CN105466625B - 物理量测量装置 - Google Patents

物理量测量装置 Download PDF

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Publication number
CN105466625B
CN105466625B CN201510619871.6A CN201510619871A CN105466625B CN 105466625 B CN105466625 B CN 105466625B CN 201510619871 A CN201510619871 A CN 201510619871A CN 105466625 B CN105466625 B CN 105466625B
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China
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mentioned
connector
cylindrical portion
flat surface
sensor module
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CN201510619871.6A
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English (en)
Chinese (zh)
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CN105466625A (zh
Inventor
远山秀司
山岸信贵
山下直树
绿川祐介
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Nagano Keiki Co Ltd
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Nagano Keiki Co Ltd
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Priority to CN201911295112.3A priority Critical patent/CN110926691B/zh
Publication of CN105466625A publication Critical patent/CN105466625A/zh
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0044Constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
CN201510619871.6A 2014-09-30 2015-09-25 物理量测量装置 Active CN105466625B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911295112.3A CN110926691B (zh) 2014-09-30 2015-09-25 物理量测量装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-201516 2014-09-30
JP2014201516A JP6301230B2 (ja) 2014-09-30 2014-09-30 物理量測定装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201911295112.3A Division CN110926691B (zh) 2014-09-30 2015-09-25 物理量测量装置

Publications (2)

Publication Number Publication Date
CN105466625A CN105466625A (zh) 2016-04-06
CN105466625B true CN105466625B (zh) 2019-12-03

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CN201510619871.6A Active CN105466625B (zh) 2014-09-30 2015-09-25 物理量测量装置
CN201911295112.3A Active CN110926691B (zh) 2014-09-30 2015-09-25 物理量测量装置

Family Applications After (1)

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CN201911295112.3A Active CN110926691B (zh) 2014-09-30 2015-09-25 物理量测量装置

Country Status (6)

Country Link
US (1) US9631991B2 (https=)
EP (2) EP3581905B1 (https=)
JP (1) JP6301230B2 (https=)
KR (1) KR102366689B1 (https=)
CN (2) CN105466625B (https=)
ES (2) ES2835649T3 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20120456A1 (it) * 2012-03-23 2013-09-24 Microtel Tecnologie Elettroniche S P A Sensore di pressione ceramico e relativo metodo di produzione, e trasduttore che incorpora un sensore di pressione ceramico
WO2015151269A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 電気機器の絶縁支持物
JP6283307B2 (ja) * 2014-12-24 2018-02-21 長野計器株式会社 物理量測定装置
JP6480375B2 (ja) * 2016-04-07 2019-03-06 長野計器株式会社 圧力センサ
JP2018021608A (ja) * 2016-08-03 2018-02-08 日本電産トーソク株式会社 センサ取付け構造
DE102017213894A1 (de) * 2017-08-09 2019-02-14 Ifm Electronic Gmbh Messgerät zur Messung des Drucks eines Mediums in einem Behältnis und kapazitive Druckmesszelle
IT201700103447A1 (it) * 2017-09-15 2019-03-15 Kolektor Microtel S P A Sensore di pressione ceramico
JP6841794B2 (ja) * 2018-06-26 2021-03-10 長野計器株式会社 物理量測定装置及び物理量測定装置の製造方法
JP6964063B2 (ja) * 2018-11-28 2021-11-10 長野計器株式会社 センサアッシーおよび物理量測定装置
JP7105492B2 (ja) * 2019-02-25 2022-07-25 ヤマシンフィルタ株式会社 差圧検出装置
JP7005550B2 (ja) * 2019-03-29 2022-01-21 長野計器株式会社 物理量測定装置および物理量測定装置の製造方法
KR102274093B1 (ko) * 2019-12-16 2021-07-07 주식회사 현대케피코 온도-압력 디지털 센서 측정장치
CN114636513B (zh) * 2020-12-15 2025-12-02 浙江三花汽车零部件有限公司 传感器组件以及阀装置
KR102564528B1 (ko) * 2021-01-23 2023-08-09 대양전기공업 주식회사 온도 센서가 구비된 압력 센서 유닛
EP4515195A4 (en) * 2022-04-26 2026-03-18 Autonics Corp SENSOR MODULE

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4215722A1 (de) * 1992-05-13 1993-11-25 Bosch Gmbh Robert Membran mit einem Rahmen zur Verwendung in einem Sensor und Verfahren zu deren Herstellung
JPH1114485A (ja) * 1997-06-24 1999-01-22 Fuji Koki Corp 圧力センサ
US5948989A (en) * 1997-08-29 1999-09-07 Mitsubishi Denki Kabushiki Kaisha Pressure sensor device
JP2002236070A (ja) * 2001-02-07 2002-08-23 Tgk Co Ltd 圧力センサ
JP2006258471A (ja) * 2005-03-15 2006-09-28 Denso Corp 圧力センサ
EP2078940A2 (en) * 2008-01-10 2009-07-15 Sensata Technologies, Inc. Combined fluid pressure and temperature sensor apparatus
CN102124313A (zh) * 2008-06-19 2011-07-13 埃尔特克有限公司 压力传感器装置
CN103512683A (zh) * 2012-06-27 2014-01-15 大陆汽车系统公司 用于最小化热噪声的具有阶梯式空腔的压力传感器件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583295A (en) 1994-03-14 1996-12-10 Nippondenso Co., Ltd. Pressure sensor having gauge resistors and temperature compensating resistors on the same surface
US5974893A (en) 1997-07-24 1999-11-02 Texas Instruments Incorporated Combined pressure responsive transducer and temperature sensor apparatus
EP1118849B1 (en) 2000-01-18 2002-08-14 Denso Corporation High-pressure sensor with one or two threaded stems bearing multi-pad sensor chips
CN1209609C (zh) * 2003-07-31 2005-07-06 西安交通大学 固态压阻式耐高温压力传感器及其制备方法
US6945118B2 (en) 2004-01-13 2005-09-20 Honeywell International Inc. Ceramic on metal pressure transducer
JP2006078379A (ja) 2004-09-10 2006-03-23 Tgk Co Ltd 圧力センサおよびその製造方法
US7762140B2 (en) * 2008-01-10 2010-07-27 Sensata Technologies, Inc. Combined fluid pressure and temperature sensor apparatus
EP2395336B1 (en) 2010-06-08 2018-08-01 Sensata Technologies, Inc. Hermetically sealed pressure sensing device
JP2013124947A (ja) * 2011-12-15 2013-06-24 Panasonic Corp 半導体圧力センサ
CN105452830B (zh) * 2013-03-15 2018-02-16 测量有限公司 低剖面压力传感器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4215722A1 (de) * 1992-05-13 1993-11-25 Bosch Gmbh Robert Membran mit einem Rahmen zur Verwendung in einem Sensor und Verfahren zu deren Herstellung
JPH1114485A (ja) * 1997-06-24 1999-01-22 Fuji Koki Corp 圧力センサ
US5948989A (en) * 1997-08-29 1999-09-07 Mitsubishi Denki Kabushiki Kaisha Pressure sensor device
JP2002236070A (ja) * 2001-02-07 2002-08-23 Tgk Co Ltd 圧力センサ
JP2006258471A (ja) * 2005-03-15 2006-09-28 Denso Corp 圧力センサ
EP2078940A2 (en) * 2008-01-10 2009-07-15 Sensata Technologies, Inc. Combined fluid pressure and temperature sensor apparatus
CN102124313A (zh) * 2008-06-19 2011-07-13 埃尔特克有限公司 压力传感器装置
CN103512683A (zh) * 2012-06-27 2014-01-15 大陆汽车系统公司 用于最小化热噪声的具有阶梯式空腔的压力传感器件

Also Published As

Publication number Publication date
EP3002572B1 (en) 2019-09-18
US20160091377A1 (en) 2016-03-31
KR20160038775A (ko) 2016-04-07
CN105466625A (zh) 2016-04-06
EP3581905A1 (en) 2019-12-18
KR102366689B1 (ko) 2022-02-22
ES2835649T3 (es) 2021-06-22
EP3002572A2 (en) 2016-04-06
ES2750561T3 (es) 2020-03-26
CN110926691B (zh) 2021-12-31
CN110926691A (zh) 2020-03-27
JP2016070813A (ja) 2016-05-09
EP3002572A3 (en) 2016-06-29
US9631991B2 (en) 2017-04-25
EP3581905B1 (en) 2020-10-28
JP6301230B2 (ja) 2018-03-28

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