CN219350156U

CN219350156U - Rotatory laminating device of semiconductor encapsulation

Info

Publication number: CN219350156U
Application number: CN202223357072.0U
Authority: CN
Inventors: 杨自良; 杨小龙; 林鸿飞
Original assignee: Zhuhai Guiku Technology Co ltd
Current assignee: Zhuhai Guiku Technology Co ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-07-14
Anticipated expiration: 2032-12-12

Abstract

The utility model provides a semiconductor packaging rotary laminating device which comprises a heating mechanism and a laminating head, wherein the device comprises a first-stage base, a servo motor, a first-stage guide mechanism, a second-stage base, a DDR motor, a third-stage base, a fourth-stage base, a second-stage guide mechanism and a voice coil motor, the laminating head is controlled to be downward by the servo motor and the voice coil motor, two groups of stamping designs provide enough force for the laminating head when the semiconductor packaging is carried out, meanwhile, the high-precision semiconductor packaging is realized by controlling the current by virtue of the characteristic that the force of the voice coil motor is proportional to the current applied to the coil, so that the current is controlled to realize the switching between large force and small force, and the heating mechanism heats the laminating head, so that the technological requirement of the laminating of partial chips under the high-temperature and high-pressure environment is met.

Description

Rotatory laminating device of semiconductor encapsulation

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging rotary laminating device.

Background

At present, semiconductor packaging refers to a process of processing a wafer passing through a test according to a product model and a function requirement to obtain an independent chip, a chip mounter is generally used for packaging the semiconductor in the semiconductor packaging industry, for example, a Besi Datacon 2200 chip mounter and a infotech Sinter Bonder chip mounter in the prior art are performed under a high-temperature and high-pressure environment for bonding a part of chips so as to meet the process requirement, and a bonding head is generally directly driven downwards through a linear motor to form an open-loop structure, so that a sufficient force cannot be provided due to structural limitation, and a relatively accurate control cannot be provided for the applied force.

Disclosure of Invention

The utility model aims to provide a semiconductor package rotary laminating device which can provide enough force, can switch between high force and small force, can realize closed-loop force control of high force while switching, and has high precision.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the utility model provides a rotatory laminating device of semiconductor encapsulation, includes heating mechanism and laminating head, and the device includes first level base, servo motor, first level guiding mechanism, second level base, DDR motor, third level base, fourth level base, second level guiding mechanism and sound motor.

The utility model provides a laminating head, laminating head parcel has heating mechanism, still is equipped with the DDR motor that drives laminating head rotation on the device on the first level base through first level guiding mechanism sliding connection has second level base on the first level base, be provided with third level base on the second level base, third level base has fourth level base through second level guiding mechanism sliding connection, be equipped with voice coil motor on the third level base, voice coil motor's output shaft is decurrent and be provided with fourth level base, fourth level base lower extreme is equipped with the laminating head, laminating head parcel has heating mechanism.

By means of the structure, the servo motor arranged on the first-stage base drives the second-stage base to move downwards, so that the structure arranged on the second-stage base moves up and down integrally, the voice coil motor controls the fourth-stage base to move downwards when the bonding head is bonded, two groups of stamping designs are formed, sufficient force is provided when the bonding head is subjected to semiconductor packaging, the effect of performing closed loop calculation through control and detection synchronization is achieved by means of the fact that the size of the voice coil motor force is proportional to the current applied to the coil, the current is controlled, switching between high force and small force is achieved through control, the DDR motor driving the bonding head to rotate is further arranged on the device, the bonding head can be adjusted according to actual requirements, bonding precision is improved, the heating mechanism heats the bonding head, the process requirement that bonding of a part of chips needs to be performed under high temperature and high pressure is met, the closed loop calculation is achieved when the driver detects the pressure change value of the pressure sensor, the effect of performing closed loop calculation is achieved, the effect of performing control and detection synchronization is achieved, the effect of performing switching is achieved, the closed loop control and the high-loop motor is improved, the bonding precision is achieved, the bonding precision of the bonding force and the bonding force of the two stages can be directly achieved, and the bonding precision is improved, and the bonding precision is also can be improved.

Preferably, the second stage base, the third stage base and the fourth stage base are all L-shaped plates.

Preferably, the voice coil motor is provided with two groups respectively arranged at two ends of the third-stage base, and the output shafts of the voice coil motor are connected with the fourth-stage base.

Therefore, by arranging two groups of voice coil motors, stronger force can be provided, and rapid and smooth switching between high force and low force can be ensured.

Preferably, the DDR motor is arranged between the second-stage base and the third-stage base, and an output shaft of the DDR motor is connected with the fourth-stage base.

Or the DDR motor is arranged between the fourth-stage base and the laminating head, the DDR motor is fixedly connected to the fourth-stage base, and the output shaft of the DDR motor is downwards connected with the laminating head.

Therefore, the DDR motor is arranged between the second-stage base and the third-stage base or between the fourth-stage base and the attaching head, two different setting modes are fixed, all components arranged on the third-stage base are driven to rotate together or directly drive the attaching head to rotate by driving the third-stage base to rotate, the effect of driving the attaching head is achieved, the attaching head is adjusted under the effect of not affecting attaching, and the attaching head can be adjusted according to actual requirements, so that attaching precision is improved.

Preferably, the first-stage guiding mechanism and the second-stage guiding mechanism are sliding structures formed by guide rail sliding blocks.

Therefore, the sliding structure formed by the guide rail sliding blocks limits the upward and downward movement or downward lamination travel, so that the occurrence of the situations such as offset is avoided, and the lamination accuracy is improved.

Drawings

Fig. 1 is a oblique two-dimensional view of the embodiment 1.

Fig. 2 is a front view of embodiment 1.

Fig. 3 is a right side view of the present embodiment 1.

Fig. 4 is a oblique two-dimensional view of the embodiment 2.

Fig. 5 is a right side view of the present embodiment 2.

Fig. 6 is a front view of embodiment 2.

Description of the embodiments

The present utility model will be described in detail below with reference to the accompanying drawings.

Examples

As shown in fig. 1 to 3, a semiconductor package rotary bonding apparatus comprises a heating mechanism 10 and a bonding head 13, and the apparatus comprises a first stage base 1, a servo motor 2, a first stage guide mechanism 3, a second stage base 4, a DDR motor 5, a third stage base 6, a fourth stage base 7, a second stage guide mechanism 8 and a voice coil motor 9.

The utility model provides a laminating head, including first level base 1, second level base 4, first level base 1 upper end fixedly connected with servo motor 2, servo motor 2's output shaft is connected with second level base 4, be provided with third level base 6 on the second level base 4, third level base 6 has fourth level base 7 through second level guiding mechanism 8 sliding connection, be equipped with voice coil motor 9 on the third level base 6, voice coil motor 9's output shaft is downwards and be provided with fourth level base 7, fourth level base 7 lower extreme is equipped with laminating head 13, laminating head parcel has heating mechanism 10, still be equipped with on the device and drive laminating head rotatory DDR motor 5, be provided with pressure sensor 11 between third level base 6 and the fourth level base 7.

Preferably, the second stage base 4, the third stage base 6 and the fourth stage base 7 are all L-shaped plates.

Preferably, the voice coil motor 9 is provided with two groups respectively arranged at two ends of the third stage base 6 and is provided with a fourth stage base 7 in common.

Preferably, the first stage guiding mechanism 3 and the second stage guiding mechanism 8 are both sliding structures formed by guide rail sliding blocks.

In the present embodiment, the DDR motor 5 is disposed between the second stage base 4 and the third stage base 6, and an output shaft of the DDR motor 5 is connected to the fourth stage base 7.

In this embodiment, the present utility model is used in a chip mounter, when the bonding is performed, the second stage base 4 is driven downward by the servo motor 2 provided on the first stage base 1, so that the whole structure provided on the second stage base 4 is downward, a downward bonding force is provided, when the bonding is performed, the voice coil motor 9 controls the fourth stage base 7, and further, the bonding head 13 is controlled downward, two sets of stamping designs are formed, when the semiconductor package is performed for the bonding head 13, a force of 30kg or more is provided, when the force is required to be adjusted, by means of the characteristic that the magnitude of the applied force of the voice coil motor 9 is proportional to the current applied to the coil, the current is controlled, so that the switching between the large force and the small force is realized, when the bonding is performed, the pressure sensor 11 and the servo motor 2 are provided, and when the driver detects the pressure change value uploaded by the pressure sensor 11, the closed loop calculation is performed, the effect of synchronous control and the detection is achieved, thereby realizing the closed loop control of the large force, the bonding is realized, the chip is improved, and the high precision of the bonding force is avoided.

Be equipped with DDR motor 5 on the device, drive all components that set up on tertiary base 6 together rotatory through driving tertiary base 6 to drive laminating head 13, in the use, the vision sensor that is equipped with in the cooperation chip mounter, make laminating head 13 can adjust according to actual requirement, further improve laminating precision.

The heating mechanism 10 heats the bonding head 13, and for chips with process requirements that need to be performed under high-temperature and high-pressure environments in part bonding, the bonding head 13 is conveniently and directly heated without adding additional heating equipment for matching, or special heat bonding equipment is replaced.

Examples

As shown in fig. 4-6, in this embodiment, except for the different setting positions of the DDR motor 5, the other structures are the same as those of embodiment 1, and the function and operation principle are the same, in this embodiment, the DDR motor 5 is disposed between the fourth stage base 7 and the bonding head 13, the DDR motor 5 is fixedly connected to the fourth stage base 7, and the output shaft thereof is downward connected to the bonding head 13, and in this embodiment, the DDR motor 5 directly drives the bonding head to rotate, so as to play a role of driving the bonding head 13 equally, and adjust under the effect of not affecting bonding, so that the bonding head 13 can be adjusted according to actual requirements, and bonding precision is improved.

The foregoing detailed description of the utility model has been presented in conjunction with a specific embodiment, and it is not intended that the utility model be limited to such detailed description. Several equivalent substitutions or obvious modifications will occur to those skilled in the art to which this utility model pertains without departing from the spirit of the utility model, and the same should be considered to be within the scope of this utility model as defined in the appended claims.

Claims

1. The utility model provides a rotatory laminating device of semiconductor package, includes heating mechanism (10) and laminating head (13), its characterized in that: the device comprises a first-stage base (1), a servo motor (2), a first-stage guide mechanism (3), a second-stage base (4), a DDR motor (5), a third-stage base (6), a fourth-stage base (7), a second-stage guide mechanism (8) and a voice coil motor (9);

the first-stage base (1) is slidably connected with a second-stage base (4) through a first-stage guide mechanism (3), the upper end of the first-stage base (1) is fixedly connected with a servo motor (2), and an output shaft of the servo motor (2) is connected with the second-stage base (4);

a third-stage base (6) is arranged on the second-stage base (4);

the third-stage base (6) is connected with a fourth-stage base (7) in a sliding way through a second-stage guide mechanism (8);

the voice coil motor (9) is arranged on the third-stage base (6), and an output shaft of the voice coil motor (9) is downward and is provided with a fourth-stage base (7);

the lower end of the fourth-stage base (7) is provided with a bonding head (13), and the bonding head is wrapped with a heating mechanism (10);

the device is also provided with a DDR motor (5) for driving the attaching head to rotate;

a pressure sensor (11) is arranged between the third-stage base (6) and the fourth-stage base (7).

2. The rotary bonding device for semiconductor packages according to claim 1, wherein: the second-stage base (4), the third-stage base (6) and the fourth-stage base (7) are all L-shaped plates.

3. The rotary bonding device for semiconductor packages according to claim 1, wherein: the voice coil motor (9) is provided with two groups which are respectively arranged at two ends of the third-stage base (6), and the output shafts of the voice coil motor are connected with the fourth-stage base (7) together.

4. The rotary bonding device for semiconductor packages according to claim 1, wherein: the DDR motor (5) is arranged between the second-stage base (4) and the third-stage base (6), and an output shaft of the DDR motor (5) is connected with the fourth-stage base (7).

5. The rotary bonding device for semiconductor packages according to claim 1, wherein: the DDR motor (5) is arranged between the fourth-stage base (7) and the attaching head (13), the DDR motor (5) is fixedly connected to the fourth-stage base (7), and an output shaft of the DDR motor is downwards connected with the attaching head (13).

6. The rotary bonding device for semiconductor packages according to claim 1, wherein: the first-stage guide mechanism (3) and the second-stage guide mechanism (8) are both sliding structures formed by guide rail sliding blocks.