CN205218689U - Throwing device is ground to little semi -ring die array - Google Patents
Throwing device is ground to little semi -ring die array Download PDFInfo
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- CN205218689U CN205218689U CN201520926620.8U CN201520926620U CN205218689U CN 205218689 U CN205218689 U CN 205218689U CN 201520926620 U CN201520926620 U CN 201520926620U CN 205218689 U CN205218689 U CN 205218689U
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Abstract
The utility model provides a throwing device is ground to little semi -ring die array, Z direction owner feed mechanism installs on the lathe bed, Z direction fine motion feed mechanism installs on Z direction owner feed mechanism, the fine motion of Z direction feed mechanism be connected with fine ultrasonic vibration device, fine ultrasonic vibration device's control end and adjustable fine supersonic generator are connected, fine ultrasonic vibration device's action end grinds through instrument connecting device ultra -precise throws the mould connection, the ultra -precise grinds the below of throwing the mould and arranges the XY workstation, the ultra -precise grinds to throw and is machining -position progressive between mould and the XY workstation, the last installation of machining -position progressive is ground throwing liquid and is fed and circulation system, grind throw liquid feed with circulation system bottom sensor installation connecting plate, the sensor connecting plate is connected with force transducer. The utility model discloses high shape precision, low roughness, high surface quality, high efficiency.
Description
Technical field
The utility model belongs to Ultra-precision Turning field, relates to a kind of micro-semi-ring die array grinding and polishing device.
Background technology
Hemispherical reso nance gyroscope is a kind of novel inertial sensor, has plurality of advantages compared with mechanical gyro.The hemispherical reso nance gyroscope precision of macro-scale has reached inertia rank, start to be applied to aviation, weapons and space inertial navigation system, but due to yardstick cause greatly that volume is large, quality is heavy, power consumption is high, and highly depends on Ultraprecision Machining, greatly limit its application.MEMS gyro has the advantages such as size is little, lightweight, low in energy consumption, but existing MEMS gyro cannot reach the Tactics-level precision of inert stage precision and Geng Gao, can not be applied in the occasion that required precision is high, such as in GPS blind area for aircraft provides short-range navigation.The main cause that MEMS gyro precision is not high is: existing MEMS element processing method, as chemical attack, etching, photolithographic transfer etc., the overwhelming majority is the structure of 2D or 2.5D, component quality and the distribution of material of the processing of these methods are uneven, cause matching between gyro induction frequencies and driving poor, the precision of MEMS gyro is extremely restricted.In order to promote the precision of MEMS gyro, Chinese scholars starts to be devoted to research 3D structure MEMS hemispherical reso nance gyroscope, the parts of this gyro most critical are the small hemisphere film shells of high accuracy be deposited on crystalline material micro-semi-ring die, study the polycrystalline diamond films resonator quality factor of proof based on chemical vapour deposition (CVD) (chemicalvapordeposition, CVD) far away higher than the silicon materials resonator of same structure.But the precision of the micro-hemispherical Shell of CVD relies on the form accuracy of its " parent " micro-semi-ring die, surface roughness and surface quality.At present, the processing method of single crystal silicon material micro-semi-ring die has: the three-dimensional structure processing method expanded from 2D and the 2.5D structure making process of traditional MEMS, fine EDM processing, micro-Milling Process, fine ultrasonic layering processing.So far, these reported processing methods also cannot meet the requirement of the hard crisp micro-semi-ring die machining accuracy of monocrystalline silicon and working (machining) efficiency, main because: MEMS micro Process-method such as wet chemical etch and dry plasma etch that (1) is traditional, in the process extended from 2D structure to 3D structure, all be difficult to the selective problems breaking away from crystallographic direction and mask material, cannot process and there is high symmetry uniform micro-semi-ring die consistent with material, this kind of method processes micro-semi-ring die low precision, and efficiency is low.(2) micro EDM (μ EDM) micro-semi-ring die, because discharge space is little, require that the precision of process equipment is high, be difficult to produce the high electrode of form accuracy, and tool-electrode weares and teares very fast in process, the micro-semi-ring molding surface processed is of poor quality, and form accuracy is not high.(3) the micro-semi-ring die of micro-Milling Process; when material fragility is removed; due to the weakness of Milling Process self; cause micro-semi-ring die top or bottom often to there will be bursting apart, surface and sub-surface damage; be difficult to meet processing request; when adopting plastic extension Milling Process, working (machining) efficiency and yield rate are extremely low.(4) utilize ultrasonic and micro tool layering to process micro-semi-ring die, the wearing and tearing due to micro tool are difficult to Accurate Prediction and control, and thus layering feeding path is difficult to make rational planning for, and cause micro-semi-ring die form accuracy poor, and working (machining) efficiency are low.(5) method of other electric machining micro-structural, as Electrolyzed Processing, is subject to the restriction of single crystal silicon material electric conductivity, is difficult to use in the processing of micro-semi-ring die.To sum up, owing to cannot process the micro-semi-ring die of high-quality resonant gyroscope monocrystalline silicon, there is not been reported so far develops the MEMS hemispherical reso nance gyroscope of inertia dimension accuracy.
Summary of the invention
Cannot realize the deficiency of high form accuracy, low surface roughness, great surface quality, high efficiency processing to overcome existing resonant gyroscope monocrystalline silicon micro-semi-ring die, the utility model provides a kind of high form accuracy, low surface roughness, great surface quality, high efficiency micro-semi-ring die array polishing method and device.
The utility model solves the technical scheme that its technical problem adopts:
A kind of micro-semi-ring die array grinding and polishing device, comprise lathe bed, the main feed mechanism of Z-direction, Z-direction micrometer feed mechanism, fine ultrasonic vibration installation, adjustable fine supersonic generator, tool coupling device, ultraprecise polishing mould, the feeding of polishing liquid and the circulatory system, sensor connecting plate, force snesor and XY worktable, the main feed mechanism of described Z-direction is arranged on lathe bed, described Z-direction micrometer feed mechanism is arranged on the main feed mechanism of described Z-direction, described Z-direction micrometer feed mechanism is connected with fine ultrasonic vibration installation, the control end of described fine ultrasonic vibration installation is connected with described adjustable fine supersonic generator, the motion end of described fine ultrasonic vibration installation is connected by ultraprecise polishing mould described in tool coupling device, the arranged beneath XY worktable of described ultraprecise polishing mould, be processing stations between described ultraprecise polishing mould and XY worktable, described processing stations installs the feeding of described polishing liquid and the circulatory system, sensor installation connecting plate bottom the feeding of described polishing liquid and the circulatory system, described sensor connecting plate is connected with force snesor,
Described polishing mould comprises instrument connecting rod, positioning baseplate, precise sphere, the upper end of instrument connecting rod is connected with fine ultrasonic generator, the lower end of described instrument connecting rod is connected with positioning baseplate, positioning baseplate processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere.
Further, described device also comprises workbench, computer control system and distribution system, described lathe bed is arranged on described workbench, the main feed mechanism of described Z-direction, Z-direction micrometer feed mechanism, adjustable fine supersonic generator, force snesor are all connected with described computer control system with XY worktable, and described adjustable fine supersonic generator is connected with described distribution system.
Further again, positioning baseplate has bondd spacing back-up ring, and the open-mouth of each array aperture arranges described spacing back-up ring.
Further, the bottom surface of described positioning baseplate covers and connects colloid.
The beneficial effects of the utility model are mainly manifested in: high form accuracy, low surface roughness, great surface quality, high efficiency.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of micro-semi-ring die array polishing.
Fig. 2 is the structure chart of array polishing mould.
Fig. 3 is the assembling schematic diagram of polishing mould assembling.
Fig. 4 is the structural representation of micro-semi-ring die array grinding and polishing device.
Fig. 5 is the schematic diagram of micro-semi-ring die array grinding and polishing device.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further described.
With reference to Fig. 1 ~ Fig. 5, a kind of micro-semi-ring die array grinding and polishing device, comprise lathe bed 1, the main feed mechanism 2 of Z-direction, Z-direction micrometer feed mechanism 3, fine ultrasonic vibration installation 4, adjustable fine supersonic generator 5, tool coupling device 6, ultraprecise polishing mould 7, the feeding of polishing liquid and the circulatory system 8, sensor connecting plate 11, force snesor 12 and XY worktable 13, the main feed mechanism of described Z-direction is arranged on lathe bed, described Z-direction micrometer feed mechanism is arranged on the main feed mechanism of described Z-direction, described Z-direction micrometer feed mechanism is connected with fine ultrasonic vibration installation, the control end of described fine ultrasonic vibration installation is connected with described adjustable fine supersonic generator, the motion end of described fine ultrasonic vibration installation is connected by ultraprecise polishing mould described in tool coupling device, the arranged beneath XY worktable of described ultraprecise polishing mould, be processing stations between described ultraprecise polishing mould and XY worktable, described processing stations installs the feeding of described polishing liquid and the circulatory system, sensor installation connecting plate bottom the feeding of described polishing liquid and the circulatory system, described sensor connecting plate is connected with force snesor,
Described polishing mould comprises instrument connecting rod 71, positioning baseplate 72, precise sphere 75, the upper end of instrument connecting rod 71 is connected with fine ultrasonic generator, the lower end of described instrument connecting rod 71 is connected with positioning baseplate 72, positioning baseplate 72 processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere 75;
Further, described device also comprises workbench 14, computer control system 15 and distribution system 16, described lathe bed 1 is arranged on described workbench 14, the main feed mechanism of described Z-direction 2, Z-direction micrometer feed mechanism 3, adjustable fine supersonic generator 5, force snesor 12 are all connected with described computer control system 15 with XY worktable 13, and described adjustable fine supersonic generator 5 is connected with described distribution system 16.
Further again, positioning baseplate 72 has bondd spacing back-up ring 74, and the open-mouth of each array aperture arranges described spacing back-up ring 74.
Further, the bottom surface of described positioning baseplate 72 covers and connects colloid 73.
In the present embodiment, lathe bed 1 is fixed in marble platform, marble platform has splendid vibrationproof performance, can isolate and reduce the vibration of external environment condition, Z-direction feed mechanism is two-stage feeding, main feed mechanism 2 is arranged on lathe bed, micrometer feed mechanism 3 is installed on main feed mechanism, actual adding, realizes two-stage feeding man-hour, the precision of main feed mechanism is at micron order, the precision of micrometer feed mechanism can reach nanoscale, fine ultrasonic vibration installation 4 is connected with micrometer feed mechanism 3, regulate the parameter of adjustable fine supersonic generator 5 can adjust vibration frequency and the amplitude of small ultrasonic vibration installation 4, by tool coupling device 6, realize the connection of ultraprecise polishing mould 7 and fine ultrasonic vibration installation 4, polishing liquid feed system and the circulatory system 8, polishing liquid is made to be uniformly distributed and to follow bad between polishing mould 7 and workpiece 10.Add man-hour, while the feeding of Z-direction two-stage, realize the fine ultrasonic vibration of polishing mould, this vibration makes abrasive particle with very high velocity shock surface of the work, realize material under the comprehensive function of the factors such as ultrasonic cavitation in addition, the hammering of polishing mould, scraping to remove fast, realize micro-semi-ring die array Polishing machining.While processing, the distribution of trace particle stream field and abrasive particle field and motion state can be adopted to carry out analyzing and following the tracks of, when using PIV to observe abrasive particle field, need the acrylic transparent panel of manufacture and the same geometry of workpiece to be processed, can respectively from top and distribution and the motion state of observing trace particle below workpiece respectively, observation analysis is carried out in camera head stream field and abrasive particle field frequently also can to adopt sudden strain of a muscle.According to processing request, real-time microscopic system 9 is utilized to observe the general shape of micro-semi-ring die and the state of wear of ultraprecise spheroid.Sensor connecting plate 11 is for connecting workpiece 10 and force snesor 12, sensor 12 is used for detecting the size of operating force and whether stopping means contacts with workpiece, XY worktable 13 is used for realizing the planar movement of workpiece, with satisfied processing difformity, different array arrangement, the requirement of varying number array, sensor 12 is fixed on above XY workbench, computer control system is in order to the feed speed of controlled working device, polishing power size, polishing liquid feed speed and other machined parameters, distribution system is used for powering to whole machine tool system and fine supersonic generator.
In the present embodiment, micro-semi-ring die array, at certain thickness crystalline material (monocrystalline silicon, sapphire, ruby, carborundum) on substrate slice, the micro-semi-ring die formed is removed by material, geometry mostly is spherical crown, but be not limited to spherical crown, geometric shape maximum cross-section diameter (or on maximum secting area 2 ultimate ranges) scope is 0.2mm to 10mm, if die is spherical cap-shaped structure, require that there is splendid form accuracy (sphericity), die edge is positioned at substrate top surface, ratio between edge radius variable quantity △ R and edge radius R levels off to 0 as far as possible, between the different dies of same size, shape has uniformity.
For realizing the array polishing of this micro-semi-ring die, its principle is: be full of polishing liquid between self-control ultraprecise high uniformity polishing mould and substrate slice, contained by polishing liquid, the size of abrasive particle is nanoscale, polishing mould does the fine ultrasonic vibration of high frequency in slight distance (being generally within 100 microns) above substrate slice, ultrasonic vibration excites the abrasive particle high speed impact substrate slice in polishing liquid, according to the situation that material is removed, polishing mould does the feed motion of certain speed downwards in Z-direction, impact at abrasive particle, ultrasonic cavitation, the hammering of polishing mould, under the compound actions such as polishing mould scraping, the material realizing micro-semi-ring die array is removed.Because polishing mould is array type precise spheroid composition, precise sphere has high form accuracy and high geometry uniformity and high surface roughness, thus can realize micro-semi-ring die array material to remove, can ensure shape coincidence very high between each micro-semi-ring die, its process principle as shown in Figure 1.
Ultraprecise high uniformity array polishing mode structure and assembly method thereof are as shown in Figures 2 and 3.The structure of polishing mould mainly comprises: instrument connecting rod 71, positioning baseplate 72, connection colloid 73, spacing back-up ring 74, precise sphere 75, instrument connecting rod 71 is connected with fine ultrasonic generator.Positioning baseplate 72 processes array aperture, pore size is less than precise sphere 75 diameter, binding agent is full of between aperture and precise sphere 75, in a part of embedded hole of spheroid, size difference due to all array apertures is minimum and size between precise sphere diameter also differs very little, so embed highly basically identical after precision ball embedded hole, concrete contour assembly method describes below.For preventing Z-direction excessive to lower feeding, positioning baseplate 5 has bondd spacing back-up ring 74, when spacing back-up ring 74 (flexible and there is certain rigidity), touch workpiece planarization, the motion of Z-axis direction lower feeding stops, remove the pre-allowance of situation and follow-up polishing according to material, the height of spacing back-up ring can adjust.The bottom surface of described positioning baseplate 72 covers and connects colloid 73.
The assembly method of polishing mould is: by uniform application water proofing property binding agent in array hole, as shown in Figure 3 polishing mould is inverted, adopt the accurate pressing plate 76 vertical depression precise sphere that flatness is splendid, owing to being full of water proofing property binding agent between precise sphere 75 and aperture, pressure at right angle can regulate the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at conplane object.Similar assembling mode is adopted for spacing back-up ring 74, adopt the accurate pressing plate with array hole (array aperture size is greater than bulb diameter), the spacing back-up ring 74 of vertical depression, makes ring cross-section on spacing back-up ring in a plane, complete the assembling of spacing back-up ring.
For solving the wear problem of the high-accuracy spheroid of polishing mould in process, the technical scheme adopted comprises: the first scheme, adopt traditional plasticity spheroid, material is that steel alloy and special type are firm, experimental study shows, adopts steel alloy as high-accuracy spheroid, monocrystalline silicon silicon chip carries out die array and adds man-hour, the machined parameters such as price such as suitable adjustment feed speed and supersonic frequency, can ensure that the wear extent of spheroid is less than 5%.First scheme, the utility model patent proposes the higher spheres of ceramic of employing hardness as accurate polishing ball, and its hardness order is: MOHS
precision ball>MOHS
abrasive particle>MOHS
workpiece, be readily appreciated that the wear extent of precision ball will reduce while workpiece being carried out to effectively processing from the sequence of Mohs' hardness.
The utility model realizes the high surface roughness of the small die of array, method is: the HNA solution adopting extremely low concentration, ensure HNA solution under normal temperature condition to the corrosion rate of workpiece material lower than 2-3 μm/min, utilize the micro-elastic polishing mould (die size is less than die size) being moistened with HNA solution, polished die form accuracy does not need special requirement, to previous step, each the micro-semi-ring die processed in the micro-semi-ring die array created carries out of short duration polishing, can improve rapidly molding surface roughness.
The present embodiment self-control ultraprecise array polishing mould, the feeding of two-stage Z-direction, fine ultrasonic vibration collaborative under, comprehensive flow field and abrasive particle field analysis, realize the efficient ultraprecise polishing of small die array.
Claims (4)
1. a micro-semi-ring die array grinding and polishing device, it is characterized in that: comprise lathe bed, the main feed mechanism of Z-direction, Z-direction micrometer feed mechanism, fine ultrasonic vibration installation, adjustable fine supersonic generator, tool coupling device, ultraprecise polishing mould, the feeding of polishing liquid and the circulatory system, sensor connecting plate, force snesor and XY worktable, the main feed mechanism of described Z-direction is arranged on lathe bed, described Z-direction micrometer feed mechanism is arranged on the main feed mechanism of described Z-direction, described Z-direction micrometer feed mechanism is connected with fine ultrasonic vibration installation, the control end of described fine ultrasonic vibration installation is connected with described adjustable fine supersonic generator, the motion end of described fine ultrasonic vibration installation is connected by ultraprecise polishing mould described in tool coupling device, the arranged beneath XY worktable of described ultraprecise polishing mould, be processing stations between described ultraprecise polishing mould and XY worktable, described processing stations installs the feeding of described polishing liquid and the circulatory system, sensor installation connecting plate bottom the feeding of described polishing liquid and the circulatory system, described sensor connecting plate is connected with force snesor,
Described polishing mould comprises instrument connecting rod, positioning baseplate, precise sphere, the upper end of instrument connecting rod is connected with fine ultrasonic generator, the lower end of described instrument connecting rod is connected with positioning baseplate, positioning baseplate processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere.
2. micro-semi-ring die array grinding and polishing device as claimed in claim 1, it is characterized in that: described device also comprises workbench, computer control system and distribution system, described lathe bed is arranged on described workbench, the main feed mechanism of described Z-direction, Z-direction micrometer feed mechanism, adjustable fine supersonic generator, force snesor are all connected with described computer control system with XY worktable, and described adjustable fine supersonic generator is connected with described distribution system.
3. micro-semi-ring die array grinding and polishing device as claimed in claim 1 or 2, is characterized in that: bondd spacing back-up ring on positioning baseplate, and the open-mouth of each array aperture arranges described spacing back-up ring.
4. micro-semi-ring die array grinding and polishing device as claimed in claim 3, is characterized in that: the bottom surface of described positioning baseplate covers and connects colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201520926620.8U CN205218689U (en) | 2015-11-19 | 2015-11-19 | Throwing device is ground to little semi -ring die array |
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| CN201520926620.8U CN205218689U (en) | 2015-11-19 | 2015-11-19 | Throwing device is ground to little semi -ring die array |
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| CN205218689U true CN205218689U (en) | 2016-05-11 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018227378A1 (en) * | 2017-06-13 | 2018-12-20 | 大连理工大学 | Device for precisely polishing outer cylindrical surface of plate part, and taper error adjustment method therefor |
| CN110355619A (en) * | 2019-05-30 | 2019-10-22 | 浙江工业大学 | The micro- hemisphere cavity plate array polishing method of cavitation auxiliary at high temperature under high pressure |
-
2015
- 2015-11-19 CN CN201520926620.8U patent/CN205218689U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018227378A1 (en) * | 2017-06-13 | 2018-12-20 | 大连理工大学 | Device for precisely polishing outer cylindrical surface of plate part, and taper error adjustment method therefor |
| US10513003B2 (en) | 2017-06-13 | 2019-12-24 | Dalian University Of Technology | Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereof |
| CN110355619A (en) * | 2019-05-30 | 2019-10-22 | 浙江工业大学 | The micro- hemisphere cavity plate array polishing method of cavitation auxiliary at high temperature under high pressure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20181119 |
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| CF01 | Termination of patent right due to non-payment of annual fee |