CN105392299A - 一种改善pcb减铜均匀性的方法 - Google Patents
一种改善pcb减铜均匀性的方法 Download PDFInfo
- Publication number
- CN105392299A CN105392299A CN201510849051.6A CN201510849051A CN105392299A CN 105392299 A CN105392299 A CN 105392299A CN 201510849051 A CN201510849051 A CN 201510849051A CN 105392299 A CN105392299 A CN 105392299A
- Authority
- CN
- China
- Prior art keywords
- copper
- corrosion preventing
- preventing layer
- layers
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510849051.6A CN105392299B (zh) | 2015-11-27 | 2015-11-27 | 一种改善pcb减铜均匀性的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510849051.6A CN105392299B (zh) | 2015-11-27 | 2015-11-27 | 一种改善pcb减铜均匀性的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105392299A true CN105392299A (zh) | 2016-03-09 |
CN105392299B CN105392299B (zh) | 2018-08-03 |
Family
ID=55424008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510849051.6A Active CN105392299B (zh) | 2015-11-27 | 2015-11-27 | 一种改善pcb减铜均匀性的方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105392299B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107072074A (zh) * | 2017-02-24 | 2017-08-18 | 华为机器有限公司 | 一种用于印刷电路板pcb的散热孔的加工方法 |
CN109246942A (zh) * | 2018-10-19 | 2019-01-18 | 高德(江苏)电子科技有限公司 | 一种干膜盖孔去除印刷线路板表层铜厚的加工工艺 |
CN110392488A (zh) * | 2019-06-26 | 2019-10-29 | 深圳市景旺电子股份有限公司 | 高频线路板制造方法 |
CN116156779A (zh) * | 2023-04-20 | 2023-05-23 | 圆周率半导体(南通)有限公司 | 一种改善pcb板铜厚均匀性的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101219423B1 (ko) * | 2011-07-05 | 2013-01-11 | 대덕전자 주식회사 | 동판 코어와 절연층 간의 밀착력 개선방법 |
CN103533766A (zh) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | 电路板的制作方法以及该方法制得的电路板 |
CN104053305A (zh) * | 2013-03-13 | 2014-09-17 | 北大方正集团有限公司 | 一种印制线路板及其制作方法 |
-
2015
- 2015-11-27 CN CN201510849051.6A patent/CN105392299B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101219423B1 (ko) * | 2011-07-05 | 2013-01-11 | 대덕전자 주식회사 | 동판 코어와 절연층 간의 밀착력 개선방법 |
CN104053305A (zh) * | 2013-03-13 | 2014-09-17 | 北大方正集团有限公司 | 一种印制线路板及其制作方法 |
CN103533766A (zh) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | 电路板的制作方法以及该方法制得的电路板 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107072074A (zh) * | 2017-02-24 | 2017-08-18 | 华为机器有限公司 | 一种用于印刷电路板pcb的散热孔的加工方法 |
CN107072074B (zh) * | 2017-02-24 | 2019-07-12 | 华为机器有限公司 | 一种用于印刷电路板pcb的散热孔的加工方法 |
CN109246942A (zh) * | 2018-10-19 | 2019-01-18 | 高德(江苏)电子科技有限公司 | 一种干膜盖孔去除印刷线路板表层铜厚的加工工艺 |
CN110392488A (zh) * | 2019-06-26 | 2019-10-29 | 深圳市景旺电子股份有限公司 | 高频线路板制造方法 |
CN116156779A (zh) * | 2023-04-20 | 2023-05-23 | 圆周率半导体(南通)有限公司 | 一种改善pcb板铜厚均匀性的方法 |
CN116156779B (zh) * | 2023-04-20 | 2023-07-07 | 圆周率半导体(南通)有限公司 | 一种改善pcb板铜厚均匀性的方法 |
Also Published As
Publication number | Publication date |
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CN105392299B (zh) | 2018-08-03 |
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Effective date of registration: 20220621 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |
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