CN105448781A - Chip heating and bonding device - Google Patents
Chip heating and bonding device Download PDFInfo
- Publication number
- CN105448781A CN105448781A CN201510915928.7A CN201510915928A CN105448781A CN 105448781 A CN105448781 A CN 105448781A CN 201510915928 A CN201510915928 A CN 201510915928A CN 105448781 A CN105448781 A CN 105448781A
- Authority
- CN
- China
- Prior art keywords
- chip
- gas passage
- transmission mechanism
- stopping means
- cavity structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a chip heating and bonding device, which comprises an operation platform, a transmission mechanism, a limiting device, a drive device, a vacuum adsorption device and a control device, wherein the operation platform is used for bearing a chip and heating the chip; the operation platform is fixed at one end of the transmission mechanism; the other end of the transmission mechanism is arranged in the limiting device in a penetrating manner; the drive device is arranged on the limiting device; the drive device can drive the transmission mechanism to move in the limiting device; a gas channel of the vacuum adsorption device is communicated with the operation platform through the transmission mechanism; the vacuum adsorption device can provide adsorption force and blowback force to the chip; the control device comprises a temperature control unit and a control unit; the temperature control unit for monitoring a real-time temperature of the operation platform is connected with the operation platform; and a control unit for controlling a working state of the drive device is connected with the drive device. The chip heating and bonding device has heating and motion control functions and has stable pickup force and bonding force; and the technological adaptability is improved.
Description
Technical field
The present invention relates to semiconductor manufacturing or process field, particularly relate to a kind of chip and add thermal linking device.
Background technology
Along with developing rapidly of electronic information technology, the trend development that electronic product is just little towards volume, integration degree is high, function is complicated, reliability is high, thus make advanced encapsulation and interconnection technique replace conventional packaging techniques.Advanced Packaging in conjunction with semiconductor packages and packaging technology to reach the object improving packaging efficiency, reduce packaging cost, improve device performance.Back bonding technology makes the market demand of flip chip semiconductor package just increase rapidly with its feature such as high density and small size.Flip-chip is not only a kind of high-density chip interconnections technology, or a kind of desirable die bonding technology, is obtained for and applies widely in PGA, BGA and CSP.The interconnection line of flip-chip is very short, and I/O exit distributes whole chip surface, and flip-chip industry is applicable to using the technological means of SMT to produce in batches simultaneously, and therefore flip-chip has become the main development direction of High Density Packaging Technology.
Flip-chip bonding is picked up from blue film by the chip with salient point and overturns, and makes its pad patterns down, be placed on base material by Machine Vision Recognition to brigadier's chip.Reverse chip key binder decides the precision of flip-chip bonding, efficiency and reliability, be the key equipment in Flip-Chip Using field, wherein bonding apparatus reverse chip key binder realizes chip from blue film pickup and by machine vision by high-precision for the chip critical component be positioned on base material.
In the last few years, the development of back bonding encapsulation technology was accelerated gradually, and this has following typical feature with regard to requiring the bonding apparatus on reverse chip key binder to need:
1, response speed quickly, has the ability controlling pickup force simultaneously, thus be unlikely to chip of damaging in the process from blue film pick-up chip;
2, complicated and changeable due to packaging technology, need bonding apparatus possess chip heating and provide the several functions such as rigid support, meet with this, after pick-up chip blue film, related process process is carried out as planted ball at chip bump or carrying out the operations such as wire bonding to chip to chip;
3, due to the raising of back bonding precision, bonding apparatus need have compact conformation, integral rigidity high.
Conventional keys locking device, do not possess for chip heating function, packaging technology requirement complicated and changeable cannot be adapted to, and the pickup force of conventional keys locking device and bonding force are by regulating the control of air pressure, the fluctuation of bleed pressure can pass to pickup force and bonding force, cause pickup force and bonding force to drift about, cannot ensure to stablize and consistent pickup force and bonding force.In addition, the nozzle head of conventional keys locking device only can be moved along a direction, and can not move in the other direction along it, and namely stretching motion is uncontrollable.
Summary of the invention
The invention provides a kind of chip and add thermal linking device, solve traditional bonding apparatus and do not possess heating function, stretching motion is uncontrollable, and the problem of bonding force and pickup force instability.
According to one aspect of the present invention, provide a kind of chip and add thermal linking device, comprising:
Carries chips is also the operating platform of its heating;
Transmission mechanism, operating platform is fixed on one end of transmission mechanism;
Stopping means, the other end of transmission mechanism is arranged in stopping means;
Drive unit, is arranged on stopping means, and drive unit can move back and forth by drive transmission device in stopping means;
Vacuum absorption device, the gas passage of vacuum absorption device is communicated to operating platform via transmission mechanism, and vacuum absorption device can provide absorption affinity and blowback power to chip; And,
Control device, comprising: temperature conditioning unit and control unit, and wherein, the temperature conditioning unit of monitoring operating platform real time temperature is connected with operating platform, and the control unit of accessory drive operating state is connected with drive unit.
Alternatively, operating platform comprises:
The nozzle head of carries chips, nozzle head is provided with the first gas passage;
For the heat block of chip heating, heat block is provided with the second gas passage, and one end of nozzle head is arranged in the second gas passage, and the first gas passage is communicated with the second gas passage; And,
Multiple regulating spring, one end of regulating spring is fixed on heat block, and the other end of regulating spring is fixed on stopping means.
Alternatively, heat block comprises at least one dismountable heating rod, and detects the temperature sensor of heating rod temperature; Wherein, heating rod is connected with temperature conditioning unit respectively with temperature sensor.
Alternatively, one end that regulating spring is connected with heat block is provided with an adjustment screw, by the decrement regulating adjustment screw to regulate regulating spring.
Alternatively, transmission mechanism is a splined shaft, splined shaft offers the 3rd gas passage, and wherein, one end of splined shaft is fixed on heat block, and the 3rd gas passage is connected with the second gas passage.
Alternatively, stopping means comprises:
The first cavity structure in axial direction arranged, splined shaft is arranged in the first cavity structure relative to one end of heat block, and splined shaft can move in the first cavity structure;
For limiting the guide vane end stop of splined shaft displacement; And,
The second cavity structure radially arranged, one end of vacuum absorption device is arranged in the second cavity structure.
Alternatively, the end of the first cavity structure is provided with the spline tooth be meshed with splined shaft, and splined shaft rotates in the first cavity structure by spline fitted.
Alternatively, drive unit comprises:
For transmission mechanism provides the solenoid of rectilinear motion power, solenoid is arranged on stopping means around the first cavity structure, and solenoid is connected with control unit; And,
For transmission mechanism provides the electric rotating machine of rotary power, be connected with stopping means by flange.
Alternatively, vacuum absorption device comprises:
Vacuum generator and air compressor; And,
Tracheae, one end of tracheae is connected with air compressor with vacuum generator by electromagnetically operated valve; The other end of tracheae is arranged in the second cavity structure, and the gas passage of tracheae is connected with the 3rd gas passage.
The beneficial effect of embodiments of the invention is:
Chip of the present invention adds thermal linking device, by operating platform carries chips and to its heating, packaging technology requirement complicated and changeable can be adapted to, improve its Technological adaptability.Operating platform common reciprocal is driven to move at the effect lower transmission mechanism of drive unit, realize the stretching motion controllability of operating platform, be convenient to pickup and the bonding of chip, under the Real-Time Monitoring of this external control device, operating platform is stablized controlled to the pickup force of chip and bonding force, improves its performance accuracy.
Accompanying drawing explanation
Fig. 1 represents that chip of the present invention adds the structural representation one of thermal linking device;
Fig. 2 represents that chip of the present invention adds the structural representation two of thermal linking device;
Fig. 3 represents partial exploded view in Fig. 2 of the present invention.
Wherein in figure: 1, chip, 2, operating platform, 3, transmission mechanism, 4, stopping means, 5, drive unit, 6, vacuum absorption device, 7, control device;
21, nozzle head, 22, heat block, 23, regulating spring, 24, adjustment screw;
41, the first cavity structure, 42, guide vane end stop, the 43, second cavity structure;
51, solenoid, 52, electric rotating machine;
61, vacuum generator, 62, air compressor, 63, tracheae;
71, temperature conditioning unit, 72, control unit;
221, heating rod, 222, temperature sensor.
Embodiment
Below with reference to accompanying drawings exemplary embodiment of the present invention is described in more detail.Although show exemplary embodiment of the present invention in accompanying drawing, however should be appreciated that can realize the present invention in a variety of manners and not should limit by the embodiment set forth here.On the contrary, provide these embodiments to be in order to more thoroughly the present invention can be understood, and complete for scope of the present invention can be conveyed to those skilled in the art.
Embodiment one
As shown in Figure 1, The embodiment provides a kind of chip and add thermal linking device, specifically comprise: for the operating platform 2 of carries chips 1, transmission mechanism 3, stopping means 4, drive unit 5, vacuum absorption device 6 and control device 7.
Wherein, the Main Function of operating platform 2 is for chip 1 provides a carrying platform, pick up and bonding by this operating platform 2 pairs of chips 1, in addition operating platform 2 also possesses heating function, chip 1 surface metal-layer can be increased active by heating, for the correlated activation (planting ball, wire bonding etc.) carried out for chip lays the foundation, thus make the operation of chip 1 can adapt to different packaging environments and technological requirement, improve the Technological adaptability of whole device.
Operating platform 2 is fixed on one end of transmission mechanism 3, and the Main Function of transmission mechanism 3 drives operating platform 2 to move back and forth, such controllable operation platform in different sequential for chip 1 provides different operating positions, to adapt to different operational requirements.
The other end of transmission device 3 is arranged in stopping means 4, and can move back and forth in stopping means 4; Stopping means 4 is for providing reliable limited support for operating platform 2, when transmission mechanism 3 moves to the diverse location of transmission device 3, stopping means 3 provides the support of otherwise limit position for operating platform 2, such as: when pick-up chip 1, transmission mechanism 3 is needed to drive operating platform 2 to eject in stopping means 4, so that the pickup to chip 1; And when needs carry out relevant treatment to chip 1, need to provide a secure support for it, transmission mechanism 3 drives operating platform 2 to be contracted to and abuts against with stopping means 4, utilizes stopping means 4 to provide a stable rigid support for operating platform 2.
Drive unit 5 is arranged on stopping means 4, for providing actuating force for transmission mechanism 3, such as: drive transmission device 3 does linear reciprocation and moves in stopping means 4, to adjust chip 1 height, or drive transmission device 3 rotates in stopping means 4, to finely tune chip 1 angle.
Vacuum absorption device 6 is for providing absorption affinity and blowback power for chip 1, and the gas passage of vacuum absorption device 6 is communicated to operating platform 2 via transmission mechanism 3, adsorbs chip 1 or blowback chip 1 by operating platform 2.
For ensureing the intelligent of whole device and stability, control device 7 is for according to current chip 1 processing demands and instantaneous operating conditions dynamic conditioning operating platform 2, drive unit 5 or vacuum absorption device 6.Wherein, control device 7 at least comprises temperature conditioning unit 71 and control unit 72, and particularly, temperature conditioning unit 71 is connected with operating platform 2, for monitoring and adjust the real time temperature of operating platform; Control unit 72 is connected with drive unit 5, for the operating state of accessory drive 5.
The chip that the embodiment of the present invention one provides adds thermal linking device, by operating platform 2 carries chips 1 and to its heating, packaging technology requirement complicated and changeable can be adapted to, improve its Technological adaptability.Operating platform 2 is driven jointly to move back and forth in stopping means 4 at the effect lower transmission mechanism 3 of drive unit 5, realize the stretching motion controllability of operating platform 2, be convenient to pickup and the bonding of chip 1, under the Real-Time Monitoring of this external control device 7, the heating-up temperature of operating platform 2 pairs of chips 1, pickup force and bonding force are stablized controlled, improve its performance accuracy.
Embodiment two
Above embodiment one simply describes the matching relationship between all parts that chip of the present invention adds thermal linking device, is described further below in conjunction with embody rule scene.
Particularly, as shown in Figure 1 to Figure 3, operating platform 2 specifically comprises: the nozzle head 21 of carries chips 1, is the heat block 22 that chip 1 heats, and multiple regulating spring 23.Wherein, nozzle head 21 is fixed on heat block 22 by the magnetive attraction of multiple magnet be installed in heat block 22.Wherein, nozzle head 21 is provided with the first gas passage, heat block 22 is provided with the second gas passage, one end of nozzle head 21 is arranged in the second gas passage, and the first gas passage is connected with the second gas passage, the gas passage of vacuum absorption device 6 via the second gas passage and the first gas passage for chip 1 provides absorption affinity or blowback power.One end of regulating spring 23 is fixed on heat block 22, and particularly, regulating spring 23 is fixed on heat block 22 by bearing lock nut; The other end of regulating spring 23 is fixed on stopping means 4, when regulating spring 23 is in different conditions, nozzle head 21 is in different operating positions, when when pick-up chip 1, under the effect of the compression and back elastic force of regulating spring 23, heat block 22 ejects in stopping means 4, so that the pickup to chip 1; And when needs carry out relevant treatment to chip 1, need for it provides a secure support, transmission mechanism 3 drives heat block 2 to shrink, extreme position is compressed to make regulating spring 23, to make heat block 22 and stopping means 4 abut against, stopping means 4 is utilized to provide a stable rigid support for heat block 22 and nozzle head 21.
Wherein, heat block 22 comprises at least one dismountable heating rod 221, and detect the temperature sensor 222 of heating rod 221 temperature, heating rod 221 and temperature sensor 222 are fixed respectively by screw, and a heating rod 221 stablizes controlled heating-up temperature for thermal source coordinates temperature sensor 21 to provide; Wherein, heating rod 221 is connected with temperature conditioning unit 71 respectively with temperature sensor 222.When in the process that heating rod 221 heats for chip, temperature is higher than temperature required most high threshold, the temperature information collected is fed back to temperature conditioning unit 71 by temperature sensor 222, and under the control of temperature conditioning unit 71, reduce the heating-up temperature of heating rod 221; And when in the process that heating rod 221 heats for chip, temperature is lower than temperature required minimum threshold, the temperature information collected is fed back to temperature conditioning unit 71 by temperature sensor 222, and under the control of temperature conditioning unit 71, improve the heating-up temperature of heating rod 221, to realize the closed-loop control to chip 1 operating temperature, ensure stability and the controllability of whole processing procedure.
Further, one end that regulating spring 23 is connected with heat block 22 is provided with an adjustment screw 24, can regulate the decrement of regulating spring 23 by regulating this adjustment screw 24, thus regulating spring 23 is pressed in bearing nut that heat block 22 is connected with regulating spring 23, when adjustment screw 24 screws, the compression quantitative change of regulating spring 23 is large, when adjustment screw 24 unscrews, the decrement of regulating spring 23 can be made to diminish.Regulated by the decrement of regulating spring 23, the resilience force size of adjustable heat block 22 and nozzle head 21.
As shown in Figure 2, transmission mechanism 3 is specially a splined shaft, this splined shaft offers the 3rd gas passage, wherein, one end of splined shaft is fixed on heat block 22, and concrete heat block 22 is fixed by screw and splined shaft, and the 3rd gas passage is connected with the second gas passage.
Stopping means 4 specifically comprises:
The first cavity structure 41 in axial direction arranged, splined shaft is arranged in this first cavity structure relative to one end of heat block 22, and splined shaft can move in the first cavity structure;
For limiting the guide vane end stop 42 of splined shaft displacement, wherein, when ejecting certain displacement under the resilience force effect of heat block 22 at regulating spring 23, the shaft shoulder of splined shaft contacts with guide vane end stop 42, the ejection displacement of restriction heat block 22, when heat block 22 bounces back to stopping means 4 under the induced effect of transmission mechanism 3, when heat block 22 abuts with stopping means 4, the body of stopping means 4 or be called the advanced position of pressure cylinder restriction heat block 22; And,
The second cavity structure 43 radially arranged, one end of vacuum absorption device 6 is arranged in the second cavity structure 43, the gas passage of vacuum absorption device 6 is communicated with the 3rd gas passage of splined shaft by the second cavity structure 43, then provides absorption affinity and blowback power via the second gas passage and the first gas passage to chip 1.
In order to finely tune the process angle of chip 1, the end of the first cavity structure 41 is provided with the spline tooth be meshed with splined shaft, splined shaft rotates in the first cavity structure by the mode of spline fitted.When splined shaft is under the effect of drive unit 5, when driving heat block 22 to move to the extreme position of regulating spring 23, the spline of splined shaft contacts with the spline tooth in the first cavity structure 41 and engages, when needing the process angle of finely tuning chip 1, realize the rotation of whole operating platform 2 and transmission mechanism 3 by spline fitted mode.
And provide the drive unit 5 of actuating force specifically to comprise for transmission mechanism: be arranged at the solenoid 51 on stopping means 4 around the first cavity structure 41, wherein this solenoid 51 is connected with control unit 72.Particularly, solenoid 51 is fixed on stopping means 4 by holding screw.When needs pick-up chip 1, the power-off of control unit 72 pairs of solenoids 51, under the resilience force effect of regulating spring 23, heat block 22 drives nozzle head 21 to move to the direction away from stopping means 4, with pick-up chip 1; When needing to carry out correlated activation to the chip 1 of pickup, need for chip 1 provides a stable rigid support, at this moment control unit 72 pairs of solenoids 51 are energized, the elastic force that heat block 22 overcomes regulating spring 23 under the electromagnetic attraction effect of solenoid 51 moves to the direction near stopping means 4, until abut against with stopping means 4, by the rigid support of stopping means 4 pairs of heat blocks 22 and nozzle head 21, for chip 1 provides reliable and stable processing platform.It is worthy of note that nozzle head 21, heat block 22 and transmission mechanism 3 are relative immobilizing, when nozzle head 21 and heat block 22 eject, transmission mechanism 3 also ejects thereupon, and when nozzle head 21 and heat block 22 bounce back, transmission mechanism 3 also bounces back thereupon.
Drive unit 5 except comprise above-mentioned mention provide the solenoid 51 of rectilinear motion power, this drive unit 5 also to comprise for transmission mechanism 3 provides the electric rotating machine 52 of rotary power for nozzle head 21, heat block 22 and transmission mechanism 3.Wherein, electric rotating machine 52 is fixed on stopping means 4 one end relative to heat block 22 by flange, this electric rotating machine 52 is connected with transmission mechanism 3, under the revolving force effect of electric rotating machine 52, can drive transmission mechanism 3, heat block 22 and nozzle head 21 that angle occurs to rotate, thus realize the angle adjustment of chip 1, be convenient to carry out correlated activation to chip 1 more accurately.
Alternatively, vacuum absorption device 6 is for providing absorption affinity and blowback power for chip 1, and particularly, vacuum absorption device 6 comprises: vacuum generator 61, air compressor 62 and tracheae 63, wherein, one end of tracheae 63 is connected with air compressor 62 with vacuum generator 61 by electromagnetically operated valve; The other end of tracheae 63 is arranged in the second cavity structure 43, and the gas passage of tracheae 63 is connected with the 3rd gas passage.When electromagnetically operated valve gating vacuum generator 61 and tracheae 63, the gas passage of gas in whole device by the first gas passage, the second gas passage, the 3rd gas passage and tracheae 63 is extracted out by vacuum generator 61, such chip 1 is the tight pressing with nozzle head 21 under atmospheric pressure effect, for chip provides stable pull of vacuum; When electromagnetically operated valve gating air compressor 62 and tracheae 63, the air that air compressor 62 produces through the gas passage of tracheae 63, the 3rd gas passage, the second gas passage and the first gas passage be the inflation of whole device, when device internal gas pressure is greater than external atmosphere pressure, chip 1 is departed from by blowback and nozzle head 21.
To sum up, the chip that the embodiment of the present invention provides adds thermal linking device, by operating platform carries chips and to its heating, packaging technology requirement complicated and changeable can be adapted to, improve its Technological adaptability.Operating platform common reciprocal is driven to move at the effect lower transmission mechanism of drive unit, realize the stretching motion controllability of operating platform, be convenient to pickup and the bonding of chip, under the Real-Time Monitoring of this external control device, operating platform is stablized controlled to the pickup force of chip and bonding force, improves its performance accuracy.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; can also make some improvements and modifications not departing under principle prerequisite of the present invention, these improvements and modifications are also in protection scope of the present invention.
Claims (9)
1. chip adds a thermal linking device, it is characterized in that, comprising:
Carries chips (1) and be its heating operating platform (2);
Transmission mechanism (3), described operating platform (2) is fixed on one end of described transmission mechanism (3);
Stopping means (4), the other end of described transmission mechanism (3) is arranged in described stopping means (4);
Drive unit (5), is arranged on described stopping means (4), and described drive unit (5) can drive described transmission mechanism (3) to move back and forth in described stopping means (4);
Vacuum absorption device (6), the gas passage of described vacuum absorption device (6) is communicated to described operating platform (2) via described transmission mechanism (3), and described vacuum absorption device (6) can provide absorption affinity and blowback power to described chip (1); And,
Control device (7), comprise: temperature conditioning unit (71) and control unit (72), wherein, the temperature conditioning unit (71) of monitoring described operating platform (2) real time temperature is connected with described operating platform (2), and the control unit (72) controlling described drive unit (5) operating state is connected with described drive unit (5).
2. chip according to claim 1 adds thermal linking device, it is characterized in that, described operating platform (2) comprising:
Carry the nozzle head (21) of described chip (1), described nozzle head (21) is provided with the first gas passage;
For the heat block (22) that described chip (1) heats, described heat block (22) is provided with the second gas passage, one end of described nozzle head (21) is arranged in described second gas passage, and described first gas passage is communicated with described second gas passage; And,
Multiple regulating spring (23), one end of described regulating spring (23) is fixed on described heat block (22), and the other end of described regulating spring (23) is fixed on described stopping means (4).
3. chip according to claim 2 adds thermal linking device, it is characterized in that, described heat block (22) comprises at least one dismountable heating rod (221), and detects the temperature sensor (222) of described heating rod (221) temperature; Wherein, described heating rod (221) is connected with described temperature conditioning unit (71) respectively with described temperature sensor (222).
4. chip according to claim 2 adds thermal linking device, it is characterized in that, one end that described regulating spring (23) is connected with described heat block (22) is provided with an adjustment screw (24), by the decrement regulating described adjustment screw (24) to regulate described regulating spring (23).
5. chip according to claim 2 adds thermal linking device, it is characterized in that, described transmission mechanism (3) is a splined shaft, described splined shaft offers the 3rd gas passage, wherein, one end of described splined shaft is fixed on described heat block (22), and described 3rd gas passage is connected with described second gas passage.
6. chip according to claim 5 adds thermal linking device, it is characterized in that, described stopping means (4) comprising:
The first cavity structure (41) in axial direction arranged, described splined shaft is arranged in described first cavity structure relative to one end of described heat block (22), and described splined shaft can move in described first cavity structure;
For limiting the guide vane end stop (42) of described splined shaft displacement; And,
The second cavity structure (43) radially arranged, one end of described vacuum absorption device (6) is arranged in described second cavity structure (43).
7. chip according to claim 6 adds thermal linking device, it is characterized in that, the end of described first cavity structure (41) is provided with the spline tooth be meshed with described splined shaft, and described splined shaft rotates in described first cavity structure (41) by spline fitted.
8. chip according to claim 6 adds thermal linking device, it is characterized in that, described drive unit (5) comprising:
For described transmission mechanism (3) provides the solenoid (51) of rectilinear motion power, described solenoid (51) is arranged on described stopping means (4) around described first cavity structure (41), and described solenoid (51) is connected with described control unit (72); And,
For described transmission mechanism (3) provides the electric rotating machine (52) of rotary power, be connected with described stopping means (4) by flange.
9. chip according to claim 6 adds thermal linking device, it is characterized in that, described vacuum absorption device (6) comprising:
Vacuum generator (61) and air compressor (62); And,
Tracheae (63), one end of described tracheae (63) is connected with described air compressor (62) with described vacuum generator (61) by electromagnetically operated valve; The other end of described tracheae (63) is arranged in described second cavity structure (43), and the gas passage of described tracheae (63) is connected with described 3rd gas passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915928.7A CN105448781B (en) | 2015-12-10 | 2015-12-10 | A kind of chip heats bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915928.7A CN105448781B (en) | 2015-12-10 | 2015-12-10 | A kind of chip heats bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448781A true CN105448781A (en) | 2016-03-30 |
| CN105448781B CN105448781B (en) | 2017-12-08 |
Family
ID=55558826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510915928.7A Expired - Fee Related CN105448781B (en) | 2015-12-10 | 2015-12-10 | A kind of chip heats bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448781B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106984369A (en) * | 2017-04-26 | 2017-07-28 | 广东工业大学 | A kind of micro-fluidic chip bonding apparatus |
| CN107293504A (en) * | 2016-03-31 | 2017-10-24 | 上海微电子装备（集团）股份有限公司 | It is bonded heating control apparatus and its method |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN112018018A (en) * | 2019-12-20 | 2020-12-01 | 东莞市中帆新材料科技有限公司 | Wearable multi-size universal processing platform for chips |
| CN115662923A (en) * | 2022-11-14 | 2023-01-31 | 沈阳恒进真空科技有限公司 | Anode bonding device |
| CN116190273A (en) * | 2023-03-01 | 2023-05-30 | 苏州联讯仪器股份有限公司 | Adsorption type chip carrying device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| JP2013187404A (en) * | 2012-03-08 | 2013-09-19 | Toray Eng Co Ltd | Chip delivery jig and chip delivery method |
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
-
2015
- 2015-12-10 CN CN201510915928.7A patent/CN105448781B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187404A (en) * | 2012-03-08 | 2013-09-19 | Toray Eng Co Ltd | Chip delivery jig and chip delivery method |
| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293504A (en) * | 2016-03-31 | 2017-10-24 | 上海微电子装备（集团）股份有限公司 | It is bonded heating control apparatus and its method |
| CN107293504B (en) * | 2016-03-31 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Bonding heating control device and method thereof |
| CN106984369A (en) * | 2017-04-26 | 2017-07-28 | 广东工业大学 | A kind of micro-fluidic chip bonding apparatus |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN107293512B (en) * | 2017-08-05 | 2023-12-05 | 广州明森科技股份有限公司 | Chip packaging device of multi-core smart card |
| CN112018018A (en) * | 2019-12-20 | 2020-12-01 | 东莞市中帆新材料科技有限公司 | Wearable multi-size universal processing platform for chips |
| CN115662923A (en) * | 2022-11-14 | 2023-01-31 | 沈阳恒进真空科技有限公司 | Anode bonding device |
| CN115662923B (en) * | 2022-11-14 | 2023-11-07 | 沈阳恒进真空科技有限公司 | Anode bonding device |
| CN116190273A (en) * | 2023-03-01 | 2023-05-30 | 苏州联讯仪器股份有限公司 | Adsorption type chip carrying device |
| CN116190273B (en) * | 2023-03-01 | 2023-11-21 | 苏州联讯仪器股份有限公司 | Adsorption type chip carrying device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105448781B (en) | 2017-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105448781A (en) | Chip heating and bonding device | |
| CN110890307B (en) | Multi-sucker automatic switching chip picking and bonding mechanism | |
| CN102173345B (en) | Pneumatic linear driven chip picking and turning device | |
| KR102059421B1 (en) | Electronic component mounting unit | |
| CN105070670A (en) | Bonding head device and chip packaging device | |
| JP2008103648A (en) | Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device | |
| JP5507775B1 (en) | Bonding apparatus and bonding method | |
| CN1725948A (en) | Vacuum attraction system | |
| CN110880458B (en) | Bonding head assembly | |
| JP3228140B2 (en) | Mounting method of conductive ball | |
| CN110112093B (en) | Flexible ejector pin operating device and system for inverted packaging chip | |
| JPS5979547A (en) | Sucker for minute part | |
| WO2017203888A1 (en) | Resin supply method, resin supply device, resin molding device, resin setting method, and resin molding method | |
| US20140123454A1 (en) | Adjustable Pick-up Head and Method for Manufacturing a Device | |
| JP2015103795A (en) | Bonding device | |
| CN217822719U (en) | Vacuum base plate for wafer | |
| JP2010123825A (en) | Component mounting apparatus and method of mounting component | |
| JP2000183596A (en) | Part mounting device | |
| CN205571404U (en) | Automatic pick device of powder metallurgy gear blank | |
| CN110491806A (en) | A kind of chip double-side aligning bonding head of bonder | |
| JP2024019098A (en) | Method and device for removing chip from wafer film frame, mounting system, and computer program | |
| CN219066776U (en) | Semiconductor packaging bonding wire device | |
| CN219350156U (en) | Rotatory laminating device of semiconductor encapsulation | |
| WO2019026160A1 (en) | Mounting head and component mounting machine | |
| KR100563434B1 (en) | Method for processing ruuber pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171208 Termination date: 20191210 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |