CN105364641B - Micro- semi-ring cavity plate array polishing method and device - Google Patents
Micro- semi-ring cavity plate array polishing method and device Download PDFInfo
- Publication number
- CN105364641B CN105364641B CN201510804387.0A CN201510804387A CN105364641B CN 105364641 B CN105364641 B CN 105364641B CN 201510804387 A CN201510804387 A CN 201510804387A CN 105364641 B CN105364641 B CN 105364641B
- Authority
- CN
- China
- Prior art keywords
- polishing
- micro
- semi
- cavity plate
- ring cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
A kind of micro- semi-ring cavity plate array polishing method, comprises the following steps：1) the high uniformity polishing mould of ultraprecise is made, the upper end of instrument connecting rod is connected with fine ultrasonic generator, the lower end of the instrument connecting rod and positioning substrate connection, array aperture is processed on positioning substrate, pore size is less than precise sphere diameter, it is full of between aperture and precise sphere in binding agent, a part of embedded hole of spheroid；2) polishing liquid is full of between the high uniformity polishing mould of ultraprecise and substrate slice, the size of abrasive particle contained by polishing liquid is nanoscale, polishing mould is doing the fine ultrasonic vibration of high frequency in slight distance above substrate slice, ultrasonic vibration excites the abrasive particle high speed impact substrate slice in polishing liquid, polishing mould does downwards the feed motion of setting speed in Z-direction, realizes that the material of micro- semi-ring cavity plate array is removed.And a kind of micro- semi-ring cavity plate array grinding and polishing device is provided.The polishing effect of the present invention：High efficiency, high form accuracy, high shape coincidence, low surface roughness, great surface quality.
Description
Technical field
The invention belongs to Ultra-precision Turning field, it is related to a kind of micro- semi-ring cavity plate array polishing method and device.
Background technology
Hemispherical reso nance gyroscope is a kind of new inertial sensor, is had many advantages, such as compared with mechanical gyro.Macro-scale
Hemispherical reso nance gyroscope precision reached inertia rank, start to be applied to aviation, weapons and space inertial navigation system, but due to yardstick
It is big to cause big volume, quality weight, power consumption high, and Ultraprecision Machining is highly dependent on, greatly limit it should
With.MEMS gyro has the advantages that size is small, lightweight, low in energy consumption, but existing MEMS gyro is unable to reach inertia class precision
Higher tactics class precision, it is impossible to apply in the high occasion of required precision, for example, provide short distance for aircraft in GPS blind areas and lead
Boat.MEMS gyro precision it is not high main reason is that：Existing MEMS element processing method, such as chemical attack, etching, photoetching
Transfer etc., mostly 2D or 2.5D structure, the component quality and material skewness of the processing of these methods cause top
Matching is poor between spiral shell induction frequencies and driving so that the precision of MEMS gyro is extremely restricted.In order to lift MEMS gyro
Precision, domestic and foreign scholars start to be directed to study 3D structure MEMS hemispherical reso nance gyroscopes, and the part of this gyro most critical is
The small hemisphere film shell of high accuracy on the micro- semi-ring cavity plate of crystalline material is deposited on, research has shown that to be based on chemical vapor deposition
The polycrystalline diamond films resonator quality factor of (chemical vapor deposition, CVD) is significantly larger than same structure
Silicon materials resonator.However, to rely on the form accuracy of its " parent " micro- semi-ring cavity plate, surface thick for the precision of the micro- hemispherical Shells of CVD
Rugosity and surface quality.At present, the processing method of the micro- semi-ring cavity plate of single crystal silicon material has：From 2D the and 2.5D structures of traditional MEMS
Three-dimensional structure processing method that manufacture method is expanded, fine EDM processing, micro- Milling Process, fine ultrasound layering processing.Extremely
The present, these reported processing methods can not also meet wanting for monocrystalline silicon hard crisp micro- semi-ring cavity plate machining accuracy and processing efficiency
Ask, be primarily due to：(1) traditional MEMS micro Process-method such as wet chemical etch and dry plasma etch, is tied from 2D
During structure extends to 3D structures, all it is difficult to break away from crystallographic direction and the selective problems of mask material, it is impossible to which processing is provided
There is high symmetry uniform micro- semi-ring cavity plate consistent with material, such a method processes micro- semi-ring cavity plate low precision, and efficiency is low.
(2) micro EDM (μ EDM) micro- semi-ring cavity plate, because discharge space is small, it is desirable to which the precision of process equipment is high, it is difficult to
The high electrode of form accuracy is produced, and tool-electrode weares and teares quickly in process, the micro- semi-ring cavity plate processed
Surface quality is poor, and form accuracy is not high.(3) the micro- semi-ring cavity plate of micro- Milling Process, when material fragility is removed, due to Milling Process
The weakness of itself, cause at the top of micro- semi-ring cavity plate or bottom often occur burst apart, surface and sub-surface damage, it is difficult to meet
Processing request, when using plastic extension Milling Process, processing efficiency and yield rate are extremely low.(4) ultrasound and micro tool are utilized
The micro- semi-ring cavity plate of layering processing, because the abrasion of micro tool is difficult to Accurate Prediction and control, thus layering feeds path and is difficult to
Make rational planning for, cause micro- semi-ring cavity plate form accuracy poor, and processing efficiency is low.(5) method of other electric machining micro-structurals,
Such as Electrolyzed Processing, limited by single crystal silicon material electric conductivity, it is difficult to the processing for micro- semi-ring cavity plate.To sum up, due to can not
The micro- semi-ring cavity plate of high-quality resonant gyroscope monocrystalline silicon is processed, there is not been reported so far develops the MEMS of inertia dimension accuracy
Hemispherical reso nance gyroscope.
The content of the invention
In order to overcome the micro- semi-ring cavity plate of existing resonant gyroscope can not realize high form accuracy, low surface roughness, high surface
Quality, high efficiency processing deficiency, the invention provides a kind of high form accuracy, low surface roughness, great surface quality, efficiently
The micro- semi-ring cavity plate array polishing method and device of rate.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of micro- semi-ring cavity plate array polishing method, the polishing method comprises the following steps：
1) the high uniformity polishing mould of ultraprecise is made
The polishing mould includes instrument connecting rod, positioning substrate, connection colloid, spacing back-up ring, precise sphere, instrument connecting rod
Upper end is connected with fine ultrasonic generator, lower end and the positioning substrate connection of the instrument connecting rod, is processed on positioning substrate
Go out array aperture, pore size is less than precise sphere diameter, and binding agent, one of spheroid are full of between aperture and precise sphere
Divide in embedded hole；
2) polishing liquid, the size of abrasive particle contained by polishing liquid are full of between the high uniformity polishing mould of ultraprecise and substrate slice
For nanoscale, polishing mould is excited in polishing liquid doing the fine ultrasonic vibration of high frequency, ultrasonic vibration above substrate slice in slight distance
Abrasive particle high speed impact substrate slice, situation about being removed according to material, polishing mould Z-direction do downwards setting speed feeding fortune
It is dynamic, scraped in abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, polishing mould under compound action, realize the material of micro- semi-ring cavity plate array
Material is removed.
Further, the step 1) in, spacing back-up ring has been bonded on positioning substrate, has been put down when spacing back-up ring touches workpiece
Face, the downward feed motion of Z axis stops.
Further, the step 1) in, the assembly method of the high uniformity polishing mould of ultraprecise is as follows：By array hole
Interior uniform smearing water proofing property binding agent, polishing mould is inverted, using accurate pressing plate vertical depression precise sphere, due to precise sphere
Water proofing property binding agent is full of between aperture, pressure at right angle adjusts the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end
Peak is generally aligned in the same plane.
The step 1) in, the assembly method of the high uniformity polishing mould of ultraprecise is as follows：To uniformly it be applied in array hole
Smear water proofing property binding agent, polishing mould be inverted, using accurate pressing plate vertical depression precise sphere, due to precise sphere and aperture it
Between be full of water proofing property binding agent, pressure at right angle adjusts the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak position
In same plane；
For spacing back-up ring assembling mode, using the accurate spacing back-up ring of pressing plate vertical depression with array hole so that limit
Ring cross-section completes the assembling of spacing back-up ring in a plane on the back-up ring of position.
Situation is removed according to material and the pre- allowance subsequently polished adjusts the height of spacing back-up ring.
The precise sphere uses traditional plasticity spheroid, and material is that steel alloy and special type are firm；
Either：The precise sphere uses spheres of ceramic.
The polishing liquid uses the HNA solution of extremely low concentration, it is ensured that corruption of the HNA solution under normal temperature condition to workpiece material
Lose speed and be less than 2-3 μm/min, using the micro-elastic polishing mould for being moistened with HNA solution, the micro- semi-ring cavity plate created to processing
Each micro- semi-ring cavity plate in array carries out of short duration polishing, and molding surface roughness can be improved rapidly.
A kind of micro- semi-ring cavity plate array grinding and polishing device, including the main feed mechanism of lathe bed, Z-direction, Z-direction micrometer feed machine
Structure, fine ultrasonic vibration installation, adjustable fine supersonic generator, tool coupling device, ultraprecise polishing mould, the feeding of polishing liquid
With the circulatory system, sensor connecting plate, force snesor and XY worktable, the main feed mechanism of Z-direction is arranged on lathe bed, institute
Z-direction micrometer feed mechanism is stated on the main feed mechanism of the Z-direction, the Z-direction micrometer feed mechanism surpasses with fine
Acoustic vibration device is connected, and the control end of the fine ultrasonic vibration installation is connected with the adjustable fine supersonic generator, institute
The motion end for stating fine ultrasonic vibration installation is connected by ultraprecise polishing mould described in tool coupling device, the ultraprecise polishing
The arranged beneath XY worktable of mould, is on processing stations, the processing stations between the ultraprecise polishing mould and XY worktable
The polishing liquid feeding and the circulatory system, the polishing liquid feeding and circulatory system bottom install sensor connecting plate, institute are installed
Sensor connecting plate is stated to be connected with force snesor；
The polishing mould includes instrument connecting rod, positioning substrate, connection colloid, spacing back-up ring, precise sphere, instrument connecting rod
Upper end is connected with fine ultrasonic generator, lower end and the positioning substrate connection of the instrument connecting rod, is processed on positioning substrate
Go out array aperture, pore size is less than precise sphere diameter, and binding agent, one of spheroid are full of between aperture and precise sphere
Divide in embedded hole.
Described device also includes workbench, computer control system and distribution system, and the lathe bed is arranged on the work
Make on platform, the main feed mechanism of Z-direction, Z-direction micrometer feed mechanism, adjustable fine supersonic generator, force snesor
It is connected with XY worktable with the computer control system, the adjustable fine supersonic generator connects with the distribution system
Connect.
The present invention technical concept be：By micro- ultrasonic vibration of ultraprecise array polishing mould, polishing mould and nick are excited
The nanoscale abrasive particle in polishing liquid between mould substrate work pieces (functional crystal such as monocrystalline silicon, sapphire), high speed impact cavity plate lining
Substrate work pieces are carried out material removal, are substantially improved micro- by the compound action such as bottom and adjoint ultrasonic cavitation, the scraping of polishing mould, hammering
The processing efficiency of semi-ring cavity plate, it is ensured that the uniformity of geometry between the uniformity of cavity plate radius of a circle and different cavity plates is right
The cavity plate machined can realize Nanoscale Surface roughness using the polishing of flexible body chemical reagent.
Beneficial effects of the present invention are mainly manifested in：High form accuracy, low surface roughness, high shape coincidence, high table
Face quality, high efficiency.
Brief description of the drawings
Fig. 1 is the schematic diagram of micro- semi-ring cavity plate array polishing method.
Fig. 2 is the structure chart of array polishing mould.
Fig. 3 is the assembling schematic diagram of polishing mould assembling.
Fig. 4 is the structural representation of micro- semi-ring cavity plate array grinding and polishing device.
Fig. 5 is the structural representation and schematic diagram of micro- semi-ring cavity plate array grinding and polishing device.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
A kind of 1~Fig. 5 of reference picture, micro- semi-ring cavity plate array polishing method, the polishing method comprises the following steps：
1) the high uniformity polishing mould of ultraprecise is made
The polishing mould include instrument connecting rod 71, positioning substrate 72, precise sphere 75, the upper end of instrument connecting rod 71 with it is fine
Ultrasonic generator is connected, and the lower end of the instrument connecting rod 71 is connected with positioning substrate 72, is processed and is entered the arena on positioning substrate 72
Aperture is arranged, pore size is less than precise sphere diameter, and binding agent, a part for spheroid are full of between aperture and precise sphere 75
In embedded hole；
2) polishing liquid, the size of abrasive particle contained by polishing liquid are full of between the high uniformity polishing mould of ultraprecise and substrate slice
For nanoscale, polishing mould is excited in polishing liquid doing the fine ultrasonic vibration of high frequency, ultrasonic vibration above substrate slice in slight distance
Abrasive particle high speed impact substrate slice, situation about being removed according to material, polishing mould Z-direction do downwards setting speed feeding fortune
It is dynamic, scraped in abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, polishing mould under compound action, realize the material of micro- semi-ring cavity plate array
Material is removed.
In the present embodiment, micro- semi-ring cavity plate array, certain thickness crystalline material (monocrystalline silicon, sapphire, ruby,
Carborundum) on substrate slice, the micro- semi-ring cavity plate to be formed is removed by material, geometry is generally spherical crown, but is not limited to spherical crown, several
What profile maximum cross-section diameter (or 2 ultimate range on maximum secting area) scope is 0.2mm to 10mm, if cavity plate is spherical crown
Shape structure, it is desirable to which, with splendid form accuracy (sphericity), cavity plate edge is located at substrate top surface, edge radius variable quantity △ R
Ratio between edge radius R levels off to 0 as far as possible, and shape has uniformity between the different cavity plates of same size.
To realize the array polishing of this micro- semi-ring cavity plate, its principle is：Make by oneself the high uniformity polishing mould of ultraprecise with
Polishing liquid is full of between substrate slice, the size of abrasive particle contained by polishing liquid is nanoscale, and polishing mould is small above substrate slice
The fine ultrasonic vibration of high frequency is done in distance (within generally 100 microns), ultrasonic vibration excites the abrasive particle high-speed punching in polishing liquid
Hit substrate slice, situation about being removed according to material, polishing mould does downwards the feed motion of certain speed in Z-direction, abrasive particle impact,
Under the compound actions such as ultrasonic cavitation, the hammering of polishing mould, the scraping of polishing mould, realize that the material of micro- semi-ring cavity plate array is removed.Due to
Polishing mould constitutes for array type precise spheroid, and precise sphere has high form accuracy and high geometry uniformity and high table
Surface roughness, thus can realize that micro- semi-ring cavity plate array material is removed, ensure that very high between each micro- semi-ring cavity plate
Shape coincidence, its process principle is as shown in Figure 1.
The high uniformity array polishing mode structure of ultraprecise and its assembly method are as shown in Figures 2 and 3.The structure master of polishing mould
Including：Instrument connecting rod 71, positioning substrate 72, connection colloid 73, spacing back-up ring 74, precise sphere 75, instrument connecting rod 71 with it is micro-
Thin ultrasonic generator is connected.Array aperture is processed on positioning substrate 72, pore size is less than the diameter of precise sphere 75,
It is full of between aperture and precise sphere 75 in binding agent, a part of embedded hole of spheroid, due to the size phase of all array apertures
Size between poor minimum and precise sphere diameter also differs very little, so insertion is highly basically identical after precision ball embedded hole,
Specific contour assembly method is described below.To prevent Z-direction from excessively, spacing back-up ring has been bonded on positioning substrate 5 to lower feeding
74, when spacing back-up ring 74 (flexible and with certain rigidity), workpiece planarization is touched, the downward feed motion of Z axis stops, according to material
Removal situation and the pre- allowance subsequently polished, the height of spacing back-up ring can be adjusted.The bottom surface covering of the positioning substrate 72
Connect colloid 73.
The assembly method of polishing mould is：Water proofing property binding agent is smeared by uniform in array hole, as shown in Figure 3 polishing mould is fallen
Put, using the splendid vertical depression precise sphere of accurate pressing plate 76 of flatness, due to being full of anti-between precise sphere 75 and aperture
Aqueous binders, pressure at right angle can adjust the thickness of water proofing property adhensive membrane, and then it is same to reach that spheroid upper end peak is located at
The purpose of one plane.Similar assembling mode is used for spacing back-up ring 74, using (array aperture size is more than with array hole
Bulb diameter) accurate pressing plate, the spacing back-up ring 74 of vertical depression so that on spacing back-up ring ring cross-section in a plane, complete
The assembling of spacing back-up ring.
To solve the wear problem of the high-accuracy spheroid of polishing mould in process, the technical scheme used includes：The
A kind of scheme, using traditional plasticity spheroid, material is that steel alloy and special type are firm, and experimental study shows, using steel alloy conduct
High-accuracy spheroid, when the processing of cavity plate array is carried out on monocrystalline silicon silicon chip, the appropriate adjustment price such as feed speed and supersonic frequency
Deng machined parameters, it is ensured that the wear extent of spheroid is less than 5%.Second scheme, patent of the present invention proposes higher using hardness
Spheres of ceramic as accurate polishing ball, its hardness order is：MOHSPrecision ball>MOHSAbrasive particle>MOHSWorkpiece, from the sequence of Mohs' hardness
On be readily appreciated that while effectively being processed to workpiece, the wear extent of precision ball will reduce.
The present invention realizes the high surface roughness of the small cavity plate of array, and method is：Using the HNA solution of extremely low concentration,
Ensure that HNA solution is less than 2-3 μm/min under normal temperature condition to the corrosion rate of workpiece material, using being moistened with the micro- of HNA solution
Small polishing mould (die size is less than cavity plate size), polished die form accuracy does not need special requirement, to previous step
Each the micro- semi-ring cavity plate processed in the micro- semi-ring cavity plate array created carries out of short duration polishing, and molding surface can be improved rapidly
Roughness.
Micro- semi-ring cavity plate array polishing is constituted as shown in Figure 4 and Figure 5.The parts mainly included are：1. lathe bed, 2.Z
The main feed mechanism in direction, the fine ultrasonic vibration installation of 3.Z directions micrometer feed mechanism 4., 5. adjustable fine supersonic generators,
6. tool coupling device, 7. ultraprecise polishing moulds, 8. polishing liquid are fed and the circulatory system, 9. realtime graphic microscopic systems, 10. works
Part, 11. sensor connecting plates, 12. force snesors, 13.XY workbench, 14. workbenches (being preferably marble platform), 15.
Computer control system, 16. distribution systems.Specific connected mode and processing method are：Lathe bed 1 is fixed in marble platform,
Marble platform has splendid vibrationproof performance, can isolate and reduce the vibration of external environment condition, and Z-direction feed mechanism is two-stage
Feeding, main feed mechanism 2 is arranged on lathe bed, and micrometer feed mechanism 3 is installed on main feed mechanism, is realized during actual processing
Two-stage is fed, and the precision of main feed mechanism is in micron order, and the precision of micrometer feed mechanism is up to nanoscale, fine ultrasonic vibration dress
Put 4 to be connected with micrometer feed mechanism 3, small ultrasonic vibration dress can be adjusted by adjusting the parameter of adjustable fine supersonic generator 5
Put 4 vibration frequency and amplitude, by tool coupling device 6, realize ultraprecise polishing mould 7 and fine ultrasonic vibration installation 4
Connection, polishing liquid feed system and the circulatory system 8 so that polishing liquid is uniformly distributed and followed bad between polishing mould 7 and workpiece 10.
During processing, while Z-direction two-stage is fed, the fine ultrasonic vibration of polishing mould is realized, this vibration causes abrasive particle with very high
Velocity shock workpiece surface, realizes that material is quickly gone under the comprehensive function of factor such as ultrasonic cavitation, the hammering of polishing mould, scraping in addition
Remove, realize micro- semi-ring cavity plate array Polishing machining., can be using trace particle stream field and abrasive particle while processing
Distribution and motion state are analyzed and tracked, when observing abrasive particle using PIV, it is necessary to manufacture same with workpiece to be processed
The acrylic transparent panel of geometry, the distribution of observation trace particle and can move shape from top and below the workpiece respectively respectively
State, also can carry out observation analysis using sudden strain of a muscle frequency camera device stream field and abrasive particle.According to processing request, real-time micro- system is utilized
The general shape of the micro- semi-ring cavity plate of the observation of system 9 and the state of wear of ultraprecise spheroid.Sensor connecting plate 11 is used to connect workpiece
10 and force snesor 12, sensor 12 is used for detecting whether the size and stopping means of operating force contact with workpiece, and XY works
Platform 13 is used for realizing the planar movement of workpiece, with meet processing different shape, different array arrangements, varying number array will
Ask, sensor 12 is fixed on above XY workbenches, feed speed, polishing of the computer control system to control processing unit (plant)
Power size, polishing liquid feed speed and other machined parameters, distribution system are used for whole machine tool system and fine ultrasonic wave
Generator is powered.
The present embodiment is comprehensive under self-control ultraprecise array polishing mould, the feeding of two-stage Z-direction, the collaboration of fine ultrasonic vibration
Collaborate field and abrasive particle field analysis, realize the efficient ultraprecise polishing of small cavity plate array.
Claims (10)
1. a kind of micro- semi-ring cavity plate array polishing method, it is characterised in that：The polishing method comprises the following steps：
1) the high uniformity polishing mould of ultraprecise is made
The polishing mould includes instrument connecting rod, positioning substrate, connection colloid, spacing back-up ring, precise sphere, the upper end of instrument connecting rod
It is connected with fine ultrasonic vibration installation, lower end and the positioning substrate connection of the instrument connecting rod are processed on positioning substrate
Array aperture, pore size is less than precise sphere diameter, and binding agent, a part for spheroid are full of between aperture and precise sphere
In embedded hole；
2) polishing liquid is full of between the high uniformity polishing mould of ultraprecise and substrate slice, the size of abrasive particle contained by polishing liquid is to receive
Meter level, polishing mould excites the mill in polishing liquid doing the fine ultrasonic vibration of high frequency, ultrasonic vibration above substrate slice in slight distance
Grain high speed impact substrate slice, situation about being removed according to material, polishing mould does the feed motion of setting speed in Z-direction, in abrasive particle
Impact, ultrasonic cavitation, the hammering of polishing mould, polishing mould are scraped under compound action, realize that the material of micro- semi-ring cavity plate array is removed.
2. a kind of micro- semi-ring cavity plate array polishing method as claimed in claim 1, it is characterised in that：The step 1) in,
Spacing back-up ring is bonded on positioning substrate, when spacing back-up ring touches workpiece planarization, the downward feed motion of Z axis stops.
3. a kind of micro- semi-ring cavity plate array polishing method as claimed in claim 1, it is characterised in that：The step 1) in,
The assembly method of the high uniformity polishing mould of ultraprecise is as follows：
Water proofing property binding agent is smeared by uniform in array hole, polishing mould is inverted, using accurate pressing plate vertical depression precise sphere,
Due to being full of water proofing property binding agent between precise sphere and aperture, pressure at right angle adjusts the thickness of water proofing property adhensive membrane, and then
Reach that spheroid upper end peak is generally aligned in the same plane.
4. a kind of micro- semi-ring cavity plate array polishing method as claimed in claim 2, it is characterised in that：The step 1) in,
The assembly method of the high uniformity polishing mould of ultraprecise is as follows：Water proofing property binding agent is smeared by uniform in array hole, by polishing
Mould is inverted, and using accurate pressing plate vertical depression precise sphere, due to being full of water proofing property binding agent between precise sphere and aperture, is hung down
Vertical compression power adjusts the thickness of water proofing property adhensive membrane, and then reaches that spheroid upper end peak is generally aligned in the same plane；
For spacing back-up ring assembling mode, using the accurate spacing back-up ring of pressing plate vertical depression with array hole so that limiting block
Ring cross-section completes the assembling of spacing back-up ring in a plane on circle.
5. a kind of micro- semi-ring cavity plate array polishing method as claimed in claim 3, it is characterised in that：Feelings are removed according to material
Condition and the pre- allowance subsequently polished adjust the height of spacing back-up ring.
6. a kind of micro- semi-ring cavity plate array polishing method as described in one of Claims 1 to 5, it is characterised in that：The essence
Close spheroid uses traditional plasticity spheroid, and material is steel alloy and special steel.
7. a kind of micro- semi-ring cavity plate array polishing method as described in one of Claims 1 to 5, it is characterised in that：The essence
Close spheroid uses spheres of ceramic.
8. a kind of micro- semi-ring cavity plate array polishing method as described in one of Claims 1 to 5, it is characterised in that：It is described to grind
Throw the HNA solution that liquid uses extremely low concentration, it is ensured that HNA solution is less than 2-3 μ under normal temperature condition to the corrosion rate of workpiece material
M/min, using the micro-elastic polishing mould for being moistened with HNA solution, to processing each in the micro- semi-ring cavity plate array created
Micro- semi-ring cavity plate carries out of short duration polishing, and molding surface roughness can be improved rapidly.
9. a kind of device for realizing micro- semi-ring cavity plate array polishing method as claimed in claim 1, it is characterised in that：It is described
Device includes lathe bed, the main feed mechanism of Z-direction, Z-direction micrometer feed mechanism, fine ultrasonic vibration installation, adjustable fine ultrasound
Wave producer, tool coupling device, ultraprecise polishing mould, the feeding of polishing liquid and the circulatory system, sensor connecting plate, force snesor
And XY worktable, the main feed mechanism of Z-direction is on lathe bed, and the Z-direction micrometer feed mechanism is arranged on the Z side
To on main feed mechanism, the Z-direction micrometer feed mechanism is connected with fine ultrasonic vibration installation, the fine ultrasonic vibration dress
The control end put is connected with the adjustable fine supersonic generator, and the motion end of the fine ultrasonic vibration installation passes through instrument
Attachment means are connected with the ultraprecise polishing mould, the arranged beneath XY worktable of the ultraprecise polishing mould, the ultraprecise
It is that the polishing liquid feeding and the circulatory system, institute are installed on processing stations, the processing stations between polishing mould and XY worktable
The feeding of polishing liquid and circulatory system bottom install sensor connecting plate are stated, the sensor connecting plate is connected with force snesor；
The polishing mould includes instrument connecting rod, positioning substrate, connection colloid, spacing back-up ring, precise sphere, the upper end of instrument connecting rod
It is connected with fine ultrasonic vibration installation, lower end and the positioning substrate connection of the instrument connecting rod are processed on positioning substrate
Array aperture, pore size is less than precise sphere diameter, and binding agent, a part for spheroid are full of between aperture and precise sphere
In embedded hole.
10. device as claimed in claim 9, it is characterised in that：Described device also includes workbench, computer control system
And distribution system, the lathe bed is on the workbench, the main feed mechanism of Z-direction, Z-direction micrometer feed machine
Structure, adjustable fine supersonic generator, force snesor and XY worktable are connected with the computer control system, described adjustable
Fine supersonic generator is connected with the distribution system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510804387.0A CN105364641B (en) | 2015-11-19 | 2015-11-19 | Micro- semi-ring cavity plate array polishing method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510804387.0A CN105364641B (en) | 2015-11-19 | 2015-11-19 | Micro- semi-ring cavity plate array polishing method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105364641A CN105364641A (en) | 2016-03-02 |
| CN105364641B true CN105364641B (en) | 2017-07-28 |
Family
ID=55367524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510804387.0A Active CN105364641B (en) | 2015-11-19 | 2015-11-19 | Micro- semi-ring cavity plate array polishing method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105364641B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370098A (en) * | 2019-05-30 | 2019-10-25 | 浙江工业大学 | Embedded ball mould Compostie abrasive particles polishing silicon dimple mode array method |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560607A (en) * | 2017-08-16 | 2018-01-09 | 浙江大学 | Gyroscope based on semi circular shells harmonic oscillator and preparation method thereof |
| CN109483394B (en) * | 2018-09-13 | 2023-12-12 | 西安航晨机电科技股份有限公司 | Ultra-precise spherical surface machining device and method for hemispherical harmonic oscillator |
| DE102019005294A1 (en) * | 2019-01-17 | 2020-07-23 | Schneider Gmbh & Co. Kg | Polishing tool and device for polishing a workpiece |
| CN110370099B (en) * | 2019-05-30 | 2021-01-29 | 浙江工业大学 | Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding |
| CN110355620B (en) * | 2019-05-30 | 2021-07-27 | 浙江工业大学 | Fenton-assisted rotary ultrasonic efficient polishing method for ceramic materials |
| CN110355619B (en) * | 2019-05-30 | 2020-09-01 | 浙江工业大学 | Cavitation-assisted micro-hemisphere concave die array polishing method under high temperature and high pressure |
| CN110340747B (en) * | 2019-05-30 | 2021-02-19 | 浙江工业大学 | Bubble-controlled micro-ultrasonic sphere emission profiling array polishing method and device |
| CN110238713B (en) * | 2019-05-30 | 2021-04-30 | 浙江工业大学 | Processing method of temperature-control pressure-control grinding and polishing micro-hemisphere concave die array |
| CN110340748A (en) * | 2019-05-30 | 2019-10-18 | 浙江工业大学 | A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array |
| CN110421413B (en) * | 2019-05-30 | 2021-05-14 | 浙江工业大学 | Method and device for preparing micro-hemispherical concave die array by Fenton multi-domain ultrasonic processing |
| CN110370100B (en) * | 2019-05-30 | 2020-11-03 | 浙江工业大学 | Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere |
| CN110370101B (en) * | 2019-05-30 | 2021-05-04 | 浙江工业大学 | Fenton auxiliary force control micro-hemisphere concave die array composite processing method |
| CN111390659A (en) * | 2020-04-30 | 2020-07-10 | 岭南师范学院 | Micro-channel ultrasonic machining device and method based on 3D printing mold |
| CN113172487A (en) * | 2021-04-21 | 2021-07-27 | 华中科技大学 | Vibratory ferrofluid ultra-precision polishing device and method with micron-scale functional structure |
| CN113523913B (en) * | 2021-07-12 | 2022-03-25 | 长春理工大学 | Ultrasonic energy beam-assisted high-efficiency low-damage ultra-precise polishing device and method |
| CN114523340B (en) * | 2022-02-22 | 2023-02-14 | 深圳大学 | Complete grinding and polishing equipment and grinding and polishing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093081A (en) * | 1996-05-09 | 2000-07-25 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
| JP2000052217A (en) * | 1998-08-10 | 2000-02-22 | Fanuc Ltd | Tool and processing method |
| GB2477557A (en) * | 2010-02-08 | 2011-08-10 | Qioptiq Ltd | Aspheric optical surface polishing tool with individually movable polishing pads |
| CN203357184U (en) * | 2013-06-18 | 2013-12-25 | 南通综艺新材料有限公司 | Polycrystalline silicon C-corner hairbrush polishing machine |
| CN203390714U (en) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | Wafer grinding device |
| CN203485018U (en) * | 2013-10-08 | 2014-03-19 | 中国电子科技集团公司第四十四研究所 | Array optical fiber grinding and polishing device |
| CN204604090U (en) * | 2015-03-26 | 2015-09-02 | 蓝思科技股份有限公司 | A kind of automatic rotary burnishing device |
-
2015
- 2015-11-19 CN CN201510804387.0A patent/CN105364641B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370098A (en) * | 2019-05-30 | 2019-10-25 | 浙江工业大学 | Embedded ball mould Compostie abrasive particles polishing silicon dimple mode array method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105364641A (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105364641B (en) | Micro- semi-ring cavity plate array polishing method and device | |
| CN105479275B (en) | A kind of micro- semi-ring cavity plate array micro ultrasound classification polishing method | |
| CN105364640B (en) | A kind of chemical mechanical classification composite manufacturing method of micro- semi-ring cavity plate array | |
| CN103722467B (en) | Hard brittle material grinding is crisp-and prolong conversion critical cutting depth and determine method and apparatus | |
| Liu et al. | Rotary ultrasonic face grinding of carbon fiber reinforced plastic (CFRP): a study on cutting force model | |
| CN108972302B (en) | Non-resonant vibration auxiliary polishing device and method | |
| CN103769959B (en) | A kind of ultrasonic micro- grinding equipment and technique | |
| CN110370099B (en) | Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding | |
| CN104002220A (en) | Device and method for single abrasive grain grinding experiments under assistance of ultrasonic vibration | |
| JP2006239813A (en) | Small multiaxis composite working machine and working method | |
| Yu et al. | The study of ultrasonic vibration assisted polishing optical glass lens with ultrasonic atomizing liquid | |
| CN106501883B (en) | A kind of micro-nano preparation method of high-precision microlens array structure | |
| CN205218689U (en) | Throwing device is ground to little semi -ring die array | |
| CN110340748A (en) | A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array | |
| JP2011245574A (en) | Two-dimensional (oval) ultrasonic-assisted chemical mechanical composite machining method and device | |
| CN203679976U (en) | Device for determining grinding brittle-ductile conversion critical cutting depth of hard and brittle material | |
| CN110370100B (en) | Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere | |
| CN110421413B (en) | Method and device for preparing micro-hemispherical concave die array by Fenton multi-domain ultrasonic processing | |
| CN110434754A (en) | A kind of mechanical milling tech of high-precision single-crystal diamond circular cone pressure head | |
| CN110238713B (en) | Processing method of temperature-control pressure-control grinding and polishing micro-hemisphere concave die array | |
| CN110315398B (en) | Micro-ultrasonic array sphere emission profiling constant force grinding and polishing method | |
| CN203843604U (en) | Ultrasonic micro-grinding equipment | |
| Wang et al. | Research on material removal of ultrasonic-magnetorheological compound finishing | |
| CN110355620B (en) | Fenton-assisted rotary ultrasonic efficient polishing method for ceramic materials | |
| CN110370098A (en) | Embedded ball mould Compostie abrasive particles polishing silicon dimple mode array method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |