CN110340748A - A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array - Google Patents
A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array Download PDFInfo
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- CN110340748A CN110340748A CN201910463422.5A CN201910463422A CN110340748A CN 110340748 A CN110340748 A CN 110340748A CN 201910463422 A CN201910463422 A CN 201910463422A CN 110340748 A CN110340748 A CN 110340748A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/20—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
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- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Radar, Positioning & Navigation (AREA)
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses the method and devices that a kind of rotary ultrasonic method processes micro- hemisphere cavity plate array, including Ultrasonic probe, fixed substrate, ultra hard ceramic sphere, modulation polishing liquid, the Ultrasonic probe lower end is connected with fixed substrate, through-hole is machined in fixed substrate, aperture is less than aluminium oxide ultra hard ceramic sphere diameter, binder is being full of in fixed substrate hole between ultra hard ceramic sphere, so that in sphere insertion fixed substrate.Modulation polishing liquid is added dropwise on monocrystalline substrate material, the amplitude transformer drives Ultrasonic probe vibration at high speed, accompanying rotation system makes ultra hard ceramic sphere vibration at high speed in short distance while rotation, it excites the abrasive grain in polishing liquid to impact substrate material, material is removed by cavitation phenomenon of the abrasive grain to the mechanical shock of substrate material, shearing, rubbing down, polishing liquid.Fragile material plastic removal is realized by control rotation speed during processing, realizes that multiple domain is controllable, obtains surface roughness SaThe micro- hemisphere cavity plate array of < 20nm.
Description
Technical field
The present invention relates to the sides that Ultra-precision Turning field more particularly to a kind of rotary ultrasonic method process micro- hemisphere cavity plate array
Method.
Background technique
Hemispherical reso nance gyroscope (Hemispherical Resonator Gyro, abbreviation HRG) is a kind of without high speed rotor
With the oscillation gyro of expansion bearing, with precision height, quality is small, small in size, the starting time is short, high overload characteristic, is known as
Most potential taxi driver brother's formula oscillation gyro.
External HRG development is concentrated mainly on the U.S., Russia and this French 3 countries, mainly applies to telecommunication satellite, leads
The fields such as bullet system, oil exploration, these three countries have reached inert stage precision level on HRG at present, high-accuracy
The field the HRG country and leading nation's gap are larger.
Because the quality factor of hemispherical reso nance gyroscope have high requirements to having in the geometry physical accuracy of oscillator, current
HRG harmonic oscillator manufacturing method is all the hemisphere cavity plate for obtaining a high rotating accuracy and great surface quality first, then using each
Kind deposition method deposits a hemisphere cavum in molding surface, using a series of work steps, the final assembly for realizing harmonic oscillator.
The difficult point of technology is to obtain the hemisphere cavity plate of high rotating accuracy and great surface quality at present, existing in hard brittle material in the world
The traditional diamond-making technique of upper processing hemisphere cavity plate mainly has: micro spark processing, high energy beam processing, Ultrasonic machining etc..
Micro spark processes (ElectroDischargeMeching, EDM), is to utilize two interpolar high intensity spark discharges
Galvanic corrosion phenomenon carry out the method for ablation material.High energy beam processing, it is common as laser machined, made using the high temperature of generation nonmetallic
Melt gasification and achieve the purpose that remove material with explosion in hard brittle material surface.Traditional Ultrasonic machining is also known as suspension abrasive grain
Ultrasonic impact processing carries out mechanical removal to material using the high energy impact abrasive grain of ultrasound.They when processing hemisphere cavity plate all
Fatal disadvantage is wanted, processing efficiency is low for micro spark, and is difficult to obtain preferable form accuracy；Laser processing can also make material hot
Stress is concentrated, and is cracked and thermal deformation, and machining shape precision and surface quality are influenced.Ultrasonic probe is worn in Ultrasonic machining
Seriously, finished surface often will appear " collapsing open-minded " phenomenon when processing efficiency is low and processing hard brittle material, seriously affect finished surface matter
Amount.
Conventional ultrasound processing is by Ultrasonic probe longitudinal direction high-frequency vibration, and excitation abrasive grain impacts workpiece surface, a large amount of
Under the lasting impact of abrasive grain, finished surface is broken and removes.But conventional ultrasound rapidoprint removal rate is low, Ultrasonic probe abrasion
Rate is high.The clast being crushed from workpiece can damage finished surface, and surface quality is bad.
Summary of the invention
The purpose of the present invention is not can guarantee surface quality and shape for existing for existing resonance oscillator cavity plate processing technology
Shape precision, can not batch micro operations, processing complicated defect and deficiency, a kind of rotary ultrasonic method is provided and processes micro- hemisphere cavity plate array
Method and device.
In order to achieve the goal above, the invention adopts the following technical scheme:
A kind of method that the grinding of rotary ultrasonic multistage prepares micro- hemisphere cavity plate array, includes the following steps:
S1, the polishing liquid is uniformly filled between fixed substrate and silicon carbide substrates；
S2, Ultrasonic probe receive given frequency and amplitude and drive the ultra hard ceramic for being constrained on Ultrasonic probe front end
The vibration of sphere high-speed high frequency, excitation abrasive grain are launched impact substrate material, are rushed by machinery of the abrasive grain to substrate material
It hits, shear, the cavitation phenomenon of rubbing down, polishing liquid removal material, while high-speed rotating ultra hard ceramic sphere drives abrasive grain to lining
The multistage polishing of bottom material acts on, and removes material；
S3, surface roughness S is obtainedaThe micro- hemisphere cavity plate array of < 20nm.
The rotary ultrasonic tool heads can while ultrasonic vibration radial direction high speed rotation, both direction collective effect can
Clast is excluded in time, clast is avoided to scratch machined surface, improves processing efficiency and machining accuracy.Meanwhile because Ultrasonic machining
In rotary motion presence, can guarantee that micro- hemisphere cavity plate can have preferable form accuracy.
Further, industry camera is provided with by Ultrasonic probe, industry camera captures Ultrasonic probe front end
Ultra hard ceramic ball position, the 1mm above Z-direction slide unit drive Ultrasonic probe front end ultra hard ceramic sphere arrival workpiece surface,
Control centre's transmitting signal control Z axis motor stopping is fed down, and Ultrasonic probe reaches Working position.
Further, the ultra hard ceramic sphere size is less than fixed substrate through-hole diameter, can be by ultra hard ceramic sphere
It is embedded, binder is full of between fixed substrate and ultra hard ceramic sphere, before ultra hard ceramic sphere is fixed in Ultrasonic probe
End.
Further, the ultra hard ceramic sphere assembly method is as follows: diameter is slightly less than the superhard of fixed substrate through-hole
Spheres of ceramic is put into fixed substrate, is full of binder therebetween, then be fixed in Ultrasonic probe front end, Ultrasonic probe is filled
It is fed down after upper Ultrasonic probe support by adjusting Z-direction workbench, until all ultra hard ceramic spheres contact marble
Horizontal table obtains the levelness consistent ultrasonic tool head assembly of height completely after binder solidification.In aperture and surpass
It is full of binder between sound tool heads front end, ultra hard ceramic sphere is embedded in aperture, Ultrasonic probe front end is secured to,
Ultra hard ceramic sphere is detached from Working position when the purpose is to prevent Ultrasonic machining, causes mismachining tolerance.
Further, it is monitored using industry camera and captures ultra hard ceramic ball position, processing is controlled by its position
Process.
Further, Ultrasonic probe is detachable rotary ultrasonic tool heads, passes through the coil windings in rotating device
Amplitude transformer high-speed rotation on horizontal basal plane is driven, while rotating device enables to amplitude transformer perpendicular by axially stop block
Histogram does not generate the shake in addition to ultrasonic vibration upwards, so that Ultrasonic probe attached rotation fortune while making ultrasonic vibration
It is dynamic.
Further, the ultra hard ceramic sphere forms multiple domain controllable multi-level by control rotation speed and supersonic frequency and grinds
Mill, previous stage is brittle break, accelerates processing speed, and the latter half is fragile material plastic processing, and it is thick to reduce finished surface
Rugosity.
Further, the fixed substrate is aluminium alloy base plate, with a thickness of 0.2mm-0.5mm.But it is not limited to aluminium alloy, it can
Think that any substrate for being equipped with diameter through-hole more smaller than ultra hard ceramic sphere, thickness are much smaller than other geometric dimensions, is 0.2mm-
0.5mm。
Further, the ultra hard ceramic sphere is 99 small aluminium oxide ultra hard ceramic spheres of diameter, but is not limited to oxygen
Change aluminium, can be any wear-resisting nonplastic sphere of superhard plasticity, such as silicon carbide, silicon nitride, boron nitride.
The present invention realizes that above method is that the device for processing micro- hemisphere cavity plate array by a kind of rotary ultrasonic method is realized,
Including ultrasonic polishing experimental bench, the ultrasound polishing experimental bench includes: that Z-direction feeds slide unit, marble rack and hold-down support,
Marble rack level is erected on hold-down support, and Z-direction feeds slide unit and is rigidly connected in marble rack by bolt, Z-direction into
To Z-direction second level precision surface plate is equipped on slide unit, rotary ultrasonic tool heads group is installed on front side of Z-direction second level precision surface plate.
Further, the rotary ultrasonic tool heads group includes: Ultrasonic probe support, energy converter, Ultrasonic probe rotation
Rotary device, amplitude transformer, Ultrasonic probe, rotary ultrasonic tool heads group are rigidly connected in Z-direction second level by Ultrasonic probe support
On precision surface plate, energy converter is fixed on Ultrasonic probe support center, receives the high frequency electric pulse from ultrasonic generator, and
High frequency electric pulse is converted into mechanical oscillation by multiple amplitude transformers, amplitude transformer is rigidly connected by screw thread and Ultrasonic probe,
Ultrasonic probe rotating device is realized for amplitude transformer and energy converter and is able to drive Ultrasonic probe while conducting connection function
Realize radial high speed rotation.
Further, the Ultrasonic probe includes removable Ultrasonic probe front end assemblies, ultra hard ceramic sphere, fixation
Substrate, fixed substrate are connect by screw thread with Ultrasonic probe front end, and ultra hard ceramic sphere insertion fixed substrate is in sphere and admittedly
Determine to be full of binder between substrate, ultra hard ceramic sphere is fixed on to the front end of Ultrasonic probe front end assemblies.
Technical solution of the present invention is used, the invention has the benefit that compared with prior art, the present invention is added by ultrasound
The power control Ultrasonic probe rotary rpm and ultrasonic tool of the controllable method of the multiple domain of work and control centre and ultrasonic generator
The amplitude of head realizes the slower modeling of the processing speed that previous stage is changed into the latter half for the faster brittle break of processing speed
Property processing.Previous stage overcomes the slow disadvantage of rate of ultrasonic machining, realizes the roughing to substrate material, obtaining one has
Certain shapes precision but the bad hemisphere cavity plate of surface quality.The latter half realizes the finishing of double of ball impression mould, utilizes brittleness
The principle of Plastic working " can significantly reduce in process under conditions of micro removal amount to hard brittle material (carbonization
Silicon) surface breakdown, reduce its crack number and scale, thus obtain the hemisphere cavity plate of better surface roughness.
Detailed description of the invention
Fig. 1 is a kind of ultrasonic polishing experimental bench structure chart provided by the invention.
Fig. 2 is a kind of rotary ultrasonic tool heads group structure chart provided by the invention.
Fig. 3 is a kind of Ultrasonic probe structure chart provided by the invention.
Fig. 4 is that a kind of rotary ultrasonic provided by the invention prepares hemisphere cavity plate schematic diagram.
Specific embodiment
Concrete scheme specific embodiment of the present invention is further elaborated in conjunction with attached drawing.
As shown in Figure 1, a kind of micro- hemisphere for realizing ideal geometric properties based on the controllable method removal material of rotary ultrasonic multiple domain
The method of cavity plate, the ultrasound polishing experimental bench include: Z-direction feeding slide unit 1, marble rack 2, X to feeding slide unit 3, fixed
Support 4, control centre 5, Z are to accurate second level platform 6, rotary ultrasonic tool heads group 7, horizontal table 8, industrial camera
9, y to feeding slide unit 10, revolution speed control device 11, ultrasonic generator 12.Wherein marble rack is erected at fixation by level
On support 4, Z-direction feeds slide unit and is rigidly connected in marble rack 2 by bolt.Z-direction second level precision surface plate 6 be fixed on Z-direction into
To on slide unit 1, Z-direction feeding slide unit is able to drive Z-direction second level precision surface plate and realizes quick length feed, and Z-direction second level is accurate
Platform realizes the length feed in processing by microfeed (about 1um/s), controls machining accuracy.
As shown in Fig. 2, the rotary ultrasonic tool heads group 7 includes: Ultrasonic probe support 7-1, energy converter 7-2, ultrasound
Tool heads rotating device 7-3, amplitude transformer 7-4, Ultrasonic probe 7-5.Rotary ultrasonic tool heads group 7 passes through Ultrasonic probe branch
Seat 7-1 is rigidly connected on Z-direction second level precision surface plate, and energy converter 7-2 is fixed on the center Ultrasonic probe support 7-1, is received and
High frequency electric pulse is converted into mechanical oscillation from the high frequency electric pulse of ultrasonic generator 12, and by multiple amplitude transformer 7-4, is become
Width bar 7-4 is rigidly connected by screw thread and Ultrasonic probe 7-5.Ultrasonic probe rotating device 7-4 is amplitude transformer 7-4 and to change
The radial high speed rotation of Ultrasonic probe 7-5 realization can be able to drive while device 7-2 realization conduction connection function.
As shown in figure 3, the Ultrasonic probe includes removable Ultrasonic probe front end assemblies 13-1, ultra hard ceramic ball
Body 13-2, fixed substrate 13-3.Fixed substrate 13-3 is connect by screw thread with Ultrasonic probe front end 13-1, ultra hard ceramic sphere
13-2 is embedded in fixed substrate 13-3 and is full of binder between sphere and fixed substrate, ultra hard ceramic sphere 13-2 is fixed on super
The front end of sound tool heads front end assemblies.
As shown in figure 4, rotary ultrasonic prepares hemisphere cavity plate schematic diagram, because of ultra hard ceramic sphere 13-2 and ultrasonic tool
Head front end 13-1 is realized under the action of Ultrasonic probe rotating device 7-3 and amplitude transformer 7-4 to be done while high frequency extensional vibration
High speed rotary motion.
The present invention the following steps are included:
S1, the polishing liquid is uniformly filled between fixed substrate and silicon carbide substrates.It is equipped in fixed substrate smooth logical
Hole is dimensioned slightly smaller than ultra hard ceramic sphere, can be embedded ultra hard ceramic sphere, between fixed substrate and ultra hard ceramic sphere
Full of binder, ultra hard ceramic sphere is fixed in Ultrasonic probe front end.The polishing drop is added in workpiece monocrystalline silicon lining
On bottom material Working position.
S2, industry camera is provided with by Ultrasonic probe, industry camera captures the superhard pottery in Ultrasonic probe front end
Porcelain ball position, when in Z-direction slide unit drive Ultrasonic probe front end ultra hard ceramic sphere arrival workpiece surface top 1mm, control
Heart transmitting signal control Z axis motor stopping is fed down, and Ultrasonic probe reaches Working position.Reach the ultrasonic work of Working position
Tool head is rotated with given pace, while amplitude transformer drives Ultrasonic probe, the ultra hard ceramic sphere side rotation of Ultrasonic probe front end
Turn side and do ultrasonic vibration, excitation abrasive grain impacts substrate material, with ultrasonic cavitation, abrasive grain shearing, hammering, realizes micro- hemisphere cavity plate
Material removal.
S3, the rotary ultrasonic tool heads can while ultrasonic vibration radial direction high speed rotation, both direction collective effect,
Clast can be excluded in time, clast is avoided to scratch machined surface, improve processing efficiency and machining accuracy.Meanwhile because ultrasound adds
The presence of rotary motion in work can guarantee that micro- hemisphere cavity plate can have preferable form accuracy.Obtain surface roughness Sa<
The micro- hemisphere cavity plate array of 20nm.
The Ultrasonic probe group 7 is fixed on Z-direction precision second level platform, and energy converter 7-3 and adjustable ultrasonic wave occur
Device 12 is connected, and ultrasonic generator 12 emits certain current impulse and is transmitted to energy converter 7-3, and high-frequency electrical energy is converted into
High-frequency vibration is transmitted on amplitude transformer 7-4, drives the ultra hard ceramic sphere 13-2 for being fixed in Ultrasonic probe front end 13-1
High frequency ultrasound vibration, while 7 rotating device 7-3 of Ultrasonic probe group is rotated with given pace, drives ultra hard ceramic sphere 13-2
It makes rotating motion on x/y plane while high frequency ultrasound vibration, the speed of rotation is controlled by controller 10.
Industrial video camera 9 capture 7 front end ultra hard ceramic sphere 13-2 of Ultrasonic probe group from substrate material 14-2 away from
From passing it to control centre 5, control centre 5 controls Z and feeds down to working slider 1, as ultra hard ceramic sphere 13-2
1 feed-disabling of Z-direction working slider when reaching 1-2mm above substrate material 11-4.Control centre 5 controls second level fine-limit work at this time
Platform 6 is processed downwards with small feeding 20um/s.Ultra hard ceramic sphere 13-2 high-frequency vibration, which is hit, to be added dropwise in monocrystalline substrate material
Expect the abrasive grain 14-1 on 14-2, mechanical shock, shearing, throwing of the abrasive grain to substrate material are excited by ultra hard ceramic sphere 13-2
Mill, the cavitation phenomenon of polishing liquid and high-speed rotating ultra hard ceramic sphere drive abrasive grain to act on removal material to substrate material polishing
Material, broken monocrystalline substrate material 14-2 process substantially semi-spherical shape.
It is 700r/min that period, which controls revolving speed, and amplitude controlling is in 12um-40um, frequency 40kHz-60kHz, using hitting greatly
The abrasive grain for hitting energy realizes the removal of bulk substrate material, and will be embedded in the abrasive grain in workpiece material with tangentially using rotary motion
Power removal, accelerates process velocity, obtains the hemisphere cavity plate that form accuracy is good but surface quality is bad, surface roughness is
Sa=50nm-80nm.Realize the roughing of double of ball impression mould.
Multistage grinding is realized by the controllable method of the multiple domain of Ultrasonic machining, and Ultrasonic probe 7 is adjusted by control centre 5 and is processed
Amplitude is 0.5 μm -4 μm, and frequency is that 10kHz-20kHz control Ultrasonic probe rotary rpm is 1200r/min, is realized to hemisphere
The finishing of cavity plate can be substantially reducing at processing under conditions of micro removal amount using the principle of fragile material plastic processing
In the process to the surface breakdown of the hard & brittle material of workpiece, its crack number and scale are reduced, it is thick thus to obtain better surface
Rugosity (reaches 20nm < Sa<40nm).Process finishing position is reached when industrial camera 9 captures ultra hard ceramic sphere 13-2
When, control centre 5 closes the ultrasonic vibration of Ultrasonic probe 13-1 while controlling its feed-disabling, by rotary motion band
Dynamic abrasive grain 14-2 carries out the rough surface that micro circumference material removal further decreases hemisphere molding surface to substrate material 14-2
Degree (reaches Sa< 20nm), last control centre 5 controls Z-direction working slider 1 and rises, and completes the processing of double of ball impression mode array.
Processing object in the implementation case is certain thickness hard brittle material, such as monocrystalline silicon, silicon carbide, aluminium oxide
Deng cavity plate geometry is generally hemispherical, but is not limited to hemispherical, can be free kick coronal structure.
It is equipped with smooth bore on the aluminium alloy fixed substrate 13-3, is dimensioned slightly smaller than ultra hard ceramic sphere 13-2, it can
Ultra hard ceramic sphere 13-2 is embedded, binder, superhard pottery are full of between fixed substrate 13-3 and ultra hard ceramic sphere 13-2
Porcelain sphere 13-2 is fixed in the front end Ultrasonic probe 13-1.First by Ultrasonic probe when fixed ultra hard ceramic sphere 13-2
Group 7 fixation is then embedded in the fixed substrate 13-3 for filling bonding agent, then by adjusting Z to workbench 1 downwards into
It gives, until the marble horizontal table 8 of all ultra hard ceramic sphere 13-2 contact level-off, is obtained after binder solidification
The consistent ultrasonic tool head assembly of levelness height.
To solve the wear problem that Ultrasonic probe front end ultra hard ceramic sphere generates in process, using high rigidity
Material with the material of high-wearing feature as ultra hard ceramic sphere, specific hardness MOHS ultra hard ceramic sphere > MOHS abrasive grain > MOHS
Workpiece, while for convenience of the replacement problem after Ultrasonic probe abrasion, the removable Ultrasonic probe front end 7-5 and rotating dress
Setting 7-3 can be realized disassembly, reduce processing cost and mould replacing time.
The workbench body frame 2 is damped platform material is marble, guarantees that second level precision surface plate 6 is being fed down
When horizontal table 8 do not shake or shake it is minimum, improve machining accuracy, guarantee machined surface quality.
The circularity in micro- each hole of hemisphere cavity plate permutation that the present invention obtains is high, and cavity plate changes of section radius is small, mills with tradition
Processing to be cut to compare, radius change is small, do not occur collapsing bottom, 400 microns of hemisphere cavity plates processing comparisons such as the following table 1:
Table 1
The present invention processes 100 hemisphere cavity plates by the multistage grinding of ultrasound and milling radius change, the comparison for collapsing bottom occurs,
10 one group see the table below 2,
| Grouping | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Bottom number is collapsed in ultrasonic multistage grinding | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Milling radius change collapses bottom number | 2 | 3 | 3 | 4 | 4 | 3 | 3 | 2 | 3 | 2 |
Table 2
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array, which comprises the steps of:
S1, the polishing liquid is uniformly filled between fixed substrate and silicon carbide substrates；
S2, Ultrasonic probe receive given frequency and amplitude and drive the ultra hard ceramic sphere for being constrained on Ultrasonic probe front end
High-speed high frequency vibration, excitation abrasive grain are launched impact substrate material, by abrasive grain to the mechanical shock of substrate material, cut
It cuts, the cavitation phenomenon of rubbing down, polishing liquid removal material, while high-speed rotating ultra hard ceramic sphere drives abrasive grain to substrate material
Multistage polishing effect, remove material,
S3, surface roughness S is obtainedaThe micro- hemisphere cavity plate array of < 20nm.
2. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that described
Ultra hard ceramic sphere size is less than fixed substrate through-hole diameter, can be embedded ultra hard ceramic sphere, fixed substrate and super
It is full of binder between hard spheres of ceramic, ultra hard ceramic sphere is fixed in Ultrasonic probe front end.
3. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that described
Ultra hard ceramic sphere assembly method is as follows: the ultra hard ceramic sphere that diameter is slightly less than fixed substrate through-hole is put into fixed substrate,
It is full of binder therebetween, then is fixed in Ultrasonic probe front end, leads to after Ultrasonic probe is loaded onto Ultrasonic probe support
It crosses adjustment Z-direction workbench to feed down, until all ultra hard ceramic spheres contact marble horizontal table, until binder
The levelness consistent ultrasonic tool head assembly of height completely is obtained after solidification.
4. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that use
Industry camera monitoring captures ultra hard ceramic ball position, controls machine process by its position.
5. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that ultrasound
Tool heads are detachable rotary ultrasonic tool heads, drive amplitude transformer on horizontal basal plane by the coil windings in rotating device
High-speed rotation, while rotating device enables to amplitude transformer not generated in the vertical direction except ultrasound vibration by axially stop block
Outer shake is moved, so that Ultrasonic probe attached rotary motion while making ultrasonic vibration.
6. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that described
Ultra hard ceramic sphere forms the grinding of multiple domain controllable multi-level by control rotation speed and supersonic frequency, and previous stage is broken for brittleness
Bad, the latter half is fragile material plastic processing.
7. a kind of method that rotary ultrasonic method processes micro- hemisphere cavity plate array as described in claim 1, which is characterized in that described
Fixed substrate is aluminium alloy base plate, with a thickness of 0.2mm-0.5mm.
8. the device that a kind of rotary ultrasonic method processes micro- hemisphere cavity plate array, which is characterized in that including ultrasonic polishing experimental bench, institute
Stating ultrasonic polishing experimental bench includes: that Z-direction feeding slide unit, marble rack and hold-down support, marble rack level are erected at solid
Determine on support, Z-direction feeds slide unit and is rigidly connected in marble rack by bolt, and Z-direction second level essence is equipped on Z-direction feeding slide unit
Close platform, Z-direction second level precision surface plate front side are installed with rotary ultrasonic tool heads group.
9. as a kind of rotary ultrasonic method of claim 8 processes the device of micro- hemisphere cavity plate array, which is characterized in that the rotation is super
Sound tool heads group includes: Ultrasonic probe support, energy converter, Ultrasonic probe rotating device, amplitude transformer, Ultrasonic probe, rotation
Turn Ultrasonic probe group to be rigidly connected on Z-direction second level precision surface plate by Ultrasonic probe support, energy converter is fixed on ultrasound
Tool heads supports center, receives the high frequency electric pulse from ultrasonic generator, and by multiple amplitude transformers by high frequency electric pulse
It is converted into mechanical oscillation, amplitude transformer is rigidly connected by screw thread and Ultrasonic probe, and Ultrasonic probe rotating device is for luffing
Bar and energy converter are able to drive Ultrasonic probe and realize radial high speed rotation while realizing conduction connection function.
10. as a kind of rotary ultrasonic method of claim 9 processes the device of micro- hemisphere cavity plate array, which is characterized in that the ultrasound
Tool heads include removable Ultrasonic probe front end assemblies, ultra hard ceramic sphere, fixed substrate, and fixed substrate is by screw thread and surpasses
The connection of sound tool heads front end, ultra hard ceramic sphere are embedded in fixed substrate and are full of binder between sphere and fixed substrate, will be superhard
Spheres of ceramic is fixed on the front end of Ultrasonic probe front end assemblies.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111390658A (en) * | 2020-04-30 | 2020-07-10 | 岭南师范学院 | Micro-channel electrophoresis auxiliary micro-ultrasonic processing device and method |
| CN112461264A (en) * | 2020-11-20 | 2021-03-09 | 大连理工大学 | Nano manufacturing equipment for quartz hemispherical harmonic oscillator |
| CN113857767A (en) * | 2021-10-26 | 2021-12-31 | 山东大学 | Tool head and method for self-adaptive machining and forming of micro-texture on surface of curved-surface thin-wall part |
| CN114161268A (en) * | 2021-11-30 | 2022-03-11 | 北京卫星制造厂有限公司 | Grinding device and method |
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| CN113857767A (en) * | 2021-10-26 | 2021-12-31 | 山东大学 | Tool head and method for self-adaptive machining and forming of micro-texture on surface of curved-surface thin-wall part |
| CN113857767B (en) * | 2021-10-26 | 2022-08-12 | 山东大学 | Tool head and method for self-adaptive machining and forming of micro-texture on surface of curved-surface thin-wall part |
| CN114161268A (en) * | 2021-11-30 | 2022-03-11 | 北京卫星制造厂有限公司 | Grinding device and method |
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