CN110370100B - Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere - Google Patents

Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere Download PDF

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CN110370100B
CN110370100B CN201910463390.9A CN201910463390A CN110370100B CN 110370100 B CN110370100 B CN 110370100B CN 201910463390 A CN201910463390 A CN 201910463390A CN 110370100 B CN110370100 B CN 110370100B
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coating
concave die
micro
tool head
sphere
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CN110370100A (en
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赵军
王睿
黄金锋
吕经国
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Zhejiang University of Technology ZJUT
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Zhejiang University of Technology ZJUT
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a method for preparing a hemispherical concave die array by using a Fenton auxiliary composite rod micro-ultrasonic sphere, which comprises an amplitude transformer, a micro-ultrasonic generator and a tool head, wherein the upper end of the amplitude transformer is connected with the micro-ultrasonic generator, and the lower end of the amplitude transformer is connected with a replaceable tool head; the bottom of the tool head is provided with a plurality of layers of plating layers or a layer of coating, if the coating material is diamond, the coating at the bottom of the tool is ground by a diamond grinding wheel, the surface of the coating is ground into a plane, then the surface of the coating is polished by a chemical mechanical polishing method, then a micro-hemispherical concave die array is processed within the range of the thickness of the coating at the bottom of the tool head, the depth of the concave die is less than the thickness of the coating, and the diameter of the hemispherical concave die is more than or equal to the diameter of a sphere. The invention greatly improves the processing efficiency of the hemispherical concave die array, ensures the consistency of the circumferential radius of the concave die and the consistency of the geometric shapes of different concave dies, and can polish the processed concave die by adopting a flexible chemical reagent to realize the nanoscale surface roughness.

Description

Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere
Technical Field
The invention relates to the field of ultra-precision machining, in particular to a method for preparing a hemispherical concave die array by using Fenton auxiliary composite rod micro-ultrasonic spheres.
Background
The hemispherical resonator gyroscope is one of Ge-type vibration gyroscopes, has the advantages of high precision, long service life and the like, and is widely applied to high-precision fields such as national defense, aerospace and the like. However, the macro-scale hemispherical resonator gyroscope has large volume, large mass, high energy consumption, high manufacturing cost and high dependence on ultra-precision machining technology, and the factors greatly limit the application of the micro-hemispherical resonator gyroscope, so the us has first proposed the development of a micro-hemispherical gyroscope based on the MEMS technology.
Compared with a common mechanical gyroscope and a macro-scale hemispherical resonant gyroscope, the micro-hemispherical MEMS gyroscope has the advantages of small volume, light weight and low energy consumption, but the precision of the micro-hemispherical MEMS gyroscope cannot reach an inertial navigation level and a higher tactical level at present, and the micro-hemispherical MEMS gyroscope cannot be used in occasions with high precision requirements, such as providing auxiliary navigation for intercontinental missiles losing GPS signals.
The reason why the manufacturing precision of the micro-hemispherical MEMS gyroscope is not high enough is that the quality and the material distribution of the device processed by the traditional processing method are not uniform and cannot reach the required precision level.
Therefore, scholars at home and abroad begin to research on processing micro semi-ring female dies on silicon materials, which are key parts of the micro semi-ring MEMS gyroscope with a novel 3D structure, and play a significant role in improving the precision of the MEMS gyroscope.
However, a processing method and a processing device which can meet the requirements of processing precision and processing efficiency of the silicon carbide hard and brittle half-ring female die do not exist so far, and the main difficulties are that the silicon carbide wafer raw material has high hardness and brittleness, the processing cost is high, the precision control difficulty is high, and the silicon carbide wafer raw material has a large abrasion effect on a processing device.
In addition, although the machining methods such as micro EDM machining, micro milling machining, micro ultrasonic layered machining and the like are novel 3D structure machining methods, the machining methods cannot be realized due to low machining efficiency, low yield, high cost or the chemical characteristics of silicon carbide materials.
In conclusion, no feasible method and device for processing the high-quality MEMS gyroscope micro semi-ring female die exist at present, and the development of the MEMS hemispherical resonator gyroscope with the inertia level precision is not reported to date.
Disclosure of Invention
The invention aims to provide a method for preparing a hemispherical concave die array by using Fenton auxiliary composite rod micro-ultrasonic spheres aiming at the defects of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: the method for preparing the hemispherical concave die array by using the Fenton auxiliary composite rod micro-ultrasonic sphere is characterized by comprising an amplitude transformer, a micro-ultrasonic generator and a tool head, wherein the upper end of the amplitude transformer is connected with the micro-ultrasonic generator, and the lower end of the amplitude transformer is connected with a replaceable tool head; the bottom of the tool head is provided with a layer of superhard wear-resistant coating with the thickness of 0.05mm-3mm, the coating material is diamond, the coating at the bottom of the tool head is ground by a diamond grinding wheel, the surface of the coating is ground into a plane, then the surface of the coating is polished by a chemical mechanical polishing method, the roughness of the surface of the coating is reduced, then a micro-hemispherical concave die array is processed within the thickness range of the coating at the bottom of the tool head, the array is in the specification of m x n, m x 1 or n, wherein m and n are natural numbers which are more than or equal to 2, the depth of the concave die is less than the thickness of the coating, and the diameter of the hemispherical concave die is more than or equal; polishing liquid is arranged among the tool coating, the hemisphere female die, the ball body, the guide plate and the workpiece, and Fenton reagent with the concentration of hydroxyl free radicals of 0.1-0.2mol/L is added into the polishing liquid.
The grinding and polishing liquid is fluid which can form stable solution, such as deionized water, kerosene and the like, and a stabilizing agent and a dispersing agent are added into the grinding and polishing liquid to prevent the abrasive from precipitating and agglomerating.
Ferrous ions in the Fenton solution react with hydroxyl ions in the solution under the catalytic action of hydrogen peroxide to generate hydroxyl radicals and ferric ions, so that the silicon carbide on the surface layer of the silicon carbide workpiece is converted into silicon dioxide with the hardness lower than that of the silicon carbide.
Further, a guide plate is arranged below the tool head, and an s-t (s > = m, t > = n) hole array is arranged on the guide plate, wherein the hole diameter is larger than or equal to the diameter of the sphere. The material of the guide plate is required to have good wear resistance and oxidation resistance, such as PTFE plastic (including but not limited to PTFE plastic).
Furthermore, the diameter of the launching sphere is selected according to the depth of the micro-hemispherical concave die array to be processed, the sphere diameter range is 0.1mm-5mm, each sphere is limited by the guide plate to move in the X direction and the Y direction, the movement in the Z direction is limited by the tool head and the workpiece, and the spheres can rotate freely.
The ball body is required to have extremely high hardness and wear resistance, and the material can be alloy steel, tungsten carbide, silicon nitride ceramic and the like.
Further, the abrasive grains contained in the polishing liquid have an average grain size ranging from several tens of nanometers to several micrometers.
The abrasive particles are selected from composite abrasive particles with excellent polishing performance and small damage degree to the microscopic surface of a workpiece.
The abrasive grain preparation process is as follows: preparing a solution by using cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying and then roasting at high temperature to prepare the alumina-ceria core/shell composite abrasive particles taking alumina as an inner core and cerium oxide containing trivalent cerium as an outer shell.
Further, an oxidation-resistant protective film is coated on the silicon carbide wafer in the non-processing region. Alternative PTFE plastic films include, but are not limited to, PTFE plastic.
The coating, the guide plate and the ball body at the bottom of the tool head are made of materials with good oxidation resistance and wear resistance, for example, the coating can be made of a diamond coating, the guide plate can be made of PTFE plastic, the ball body can be made of alloy steel, tungsten carbide, silicon nitride ceramic and the like.
By adopting the technical scheme of the invention, the invention has the beneficial effects that: compared with the prior art, the invention uses the micro-ultrasonic vibration of the tool head to strike the ball body in the guide plate, so as to excite the composite abrasive particles in the polishing liquid between the tool head and the micro-concave die substrate workpiece (silicon carbide wafer) and impact the concave die substrate at high speed.
Under the combined action of the hammering action of the free emission ball on the workpiece, the impact of composite abrasive particles in the polishing liquid on the workpiece, the cavitation generated by micro-ultrasound and the chemical action, the workpiece material is removed, the processing efficiency of the hemispherical concave die array is greatly improved, the consistency of the circumferential radius of the concave die and the consistency of the geometric shapes of different concave dies are ensured, the processed concave die can be polished by adopting a flexible chemical reagent, and the nanoscale surface roughness is realized.
The method has the advantages of concave die shape precision, low surface roughness, high shape consistency and high surface quality.
Drawings
Fig. 1 is a schematic view of the structure of the tool head of the present invention.
Fig. 2 is a structural view of the guide plate device of the present invention.
Fig. 3 is an overall structural diagram and an operational principle diagram of the superhard rod hemispherical concave die array ultrasonic emission machining device.
FIG. 4 is a general structural diagram of the superhard rod hemispherical concave die array ultrasonic emission machining device.
Detailed Description
Specific embodiments of the present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, the method for preparing a hemispherical concave die array by using a fenton auxiliary composite rod micro-ultrasonic sphere comprises an amplitude transformer 11, a tool head 12 and an array concave ball pit 13, wherein the main body of the amplitude transformer 11 is made of a titanium alloy material, the upper end of the amplitude transformer is connected with a micro-ultrasonic generator, and the lower end of the amplitude transformer is connected with the tool head 12.
The amplitude transformer 11 is driven by double motors and can perform macroscopic transmission and microscopic transmission according to specific requirements.
A diamond coating having a thickness of 2mm is deposited on the bottom of the tool bit 12 using a CVD process or similar method.
2 x 2 array concave hemisphere ball pits with good surface consistency are machined in the plating layer at the bottom of the tool head 12, the diameter of a concave hemisphere is equal to the diameter of a sphere which is 1mm, and therefore impact and abrasion to the bottom of the tool head 12 when the free sphere recoils are reduced.
A guide plate 20 with the thickness of 1/4 spherical diameters, namely 0.25mm is arranged below the tool head 12, and the material of the guide plate 20 is PTFE plastic.
As shown in fig. 2, the guide plate 20 has 8 × 8 holes, each of which has a diameter slightly larger than the diameter of the sphere and is 1.2 mm.
An array of 2X 2 spheres 14 is arranged, each limited in the X and Y directions of movement by the guide plate 20, but free to move in the Z direction and at the same time free to rotate.
The ball body is made of traditional plastic ball body made of superhard silicon nitride ceramic and has a diameter of 1 mm.
The bottom of the tool head 12 is provided with a plurality of layers of plating layers or a coating layer with the thickness of 0.05mm-3mm, the coating material can be metal or nonmetal materials such as diamond, tungsten carbide and the like, and the coating material is super-hard and wear-resistant. If the coating material is diamond, grinding the coating at the bottom of the tool by using a diamond grinding wheel, grinding the surface of the coating into a plane, polishing the surface of the coating by using a chemical mechanical polishing method to reduce the roughness of the surface of the coating, and then processing a micro-hemispherical concave die array within the range of the thickness of the coating at the bottom of the tool head 12, wherein the depth of the concave die is less than the thickness of the coating, the array is in the specification of m × n, m × 1 or n × n, wherein m and n are natural numbers, and the diameter of the hemispherical concave die is more than or equal to the diameter of a sphere for ultrasonic emission.
The tool head 12 is filled with polishing liquid among the coated hemispherical female die, the ball body, the guide plate 20 and the workpiece, deionized water is selected as a solvent of the polishing liquid, and a stabilizing agent and a dispersing agent are added into the polishing liquid to prevent abrasive materials from precipitating and aggregating.
Preparing 0.5mol/L solution of cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying, placing the mixture into a high-temperature furnace, introducing nitrogen, and roasting for 2 hours at the temperature of about 950 ℃ to prepare the alumina-ceria core/shell composite abrasive particles with alumina as an inner core and ceria containing trivalent cerium as an outer shell, wherein the particle size of the alumina-ceria core/shell composite abrasive particles is about 2 mu m. Preparing 0.15mol/L hydrogen peroxide solution and 0.05mol/L ferrous sulfate solution, maintaining the pH of the solution at 3-4, and mixing the hydrogen peroxide solution and the ferrous sulfate solution according to the volume ratio of 1: 3, mixing, fully reacting for 2 hours to obtain a Fenton solution, and mixing the Fenton solution into the polishing solution.
The non-processing area of the silicon carbide wafer workpiece is covered with a PTFE plastic protective film 21 to prevent the non-processing area from oxidation corrosion by Fenton liquid.
The tool head 12 performs high-frequency ultrasonic vibration within a distance of 0-5000um above the workpiece, the frequency reaches or exceeds 16kHz, the amplitude is 1-2um, and slow feeding motion is performed in the direction of approaching the workpiece in the Z axis, and the feeding amount is 1um each time.
A micron-sized laser visual positioning sensor 40 is additionally arranged beside the tool head 12 and the workpiece to detect and regulate the relative position of the tool head 12 and the workpiece so as to prevent the position deviation during processing.
During machining, as the downward feeding motion and the high-frequency vibration of the tool head 12 are carried out simultaneously, the ball body can be impacted with impact polishing liquid, so that the composite abrasive particles in the ball body impact the concave die substrate at a high speed and are physically hammered by the tool head 12 along with the cavitation generated by the micro-ultrasonic, and finally the machining of the hemispherical concave die array is realized.
Since the aperture of each guide plate 20 is slightly larger than the diameter of the ball, the ball can move and rotate freely all the time, and the abrasion is uniform.
Meanwhile, the bottom of the tool head 12 is provided with the array concave ball pits 13, so that the impact and abrasion on the bottom of the tool head during ball recoil can be reduced.
In addition, the launching-type sphere can also intensify the action of the launching-type sphere with a substrate workpiece, so that the material removing effect is more obvious, and the processing efficiency is higher.
A guide plate 20 is arranged below the tool head 12, and an s-t (s > = m, t > = n) hole array is arranged on the guide plate 20, wherein the hole diameter is larger than or equal to the diameter of the sphere.
The material of the guide plate 20 is required to have good wear resistance and oxidation resistance, such as PTFE plastic (including but not limited to PTFE plastic).
The diameter of the launching sphere is selected according to the depth of the micro-hemispherical concave die array to be processed, the sphere diameter range is 0.1mm-5mm, each sphere is limited by the guide plate 20 to move in the X direction and the Y direction, the movement in the Z direction is limited by the tool head 12 and the workpiece, and the spheres can rotate freely.
The ball body is required to have extremely high hardness and wear resistance, and the material can be alloy steel, tungsten carbide, silicon nitride ceramic and the like.
And polishing liquid is arranged among the tool coating, the hemispherical female die, the ball body, the guide plate 20 and the workpiece. The grinding and polishing liquid is fluid which can form stable solution, such as deionized water, kerosene and the like, and a stabilizing agent and a dispersing agent are added into the grinding and polishing liquid to prevent the abrasive from precipitating and agglomerating.
The abrasive grains contained in the polishing liquid have an average grain size ranging from several tens of nanometers to several micrometers.
The abrasive particles are selected from composite abrasive particles with excellent polishing performance and small damage degree to the microscopic surface of a workpiece.
The abrasive grain preparation process is as follows: preparing a solution by using cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying and then roasting at high temperature to prepare the alumina-ceria core/shell composite abrasive particles taking alumina as an inner core and cerium oxide containing trivalent cerium as an outer shell.
Adding Fenton reagent with the concentration of hydroxyl free radicals of about 0.1-0.2mol/L into the polishing solution, and reacting ferrous ions in the Fenton solution with hydroxyl ions in the solution under the catalytic action of hydrogen peroxide to generate hydroxyl free radicals and ferric ions so as to convert silicon carbide on the surface layer of the silicon carbide workpiece into silicon dioxide with the hardness lower than that of the silicon carbide.
And covering the silicon carbide wafer in the non-processing area with an oxidation-resistant protective film.
Alternative PTFE plastic films include, but are not limited to, PTFE plastic.
The coating at the bottom of the tool head 12, the guide plate 20 and the ball body are made of materials with good oxidation resistance and wear resistance, for example, the coating can be made of diamond coating, the guide plate 20 can be made of PTFE plastic, the ball body can be made of alloy steel, tungsten carbide, silicon nitride ceramic and the like.
In this example, the workpiece is a silicon carbide wafer with a thickness of 2mm, an array hemispherical concave die is processed on the workpiece by a material removing method, the diameter of the processed concave die is expected to be 1mm, and the spherical crown height is expected to be 400 um.
The concave die is in a hemispherical shell shape, so that the concave die is required to have excellent sphericity, the edge of the concave die is positioned at the top of the workpiece and is in smooth transition with the top of the workpiece, and the shape and the size of the concave die in the array are consistent.
In order to realize the array hemisphere concave die, the principle is as follows: the micro ultrasonic vibration of the ultra-precise tool head 12 bombards the ball in the guide plate 20 to excite the composite abrasive particles in the polishing liquid between the tool head 12 and the micro-concave die substrate workpiece (silicon carbide wafer) to impact the concave die substrate at a high speed. Under the combined action of the hammering action of the free emission ball on the workpiece, the impact of composite abrasive particles in the polishing liquid on the workpiece, the cavitation generated by micro-ultrasound and the chemical action, the workpiece material is removed, the processing efficiency of the micro semi-ring female die is greatly improved, and the consistency of the circumferential radius of the female die and the consistency of the geometric shapes of different female dies are ensured.
The device assembling method comprises the following steps: the center of each hole on the guide plate 20 is aligned with the center of the corresponding array hole at the bottom of the tool head 12, the relative position of the tool head 12 and the guide plate 20 is detected and regulated by a micron-sized laser positioning sensor so that the tool head 12 and the guide plate 20 do not move relatively during processing, and a sphere is arranged in an array ball pit under the tool head 12 and the guide plate 20 so that the sphere can move freely and smoothly in the Z direction and can rotate freely at the same time.
The guide plate 20 and the workpiece are also positioned by a micron-sized laser positioning sensor, so that the guide plate and the workpiece do not move relatively when being processed.
The tool head 12 performs high frequency ultrasonic vibration within 0-5000 microns above the workpiece and performs low speed feeding in the direction of Z axis approaching the workpiece.
During processing, as the downward feeding motion and the high-frequency vibration of the tool head 12 are carried out simultaneously, the ball body can be acted to impact the lapping and polishing liquid, so that the composite abrasive particles in the ball body impact the die substrate at a high speed.
The removal of workpiece materials is realized under the combined action of the hammering action of the free emission ball on the workpiece, the impact of composite abrasive particles in the polishing liquid on the workpiece, the cavitation generated by micro-ultrasound and the chemical action, and finally the machining of the hemispherical concave die array is realized.
The polishing device comprises an amplitude transformer 11, a tool head 12 and an array concave ball pit 13 as shown in figure 1, wherein the main body of the amplitude transformer 11 is made of titanium alloy material, the upper end of the amplitude transformer is connected with a micro ultrasonic generator, the lower end of the amplitude transformer is connected with the tool head 12, the amplitude transformer 11 is driven by double motors, and macro transmission and micro transmission can be carried out according to specific requirements.
A diamond coating having a thickness of 2mm is deposited on the bottom of the tool bit 12 using a CVD process or similar method.
2 x 2 array concave hemisphere ball pits with good surface consistency are machined in the plating layer at the bottom of the tool head 12, the diameter of a concave hemisphere is equal to the diameter of a sphere which is 1mm, and therefore impact and abrasion to the bottom of the tool head 12 when the free sphere recoils are reduced.
A guide plate 20 with the thickness of 1/4 spherical diameters, namely 0.25mm is arranged below the tool head 12, and the material of the guide plate 20 is PTFE plastic.
As shown in fig. 2, the guide plate 20 has 8 × 8 holes, each of which is slightly larger than the diameter of the sphere, and is about 1.2 mm.
An array of 2X 2 spheres 14 is arranged, each limited in the X and Y directions of movement by the guide plate 20, but free to move in the Z direction and at the same time free to rotate.
The ball body is made of traditional plastic ball body made of superhard silicon nitride ceramic and has a diameter of 1 mm.
Referring to fig. 3, the tool head 12 performs high frequency ultrasonic vibration in a distance of 0 to 5000um above the workpiece, the frequency reaches or exceeds 16kHz, the amplitude is 1 to 2um, and the tool head performs slow feeding motion in the direction of approaching the workpiece in the Z axis, and the feeding amount is 1um each time.
A micron-sized laser visual positioning sensor 40 is additionally arranged beside the tool head 12 and the workpiece to detect and regulate the relative position of the tool head 12 and the workpiece so as to prevent the position deviation during processing.
During machining, as the downward feeding motion and the high-frequency vibration of the tool head 12 are carried out simultaneously, the ball body can be impacted with impact polishing liquid, so that the composite abrasive particles in the ball body impact the concave die substrate at a high speed and are physically hammered by the tool head 12 along with the cavitation generated by the micro-ultrasonic, and finally the machining of the hemispherical concave die array is realized.
In order to solve the problem of abrasion of the ball and the bottom of the tool head 12 in the machining process, the adopted technical scheme comprises the following steps: in the first option, a diamond coating with a thickness of 2mm is deposited by a CVD process or similar.
2 x 2 array concave hemispherical ball pits with good surface consistency are machined in the plating layer at the bottom of the tool head 12, so that the hardness and the wear resistance of the tool head 12 can be effectively improved, the wear of a frequently impacted bottom working surface is reduced, and the machining reliability and the machining precision consistency are improved; the second scheme is as follows: the ball body is made of traditional plastic ball bodies, alloy steel, tungsten carbide, silicon nitride ceramics and the like with high hardness can be selected as the ball body material, and the wear of the ball body can be effectively reduced by using the material with high hardness; in the third scheme: the Fenton reagent with the concentration of hydroxyl free radicals of about 0.15mol/L is added into the polishing solution, and ferrous ions in the Fenton solution react with hydroxyl ions in the solution under the catalytic action of hydrogen peroxide to generate hydroxyl free radicals and ferric ions with strong oxidizability, so that the silicon carbide workpiece is slowly oxidized to generate a silicon dioxide-containing surface layer.
It is well known that silica, which is significantly less hard than silicon carbide, is more easily removed by the action of the abrasive particles, thus reducing wear on the ball and the bottom of the tool head 12; a fourth scheme: a guide plate 20 with the thickness of about 1/4 mm of the diameter of the ball is arranged below the tool head 12, 8-8 holes are arranged on the guide plate 20, the hole diameter is slightly larger than the diameter of the ball and is about 1.2mm, so the ball can move and rotate freely all the time and is worn evenly. Meanwhile, the bottom of the tool head 12 is provided with the array concave ball pits 13, so that the impact and abrasion on the bottom of the tool head during ball recoil can be reduced.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention.
Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (5)

1. The method for preparing the hemispherical concave die array by using the Fenton auxiliary composite rod micro-ultrasonic sphere is characterized by comprising an amplitude transformer, a micro-ultrasonic generator and a tool head, wherein the upper end of the amplitude transformer is connected with the micro-ultrasonic generator, and the lower end of the amplitude transformer is connected with a replaceable tool head;
the bottom of the tool head is provided with a layer of superhard wear-resistant coating with the thickness of 0.05mm-3mm, the coating material is diamond, the coating at the bottom of the tool head is ground by a diamond grinding wheel, the surface of the coating is ground into a plane, then the surface of the coating is polished by a chemical mechanical polishing method, the roughness of the surface of the coating is reduced, then a micro-hemispherical concave die array is processed within the thickness range of the coating at the bottom of the tool head, the array is in the specification of m x n, m x 1 or n, wherein m and n are natural numbers which are more than or equal to 2, the depth of the concave die is less than the thickness of the coating, and the diameter of the hemispherical concave die is more than or equal;
a polishing liquid is arranged among the tool coating, the hemisphere female die, the sphere, the guide plate and the workpiece, and a Fenton reagent with the concentration of hydroxyl free radicals of 0.1-0.2mol/L is added into the polishing liquid.
2. A fenton-assisted composite rod micro-ultrasonic sphere manufacturing hemisphere concave mold array method according to claim 1, wherein a guide plate is arranged below the tool head, and the guide plate is provided with an s x t (s > = m, t > = n) hole array, and the hole diameter is larger than or equal to the sphere diameter.
3. A fenton-assisted composite rod micro-ultrasonic sphere manufacturing method of a hemispherical concave die array as claimed in claim 2, wherein the diameter of the emitting sphere is selected according to the depth of the micro-hemispherical concave die array to be processed, the sphere diameter is in the range of 0.1mm to 5mm, each sphere is limited by a guide plate to move in X and Y directions, the movement in Z direction is limited by a tool head and a workpiece, and the sphere can rotate freely.
4. A method for preparing a hemispherical concave die array by using a fenton auxiliary composite rod micro-ultrasonic sphere according to claim 1, wherein the average particle size of abrasive particles contained in the polishing liquid ranges from dozens of nanometers to several micrometers, and the abrasive particles are prepared by the following steps: preparing a solution by using cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying and then roasting at high temperature to prepare the alumina-ceria core/shell composite abrasive particles taking alumina as an inner core and cerium oxide containing trivalent cerium as an outer shell.
5. A fenton's auxiliary composite rod micro-ultrasonic sphere fabrication hemisphere concave mold array method as claimed in claim 1, wherein a work piece in a non-processing region is covered with an oxidation-resistant protective film.
CN201910463390.9A 2019-05-30 2019-05-30 Method for preparing hemispherical concave die array by Fenton auxiliary composite rod micro-ultrasonic sphere Active CN110370100B (en)

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