CN105479275A - Micro half ring die array micro ultrasonic classification polishing method - Google Patents
Micro half ring die array micro ultrasonic classification polishing method Download PDFInfo
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- CN105479275A CN105479275A CN201510802001.2A CN201510802001A CN105479275A CN 105479275 A CN105479275 A CN 105479275A CN 201510802001 A CN201510802001 A CN 201510802001A CN 105479275 A CN105479275 A CN 105479275A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a micro half ring die array micro ultrasonic classification polishing method. The method comprises the steps of 1) manufacturing of a precise ball array polishing die; 2) primary polishing: an array micro tool is adopted, the polishing die performs high-frequency micro ultrasonic vibration in the micro distance above a substrate, and feeds downwards in the Z direction, an X platform and a Y platform are matched with each other for processing and driving a workpiece to move, after a layer of material is removed, a Z shaft continuously feeds downwards, a track point is enabled to adduct in the projection of anXY plane, a next layer of material is removed, and the steps are repeated till step-progressive micro die arrays and micro die arrays with extremely similar processing shapes are processed; 3) secondary polishing: the material brittleness removal of the micro half ring die arrays is achieved through adopting the precise ball array polishing die; and 4) third-level polishing: the precise ball array polishing die performs micro ultrasonic vibration, the micro die is trimmed, and the surface roughness is reduced through adopting nanoscale abrasive particles. According to the method, the shape accuracy is high, the surface roughness is low, the surface quality is high, and the efficiency is high.
Description
Technical field
The invention belongs to Ultra-precision Turning field, the ultrasonic classification polishing method of especially a kind of micro-semi-ring die array micro.
Background technology
Hemispherical reso nance gyroscope is a kind of novel inertial sensor, has plurality of advantages compared with mechanical gyro.The hemispherical reso nance gyroscope precision of macro-scale has reached inertia rank, start to be applied to aviation, weapons and space inertial navigation system, but due to yardstick cause greatly that volume is large, quality is heavy, power consumption is high, and highly depends on Ultraprecision Machining, greatly limit its application.MEMS gyro has the advantages such as size is little, lightweight, low in energy consumption, but existing MEMS gyro cannot reach inert stage precision, can not be applied in the occasion that required precision is high, such as in GPS blind area for aircraft provides short-range navigation.The main cause that MEMS gyro precision is not high is: existing MEMS element processing method, as chemical attack, etching, photolithographic transfer etc., the overwhelming majority is the structure of 2D or 2.5D, component quality and the distribution of material of the processing of these methods are uneven, cause matching between gyro induction frequencies and driving poor, the precision of MEMS gyro is extremely restricted.In order to promote the precision of MEMS gyro, Chinese scholars starts to be devoted to research 3D structure MEMS hemispherical reso nance gyroscope, the parts of this gyro most critical are the small hemisphere film shells of high accuracy be deposited on crystalline material micro-semi-ring die, study the polycrystalline diamond films resonator quality factor of proof based on chemical vapour deposition (CVD) (chemicalvapordeposition, CVD) far away higher than the silicon materials resonator of same structure.But the precision of the micro-hemispherical Shell of CVD relies on the form accuracy of its " parent " micro-semi-ring die, surface roughness and surface quality.At present, the processing method of single crystal silicon material micro-semi-ring die has: the three-dimensional structure processing method expanded from 2D and the 2.5D structure making process of traditional MEMS, fine EDM processing, micro-Milling Process, fine ultrasonic layering processing.So far, these reported processing methods also cannot meet the requirement of the hard crisp micro-semi-ring die machining accuracy of monocrystalline silicon and working (machining) efficiency, main because: MEMS micro Process-method such as wet chemical etch and dry plasma etch that (1) is traditional, in the process extended from 2D structure to 3D structure, all be difficult to the selective problems breaking away from crystallographic direction and mask material, cannot process and there is high symmetry uniform micro-semi-ring die consistent with material, this kind of method processes micro-semi-ring die low precision, and efficiency is low.(2) micro EDM (μ EDM) micro-semi-ring die, because discharge space is little, require that the precision of process equipment is high, be difficult to produce the high electrode of form accuracy, and tool-electrode weares and teares very fast in process, the micro-semi-ring molding surface processed is of poor quality, and form accuracy is not high.(3) the micro-semi-ring die of micro-Milling Process; when material fragility is removed; due to the weakness of Milling Process self; cause micro-semi-ring die top or bottom often to there will be bursting apart, surface and sub-surface damage; be difficult to meet processing request; when adopting plastic extension Milling Process, working (machining) efficiency and yield rate are extremely low.(4) utilize ultrasonic and micro tool layering to process micro-semi-ring die, the wearing and tearing due to micro tool are difficult to Accurate Prediction and control, and thus layering feeding path is difficult to make rational planning for, and cause micro-semi-ring die form accuracy poor, and working (machining) efficiency are low.(5) method of other electric machining micro-structural, as Electrolyzed Processing, is subject to the restriction of single crystal silicon material electric conductivity, is difficult to use in the processing of micro-semi-ring die.To sum up, owing to cannot process the micro-semi-ring die of high-quality resonant gyroscope monocrystalline silicon, there is not been reported so far develops the MEMS hemispherical reso nance gyroscope of inertia dimension accuracy.
Summary of the invention
The deficiency of high form accuracy, low surface roughness, great surface quality, high efficiency processing cannot be realized to overcome existing resonant gyroscope monocrystalline silicon micro-semi-ring die, the invention provides a kind of high form accuracy, low surface roughness, great surface quality, the ultrasonic classification polishing method of high efficiency micro-semi-ring die array micro.
The technical solution adopted for the present invention to solve the technical problems is:
The ultrasonic classification polishing method of a kind of micro-semi-ring die array micro, described polishing method comprises the steps:
1) precision ball array polishing mould is made
Described polishing mould comprises instrument connecting rod, positioning baseplate and precise sphere, the upper end of instrument connecting rod is connected with fine ultrasonic generator, the lower end of described instrument connecting rod is connected with positioning baseplate, positioning baseplate processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere;
2) first order polishing
Adopt array micro instrument, polishing liquid is full of between micro tool polishing mould and substrate slice, fine abrasive grains is comprised in polishing liquid, polishing mould does the fine ultrasonic vibration of high frequency also along the Z direction to lower feeding above substrate slice in slight distance, XY platform coordinates processing request to drive workpiece motion s, first remove layer of material, afterwards, XY platform continues to drive workpiece motion s, Z axis continues to lower feeding, make tracing point in the projection adduction of XY plane, remove lower layer of material again, the rest may be inferred, until process have that ladder goes forward one by one with machining shape and similar nick mode array thereof,
3) second level polishing
Precision ball array polishing mould is moved downward along Z-direction by two-stage feeding, collaborative fine ultrasonic vibration, excite the abrasive particle high speed impact substrate slice in polishing liquid, under abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, polishing mould scraping compound action, the material realizing micro-semi-ring die array is removed, and this grade of material is removed and belonged to brittle removal;
3) third level polishing
By adjusting parameter and the Z-direction feeding parameter of ultrasonic vibration, making the material of workpiece remove form is that plastic material is removed;
The downward feed motion of two-stage of Z axis, and the fine ultrasonic vibration of precision ball array polishing mould, adopt nanoscale abrasive particle, carries out correction of the flank shape and reduce surface roughness to nick mould.
Further, described step 1) in, positioning baseplate has bondd spacing back-up ring, and when spacing back-up ring touches workpiece planarization, the motion of Z-axis direction lower feeding stops.
Further again, described step 1) in, the assembly method of described ultraprecise high uniformity polishing mould is as follows: by uniform application water proofing property binding agent in array hole, polishing mould is inverted, adopt accurate pressing plate vertical depression precise sphere, owing to being full of water proofing property binding agent between precise sphere and aperture, pressure at right angle regulates the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at same plane.
Described step 1) in, the assembly method of described ultraprecise high uniformity polishing mould is as follows: by uniform application water proofing property binding agent in array hole, polishing mould is inverted, adopt accurate pressing plate vertical depression precise sphere, owing to being full of water proofing property binding agent between precise sphere and aperture, pressure at right angle regulates the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at same plane;
For spacing back-up ring assembling mode, adopt the spacing back-up ring of accurate pressing plate vertical depression with array hole, make ring cross-section on spacing back-up ring in a plane, complete the assembling of spacing back-up ring.
The pre-allowance removing situation and follow-up polishing according to material adjusts the height of spacing back-up ring.
Described precise sphere adopts traditional plasticity spheroid, and material is that steel alloy and special type are firm;
Or: described precise sphere adopts spheres of ceramic.
Described polishing liquid adopts the HNA solution of extremely low concentration, ensure HNA solution under normal temperature condition to the corrosion rate of workpiece material lower than 2-3 μm/min, utilize the micro-elastic polishing mould being moistened with HNA solution, each micro-semi-ring die in the micro-semi-ring die array create processing carries out of short duration polishing, can improve rapidly molding surface roughness.
Technical conceive of the present invention is: by the fine ultrasonic vibration of array polishing mould, excite the fine abrasive grains high speed impact nick mould substrate work pieces in the polishing liquid between polishing mould and nick mould substrate work pieces (functional crystal such as monocrystalline silicon, sapphire), and with compound actions such as ultrasonic cavitation, the scraping of polishing mould, hammerings, carry out material removal to substrate work pieces, polishing is basic originally as shown in Figure 1.Adopt three grades of classification polishings, first order polishing adopts array micro instrument, this instrument adopts the equipment such as electric spark can carry out correction of the flank shape to the micro tool of wearing and tearing online, realize the steps approximate removal of nick mode array material, by first order polishing, can process the nick mould that form accuracy is higher, but the morpheme requirement that can't meet nick mode array is created in first order polishing.To the micro-semi-ring die of the semi-finished product after first order polishing array, carry out second level polishing, second level polishing adopts homemade precision ball array polishing mould, the shape configurations of nick mode array is realized by the method for described fine ultrasonic fluid polishing, by second time polishing, the position of nick mode array and form accuracy can meet the demands substantially.Same self-control precision ball array polishing mould is adopted to carry out third time polishing, third time polishing needs to revise form accuracy and the reduction of molding surface roughness, third time polishing is different from second time polishing and is mainly manifested in: by adjusting parameter and the Z-direction feeding parameter of ultrasonic vibration, making the material of workpiece remove form is no longer that fragile material is removed, third time polishing material removal form is that the material plasticity under fine ultrasonic vibration is removed, and thus can carry out correction of the flank shape and surface roughness lifting to nick mould.
Beneficial effect of the present invention is mainly manifested in: high form accuracy, high shape coincidence, low surface roughness, great surface quality, high efficiency.
Accompanying drawing explanation
Fig. 1 is nick mode array formula polishing schematic diagram.
Fig. 2 is the schematic diagram of first order array polishing polishing mould.
Fig. 3 is that the single die part material of first order polishing removes schematic diagram.
Fig. 4 is polishing mode structure figure.
Fig. 5 is polishing mould assembly method schematic diagram.
Fig. 6 is the structure chart of the ultrasonic classification grinding and polishing device of micro-semi-ring die array micro.
Fig. 7 is the side top views such as the axle of the ultrasonic classification grinding and polishing device of micro-semi-ring die array micro
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
With reference to Fig. 1 ~ Fig. 7, the ultrasonic classification polishing method of a kind of micro-semi-ring die array micro, described polishing method comprises the steps:
1) precision ball array polishing mould is made
Described polishing mould comprises instrument connecting rod 71, positioning baseplate 72, precise sphere 75, the upper end of instrument connecting rod 71 is connected with fine ultrasonic generator, the lower end of described instrument connecting rod 71 is connected with positioning baseplate 72, positioning baseplate 72 processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere 75;
2) first order polishing
Adopt array micro instrument, polishing liquid is full of between micro tool polishing mould and substrate slice, fine abrasive grains is comprised in polishing liquid, polishing mould does the fine ultrasonic vibration of high frequency also along the Z direction to lower feeding above substrate slice in slight distance, XY platform coordinates processing request to drive workpiece motion s, first remove layer of material, afterwards, XY platform continues to drive workpiece motion s, Z axis continues to lower feeding, make tracing point in the projection adduction of XY plane, remove lower layer of material again, the rest may be inferred, until process have that ladder goes forward one by one with machining shape and similar nick mode array thereof,
3) second level polishing
Precision ball array polishing mould is moved downward along Z-direction by two-stage feeding, collaborative fine ultrasonic vibration, excite the abrasive particle high speed impact substrate slice in polishing liquid, under abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, polishing mould scraping compound action, the material realizing micro-semi-ring die array is removed, and this grade of material is removed and belonged to brittle removal;
3) third level polishing
By adjusting parameter and the Z-direction feeding parameter of ultrasonic vibration, making the material of workpiece remove form is that plastic material is removed;
The downward feed motion of two-stage of Z axis, and the fine ultrasonic vibration of precision ball array polishing mould, adopt nanoscale abrasive particle, carries out correction of the flank shape and reduce surface roughness to nick mould.
In the present invention, at certain thickness crystalline material (monocrystalline silicon, sapphire, ruby, carborundum) on substrate slice, removed by material and form micro-semi-ring die, geometry mostly is spherical crown, but be not limited to spherical crown, geometric shape maximum cross-section diameter (or on maximum secting area 2 ultimate ranges) scope is 0.2mm to 10mm, if nick mould is spherical cap-shaped structure, require that there is splendid form accuracy (sphericity), die edge is positioned at substrate top surface, ratio between edge radius variation delta R and edge radius R levels off to 0 as far as possible, between the different dies of same size, shape has uniformity.
Further, for the fine ultrasonic classification polishing of the array realizing this micro-semi-ring die, its principle is: adopt the polishing of three grades of classification array, and first order polishing adopts array micro instrument, as shown in Figure 1, the shape of each array element is the basic configurations such as cylinder, cuboid, regular polygon.This level is processed, polishing liquid is full of between micro tool polishing mould and substrate slice, fine abrasive grains is comprised in polishing liquid, polishing mould does the fine ultrasonic vibration of high frequency also along the Z direction to lower feeding above substrate slice in slight distance (being generally within 100 microns), XY platform coordinates processing request to drive workpiece motion s, first remove layer of material, afterwards, XY platform continues to drive workpiece motion s, Z axis continues to lower feeding, make tracing point in the projection adduction of XY plane, remove lower layer of material again, the rest may be inferred, until process have that ladder goes forward one by one with machining shape and similar nick mode array thereof, instrument adopts the equipment on-lines such as electric spark to carry out correction of the flank shape to micro tool, by first order polishing, the nick mould that form accuracy is higher can be processed, but the morpheme requirement that can't meet nick mode array is created in first order polishing, single negative molding material is removed as shown in Figure 3, Fig. 3 is only schematic diagram, by the increase of the number of layering, first order polishing can process the higher nick mould shape array of form accuracy.
Further, to the nick mode array that the first order machines, carry out second level polishing, second level processing adopts homemade precision ball array polishing mould, as shown in Figure 4.Precision ball array polishing mould is moved downward along Z-direction by two-stage feeding, collaborative fine ultrasonic vibration, excite the abrasive particle high speed impact substrate slice in polishing liquid, under the compound actions such as abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, the scraping of polishing mould, the material realizing micro-semi-ring die array is removed, this grade of material is removed and is belonged to brittle removal, and the main models of second level polishing carries out correction of the flank shape to the array polishing model of first order polishing, to meet the morpheme requirement of micro-semi-ring die array.
Further, same self-control precision ball array polishing mould is adopted to carry out third time polishing, third time polishing needs revise form accuracy and reduce molding surface roughness, third time polishing needs the downward feed motion of the two-stage of Z axis equally, and the fine ultrasonic vibration of precision ball array polishing mould, be different from second time polishing to be mainly manifested in: by adjusting parameter and the Z-direction feeding parameter of ultrasonic vibration, making the material of workpiece remove form is no longer that fragile material is removed, the main percussion relying on abrasive particle removed by material, this time polishing process need adopts nanoscale abrasive particle, in addition plastic material removal is carried out to workpiece, thus can carry out correction of the flank shape to nick mould and reduce surface roughness.
Further, ultraprecise high uniformity array polishing mode structure and assembly method thereof are as shown in Figure 4 and Figure 5.Instrument connecting rod 71, positioning baseplate 72, connection colloid 73, spacing back-up ring 74, precise sphere 75, instrument connecting rod 71 is connected with fine ultrasonic generator.Positioning baseplate 72 processes array aperture, pore size is less than precise sphere 75 diameter, binding agent is full of between aperture and precise sphere 75, in a part of embedded hole of spheroid, size difference due to all array apertures is minimum and size between precise sphere diameter also differs very little, so embed highly basically identical after precision ball embedded hole, concrete contour assembly method describes below.For preventing Z-direction excessive to lower feeding, positioning baseplate 5 has bondd spacing back-up ring 74, when spacing back-up ring 74 (flexible and there is certain rigidity), touch workpiece planarization, the motion of Z-axis direction lower feeding stops, remove the pre-allowance of situation and follow-up polishing according to material, the height of spacing back-up ring can adjust.The bottom surface of described positioning baseplate 72 covers and connects colloid 73.
The assembly method of polishing mould is: by uniform application water proofing property binding agent in array hole, as shown in Figure 5 polishing mould is inverted, adopt the accurate pressing plate 76 vertical depression precise sphere that flatness is splendid, owing to being full of water proofing property binding agent between precise sphere 75 and aperture, pressure at right angle can regulate the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at conplane object.Similar assembling mode is adopted for spacing back-up ring 74, adopt the accurate pressing plate with array hole (array aperture size is greater than bulb diameter), the spacing back-up ring 74 of vertical depression, makes ring cross-section on spacing back-up ring in a plane, complete the assembling of spacing back-up ring.
Further, for solving the wear problem of the high-accuracy spheroid of precision ball polishing mould in process, except chatted use array micro instrument is removed except most of material, the other technologies scheme adopted also comprises: the first scheme, adopt traditional plasticity spheroid, material is that steel alloy and special type are firm, experimental study shows, adopt steel alloy as high-accuracy spheroid, monocrystalline silicon silicon chip carries out die array and adds man-hour, the machined parameters such as price such as suitable adjustment feed speed and supersonic frequency, can ensure that the wear extent of spheroid is less than 5%.First scheme, patent of the present invention proposes the higher spheres of ceramic of employing hardness as accurate polishing ball, and its hardness order is: MOHS
precision ball>MOHS
abrasive particle>MOHS
workpiece, be readily appreciated that the wear extent of precision ball will reduce while workpiece being carried out to effectively processing from the sequence of Mohs' hardness.
The present invention can realize the surface roughness requirements of the small semi-ring die of array, the surface roughness of below 20nm can be realized, but the surface roughness of nick mould can reduce further, its Technical Solving is: the HNA solution adopting extremely low concentration, ensure HNA solution under normal temperature condition to the corrosion rate of workpiece material lower than 0.5 μm/min, utilize the micro-elastic polishing mould (die size is less than die size) being moistened with HNA solution, polished die form accuracy does not need special requirement, to previous step, each the micro-semi-ring die processed in the micro-semi-ring die array created carries out of short duration polishing, molding surface roughness can be improved rapidly.
Further, whole small die array grinding and polishing device is formed as shown in Figure 6 and Figure 7.The parts mainly comprised are: 1. lathe bed, the main feed mechanism in 2.Z direction, the fine ultrasonic vibration installation of 3.Z direction micrometer feed mechanism 4., 5. adjustable fine supersonic generator, 6. tool coupling device, 7. ultraprecise polishing mould, 8. the feeding of polishing liquid and the circulatory system, 9. realtime graphic microscopic system, 10. workpiece, 11. sensor connecting plates, 12. force snesor, 13.XY workbench, 14. workbenches (being preferably marble platform), 15. computer control systems, 16. distribution systems.Concrete connected mode and processing method are: lathe bed 1 is fixed in marble platform, marble platform has splendid vibrationproof performance, can isolate and reduce the vibration of external environment condition, Z-direction feed mechanism is two-stage feeding, main feed mechanism 2 is arranged on lathe bed, micrometer feed mechanism 3 is installed on main feed mechanism, actual adding, realizes two-stage feeding man-hour, the precision of main feed mechanism is at micron order, the precision of micrometer feed mechanism can reach nanoscale, fine ultrasonic vibration installation 4 is connected with micrometer feed mechanism 3, regulate the parameter of adjustable fine supersonic generator 5 can adjust vibration frequency and the amplitude of small ultrasonic vibration installation 4, by tool coupling device 6, realize the connection of ultraprecise polishing mould 7 and fine ultrasonic vibration installation 4, polishing liquid feed system and the circulatory system 8, polishing liquid is made to be uniformly distributed and to follow bad between polishing mould 7 and workpiece 10.Add man-hour, while the feeding of Z-direction two-stage, realize the fine ultrasonic vibration of polishing mould, this vibration makes abrasive particle with very high velocity shock surface of the work, realize material under the comprehensive function of the factors such as ultrasonic cavitation in addition, the hammering of polishing mould, scraping to remove fast, realize micro-semi-ring die array Polishing machining.While processing, the distribution of trace particle stream field and abrasive particle field and motion state can be adopted to carry out analyzing and following the tracks of, when using PIV to observe abrasive particle field, need the acrylic transparent panel of manufacture and the same geometry of workpiece to be processed, can respectively from top and distribution and the motion state of observing trace particle below workpiece respectively, observation analysis is carried out in camera head stream field and abrasive particle field frequently also can to adopt sudden strain of a muscle.According to processing request, real-time microscopic system 9 is utilized to observe the general shape of micro-semi-ring die and the state of wear of ultraprecise spheroid.Sensor connecting plate 11 is for connecting workpiece 10 and force snesor 12, sensor 12 is used for detecting the size of operating force and whether stopping means contacts with workpiece, XY worktable 13 is used for realizing the planar movement of workpiece, with satisfied processing difformity, different array arrangement, the requirement of varying number array, sensor 12 is fixed on above XY workbench, computer control system is in order to the feed speed of controlled working device, polishing power size, polishing liquid feed speed and other machined parameters, distribution system is used for powering to whole machine tool system and fine supersonic generator.
In the present embodiment, micro tool array polishing mould, self-control ultraprecise ball array polishing mould, the feeding of two-stage Z-direction, the fine ultrasonic vibration of classification collaborative under, comprehensive flow field and abrasive particle field analysis, realize the efficient ultraprecise polishing of small semi-ring die array.
Claims (8)
1. the ultrasonic classification polishing method of micro-semi-ring die array micro, is characterized in that: described polishing method comprises the steps:
1) precision ball array polishing mould is made
Described polishing mould comprises instrument connecting rod, positioning baseplate and precise sphere, the upper end of instrument connecting rod is connected with fine ultrasonic generator, the lower end of described instrument connecting rod is connected with positioning baseplate, positioning baseplate processes array aperture, pore size is less than precise sphere diameter, binding agent is full of, in a part of embedded hole of spheroid between aperture and precise sphere;
2) first order polishing
Adopt array micro instrument, polishing liquid is full of between micro tool polishing mould and substrate slice, fine abrasive grains is comprised in polishing liquid, polishing mould does the fine ultrasonic vibration of high frequency also along the Z direction to lower feeding above substrate slice in slight distance, XY platform coordinates processing request to drive workpiece motion s, first remove layer of material, afterwards, XY platform continues to drive workpiece motion s, Z axis continues to lower feeding, make tracing point in the projection adduction of XY plane, remove lower layer of material again, the rest may be inferred, until process have that ladder goes forward one by one with machining shape and similar nick mode array thereof,
3) second level polishing
Precision ball array polishing mould is moved downward along Z-direction by two-stage feeding, collaborative fine ultrasonic vibration, excite the abrasive particle high speed impact substrate slice in polishing liquid, under the compound actions such as abrasive particle impact, ultrasonic cavitation, the hammering of polishing mould, the scraping of polishing mould, the material realizing micro-semi-ring die array is removed, and this grade of material is removed and belonged to brittle removal;
4) third level polishing
By adjusting parameter and the Z-direction feeding parameter of ultrasonic vibration, making the material of workpiece remove form is that plastic material is removed;
The downward feed motion of two-stage of Z axis, and the fine ultrasonic vibration of precision ball array polishing mould, adopt nanoscale abrasive particle, carries out correction of the flank shape and reduce surface roughness to nick mould.
2. the ultrasonic classification polishing method of a kind of micro-semi-ring die array micro as claimed in claim 1, it is characterized in that: adopt three grades of classification polishings, first configuration, rear correction of the flank shape, promote surface quality again, described step 1) in, positioning baseplate has bondd spacing back-up ring, when spacing back-up ring touches workpiece planarization, the motion of Z-axis direction lower feeding stops.
3. the ultrasonic classification polishing method of a kind of micro-semi-ring die array micro as claimed in claim 1, it is characterized in that: described step 1) in, the assembly method of described ultraprecise high uniformity polishing mould is as follows: by uniform application water proofing property binding agent in array hole, polishing mould is inverted, adopt accurate pressing plate vertical depression precise sphere, owing to being full of water proofing property binding agent between precise sphere and aperture, pressure at right angle regulates the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at same plane.
4. the ultrasonic classification polishing method of a kind of micro-semi-ring die array micro as claimed in claim 2, it is characterized in that: described step 1) in, the assembly method of described ultraprecise high uniformity polishing mould is as follows: by uniform application water proofing property binding agent in array hole, polishing mould is inverted, adopt accurate pressing plate vertical depression precise sphere, owing to being full of water proofing property binding agent between precise sphere and aperture, pressure at right angle regulates the thickness of water proofing property adhensive membrane, and then reaches spheroid upper end peak and be positioned at same plane;
For spacing back-up ring assembling mode, adopt the spacing back-up ring of accurate pressing plate vertical depression with array hole, make ring cross-section on spacing back-up ring in a plane, complete the assembling of spacing back-up ring.
5. the ultrasonic classification polishing method of a kind of micro-semi-ring die array micro as claimed in claim 3, is characterized in that: the pre-allowance removing situation and follow-up polishing according to material adjusts the height of spacing back-up ring.
6. the ultrasonic classification polishing method of the micro-semi-ring of the one as described in one of Claims 1 to 5 die array micro, is characterized in that: described precise sphere adopts traditional plasticity spheroid, material is that steel alloy and special type are firm.
7. the ultrasonic classification polishing method of the micro-semi-ring of the one as described in one of Claims 1 to 5 die array micro, is characterized in that: described precise sphere adopts spheres of ceramic.
8. the ultrasonic classification polishing method of the micro-semi-ring of the one as described in one of Claims 1 to 5 die array micro, it is characterized in that: described polishing liquid adopts the HNA solution of extremely low concentration, ensure HNA solution under normal temperature condition to the corrosion rate of workpiece material lower than 2-3 μm/min, utilize the micro-elastic polishing mould being moistened with HNA solution, each micro-semi-ring die in the micro-semi-ring die array create processing carries out of short duration polishing, can improve rapidly molding surface roughness.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108747603A (en) * | 2018-06-12 | 2018-11-06 | 山东大学 | The coarse-fine of non-rotating optical array integrates progressive method for grinding |
| CN109483394A (en) * | 2018-09-13 | 2019-03-19 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface and processing method |
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| CN114115129A (en) * | 2021-11-15 | 2022-03-01 | 上海维宏电子科技股份有限公司 | Part machining control method and device for converting plane graph into 2.5D model in numerical control system, processor and storage medium thereof |
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| CN108747603B (en) * | 2018-06-12 | 2019-05-07 | 山东大学 | The coarse-fine of non-rotating optical array integrates progressive method for grinding |
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| CN109483394B (en) * | 2018-09-13 | 2023-12-12 | 西安航晨机电科技股份有限公司 | Ultra-precise spherical surface machining device and method for hemispherical harmonic oscillator |
| CN109483394A (en) * | 2018-09-13 | 2019-03-19 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface and processing method |
| CN110340748A (en) * | 2019-05-30 | 2019-10-18 | 浙江工业大学 | A kind of rotary ultrasonic method processes the method and device of micro- hemisphere cavity plate array |
| CN110340747A (en) * | 2019-05-30 | 2019-10-18 | 浙江工业大学 | The micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and device |
| CN110355619A (en) * | 2019-05-30 | 2019-10-22 | 浙江工业大学 | The micro- hemisphere cavity plate array polishing method of cavitation auxiliary at high temperature under high pressure |
| CN110370099A (en) * | 2019-05-30 | 2019-10-25 | 浙江工业大学 | The method of the micro- hemisphere cavity plate array of rotary ultrasonic machining combination magnetic abrasive finishing |
| CN110370099B (en) * | 2019-05-30 | 2021-01-29 | 浙江工业大学 | Method for processing micro-hemispherical concave die array by combining rotary ultrasonic processing with magnetic grinding |
| CN110238713B (en) * | 2019-05-30 | 2021-04-30 | 浙江工业大学 | Processing method of temperature-control pressure-control grinding and polishing micro-hemisphere concave die array |
| CN111390659A (en) * | 2020-04-30 | 2020-07-10 | 岭南师范学院 | Micro-channel ultrasonic machining device and method based on 3D printing mold |
| CN113172486B (en) * | 2021-04-02 | 2022-09-13 | 大连理工大学 | Ultrasonic auxiliary grinding method for composite material tubular honeycomb curved surface |
| CN113172486A (en) * | 2021-04-02 | 2021-07-27 | 大连理工大学 | Ultrasonic auxiliary grinding method for composite material tubular honeycomb curved surface |
| CN114115129A (en) * | 2021-11-15 | 2022-03-01 | 上海维宏电子科技股份有限公司 | Part machining control method and device for converting plane graph into 2.5D model in numerical control system, processor and storage medium thereof |
| CN115401534A (en) * | 2022-08-30 | 2022-11-29 | 大连理工大学 | Microarray mold shape-preserving polishing method |
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