CN105407656A - Method of manufacturing interlayer interconnect structure of printed circuit board and printed circuit board - Google Patents
Method of manufacturing interlayer interconnect structure of printed circuit board and printed circuit board Download PDFInfo
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- CN105407656A CN105407656A CN201410466544.7A CN201410466544A CN105407656A CN 105407656 A CN105407656 A CN 105407656A CN 201410466544 A CN201410466544 A CN 201410466544A CN 105407656 A CN105407656 A CN 105407656A
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- copper foil
- hole
- connecting hole
- circuit board
- printed circuit
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Abstract
An embodiment of the invention discloses a method of manufacturing an interlayer interconnect structure of a printed circuit board and a printed circuit board. The method comprises the steps of opening non-deposit copper holes in a signal conducting region of an inner copper foil; filling the non-deposit copper holes with resin, and opening through holes in ports of the non-deposit copper holes filled with the resin; plating metal layers to walls of the through holes; opening first connecting holes in first control module regions preset on a first face of an outer copper foil from the outer copper foil to the inner copper foil until the first connecting holes come into contact with the inner copper foil; opening second connecting holes in second control module regions preset on a second face of the outer copper foil from the outer copper foil to the inner copper foil until the second connecting holes come into contact with the inner copper foil; and plating metal layers to walls of the first connecting holes and wall of the second connecting holes. The invention solves the problems of failure in conduction and interconnection among outer control modules and between the outer control modules and inner power modules when a PCB is densely wired with lots of through holes and thick copper foils in the prior art.
Description
Technical field
The present invention relates to PCB (Printedcircuitboard) printed circuit board and manufacture field, particularly relate to method and the printed circuit board of a kind of printed circuit board interlayer interconnect architecture manufacture.
Background technology
Along with components and parts to be welded future development towards densification, take wiring space limited, required circuit more crypto set, Copper Foil is more and more thicker, the method of general employing offers the PTH (PlatingThroughHole) that diameter is 0.15-0.35mm to sink copper hole to realize the conducting between outer field control module and the interconnected conducting between outer control module and internal layer power model, because internal layer copper is thicker, so the drill bit of minor diameter very easily causes fracture when running into thicker internal layer copper, thus small edge PTH hole cannot be adopted realize.
In prior art, the heavy copper hole of general employing 0.5mm or larger diameter realizes the interconnected conducting between ectonexine, to avoid the breaking of rod, but, because the wiring of pcb board is comparatively intensive, limited space, adopts large diameter heavy copper hole to take very large wiring space, and when making and more via intensive at circuit, the interconnected conducting of ectonexine cannot be realized.
Summary of the invention
A kind of method that the embodiment of the present invention provides printed circuit board interlayer interconnect architecture to manufacture and printed circuit board, can solve pcb board wiring congestion, via is more and Copper Foil is thicker time, the interconnected and outer control module of conducting between outer control module and the interconnected problem of the conducting between internal layer power model cannot be realized.
A kind of method that first aspect present invention provides printed circuit board interlayer interconnect architecture to manufacture, comprising:
Non-heavy copper hole is offered in the signal conduction region of internal layer Copper Foil;
In described non-heavy copper hole after potting resin, inner figure is transferred on described internal layer Copper Foil, and lamination is carried out to printed circuit board;
Via is offered in the port in the described non-heavy copper hole of potting resin;
At the hole wall metal cladding of described via;
In the first control module region of presetting of outer copper foil first surface, offer the first connecting hole from described outer copper foil inner layer Copper Foil, until touch described internal layer Copper Foil;
In the second control module region of presetting of outer copper foil second, offer the second connecting hole from described outer copper foil inner layer Copper Foil, until touch described internal layer Copper Foil;
At the hole wall of described first connecting hole and the hole wall metal cladding of described second connecting hole.
In conjunction with a first aspect of the present invention, in the embodiment of the present invention first aspect the first implementation in, the quantity of described via is equal with the quantity of the outer control module preset.
In conjunction with a first aspect of the present invention, in the embodiment of the present invention first aspect the second implementation in,
The diameter in described non-heavy copper hole is 0.3-0.85mm;
The diameter of described via is 0.15-0.35mm.
In conjunction with the first to the second implementation of a first aspect of the present invention, first aspect, in the embodiment of the present invention first aspect the third implementation in, the quantity of described first connecting hole is equal with the quantity of described via, and the quantity of described first connecting hole is equal with the quantity of described second connecting hole.
In conjunction with the first to the second implementation of a first aspect of the present invention, first aspect, in the embodiment of the present invention first aspect the 4th kind of implementation in, the degree of depth of described first connecting hole and the degree of depth of described second connecting hole are the default outer copper foil thickness to time outer copper foil.
In conjunction with the first to the second implementation of a first aspect of the present invention, first aspect, in the embodiment of the present invention first aspect the 5th kind of implementation in, described in described non-heavy copper hole after potting resin, also comprise before inner figure being transferred on described internal layer Copper Foil:
Remove the resin of described second dissipating vias excess surface;
Precuring is carried out to described second dissipating vias.
Second aspect present invention provides a kind of printed circuit board, and described printed circuit board is provided with non-heavy copper hole, via, the first connecting hole and the second connecting hole;
Described non-heavy copper hole is opened in the signal conduction region of internal layer Copper Foil;
Described via is opened in the port in the described non-heavy copper hole of potting resin;
Described first connecting hole is blind hole, till passing to described internal layer Copper Foil, in the first control module region of presetting of outer copper foil first surface;
Described first connecting hole is blind hole, till passing to described internal layer Copper Foil, is positioned at the second control module region of presetting of outer copper foil second.
Wherein, the quantity of described via is equal with the quantity of the outer control module preset;
The diameter in described non-heavy copper hole is 0.3-0.85mm; ;
The diameter of described via is 0.15-0.35mm.
The equal metal cladding of hole wall of the hole wall of described via, the hole wall of the first connecting hole and the second connecting hole.
The degree of depth of described first connecting hole and the degree of depth of described second connecting hole are the default outer copper foil thickness to this outer copper foil.
As can be seen from the above technical solutions, in the embodiment of the present invention, by offering non-heavy copper hole on the signal conduction region of internal layer Copper Foil, cause every empty effect, the breaking of rod can not be there is when making the follow-up port in the non-heavy copper hole of potting resin offer via, the first connecting hole is offered in the first control module region, the second connecting hole is offered in the second control module region, make via, first connecting hole and the second connecting hole is interconnected communicates, solve the wiring congestion at pcb board in prior art, when via is more and Copper Foil is thicker, interconnected and the outer control module of conducting between outer control module and the interconnected problem of the conducting between internal layer power model cannot be realized.
Accompanying drawing explanation
Fig. 1 is the generalized section after offering non-heavy copper hole in the present embodiment;
Fig. 2 is the generalized section in the present embodiment in non-heavy copper hole after potting resin;
Fig. 3 is the generalized section after making inner figure-lamination in the present embodiment;
Fig. 4 is the generalized section after offering via in the present embodiment;
Fig. 5 is the generalized section after offering the first connecting hole and the second connecting hole in the present embodiment;
Fig. 6 is the generalized section in the present embodiment after via, the first connecting hole and the second connecting hole metal cladding;
Fig. 7 is the method one embodiment schematic diagram that in the present embodiment, a kind of printed circuit board interlayer interconnect architecture manufactures.
In accompanying drawing, the parts representated by each label are as follows:
1, non-heavy copper hole, 2, via, the 3, first connecting hole, the 4, second connecting hole.
Embodiment
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those skilled in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Term " first ", " second ", " the 3rd " " 4th " etc. in specification of the present invention and claims and above-mentioned accompanying drawing are for distinguishing similar object, and need not be used for describing specific order or precedence.The embodiments described herein should be appreciated that the data used like this can be exchanged in the appropriate case, so that can be implemented with the order except the content except here diagram or description.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, such as, contain those steps or unit that the process of series of steps or unit, method, system, product or equipment is not necessarily limited to clearly list, but can comprise clearly do not list or for intrinsic other step of these processes, method, product or equipment or unit.
Embodiments provide a kind of method that printed circuit board interlayer interconnect architecture manufactures, for solve pcb board wiring congestion, via is more and Copper Foil is thicker time, the interconnected and outer control module of conducting between outer control module and the interconnected problem of the conducting between internal layer power model cannot be realized.
Please refer to Fig. 1 to Fig. 7, method embodiment of a kind of printed circuit board interlayer interconnect architecture manufacture in the embodiment of the present invention comprises:
101, on the signal conduction region of internal layer Copper Foil, non-heavy copper hole is offered;
Wherein, the diameter in non-heavy copper hole obtains according to the preset diameters of via, it should be noted that, the diameter in non-heavy copper hole has more 0.15-0.5mm than the diameter of the via preset, such as: when the diameter of via is between 0.15-0.35mm, this non-heavy copper hole diameter between 0.30-0.85mm;
In addition, the object offering non-heavy copper hole is to cut off thicker internal layer Copper Foil.
102, potting resin in non-heavy copper hole;
In non-heavy copper hole after potting resin, remove the resin of the second dissipating vias excess surface, and precuring is carried out to the second dissipating vias, then inner figure is transferred on internal layer Copper Foil, and lamination is carried out to printed circuit board;
The object of potting resin in order to cause the effect every sky, with make follow-up offer via over the resin time, bore position there will not be super-thick copper region, thus avoids the problem that there will be the breaking of rod when the via that drill diameter is very little.
103, via is offered in the port in the non-heavy copper hole of potting resin;
The quantity of via is equal with the quantity of the outer control module preset or default internal layer power model;
The diameter of via is between 0.15-0.35mm.
104, at the hole wall metal cladding of via;
105, in the first control module region of presetting of outer copper foil first surface, the first connecting hole is offered from outer copper foil inner layer Copper Foil;
When offering hole, until stop boring when touching internal layer Copper Foil, form blind hole.
106, in the second control module region of presetting of outer copper foil second, the second connecting hole is offered from outer copper foil inner layer Copper Foil;
When offering hole, until stop boring when touching internal layer Copper Foil, form blind hole.
The quantity of the first connecting hole is equal with the quantity of via, and the quantity of the first connecting hole is equal with the quantity of the second connecting hole.
It should be noted that, the degree of depth of the first connecting hole and the degree of depth of the second connecting hole obtain according to the thickness of the outer copper foil preset and internal substrate, when machine drilling and laser drill, decide according to the thickness of pre-set substrate and the thickness of outer copper foil, concrete bore mode is all not construed as limiting herein, in practice, boring is only needed just to touch internal layer Copper Foil, concrete drilling depth only otherwise bore empty monoblock printed circuit board, is all not construed as limiting drilling depth herein.
107, at the hole wall of the first connecting hole and the hole wall metal cladding of the second connecting hole;
After the hole wall of the first connecting hole and the hole wall metal cladding of the second connecting hole, make interconnected conducting between outer control module and internal layer power model.
In the embodiment of the present invention, by offering non-heavy copper hole on the signal conduction region of internal layer Copper Foil, cause every empty effect, the breaking of rod can not be there is when making the follow-up port in the non-heavy copper hole of potting resin offer via, the first connecting hole is offered in the first control module region, the second connecting hole is offered in the second control module region, make via, first connecting hole and the second connecting hole is interconnected communicates, solve the wiring congestion at pcb board in prior art, when via is more and Copper Foil is thicker, interconnected and the outer control module of conducting between outer control module and the interconnected problem of the conducting between internal layer power model cannot be realized.
Above the method for a kind of printed circuit board interlayer interconnect architecture manufacture is described in detail, start below to be described in detail a kind of printed circuit board, this printed circuit board is provided with non-heavy copper hole, via, the first connecting hole and the second connecting hole, refer to Fig. 1 to Fig. 6, an a kind of embodiment of printed circuit board in the embodiment of the present invention, comprising:
Printed circuit board is provided with non-heavy copper hole 1, via 2, first connecting hole 3 and the second connecting hole 4;
Non-heavy copper hole 1 is opened in the signal conduction region of internal layer Copper Foil;
Via 2 is opened in the port in the non-heavy copper hole of potting resin;
Wherein, the quantity of via can obtain according to the quantity of the outer control module preset and the internal layer power model of presetting, and generally, the quantity of via is equal with the quantity of the outer control module preset or default internal layer power model;
The diameter in non-heavy copper hole is 0.3-0.85mm;
The diameter of via is 0.15-0.35mm.
First connecting hole 3, for being blind hole, till passing to described internal layer Copper Foil, is positioned at the first control module region of presetting of outer copper foil first surface;
First connecting hole 4, for being blind hole, till passing to described internal layer Copper Foil, is positioned at the second control module region of presetting of outer copper foil second.
Wherein, the degree of depth of the first connecting hole and the degree of depth of the second connecting hole are the default outer copper foil thickness to time outer copper foil.
The equal metal cladding of hole wall of the hole wall of via 2, the hole wall of the first connecting hole 3 and the second connecting hole 4.
In the embodiment of the present invention, by have employed the non-heavy copper hole 1 offered on the signal conduction region of internal layer Copper Foil, cause every empty effect, the breaking of rod can not be there is when making the follow-up port in the non-heavy copper hole of potting resin offer via, the first connecting hole 3 offered in the first control module region, the second connecting hole 4 offered in the second control module region, make via 2, first connecting hole 3 and the second connecting hole 4 is interconnected communicates, solve the wiring congestion at pcb board in prior art, when via is more and Copper Foil is thicker, interconnected and the outer control module of conducting between outer control module and the interconnected problem of the conducting between internal layer power model cannot be realized.
Be described in detail one provided by the present invention above, apply specific case herein and set forth principle of the present invention and execution mode, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, to sum up, this description should not be construed as limitation of the present invention.
Claims (10)
1. a method for printed circuit board interlayer interconnect architecture manufacture, is characterized in that, comprising:
Non-heavy copper hole is offered in the signal conduction region of internal layer Copper Foil;
In described non-heavy copper hole after potting resin, inner figure is transferred on described internal layer Copper Foil, and lamination is carried out to printed circuit board;
Via is offered in the port in the described non-heavy copper hole of potting resin;
At the hole wall metal cladding of described via;
In the first control module region of presetting of outer copper foil first surface, offer the first connecting hole from described outer copper foil inner layer Copper Foil, until touch described internal layer Copper Foil;
In the second control module region of presetting of outer copper foil second, offer the second connecting hole from described outer copper foil inner layer Copper Foil, until touch described internal layer Copper Foil;
At the hole wall of described first connecting hole and the hole wall metal cladding of described second connecting hole.
2. method according to claim 1, is characterized in that, the quantity of described via is equal with the quantity of the outer control module preset or default internal layer power model.
3. method according to claim 2, is characterized in that, the diameter in described non-heavy copper hole is 0.3-0.85mm;
The diameter of described via is 0.15-0.35mm.
4., according to the arbitrary described method of claims 1 to 3, it is characterized in that, the quantity of described first connecting hole is equal with the quantity of described via, and the quantity of described first connecting hole is equal with the quantity of described second connecting hole.
5. according to the arbitrary described method of claims 1 to 3, it is characterized in that, the degree of depth of described first connecting hole and the degree of depth of described second connecting hole are the default outer copper foil thickness to secondary outer copper foil.
6. according to the arbitrary described method of claims 1 to 3, it is characterized in that, describedly after potting resin, also to comprise before inner figure being transferred on described internal layer Copper Foil in described non-heavy copper hole:
Remove the resin of described second dissipating vias excess surface;
Precuring is carried out to described second dissipating vias.
7. a printed circuit board, is characterized in that, described printed circuit board is provided with non-heavy copper hole, via, the first connecting hole and the second connecting hole;
Described non-heavy copper hole is opened in the signal conduction region of internal layer Copper Foil;
Described via is opened in the port in the described non-heavy copper hole of potting resin;
Described first connecting hole is blind hole, till passing to described internal layer Copper Foil, is positioned at the first control module region of presetting of outer copper foil first surface;
Described second connecting hole is blind hole, till passing to described internal layer Copper Foil, is positioned at the second control module region of presetting of outer copper foil second.
8. printed circuit board according to claim 7, is characterized in that, the quantity of described via is equal with the quantity of the outer control module preset or default internal layer power model;
The diameter in described non-heavy copper hole is 0.3-0.85mm;
The diameter of described via is 0.15-0.35mm.
9. the printed circuit board according to claim 7 or 8, is characterized in that, the equal metal cladding of hole wall of the hole wall of described via, the hole wall of the first connecting hole and the second connecting hole.
10. the printed circuit board according to claim 7 or 8, is characterized in that, the degree of depth of described first connecting hole and the degree of depth of described second connecting hole are the default outer copper foil thickness to time outer copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410466544.7A CN105407656B (en) | 2014-09-12 | 2014-09-12 | A kind of method and printed circuit board of the manufacture of printed circuit board interlayer interconnection architecture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410466544.7A CN105407656B (en) | 2014-09-12 | 2014-09-12 | A kind of method and printed circuit board of the manufacture of printed circuit board interlayer interconnection architecture |
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| CN105407656A true CN105407656A (en) | 2016-03-16 |
| CN105407656B CN105407656B (en) | 2018-08-07 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163083A (en) * | 2016-06-30 | 2016-11-23 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052264B (en) * | 2012-12-03 | 2015-04-22 | 深圳崇达多层线路板有限公司 | Pressing method for sandwich aluminum-base printed circuit board |
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2014
- 2014-09-12 CN CN201410466544.7A patent/CN105407656B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163083A (en) * | 2016-06-30 | 2016-11-23 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN106163083B (en) * | 2016-06-30 | 2017-08-15 | 广州番禺运升电路版有限公司 | A kind of Printed circuit board and manufacturing methods |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
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| Publication number | Publication date |
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| CN105407656B (en) | 2018-08-07 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |