CN217822719U

CN217822719U - Vacuum base plate for wafer

Info

Publication number: CN217822719U
Application number: CN202221340500.6U
Authority: CN
Inventors: 陈小响; 杜阳
Original assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Current assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-15
Anticipated expiration: 2032-05-31

Abstract

The utility model provides a vacuum chassis for wafer has solved the wafer product that conventional thick hard degree is big, the warpage range is high, and pressing means breaks away from the back, and the wafer still has perk bounce-back phenomenon scheduling problem because the vacuum can not be inhaleed, including chassis and the wafer of arranging the chassis center in, chassis side week equipartition has a plurality of cylinders that compress tightly, it corresponds with wafer warpage department to compress tightly the cylinder output, the chassis inner chamber still is equipped with adjustment mechanism, adjustment mechanism includes motor, two-way screw rod and guide bar, the motor is used for servo drive two-way screw rod including the cavity location rotate, guide bar one end and two-way screw rod screw-thread fit, the other end and chassis sliding connection and pass chassis side week, it is fixed with the guide bar to compress tightly the cylinder through the height pole, compress tightly the adjustable setting of cylinder on the height pole.

Description

Vacuum base plate for wafer

Technical Field

The utility model relates to a semiconductor package technical field especially relates to a vacuum chassis for wafer.

Background

A wafer-level ball placement machine is a high-end semiconductor packaging device and is used for accurately placing solder balls on a wafer printed with soldering flux, and the ball diameter of the solder balls used by the existing wafer-level ball placement machine is generally in the range of 75-300 mu m.

Traditional vacuum chassis of ball planting machine has vacuum chassis pressing mechanism, can press the warpage piece edge, flattens the warpage piece on vacuum chassis, then opens vacuum adsorption, nevertheless to the wafer product that the degree of thickness is big, the warpage range is high, pressing mechanism breaks away from the back, and the wafer still has the perk bounce-back phenomenon because the vacuum can not be lived, is unfavorable for follow-up operation.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is overcome the defect that prior art exists, the utility model provides a can be applicable to not unidimensional wafer perk department flattens, the vacuum chassis for wafer of the follow-up sucking disc absorption of being convenient for.

In order to solve the technical problem, the utility model discloses a technical scheme is: the vacuum chassis for the wafer comprises a chassis and the wafer arranged at the center of the chassis, wherein a plurality of compressing cylinders are uniformly distributed on the periphery of the side of the chassis, the output ends of the compressing cylinders correspond to the warping position of the wafer, an adjusting mechanism is further arranged in the inner cavity of the chassis and comprises a motor, a bidirectional screw rod and a guide rod, the motor is used for servo-driving the bidirectional screw rod to rotate in the inner cavity in a positioning mode, one end of the guide rod is in threaded fit with the bidirectional screw rod, the other end of the guide rod is in sliding connection with the chassis and penetrates through the periphery of the side of the chassis, the compressing cylinders are fixedly connected with the guide rod through height rods, and the compressing cylinders are adjustably arranged on the height rods.

Further, the pressing air cylinders at least comprise 4 pressing air cylinders and are symmetrical with the center of the wafer.

Furthermore, a plurality of positioning holes are uniformly distributed in the height rod in the axial direction, and the height rod is fixed with the guide rod through a connecting block at the positioning holes.

Further, the pressing air cylinder is adjustable on the height rod and can be a ball screw structure.

Further, the pressing air cylinder and the external sucker are synchronously controlled in a servo mode.

Furthermore, a contact block is fixed at the output end of the pressing cylinder, the contact block is made of an ESD (electro-static discharge) soft material, and the contact block is in contact with the wafer invalid area.

Further, two-way screw rod both ends are rotated with the inner chamber and are connected, be equipped with symmetry and revolve to opposite screw thread on the two-way screw rod, the guide bar includes two and with two-way screw rod centrosymmetric, the guide bar comprises the body of rod and plate body, the body of rod and inner chamber both ends sliding connection, plate body center and two-way screw rod screw-thread fit.

Furthermore, the output end of the pressing cylinder is further provided with an infrared sensor used for sensing the invalid area of the wafer, and the motor is electrically connected with the infrared sensor.

Compared with the prior art, the beneficial effects of the utility model include: compress tightly the cylinder through increasing at the chassis edge and compress tightly, flatten the wafer all the time on vacuum chassis, solve traditional vacuum chassis and meet thick again hard and have the problem that warpage product vacuum can not be inhaled again, can realize flattening of not unidimensional wafer through the inside adjustment mechanism in chassis, the adjustment of also accessible height-adjustable's of different warpage range height pole realization relative high position, application scope is wide, and the practicality is strong.

Drawings

The disclosure of the present invention is explained with reference to the drawings. It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention. In the drawings, like reference numerals are used to refer to like parts. Wherein:

fig. 1 is an isometric view of a preferred embodiment of the invention;

FIG. 2 is a front view of a preferred embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along the line A of FIG. 2 according to a preferred embodiment of the present invention; .

Reference numbers in the figures: 1. a chassis; 2. a wafer; 3. a pressing cylinder; 4. an adjustment structure; 41. a motor; 42. a bidirectional screw; 43. a guide bar; 44. a thread; 45. a rod body; 46. a plate body; 5. a height bar; 51. positioning holes; 52. connecting blocks; 6. a contact block; 7. an inner cavity; 8. an infrared sensor.

Detailed Description

It is easily understood that, according to the technical solution of the present invention, a plurality of alternative structural modes and implementation modes can be proposed by those skilled in the art without changing the spirit of the present invention. Therefore, the following detailed description and the accompanying drawings are merely illustrative of the technical solutions of the present invention, and should not be considered as limiting or restricting the technical solutions of the present invention in their entirety or in any other way.

According to the utility model discloses an embodiment combines fig. 1-fig. 3 to show, wafer 2 is with vacuum chassis 1, wafer 2 including chassis 1 and the center of arranging chassis 1 in, 1 side week equipartition on chassis has a plurality of cylinders 3 that compress tightly, compress tightly that cylinder 3 output corresponds with 2 warpage departments of wafer, 1 inner chamber 7 in chassis still is equipped with adjustment mechanism, adjustment mechanism includes motor 41, two-way screw rod 42 and guide bar 43, motor 41 is used for servo drive two-way screw rod 42 to rotate at inner chamber 7 location, guide bar 43 one end and two-way screw rod 42 screw thread 44 cooperation, the other end and 1 sliding connection in chassis pass 1 side week, it is fixed with guide bar 43 through height pole 5 to compress tightly cylinder 3, compress tightly adjustable setting on height pole 5 of cylinder 3.

Two ends of the bidirectional screw 42 are rotatably connected with the inner cavity 7, threads 44 which are symmetrical and have opposite rotating directions are arranged on the bidirectional screw 42, the two guide rods 43 are symmetrical by the center of the bidirectional screw 42, each guide rod 43 consists of a rod body 45 and a plate body 46, the rod body 45 is slidably connected with two ends of the inner cavity 7, and the center of the plate body 46 is matched with the threads 44 of the bidirectional screw 42.

In the encapsulation of actual wafer 2, because of 2 sizes of wafer include the multiple, if 8 exist, 12 exist etc., for the encapsulation of the wafer 2 who is applicable to multiple size, this scheme carries out the fretwork in chassis 1 inside, form inner chamber 7, drive the linear motion of the relative formula of air cylinder 3 realization parallel position's of compressing tightly with adjustment mechanism again and adjust the process as follows, servo motor 41 of formula drives two-way screw rod 42 and fixes a position the rotation in inner chamber 7, then guide bar 43 can be under the limiting displacement of chassis 1 because of the screw thread 44 cooperation of body of rod 45 and two-way screw rod 42, with screw thread 44 direction linear motion, chassis 1 is to the spacing of guide bar 43 and is realized through body of rod 45 and chassis 1 slip connection.

As shown in fig. 1, the number of the pressing cylinders 3 is at least 4, and the center of the wafer 2 is symmetrical, and in this embodiment, the number of the pressing cylinders 3 is 4, and two of the pressing cylinders correspond to the warping positions at two ends of the wafer 2.

As shown in fig. 2 and 3, height pole 5 has a plurality of locating holes 51 at the axial equipartition, height pole 5 passes through connecting block 52 and guide bar 43 bolt fastening in locating hole 51 department, it can also be adjustable ball screw structure on height pole 5 to compress tightly cylinder 3, compress tightly cylinder 3 and outside sucking disc synchronous servo control, it is fixed with contact block 6 to compress tightly the cylinder 3 output, contact block 6 is the soft material of ESD static electricity discharge, contact block 6 and the contact of the invalid area of wafer 2, it still is equipped with infrared sensor 8 that is used for responding to the invalid area of wafer 2 to compress tightly the cylinder 3 output, motor 41 and infrared sensor 8 electric connection.

Similarly for being applicable to wafers 2 with different warping degrees, in the scheme, the initial height of the compressing cylinder 3 can be adjusted, similarly, in view of lowest cost, for adjusting the height, only the threaded 44 hole needs to be formed in the height rod 5 before lifting, then the height rod 5 and the connecting block 52 correspond to each other, so that the adjustment is realized, in the adjusting process, the compressing cylinder 3 only has relative change of the height position, so that the wafers 2 are repeatedly packaged, when the compressing cylinder 3 compresses, the contact block 6 which is made of the ESD discharging soft material at the output end of the compressing cylinder is in contact compression with the side edge of the invalid area of the wafers 2, after the warping end of the wafers 2 is flattened, the external pneumatic sucker can suck the center of the wafers 2, after the motor 41 controls the compressing cylinder 3 to move outwards, the sucker is sent to a subsequent packaging line for operation, the contact block 6 made of the ESD material can slow down the surface stress deformation of the wafers 2, and the infrared sensor 8 is used for positioning the invalid area at the side edge of the wafers 2, so that the subsequent electronic control integration is convenient.

Similarly, the height adjusting structure 4 for the pressing cylinder 3 may include various structures, such as a ball screw structure, which is not limited in the embodiment.

The technical scope of the present invention is not limited to the content in the above description, and those skilled in the art can make various modifications and alterations to the above embodiments without departing from the technical spirit of the present invention, and these modifications and alterations should fall within the protection scope of the present invention.

Claims

1. The vacuum chassis for the wafer comprises a chassis and the wafer arranged at the center of the chassis, wherein a plurality of compressing cylinders are uniformly distributed on the periphery of the side of the chassis, the output ends of the compressing cylinders correspond to the warping position of the wafer, and the vacuum chassis for the wafer is characterized in that: the chassis inner chamber still is equipped with adjustment mechanism, adjustment mechanism includes motor, two-way screw rod and guide bar, the motor is used for servo drive two-way screw rod to rotate at the inner chamber location, guide bar one end and two-way screw rod screw-thread fit, the other end and chassis sliding connection and pass chassis side week, it is fixed with the guide bar to compress tightly the cylinder through the high pole, compress tightly the adjustable setting of cylinder on the high pole.

2. The vacuum chassis for wafers of claim 1, wherein: the pressing air cylinders at least comprise 4 pressing air cylinders and are symmetrical with the center of the wafer.

3. The vacuum chassis for wafers of claim 1, wherein: the height rod is uniformly distributed with a plurality of positioning holes in the axial direction, and the height rod is fixed with the guide rod bolt through a connecting block at the positioning holes.

4. A vacuum chassis for wafers according to claim 1 or 2, wherein: the compaction cylinder is adjustable on the height rod and can also be of a ball screw structure.

5. The vacuum chassis for wafers of claim 1, wherein: and the pressing cylinder and the external sucker are synchronously servo-controlled.

6. The vacuum chassis for wafers of claim 1, wherein: and a contact block is fixed at the output end of the pressing cylinder, is made of an ESD (electro-static discharge) soft material and is in contact with the wafer invalid area.

7. The vacuum chassis for wafers of claim 1, wherein: the utility model discloses a two-way screw rod, including two guide bars, the guide bar comprises the body of rod and plate body, the body of rod and inner chamber both ends sliding connection, plate body center and two-way screw rod screw-thread fit.

8. The vacuum chassis for wafers of claim 1, wherein: the output end of the pressing air cylinder is further provided with an infrared sensor used for sensing an invalid area of the wafer, and the motor is electrically connected with the infrared sensor.