Cessation
-
2017
- 2017-11-27 US US15/822,574 patent/US10100982B2/en not_active Expired - Fee Related
-
2018
- 2018-10-12 US US16/158,988 patent/US10393320B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007044472A2 (fr) * | 2005-10-07 | 2007-04-19 | Osram Sylvania Inc. | Del à dissipateur thermique transmetteur de lumière |
WO2011078217A1 (fr) * | 2009-12-25 | 2011-06-30 | 株式会社小糸製作所 | Unité de source de lumière, et luminaire pour véhicule |
Also Published As
Publication number | Publication date |
---|---|
US9829159B2 (en) | 2017-11-28 |
US20190049072A1 (en) | 2019-02-14 |
EP3036473A1 (fr) | 2016-06-29 |
US20180080610A1 (en) | 2018-03-22 |
US10100982B2 (en) | 2018-10-16 |
JP6348595B2 (ja) | 2018-06-27 |
TWM500362U (zh) | 2015-05-01 |
CN105473930A (zh) | 2016-04-06 |
US20160208987A1 (en) | 2016-07-21 |
EP3036473A4 (fr) | 2017-07-26 |
WO2015027180A1 (fr) | 2015-02-26 |
EP3036473B1 (fr) | 2021-06-02 |
JP2016528745A (ja) | 2016-09-15 |
US10393320B2 (en) | 2019-08-27 |
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