CN110340747A - The micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and device - Google Patents
The micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and device Download PDFInfo
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- CN110340747A CN110340747A CN201910463408.5A CN201910463408A CN110340747A CN 110340747 A CN110340747 A CN 110340747A CN 201910463408 A CN201910463408 A CN 201910463408A CN 110340747 A CN110340747 A CN 110340747A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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Abstract
The invention discloses the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and devices, by the vibration of micro- ultrasonic polishing mould, excitation sphere and high-frequency percussion of the nanoscale abrasive grain to silicon carbide workpiece to be processed surface in polishing liquid, to realize the removal to material.The present invention greatlys improve the processing efficiency of micro- hemisphere cavity plate array, and in such a way that bubble regulates and controls, ensure that the shape coincidence of cavity plate.
Description
Technical field
The present invention relates to Ultra-precision Turning field more particularly to the micro- ultrasonic ball-shooting profiling array polishing sides of bubble regulation
Method and device.
Background technique
Hemispherical reso nance gyroscope is a kind of novel inertial sensor, has strong precision height, stability, high reliablity and longevity
Long feature is ordered, and ability and good temperature performance with good anti shock and vibration, in aviation, weapons etc.
Field begins with utilization.But the spherical shell machining accuracy of this gyroscope is low, and main reason is that its parent --- hemisphere cavity plate
The machining accuracy of array is poor.The negative molding material hardness is big, and size is small, and processing is more difficult.The existing processing method to the cavity plate,
It is such as fine to cut processing, fine ultrasound layering processing, micro EDM mode.
So far, these reported processing methods are not possible to meet the machining accuracy and processing to the micro- hemisphere cavity plate of silicon carbide
The requirement of efficiency.Main reason is that: (1) it is fine cut process micro- hemisphere cavity plate when, material fragility removal during can go out
Existing micro- hemisphere bottom or top burst apart, surface and the case where sub-surface damage, is unable to satisfy the requirement of machining accuracy.Processing effect
Rate and yield rate are all unable to get guarantee.(2) fine ultrasound layering processing, because subtle tool will appear abrasion, and should
Abrasion can not be estimated and be controlled, and therefore, it is difficult to plan that layering is fed path, leads to micro- semi-spherical shape low precision, processing efficiency is low.
(3) the micro- hemisphere cavity plate array of micro EDM, it is small to put the space of points, it is therefore desirable to which the precision of process equipment is very high, and shape
The high electrode machining of precision is difficult, and wears in process quickly, the micro- hemisphere molding surface quality processed
Difference, form accuracy are low.So far there is not been reported develops the micro- hemisphere cavity plate array for meeting machining accuracy and quality requirement.
Summary of the invention
The purpose of the present invention is in view of the drawbacks of the prior art, provide the micro- ultrasonic ball-shooting profiling array of bubble regulation
Polishing method and device.
In order to achieve the goal above, the invention adopts the following technical scheme:
The micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation, includes the following steps:
Step (1) makes polishing mould, and polishing mould includes tool connecting rod, and tool connecting rod includes upper end amplitude transformer and lower ending tool
Head, the end face of the tool heads are coated with N-C hard material coating, and micro- hemisphere cavity plate array is machined on N-C hard material coating；
Step (2) has ball mould guide plate among polishing mould and workpiece to be processed, and the thickness of ball mould guide plate is about pending
The a quarter for the sphere diameter penetrated has array hole on ball mould guide plate, and the aperture of array hole is greater than sphere diameter, and sphere is Z
Fortune function in axis direction is rotated along Pivot Point Center, by the XY worktable of portal bench by polishing mould and workpiece to be processed into
Polishing mould is carried out the movement in Z-direction by parallel institution by the opposite fortune function on the direction row XY；
Step (3) fills the polishing liquid containing abrasive grain and bubble, polishing mould between polishing mould and workpiece to be processed surface
The fine ultrasonic vibration of high frequency is done in the distance of the top 0 to several millimeters of ball mould guide plate upper surface, ultrasonic vibration excites sphere
With abrasive grain high speed impact workpiece to be processed surface, micro- hemisphere pit is formed.
To reduce prolonged ultrasonic cavitation to the cavitation effect of material, into polishing liquid mixed with bubble, to realize right
The removal of material simultaneously, guarantees the precision of machined surface.
Further, for the N-C hard material coating in the step (1) with a thickness of 10mm, the hard material is painted with diamond
Or tungsten carbide.
Further, the diameter of the single cavity plate of micro- hemisphere cavity plate array is greater than or equal to transmitting ball in the step (1)
Body diameter, the diameter range of sphere are 100 microns to 5 millimeters.
Further, the hole count on ball mould guide plate is not less than the cavity plate number of polishing mould, and each on polishing mould
Micro- hemisphere cavity plate has a hole corresponding and concentric with it on ball mould guide plate.
Further, the abrasive grain in polishing liquid is nano-diamond particle.
Further, ball mould guide plate is fixed on workpiece to be processed by paraffin.And the thickness of paraffin can be passed through
To determine the distance between ball mould guide plate and workpiece to be processed.
Further, the air bubble content of polishing liquid is 3% to the 7.4% of water in the step (3).
Further, bubble regulates and controls the device of micro- ultrasonic ball-shooting profiling array polishing, including portal bench, damping dress
Set, parallel institution, Z-direction micrometer feed mechanism, fine ultrasonic vibration installation, fine supersonic generator, tool coupling device,
Micro- ultrasound polishing mould, workpiece to be processed mounting table, X-direction workbench, Y-direction workbench, lathe remote controler, the damping dress
It sets on two feet for being mounted on lathe bed, Y-direction workbench is mounted on lathe bed whippletree position, and the Y-direction of control polishing mould moves, and
Online structure installs the lower section of workbench in the Y direction, and fine ultrasonic vibration installation is mounted on parallel institution lower end, micro- ultrasound polishing mould
It is connected with fine ultrasonic vibration installation, the polishing mould and fine ultrasonic vibration installation synchronous vibration, under the polishing mould
Side is X-direction workbench, and the X-direction workbench is located on portal bench, and workpiece to be processed mounting table is located on the workbench,
Workpiece to be processed is temporarily fixed in workpiece to be processed mounting table by paraffin.
In addition to above-mentioned apparatus, which further includes computer control system and distribution system, the damping
Device, the feeding of Z-direction macroscopic view and micrometer feed mechanism, fine ultrasonic vibration installation, fine supersonic generator, X-direction work
Platform, is connected with computer control system Y-direction workbench, while adjustable fine supersonic generator and distribution system phase
Even.
Technical solution of the present invention is used, the invention has the benefit that compared with prior art, the present invention passes through micro- ultrasound
The vibration of polishing mould, excitation sphere and high-frequency percussion of the nanoscale abrasive grain to silicon carbide workpiece to be processed surface in polishing liquid, with
Realize the removal to material.The processing efficiency of micro- hemisphere cavity plate array is greatlyd improve, and in such a way that bubble regulates and controls, is guaranteed
The shape coincidence of cavity plate.The method of the present invention is high-efficient, controllability is strong, hemisphere cavity plate shape coincidence is high, form accuracy is high,
Surface quality is good, surface roughness is low.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that bubble of the present invention regulates and controls micro- ultrasonic ball-shooting profiling array grinding and polishing device.
Fig. 2 is the schematic diagram that bubble of the present invention regulates and controls micro- ultrasonic ball-shooting profiling array grinding and polishing device.
Fig. 3 is the schematic diagram that bubble of the present invention regulates and controls micro- ultrasonic ball-shooting profiling array polishing method and device.
Fig. 4 is polishing mould of the present invention and sphere and guide frame schematic diagram.
Fig. 5 is polishing mould of the present invention and sphere and guide frame perspective diagram.
Specific embodiment
Concrete scheme specific embodiment of the present invention is further elaborated in conjunction with attached drawing.
Referring to Fig.1~Fig. 5, a kind of micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and device, it is described to grind
Throwing method includes the following steps:
Make polishing mould 9: the polishing mould 9 includes tool connecting rod shown in figure, 93 (this example of N-C hard material coating
Using hard diamond coatings), ball mould guide plate 96 (be illustrated as part and cutd open ball mould guide plate) and sphere 95.Tool connecting rod packet
The amplitude transformer 91 of upper end and the tool heads 92 of lower end are included, the upper end of the amplitude transformer 91 is connected with subtle ultrasonic vibration installation 10
It connects, the N-C hard material coating 93 with a thickness of 5mm is coated in the tool heads 92, this example uses alumina material, in coating
On to process quantity be 10 × 10 micro- hemisphere cavity plate arrays 94, the radius of cavity plate is 0.5 millimeter, and depth is also 0.5 millimeter.Ball
The diameter of body 95 is 1 millimeter, and material is traditional plastic material, this example uses ceramic material.
There is a ball mould guide plate 96 among the polishing mould 9 and workpiece to be processed 13, the material of ball mould guide plate is aluminium
Alloy, with a thickness of 0.3 millimeter.The ball mould guide plate is bonded in 13 table of workpiece to be processed by the paraffin that a layer thickness is 0.7 millimeter
Face.During ultrasonic vibration, ball mould guide plate remains opposing stationary with workpiece to be processed 13.On ball mould guide plate
There is 100 × 100 array hole, the diameter that ball mould is oriented to plate hole is 1010 microns, and sphere can pass through just.And sphere is in x
It can not move with the direction y, function can only be transported along Z-direction or be rotated along itself centre of sphere；
Polishing liquid is full of between 13 surface of polishing mould 9 and workpiece to be processed, polishing liquid uses abrasive material, solvent, additive
According to a certain volume: 5% brightener, 5% abrasive grain, 5% stabilizer and dispersing agent, 85% water configure, in the polishing liquid of this example
Abrasive grain be nano-grade silicon nitride particle, polishing mould 9 does the fine ultrasound of high frequency in the slight distance above workpiece to be processed 13
Vibration, specifically vibrate size are as follows: coating lower edge remained at a distance from 13 upper surface of workpiece to be processed 0 to 1.5 millimeter it
Between.Ultrasonic vibration excites 13 surface of sphere high speed impact workpiece to be processed.Ball mould guiding effect of contraction under, sphere only along
Constantly do ballistic motion in z-axis direction.Under the action of abrasive grain impact, ultrasonic cavitation, ball-shooting impact, silicon carbide is to be processed
13 surface of workpiece is processed the micro- hemisphere cavity plate array to match with sphere size.
But because cavitation can not only generate huge energy impact, the influence to cavity plate machining accuracy is very big, it is long
The cavitation of time can also cavitate the surface of workpiece to be processed 13, or even can not effectively process hemisphere cavity plate, so needing
Carry out bubble regulation.
According to cavitation bubble mechanism of production, the major way of bubble regulation is continuously slowly to be mixed to polishing liquid into polishing liquid
Bubble, the air bubble content of polishing liquid are 3% to the 7.4% of water, and the air capacity mixed in the present embodiment is the 7% of water.
The micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation and device device, including feed motor 1, connect
It connects wires 2, lathe bed 3, X-direction workbench 4, lathe remote controler 5, damping device 6, cabinet base 7, workpiece to be processed mounting table 8, polishing
Mould 9, fine ultrasonic vibration installation 10, parallel institution 11, Y-direction workbench 12, fine supersonic generator 16.The damping
Device 6 is mounted on two cabinet bases 7, can effectively eliminate influence of the extraneous vibration to 13 polishing of workpiece to be processed.Y-direction
Workbench is mounted on lathe bed whippletree position, the Y-direction movement of control polishing mould 9.Parallel institution 11 installs workbench in the Y direction,
After determining Y-direction position, it is adjusted by position of the parallel institution 11 to the Z-direction of polishing mould 9.Fine ultrasonic vibration
Device 10 is connected to the lower section of parallel institution 11, and polishing mould 9 is connected with fine ultrasonic vibration installation 10, the polishing mould 9 with it is micro-
10 synchronous vibration of thin ultrasonic vibration installation, obtains vibration identical with fine 10 Frequency and Amplitude of ultrasonic vibration installation.The polishing
The lower section of mould 9 is X-direction workbench 4, and the X-direction workbench 4 is on portal bench, workpiece to be processed mounting table 8
In on the workbench, the movement to the X-direction in the horizontal plane of workpiece to be processed mounting table 8 can be realized by guide rail, it is to be processed
Workpiece is temporarily fixed in workpiece to be processed mounting table 8 by paraffin, and the mode that melted paraffin can be heated after process finishing is taken out
Workpiece to be processed.The lathe remote controler 5 is connected to the motor by connecting electric wire, the fortune of motor control all directions upper feeding device
Dynamic (diagram motor is only schematic diagram), the move distance of all directions is quantitatively controlled by remote controler.
In addition to above-mentioned apparatus, which further includes computer control system 14 and distribution system 15, described
Damping device 6, the feeding of Z-direction macroscopic view and micrometer feed mechanism, fine ultrasonic vibration installation 10, fine supersonic generator, the side X
To workbench 4, Y-direction workbench, it is connected with computer control system, while adjustable fine supersonic generator and distribution
System is connected.
The present embodiment is making the collaboration of micro- ultrasonic coat polishing mould 9, parallel institution 11 to Z-direction feeding, ball mould guiding by oneself
Under effect, the analysis in flow field and abrasive grain field is combined, to realize the high efficiency ultraprecise polishing to small hemisphere cavity plate array.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (8)
1. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation, which comprises the steps of:
Step (1) makes polishing mould, and polishing mould includes tool connecting rod, and tool connecting rod includes upper end amplitude transformer and lower end tool heads,
The end face of the tool heads is coated with N-C hard material coating, and micro- hemisphere cavity plate array is machined on N-C hard material coating；
Step (2) has ball mould guide plate among polishing mould and workpiece to be processed, and the thickness of ball mould guide plate is about to be launched
The a quarter of sphere diameter has array hole on ball mould guide plate, and the aperture of array hole is greater than sphere diameter, and sphere does Z axis side
Upward fortune function is rotated along Pivot Point Center, and polishing mould and workpiece to be processed are carried out XY by the XY worktable of portal bench
Polishing mould is carried out the movement in Z-direction by parallel institution by the opposite fortune function on direction；
Step (3) fills the polishing liquid containing abrasive grain and bubble between polishing mould and workpiece to be processed surface, and polishing mould is in ball
The fine ultrasonic vibration of high frequency is done in the distance of the top 0 to several millimeters of mould guide plate upper surface, ultrasonic vibration excites sphere and mill
Grain high speed impact workpiece to be processed surface, forms micro- hemisphere pit.
To reduce prolonged ultrasonic cavitation to the cavitation effect of material, into polishing liquid mixed with bubble, to realize to material
Removal simultaneously, guarantee the precision of machined surface.
2. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that described
For N-C hard material coating in step (1) with a thickness of 10mm, the hard material is painted with diamond or tungsten carbide.
3. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that described
The diameter of the single cavity plate of micro- hemisphere cavity plate array is greater than or equal to transmitting sphere diameter, the diameter range of sphere in step (1)
It is 100 microns to 5 millimeters.
4. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that ball mould
Hole count on guide plate is not less than the cavity plate number of polishing mould, and each micro- hemisphere cavity plate on polishing mould is in ball mould guide plate
On have a hole corresponding and concentric with it.
5. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that polishing
Abrasive grain in liquid is nano-diamond particle.
6. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that ball mould
Guide plate is fixed on workpiece to be processed by paraffin.And can be determined by the thickness of paraffin ball mould guide plate with it is to be added
The distance between work workpiece.
7. the micro- ultrasonic ball-shooting profiling array polishing method of bubble regulation as described in claim 1, which is characterized in that described
The air bubble content of polishing liquid is 3% to the 7.4% of water in step (3).
8. the device that bubble regulates and controls micro- ultrasonic ball-shooting profiling array polishing, which is characterized in that filled including portal bench, damping
Set, parallel institution, Z-direction micrometer feed mechanism, fine ultrasonic vibration installation, fine supersonic generator, tool coupling device,
Micro- ultrasound polishing mould, workpiece to be processed mounting table, X-direction workbench, Y-direction workbench, lathe remote controler, the damping device
It is mounted on two feet of lathe bed, Y-direction workbench is mounted on lathe bed whippletree position, and the Y-direction movement of control polishing mould is in parallel
The lower section of mechanism installation workbench in the Y direction, fine ultrasonic vibration installation are mounted on parallel institution lower end, micro- ultrasound polishing mould with
Fine ultrasonic vibration installation is connected, the polishing mould and fine ultrasonic vibration installation synchronous vibration, the lower section of the polishing mould
For X-direction workbench, the X-direction workbench is located on portal bench, and workpiece to be processed mounting table is located on the workbench, to
Workpieces processing is temporarily fixed in workpiece to be processed mounting table by paraffin.
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| CN201910463408.5A CN110340747B (en) | 2019-05-30 | 2019-05-30 | Bubble-controlled micro-ultrasonic sphere emission profiling array polishing method and device |
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| CN201910463408.5A CN110340747B (en) | 2019-05-30 | 2019-05-30 | Bubble-controlled micro-ultrasonic sphere emission profiling array polishing method and device |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0399129A1 (en) * | 1989-05-19 | 1990-11-28 | Akio Nakano | Ultrasonic machining method |
| JP2007098537A (en) * | 2005-10-06 | 2007-04-19 | Olympus Corp | Polishing method |
| CN105364641A (en) * | 2015-11-19 | 2016-03-02 | 浙江工业大学 | Micro semi-ring female die array-mode lapping and polishing method and device |
| CN105479275A (en) * | 2015-11-19 | 2016-04-13 | 浙江工业大学 | Micro half ring die array micro ultrasonic classification polishing method |
| CN106002500A (en) * | 2016-04-28 | 2016-10-12 | 浙江工业大学 | Supercharging ultrasonic cavitation three-phase abrasive particle flow swirling polishing device |
| CN107378655A (en) * | 2017-07-07 | 2017-11-24 | 扬州大学 | Multidimensional rotary ultrasonic transforms into organisation of working and its processing method |
| CN107598724A (en) * | 2017-08-21 | 2018-01-19 | 常熟理工学院 | Glass mold polishing robot based on parallel institution |
| CN108581816A (en) * | 2018-04-02 | 2018-09-28 | 浙江工业大学 | Three-phase flow dynamic pressure cavitation polishing method and device |
-
2019
- 2019-05-30 CN CN201910463408.5A patent/CN110340747B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0399129A1 (en) * | 1989-05-19 | 1990-11-28 | Akio Nakano | Ultrasonic machining method |
| JP2007098537A (en) * | 2005-10-06 | 2007-04-19 | Olympus Corp | Polishing method |
| CN105364641A (en) * | 2015-11-19 | 2016-03-02 | 浙江工业大学 | Micro semi-ring female die array-mode lapping and polishing method and device |
| CN105479275A (en) * | 2015-11-19 | 2016-04-13 | 浙江工业大学 | Micro half ring die array micro ultrasonic classification polishing method |
| CN106002500A (en) * | 2016-04-28 | 2016-10-12 | 浙江工业大学 | Supercharging ultrasonic cavitation three-phase abrasive particle flow swirling polishing device |
| CN107378655A (en) * | 2017-07-07 | 2017-11-24 | 扬州大学 | Multidimensional rotary ultrasonic transforms into organisation of working and its processing method |
| CN107598724A (en) * | 2017-08-21 | 2018-01-19 | 常熟理工学院 | Glass mold polishing robot based on parallel institution |
| CN108581816A (en) * | 2018-04-02 | 2018-09-28 | 浙江工业大学 | Three-phase flow dynamic pressure cavitation polishing method and device |
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