CN115799121A - Semiconductor packaging strength adjusting type laminating device - Google Patents
Semiconductor packaging strength adjusting type laminating device Download PDFInfo
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- CN115799121A CN115799121A CN202211598992.3A CN202211598992A CN115799121A CN 115799121 A CN115799121 A CN 115799121A CN 202211598992 A CN202211598992 A CN 202211598992A CN 115799121 A CN115799121 A CN 115799121A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a semiconductor packaging force adjusting type laminating device which comprises a heating mechanism, a laminating head, a pressure sensor, a servo motor, a voice coil motor and a linear motor structure, and further comprises a first-stage base, a second-stage base, a third-stage base and a fourth-stage base.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging force adjusting type laminating device.
Background
The existing semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, a chip mounter is generally used for carrying out semiconductor packaging in the semiconductor packaging industry, in the prior art, for example, a Besi Datacon 2200 chip mounter and an infotech Sinter Bonder chip mounter are used, the process requirement is met by carrying out the process under the high-temperature and high-pressure environment for the bonding of partial chips, a used bonding head is generally driven downwards directly through a linear motor to form an open-loop structure, and due to the structural limitation, enough force cannot be provided, although the applied force can be controlled to a certain extent through adjusting current, the adjusting interval is limited, the dynamic rigidity of the linear motor is extremely low, the linear motor cannot play a damping role, vibration easily occurs, more accurate control cannot be provided, and therefore, a novel high-precision bonding device capable of providing enough force, providing more accurate control and having a larger force adjusting interval is needed.
Disclosure of Invention
The invention aims to provide a semiconductor packaging force adjusting type bonding device which provides enough force, has a large switching interval between large force and small force, can realize large closed-loop force control while switching, and has high precision.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the utility model provides a semiconductor package dynamics regulation formula laminating device, the device is including heating mechanism, laminating head and pressure sensor, and the device includes servo motor, voice coil motor and linear electric motor structure, and the device still includes first order base, second level base, third level base and fourth level base.
The output shaft of the servo motor is connected to the second-stage base, the first-stage base is connected with the second-stage base in a sliding mode, a linear motor structure is arranged on the second-stage base, the output shaft of the linear motor structure is connected to the fourth-stage base, a third-stage base is arranged on the second-stage base, the third-stage base is connected with the fourth-stage base in a sliding mode, a voice coil motor is further arranged on the third-stage base, the output shaft of the voice coil motor is connected to the fourth-stage base, the lower end of the fourth-stage base is provided with a laminating head, the laminating head is wrapped with a heating mechanism, and an output shaft of the linear motor structure is provided with a pressure sensor.
By means of the structure, three groups of semiconductor packaging, laminating and force-giving structures are formed by the servo motor, the voice coil motor and the linear motor structure, wherein the servo motor arranged on the first-stage base is the structure which can give the force by the largest packaging, laminating and force-giving, the first-stage base is used as the position for mounting with the chip mounter, the servo motor drives the second-stage base to move downwards relative to the first-stage base through sliding connection, namely the servo motor arranged on the first-stage base drives the second-stage base to move downwards, so that the structure arranged on the second-stage base is wholly moved downwards, and further the laminating head is driven to carry out laminating operation, the linear motor structure arranged on the second-stage base and the voice coil motor arranged on the third-stage base act on the fourth-stage base together, so that the structure arranged on the fourth-stage base is wholly moved downwards, and further the laminating head is driven to carry out laminating operation, three groups of force-providing structures are matched for use simultaneously to provide enough force for jointing, the current can be controlled by controlling the current by means of the characteristic that the force of the voice coil motor and the linear motor structure is proportional to the applied current, so that the switching between large force and small force is realized, the three groups of force-providing structures can be independently used to provide three force-providing areas of large force, medium force, small force, medium force and small force, the upper limit of the provided force-providing force is high, the adjustable force range is larger, the force-providing structures are suitable for different semiconductor chips and meet various different operation requirements, meanwhile, the pressure sensor is arranged and matched with the servo motor or the linear motor structure, a driver detects a pressure change value uploaded by the pressure sensor to perform closed-loop calculation, the effect of synchronous control and detection is achieved, the switching is realized while the closed-loop force control of large force is realized, and the invention is matched with the force-providing structures, the adjusting range is large, the upper limit of the provided force is high, and the force can be accurately controlled, so that the adaptive range is wide, the semiconductor laminating device is suitable for the laminating requirements of various different semiconductors, the force is controllable, and the laminating precision is high.
Preferably, the second stage base, the third stage base and the fourth stage base are all L-shaped plates.
Preferably, the voice coil motor is provided with two sets of voice coil motors which are respectively arranged at two ends of the third-stage base and are connected to the fourth-stage base together.
Therefore, the two groups of voice coil motors are arranged, so that stronger force is provided, and rapid and smooth switching between large force and small force is guaranteed.
Preferably, a DDR motor is further arranged between the fourth-stage base and the laminating head, the DDR motor is fixedly connected to the fourth-stage base, and an output shaft of the DDR motor is connected with the laminating head downwards.
Therefore, the DDR motor is arranged between the fourth-stage base and the laminating head, the laminating head is directly driven to rotate, the effect of driving the laminating head to rotate is achieved, the visual recognition system of the surface mounting machine provided with the device is installed in a matched mode, adjustment can be conducted under the effect of not influencing the laminating, the laminating head can be adjusted according to actual requirements, and laminating accuracy is improved.
Preferably, first order base and second level base are through being equipped with first order guiding mechanism sliding connection between the base, and third level base and fourth level base are through being equipped with second level guiding mechanism sliding connection between the base.
Preferably, the first-stage guide mechanism and the second-stage guide mechanism are sliding structures consisting of guide rail sliding blocks.
Therefore, the first-stage guide mechanism and the second-stage guide mechanism which are composed of the guide rail sliding blocks are arranged, the stroke of up-down moving or downward fitting is limited, positioning and stabilization are provided for the servo motor, the linear motor and the voice coil motor in the operation process, and the conditions such as small deviation caused by small vibration of operation attempts are generated, so that the fitting accuracy is improved.
Preferably, the linear motor structure comprises a linear motor rotor and a linear motor stator, the linear motor rotor is arranged at the upper end of the fourth-stage base, the linear motor stator is arranged at the lower end of the second-stage base, and the linear motor rotor and the linear motor stator are connected in a matched mode to form the motor.
Therefore, the linear motor structure is formed by the linear motor rotor and the linear motor stator, closed-loop force control is formed by the linear motor with the characteristics of high precision and repeatability precision and high speed in cooperation with the pressure sensor, and when semiconductor bonding operation is carried out, the precision is guaranteed, and meanwhile the production efficiency is improved.
Drawings
FIG. 1 is a perspective view of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is a right side view of the present invention.
Detailed Description
The present invention is described in detail below with reference to the attached drawings.
As shown in fig. 1-3, a semiconductor packaging dynamics regulation formula laminating device, the device includes heating mechanism 10, laminating head 14 and pressure sensor 11, the device includes servo motor 2, voice coil motor 9 and linear electric motor structure, the device still includes first stage base 1, second stage base 4, third stage base 6 and fourth stage base 7, first stage base 1 leads to and is provided with output shaft to decurrent servo motor 2, servo motor 2's output shaft is on second stage base 4, first stage base 1 and second stage base 4 sliding connection, be equipped with the linear electric motor structure on the second stage base 4, the output shaft of line motor structure is at fourth stage base 7, be equipped with third stage base 6 on second stage base 4, third stage base 6 and fourth stage base 7 sliding connection, still be equipped with voice coil motor 9 on third stage base 6, the output shaft of voice coil motor 9 is connected at fourth stage base 7, fourth stage base 7 lower extreme is equipped with laminating head 14, laminating head parcel has heating mechanism 10, the output shaft of linear electric motor structure is equipped with pressure sensor 11.
Preferably, the second stage base 4, the third stage base 6 and the fourth stage base 7 are all L-shaped plates.
Preferably, two sets of voice coil motors 9 are respectively arranged at two ends of the third stage base 6 and are connected to the fourth stage base 7.
Preferably, a DDR motor 5 is further arranged between the fourth stage base 7 and the attaching head 14, the DDR motor 5 is fixedly connected to the fourth stage base 7, and an output shaft of the DDR motor is downwards connected with the attaching head 14.
Preferably, the first-stage base 1 is in sliding connection with the second-stage base 4 through the first-stage guide mechanism 3;
the third stage base 6 is connected with the fourth stage base 7 in a sliding mode through a second stage guide mechanism 8.
Preferably, the first-stage guide mechanism 3 and the second-stage guide mechanism 8 are sliding structures composed of guide rail sliding blocks.
Preferably, the linear motor structure includes a linear motor mover 12 and a linear motor stator 13;
the linear motor rotor 12 is arranged at the upper end of the fourth stage base 7, the linear motor stator 13 is arranged at the lower end of the second stage base 4, and the linear motor rotor 12 and the linear motor stator 13 are connected in a matched mode to form a motor.
In this embodiment, the present device is disposed in a chip mounter and is controlled and connected to the chip mounter, the first stage base 1 serves as a position where the first stage base is mounted on the chip mounter, when the chip mounter performs semiconductor bonding operation, the device is bonded by driving the chip mounter, the present device is provided with three force supply structures, the three force supply structures can be used alternatively or cooperatively, the upper limit of the provided bonding force is high, the force range that can be adjusted is larger, the present device is suitable for different semiconductor chips, and various different operation requirements are met.
Wherein the servo motor 2 that is equipped with on the first stage base 1 is the structure of the biggest encapsulation laminating power, first stage base 1 is as the position with chip mounter installation, servo motor 2 drives second level base 4 downwards, it is downward relatively first stage base 1 through sliding connection, servo motor 2 through being equipped with on first stage base 1 promptly, drive second level base 4 downwards, thereby make the structure that sets up on second level base 4 whole downwards, and then drive laminating head 14 and carry out the laminating operation, the linear electric motor structure that sets up on second level base 4 and the setting at third level base voice coil motor 9, the two coact on fourth level base 7, make the structure that sets up on fourth level base 7 whole downwards, thereby it carries out the laminating operation to drive laminating head 14, provide the dynamics that can reach 30kg or more, three groups of structures of providing power cooperate the use simultaneously, can provide sufficient dynamics and laminate, borrow the characteristic that the power of voice coil motor 9 and linear electric motor structure becomes the proportion with the electric current of applying at the while, thereby can control electric current and realize switching between energetically and little power.
The chip mounter using the laminating device has the advantages that the structure of force can be selectively used, the upper limit of the laminating force is high, the size range of the force can be adjusted to be larger, the chip mounter is suitable for different semiconductor chips, various different operation requirements are met, and the precision of the produced product is higher.
The DDR motor 5 arranged on the device can driveAttaching head 14In the using process, the visual sensor arranged in the chip mounter is matched, so that the bonding head 14 can be adjusted according to actual requirements, and the bonding precision is further improved.
The heating mechanism 10 heats the attaching head 14, and for chips with part of attaching requirements which need to be carried out in a high-temperature and high-pressure environment, the attaching head 14 is directly heated conveniently without the need of additional matching of heating equipment or replacement of special hot attaching equipment.
The present invention has been described in detail with reference to specific embodiments, and it should not be construed that the embodiments of the present invention are limited to the description. For those skilled in the art to which the invention pertains, several equivalent substitutions or obvious modifications, which are equivalent in performance or use, without departing from the inventive concept, should be considered as falling within the scope of the present invention as defined by the appended claims.
Claims (7)
1. The utility model provides a laminating device is adjusted to semiconductor package dynamics, the device includes heating mechanism (10), laminating head (14) and pressure sensor (11), its characterized in that: the device comprises a servo motor (2), a voice coil motor (9) and a linear motor structure;
the device also comprises a first stage base (1), a second stage base (4), a third stage base (6) and a fourth stage base (7);
the first-stage base (1) is provided with a servo motor (2) with an output shaft downward, and the output shaft of the servo motor (2) is connected to the second-stage base (4);
the first-stage base (1) is connected with the second-stage base (4) in a sliding manner;
a linear motor structure is arranged on the second-stage base (4), and an output shaft of the linear motor structure is connected to the fourth-stage base (7);
a third stage base (6) is arranged on the second stage base (4);
the third stage base (6) is connected with the fourth stage base (7) in a sliding manner;
the third-stage base (6) is also provided with a voice coil motor (9), and an output shaft of the voice coil motor (9) is connected to the fourth-stage base (7);
the lower end of the fourth stage base (7) is provided with a fitting head (14), and the fitting head is wrapped with a heating mechanism (10);
and an output shaft of the linear motor structure is provided with a pressure sensor (11).
2. The semiconductor package force regulating type bonding device according to claim 1, wherein: the second-stage base (4), the third-stage base (6) and the fourth-stage base (7) are all L-shaped plates.
3. The semiconductor package force regulating type bonding device according to claim 1, wherein: and the voice coil motors (9) are provided with two groups which are respectively arranged at two ends of the third-stage base (6) and are jointly connected to the fourth-stage base (7).
4. The adjustable semiconductor package force applying assembly according to claim 1, wherein: still be equipped with DDR motor (5) between fourth level base (7) and laminating head (14), DDR motor (5) fixed connection is on fourth level base (7), and its output shaft connects laminating head (14) downwards.
5. The semiconductor package force regulating type bonding device according to claim 1, wherein: the first-stage base (1) is in sliding connection with the second-stage base (4) through a first-stage guide mechanism (3);
and the third stage base (6) is connected with the fourth stage base (7) in a sliding manner through a second stage guide mechanism (8).
6. The semiconductor package force regulating type bonding device according to claim 5, wherein:
the first-stage guide mechanism (3) and the second-stage guide mechanism (8) are sliding structures formed by guide rail sliding blocks.
7. The semiconductor package force regulating type bonding device according to claim 1, wherein: the linear motor structure comprises a linear motor rotor (12) and a linear motor stator (13);
the linear motor rotor (12) is arranged at the upper end of the fourth-stage base (7), the linear motor stator (13) is arranged at the lower end of the second-stage base (4), and the linear motor rotor (12) and the linear motor stator (13) are connected in a matched mode to form a motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211598992.3A CN115799121A (en) | 2022-12-12 | 2022-12-12 | Semiconductor packaging strength adjusting type laminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211598992.3A CN115799121A (en) | 2022-12-12 | 2022-12-12 | Semiconductor packaging strength adjusting type laminating device |
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| Publication Number | Publication Date |
|---|---|
| CN115799121A true CN115799121A (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211598992.3A Pending CN115799121A (en) | 2022-12-12 | 2022-12-12 | Semiconductor packaging strength adjusting type laminating device |
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| CN (1) | CN115799121A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116470726A (en) * | 2023-04-18 | 2023-07-21 | 横川机器人（深圳）有限公司 | Closed-loop force control voice coil motor and method for controlling pressure of voice coil motor module |
-
2022
- 2022-12-12 CN CN202211598992.3A patent/CN115799121A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116470726A (en) * | 2023-04-18 | 2023-07-21 | 横川机器人（深圳）有限公司 | Closed-loop force control voice coil motor and method for controlling pressure of voice coil motor module |
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