CN105448781B - A kind of chip heats bonding apparatus - Google Patents
A kind of chip heats bonding apparatus Download PDFInfo
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- CN105448781B CN105448781B CN201510915928.7A CN201510915928A CN105448781B CN 105448781 B CN105448781 B CN 105448781B CN 201510915928 A CN201510915928 A CN 201510915928A CN 105448781 B CN105448781 B CN 105448781B
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- chip
- transmission mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of chip to heat bonding apparatus, including：Carry chip and the operating platform heated for it；Transmission mechanism, operating platform are fixed on one end of transmission mechanism；Stopping means, the other end of transmission mechanism are arranged in stopping means；Drive device, be arranged on stopping means, drive device can drive transmission device moved in stopping means；Vacuum absorption device, the gas passage of vacuum absorption device are communicated to operating platform via transmission mechanism, and vacuum absorption device can provide absorption affinity and blowback power to chip；And control device, including：Temperature conditioning unit and control unit, wherein, the temperature conditioning unit of monitoring operating platform real time temperature is connected with operating platform, controls the control unit of driving device working status to be connected with drive device.The present invention has heating and moves controllable function, and with stable pickup force and bonding force, improves its Technological adaptability.
Description
Technical field
The present invention relates to semiconductor manufacturing or process field, more particularly to a kind of chip heating bonding apparatus.
Background technology
With developing rapidly for electronic information technology, electronic product is just towards small volume, integration degree is high, function is multiple
Trend development miscellaneous, reliability is high, so that advanced encapsulation and interconnection technique substitute conventional packaging techniques.Advanced envelope
Dress technology combination semiconductor packages and package technique improve packaging efficiency, reduce packaging cost, improve device performance to reach
Purpose.Back bonding technology make it that the market demand of flip chip semiconductor package is just fast with the features such as its high density and small size
Speed increases.Flip-chip is not only a kind of high-density chip interconnections technology, or a kind of preferably die bonding technology, PGA,
It is obtained for and is widely applied in BGA and CSP.The interconnection line of flip-chip is very short, and I/O exits are distributed whole chip
Surface, while flip-chip industry is adapted to be produced in batches using SMT technological means, therefore flip-chip has turned into highly dense
Spend the main direction of development of encapsulation technology.
Flip-chip bonding be that the chip with salient point is picked up and overturn from blue film so that its pad patterns down,
Brigadier's chip is placed on base material by Machine Vision Recognition.Reverse chip key binder decides the essence of flip-chip bonding
Degree, efficiency and reliability, it is the key equipment in Flip-Chip Using field, wherein bonding apparatus is real on reverse chip key binder
Existing chip picks up from blue film and by machine vision by the high-precision critical component being positioned on base material of chip.
In the last few years, back bonding encapsulation technology development is gradually accelerated, and this requires the bonding on reverse chip key binder
Device needs have following typical feature：
1st, very fast response speed, while there is the ability of control pickup force, so as in the mistake from blue film pickup chip
It is unlikely to chip of damaging in journey；
2nd, due to packaging technology complicated and changeable, it is necessary to which bonding apparatus possesses chip heating and to provide rigid support etc. more
Kind of function, meet to pick up from blue film with this chip is carried out after chip related process processing such as on chip bump plant ball or
The operation such as wire bonding is carried out to chip；
3rd, due to the raising of back bonding precision, bonding apparatus need to have the characteristics that compact-sized, integral rigidity is high.
Traditional bonding apparatus, do not possess for chip heating function, packaging technology requirement complicated and changeable can not be adapted to, and
The pickup force of traditional bonding apparatus is that the fluctuation of bleed pressure can pass to by being adjusted to the control of air pressure with bonding force
Pickup force and bonding force, cause pickup force to be drifted about with bonding force, stable and consistent pickup force and bonding force can not be ensured.This
Outside, the nozzle head of traditional bonding apparatus is only capable of moving in one direction, and can not be moved along its opposite direction, i.e., stretching motion can not
Control.
The content of the invention
The invention provides a kind of chip to heat bonding apparatus, solves traditional bonding apparatus and does not possess heating function,
Stretching motion is uncontrollable, and the problem of bonding force and unstable pickup force.
According to one aspect of the present invention, there is provided a kind of chip heats bonding apparatus, including：
Carry chip and the operating platform heated for it；
Transmission mechanism, operating platform are fixed on one end of transmission mechanism；
Stopping means, the other end of transmission mechanism are arranged in stopping means；
Drive device, be arranged on stopping means, drive device can drive transmission device moved back and forth in stopping means；
Vacuum absorption device, the gas passage of vacuum absorption device are communicated to operating platform via transmission mechanism, and vacuum is inhaled
Adsorption device can provide absorption affinity and blowback power to chip；And
Control device, including：Temperature conditioning unit and control unit, wherein, the temperature conditioning unit of monitoring operating platform real time temperature
It is connected with operating platform, controls the control unit of driving device working status to be connected with drive device.
Alternatively, operating platform includes：
The nozzle head of chip is carried, nozzle head is provided with first gas passage；
For the heat block of chip heating, heat block is provided with second gas passage, and one end of nozzle head is arranged in the second gas
In body passage, first gas passage connects with second gas passage；And
Multiple regulation springs, the one end for adjusting spring are fixed on heat block, adjust spring the other end be fixed on it is spacing
On device.
Alternatively, heat block includes at least one dismountable heating rod, and the TEMP of detection heating rod temperature
Device；Wherein, heating rod and temperature sensor are connected with temperature conditioning unit respectively.
Alternatively, one end that regulation spring is connected with heat block is provided with an adjusting screw, is adjusted by adjusting adjusting screw
The decrement of section regulation spring.
Alternatively, transmission mechanism is a splined shaft, and third gas passage is offered on splined shaft, wherein, the one of splined shaft
End is fixed on heat block, and third gas passage is connected with second gas passage.
Alternatively, stopping means includes：
The first cavity structure in axial direction set, splined shaft are arranged in the first cavity knot relative to one end of heat block
In structure, and splined shaft can move in the first cavity structure；
For limiting the limited block of spline axial displacement；And
The second cavity structure radially set, one end of vacuum absorption device are arranged in the second cavity structure.
Alternatively, the end set of the first cavity structure has the spline tooth being meshed with splined shaft, and splined shaft can pass through flower
Key coordinates in the first cavity structure internal rotation.
Alternatively, drive device includes：
The solenoid of linear motion power is provided for transmission mechanism, solenoid is arranged at spacing dress around the first cavity structure
Put, solenoid is connected with control unit；And
The electric rotating machine of rotary power is provided for transmission mechanism, is connected by flange with stopping means.
Alternatively, vacuum absorption device includes：
Vacuum generator and air compressor；And
Tracheae, one end of tracheae are connected by magnetic valve with vacuum generator and air compressor；The other end of tracheae is set
It is placed in the second cavity structure, and the gas passage of tracheae is connected with third gas passage.
The beneficial effect of embodiments of the invention is：
The chip heating bonding apparatus of the present invention, carries chip by operating platform and it is heated, it is more to be suitable for complexity
The packaging technology requirement of change, improves its Technological adaptability.Transmission mechanism drives operating platform common in the presence of drive device
Move back and forth, realize the stretching motion controllability of operating platform, be easy to the pickup and bonding of chip, in addition in the reality of control device
When monitoring under, operating platform is stably and controllable to the pickup force and bonding force of chip, improves its performance accuracy.
Brief description of the drawings
Fig. 1 represents the structural representation one of the chip heating bonding apparatus of the present invention；
Fig. 2 represents the structural representation two of the chip heating bonding apparatus of the present invention；
Partial exploded view in Fig. 2 of Fig. 3 expression present invention.
Wherein in figure：1st, chip, 2, operating platform, 3, transmission mechanism, 4, stopping means, 5, drive device, 6, vacuum inhales
Adsorption device, 7, control device；
21st, nozzle head, 22, heat block, 23, regulation spring, 24, adjusting screw；
41st, the first cavity structure, 42, limited block, the 43, second cavity structure；
51st, solenoid, 52, electric rotating machine；
61st, vacuum generator, 62, air compressor, 63, tracheae；
71st, temperature conditioning unit, 72, control unit；
221st, heating rod, 222, temperature sensor.
Embodiment
The exemplary embodiment of the present invention is more fully described below with reference to accompanying drawings.Although the present invention is shown in accompanying drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the present invention without should be by embodiments set forth here
Limited.Conversely, there is provided these embodiments are to be able to be best understood from the present invention, and can be by the scope of the present invention
Completely it is communicated to those skilled in the art.
Embodiment one
As shown in figure 1, the embodiment provides a kind of chip to heat bonding apparatus, specifically include：For carrying
Operating platform 2, transmission mechanism 3, stopping means 4, drive device 5, vacuum absorption device 6 and the control device 7 of chip 1.
Wherein, the main function of operating platform 2 is to provide a carrying platform for chip 1, can be by the operating platform 2 to core
Piece 1 is picked up and is bonded, and operating platform 2 is also equipped with heating function in addition, can increase the surface metal-layer of chip 1 by heating
Activity, the correlated activation (planting ball, wire bonding etc.) to be carried out for chip lays the foundation, so that the operation energy of chip 1
Different packaging environments and technological requirement are enough adapted to, improves the Technological adaptability of whole device.
Operating platform 2 is fixed on one end of transmission mechanism 3, and the main function of transmission mechanism 3 is to drive operating platform 2 reciprocal
Mobile, such controllable operation platform provides different operating positions in different sequential for chip 1, to adapt to different behaviour
Make demand.
The other end of transmission device 3 is arranged in stopping means 4, and can be moved back and forth in stopping means 4；Stopping means
4 are used to provide reliable limited support for operating platform 2, when transmission mechanism 3 is moved to the diverse location of transmission device 3, limit
Position device 4 is the support that operating platform 2 provides otherwise limit position, such as：When picking up chip 1, it is necessary to which transmission mechanism 3 drives
Operating platform 2 is ejected in stopping means 4, in order to the pickup to chip 1；And when needing to carry out relevant treatment to chip 1, need
A secure support is provided for it, transmission mechanism 3 drives operating platform 2 to be contracted to and abutted against with stopping means 4, utilizes spacing dress
Put 4 and provide a stable rigid support for operating platform 2.
Drive device 5 is arranged on stopping means 4, for providing driving force for transmission mechanism 3, such as：Drive driver
Structure 3 does linear reciprocation movement in stopping means 4, to adjust the height of chip 1, or, drive transmission device 3 is in stopping means 4
Inside rotate, to finely tune the angle of chip 1.
Vacuum absorption device 6 is used to provide absorption affinity and blowback power, the gas passage warp of vacuum absorption device 6 for chip 1
Operating platform 2 is communicated to by transmission mechanism 3, chip 1 or blowback chip 1 are adsorbed by operating platform 2.
To ensure the intelligent and stability of whole device, control device 7 be used for according to the process demand of current chip 1 and
Instantaneous operating conditions dynamic adjustment operating platform 2, drive device 5 or vacuum absorption device 6.Wherein, control device 7 comprises at least
Temperature conditioning unit 71 and control unit 72, specifically, temperature conditioning unit 71 is connected with operating platform 2, flat for monitoring and adjusting operation
The real time temperature of platform；Control unit 72 is connected with drive device 5, for controlling the working condition of drive device 5.
The chip heating bonding apparatus that the embodiment of the present invention one provides, carries chip 1 by operating platform 2 and it is added
Heat, packaging technology requirement complicated and changeable is suitable for, improves its Technological adaptability.The transmission mechanism 3 in the presence of drive device 5
Drive operating platform 2 to be moved back and forth jointly in stopping means 4, realize the stretching motion controllability of operating platform 2, be easy to chip
1 pickup and bonding, in addition under the real-time monitoring of control device 7, operating platform 2 to the heating-up temperature of chip 1, pickup force and
Bonding force is stably and controllable, improves its performance accuracy.
Embodiment two
The cooperation that above example one is simply described between all parts of the chip heating bonding apparatus of the present invention is closed
System, is described further below in conjunction with concrete application scene.
Specifically, as shown in Figure 1 to Figure 3, operating platform 2 specifically includes：The nozzle head 21 of chip 1 is carried, is added for chip 1
The heat block 22 of heat, and multiple regulation springs 23.Wherein, nozzle head 21 passes through multiple magnet being installed in heat block 22
Magnetive attraction is fixed on heat block 22.Wherein, nozzle head 21 is provided with first gas passage, and the second gas is provided with heat block 22
Body passage, one end of nozzle head 21 is arranged in second gas passage, and first gas passage is connected with second gas passage,
The gas passage of vacuum absorption device 6 is that chip 1 provides absorption affinity or blowback via second gas passage and first gas passage
Power.One end of regulation spring 23 is fixed on heat block 22, and specifically, regulation spring 23 is fixed on by bearing lock nut to be added
On hot block 22；The other end of regulation spring 23 is fixed on stopping means 4, when regulation spring 23 is in different conditions, suction nozzle
First 21 are in different operating positions, when picking up chip 1, in the presence of the compression and back elastic force of regulation spring 23, and heating
Block 22 is ejected in stopping means 4, in order to the pickup to chip 1；And when needing to carry out relevant treatment to chip 1, it is necessary to be
It provides a secure support, and transmission mechanism 3 drives heat block 2 to shrink, and extreme position is compressed to adjust spring 23, so that
Heat block 22 abuts against with stopping means 4, is that heat block 22 and nozzle head 21 provide a stable rigidity and propped up using stopping means 4
Support.
Wherein, heat block 22 includes at least one dismountable heating rod 221, and the temperature of the detection temperature of heating rod 221
Sensor 222 is spent, heating rod 221 and temperature sensor 222 are fixed by screw respectively, and a heating rod 221 is that thermal source coordinates temperature
Degree sensor 21 can provide stably and controllable heating-up temperature；Wherein, heating rod 221 and temperature sensor 222 respectively with temperature control list
Member 71 connects.When temperature is higher than the highest threshold value of required temperature during heating rod 221 is chip heating, TEMP
The temperature information collected is fed back to temperature conditioning unit 71 by device 222, and heating rod 221 is reduced under the control of temperature conditioning unit 71
Heating-up temperature；And when temperature is less than the minimum threshold of required temperature during heating rod 221 is chip heating, temperature passes
The temperature information collected is fed back to temperature conditioning unit 71 by sensor 222, and heating rod 221 is improved under the control of temperature conditioning unit 71
Heating-up temperature, to realize closed-loop control to the operation temperature of chip 1, ensure the stability and controllability of whole processing procedure.
Further, regulation spring 23 is provided with an adjusting screw 24 with one end that heat block 22 is connected, should by regulation
The decrement that adjust spring 23 can be adjusted for adjusting screw 24, so as to which regulation spring 23 is pressed in into heat block 22 and regulation bullet
In the bearing nut that spring 23 connects, when adjusting screw 24 screws, the compression quantitative change of regulation spring 23 is big, when adjusting screw 24 unscrews
Some, can make the decrement of regulation spring 23 diminish.Adjusted by the decrement for adjusting spring 23, can adjust heat block 22 and inhale
The screen resilience size of mouth 21.
As shown in Fig. 2 transmission mechanism 3 is specially a splined shaft, third gas passage is offered on the splined shaft, wherein,
One end of splined shaft is fixed on heat block 22, and specific heat block 22 can be fixed by screw and splined shaft, and third gas is led to
Road is connected with second gas passage.
Stopping means 4 specifically includes：
The first cavity structure 41 in axial direction set, splined shaft relative to one end of heat block 22 be arranged in this first
In cavity structure, and splined shaft can move in the first cavity structure；
For limiting the limited block 42 of spline axial displacement, wherein, when heat block 22 is in the rebound effect of regulation spring 23
During lower ejection certain displacement, the shaft shoulder of splined shaft contacts with limited block 42, the ejection displacement of heat block 22 is limited, when heat block 22
When being bounced back under the induced effect of transmission mechanism 3 to stopping means 4, when heat block 22 abuts with stopping means 4, stopping means
4 body or the advanced position for being called pressure cylinder limitation heat block 22；And
The second cavity structure 43 radially set, one end of vacuum absorption device 6 are arranged at the second cavity structure
In 43, the gas passage of vacuum absorption device 6 is connected by the second cavity structure 43 with the third gas passage of splined shaft, then
Via second gas passage and first gas passage absorption affinity and blowback power are provided to chip 1.
In order to finely tune the process angle of chip 1, have what is be meshed with splined shaft in the end set of the first cavity structure 41
Spline tooth, splined shaft can be by way of spline fitteds in the first cavity structure internal rotation.When splined shaft is in the work of drive device 5
Under, when drive heat block 22 is moved to the extreme position of regulation spring 23, the spline of splined shaft and the first cavity structure 41
Interior spline tooth is in contact engagement, and when needing to finely tune the process angle of chip 1, whole behaviour can be realized by spline fitted mode
Make the rotation of platform 2 and transmission mechanism 3.
And the drive device 5 that driving force is provided for transmission mechanism specifically includes：Limit is arranged at around the first cavity structure 41
Solenoid 51 on the device 4 of position, the wherein solenoid 51 are connected with control unit 72.Specifically, solenoid 51 passes through clamp screw
Nail is fixed on stopping means 4.When needing to pick up chip 1, control unit 72 powers off to solenoid 51, in regulation spring 23
Under rebound effect, heat block 22 drives nozzle head 21 to be moved to the direction away from stopping means 4, to pick up chip 1；Work as needs
, it is necessary to provide a stable rigid support for chip 1, at this moment control unit 72 is right when carrying out correlated activation to the chip 1 of pickup
Solenoid 51 is powered, and heat block 22 overcomes the elastic force of regulation spring 23 to close to limit under the electromagnetic attraction effect of solenoid 51
The direction movement of position device 4, until abutted against with stopping means 4, by stopping means 4 to the firm of heat block 22 and nozzle head 21
Property support, provide reliable and stable processing platform for chip 1.It is worthy of note that nozzle head 21, heat block 22 and transmission mechanism 3
To be relatively fixed constant, when nozzle head 21 and heat block 22 eject, transmission mechanism 3 also ejects therewith, when nozzle head 21 and plus
When hot block 22 bounces back, transmission mechanism 3 also bounces back therewith.
Drive device 5 except including it is above-mentioned refer to for nozzle head 21, heat block 22 and transmission mechanism 3 provide linear motion
The solenoid 51 of power, the drive device 5 also include the electric rotating machine 52 that rotary power is provided for transmission mechanism 3.Wherein, rotate
Motor 52 is fixed on the one end of stopping means 4 relative to heat block 22 by flange, and the electric rotating machine 52 connects with transmission mechanism 3
Connect, under the revolving force effect of electric rotating machine 52, can drive transmission mechanism 3, heat block 22 and nozzle head 21 that angle rotation occurs,
So as to realize the angle adjustment of chip 1, it is easy to more accurately carry out correlated activation to chip 1.
Alternatively, vacuum absorption device 6 is used to provide absorption affinity and blowback power, specifically, vacuum absorption device for chip 1
6 include：Vacuum generator 61, air compressor 62 and tracheae 63, wherein, one end of tracheae 63 is occurred by magnetic valve and vacuum
Device 61 is connected with air compressor 62；The other end of tracheae 63 is arranged in the second cavity structure 43, and the gas of tracheae 63 leads to
Road is connected with third gas passage.When magnetic valve gating vacuum generator 61 is with tracheae 63, vacuum generator 61 will be whole
Gas in device is extracted out by the gas passage of first gas passage, second gas passage, third gas passage and tracheae 63,
So chip 1 is closely pressed under atmospheric pressure effect with nozzle head 21, and stable pull of vacuum is provided for chip；Work as magnetic valve
When gating air compressor 62 with tracheae 63, air caused by air compressor 62 passes through gas passage, the 3rd gas of tracheae 63
Body passage, second gas passage and first gas passage are inflated for whole device, when air pressure is more than external atmosphere pressure in device,
Chip 1 is departed from by blowback and nozzle head 21.
To sum up, chip heating bonding apparatus provided in an embodiment of the present invention, carries chip by operating platform and it is added
Heat, packaging technology requirement complicated and changeable is suitable for, improves its Technological adaptability.The transmission mechanism band in the presence of drive device
Dynamic operating platform common reciprocal movement, realizes the stretching motion controllability of operating platform, is easy to the pickup and bonding of chip, in addition
Under the real-time monitoring of control device, operating platform is stably and controllable to the pickup force and bonding force of chip, improves its performance accuracy.
Above-described is the preferred embodiment of the present invention, it should be pointed out that is come for the ordinary person of the art
Say, some improvements and modifications can also be made under the premise of principle of the present invention is not departed from, and these improvements and modifications also exist
In protection scope of the present invention.
Claims (8)
1. a kind of chip heats bonding apparatus, it is characterised in that including：
Carry chip (1) and the operating platform (2) heated for it；
Transmission mechanism (3), the operating platform (2) are fixed on one end of the transmission mechanism (3)；
Stopping means (4), the other end of the transmission mechanism (3) are arranged in the stopping means (4)；
Drive device (5), it is arranged on the stopping means (4), the drive device (5) can drive the transmission mechanism (3)
Moved back and forth in the stopping means (4)；
Vacuum absorption device (6), the gas passage of the vacuum absorption device (6) are communicated to institute via the transmission mechanism (3)
Operating platform (2) is stated, the vacuum absorption device (6) can provide absorption affinity and blowback power to the chip (1)；And
Control device (7), including：Temperature conditioning unit (71) and control unit (72), wherein, it is real-time to monitor the operating platform (2)
The temperature conditioning unit (71) of temperature is connected with the operating platform (2), controls the control unit of the drive device (5) working condition
(72) it is connected with the drive device (5)；
Wherein, the operating platform (2) includes：
The nozzle head (21) of the chip (1) is carried, the nozzle head (21) is provided with first gas passage；
For the heat block (22) of the chip (1) heating, the heat block (22) is provided with second gas passage, the nozzle head
(21) one end is arranged in the second gas passage, and the first gas passage connects with the second gas passage；With
And
Multiple regulation springs (23), one end of the regulation spring (23) are fixed on the heat block (22), the regulation bullet
The other end of spring (23) is fixed on the stopping means (4).
2. chip according to claim 1 heats bonding apparatus, it is characterised in that the heat block (22) includes at least one
Individual dismountable heating rod (221), and the temperature sensor (222) of detection heating rod (221) temperature；Wherein, it is described
Heating rod (221) and the temperature sensor (222) are connected with the temperature conditioning unit (71) respectively.
3. chip according to claim 1 heats bonding apparatus, it is characterised in that the regulation spring (23) adds with described
One end of hot block (22) connection is provided with an adjusting screw (24), and the regulation bullet is adjusted by adjusting the adjusting screw (24)
The decrement of spring (23).
4. chip according to claim 1 heats bonding apparatus, it is characterised in that the transmission mechanism (3) is a spline
Axle, third gas passage is offered on the splined shaft, wherein, the heat block (22) is fixed in one end of the splined shaft
On, and the third gas passage is connected with the second gas passage.
5. chip according to claim 4 heats bonding apparatus, it is characterised in that the stopping means (4) includes：
The first cavity structure (41) in axial direction set, the splined shaft are worn relative to the one end of the heat block (22)
In in first cavity structure, and the splined shaft can move in first cavity structure；
For limiting the limited block (42) of the spline axial displacement；And
The second cavity structure (43) radially set, one end of the vacuum absorption device (6) are arranged at described second
In cavity structure (43).
6. chip according to claim 5 heats bonding apparatus, it is characterised in that the end of first cavity structure (41)
Portion is provided with the spline tooth being meshed with the splined shaft, and the splined shaft can be by spline fitted in first cavity structure
(41) internal rotation.
7. chip according to claim 5 heats bonding apparatus, it is characterised in that the drive device (5) includes：
The solenoid (51) of linear motion power is provided for the transmission mechanism (3), the solenoid (51) is around described first
Cavity structure (41) is arranged on the stopping means (4), and the solenoid (51) is connected with described control unit (72)；With
And
The electric rotating machine (52) of rotary power is provided for the transmission mechanism (3), connected by flange and the stopping means (4)
Connect.
8. chip according to claim 5 heats bonding apparatus, it is characterised in that the vacuum absorption device (6) includes：
Vacuum generator (61) and air compressor (62)；And
Tracheae (63), one end of the tracheae (63) pass through magnetic valve and the vacuum generator (61) and the air compressor
(62) it is connected；The other end of the tracheae (63) is arranged in second cavity structure (43), and the gas of the tracheae (63)
Body passage is connected with the third gas passage.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915928.7A CN105448781B (en) | 2015-12-10 | 2015-12-10 | A kind of chip heats bonding apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510915928.7A CN105448781B (en) | 2015-12-10 | 2015-12-10 | A kind of chip heats bonding apparatus |
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| CN105448781A CN105448781A (en) | 2016-03-30 |
| CN105448781B true CN105448781B (en) | 2017-12-08 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107293504B (en) * | 2016-03-31 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Bonding heating control device and method thereof |
| CN106984369B (en) * | 2017-04-26 | 2019-09-20 | 广东工业大学 | A kind of micro-fluidic chip bonding apparatus |
| CN107293512B (en) * | 2017-08-05 | 2023-12-05 | 广州明森科技股份有限公司 | Chip packaging device of multi-core smart card |
| CN112018018A (en) * | 2019-12-20 | 2020-12-01 | 东莞市中帆新材料科技有限公司 | Wearable multi-size universal processing platform for chips |
| CN115662923B (en) * | 2022-11-14 | 2023-11-07 | 沈阳恒进真空科技有限公司 | Anode bonding device |
| CN116190273B (en) * | 2023-03-01 | 2023-11-21 | 苏州联讯仪器股份有限公司 | Adsorption type chip carrying device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5973753B2 (en) * | 2012-03-08 | 2016-08-23 | 東レエンジニアリング株式会社 | Chip delivery jig and chip delivery method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
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Granted publication date: 20171208 Termination date: 20191210 |