CN110355619B - Cavitation-assisted micro-hemisphere concave die array polishing method under high temperature and high pressure - Google Patents
Cavitation-assisted micro-hemisphere concave die array polishing method under high temperature and high pressure Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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Abstract
The invention discloses a cavitation-assisted micro-hemispherical concave die array grinding and polishing method under high temperature and high pressure. Meanwhile, the ultrasonic cavitation bubble regulation and control technology is combined, the development of cavitation to the direction which is beneficial to material removal is promoted, the removal of workpiece materials is realized by combining the hammering action of a free launching sphere on a workpiece, the impact and the physical and chemical action of composite abrasive particles in polishing liquid on the workpiece and the like, the processing efficiency of the micro-hemispherical concave die array is greatly improved, the consistency of the circumferential radius of concave dies and the consistency of geometric shapes among different concave dies are ensured, and meanwhile, the abrasion to processing tools is reduced.
Description
Technical Field
The invention relates to the field of ultra-precision machining, in particular to a method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure with the assistance of cavitation.
Background
Since the microprism optical device has the advantages of good reflectivity, high brightness, good durability, low material cost and the like, the microprism optical device is widely applied in the optical field after being developed in the last stage of the 80 s in the 20 th century. For example, the microprism reflective film has higher brightness, wider reflection angle and more stable work compared with the traditional prism type reflective material, and is widely used in the field of road traffic safety requiring high brightness at present, and diamond microprism reflective films are all applied to the frames and icons of traffic signs on highways of california in the united states to improve the identifiability at night. At present, only enterprises such as Avery Dennison,3M and japan calcium carbide industries co., ltd, etc. in the united states have the capability of manufacturing a microprism master mold, but due to high processing technology and complex machine tool structure, the processing cost is high, and the requirements of mass, low cost and high precision production of microprism optical devices at present cannot be met. At present, the existing method for processing a micro-prism female die with a micro-concave hemispherical structure is mainly a photoetching technology, but the equipment required by the photoetching technology is expensive, and the three-dimensional structure micro-prism female die with high surface quality is difficult to process only based on 2D processing. Some emerging grinding and polishing methods based on three-dimensional structure processing, such as micro-milling, precision fly-cutting and other technologies, are still difficult to get rid of the defects that machine tools are complex in structure, high in processing cost or difficult to process due to the characteristics of hard and brittle raw materials. The methods such as micro electric discharge machining, electrolytic machining and the like are difficult to meet the machining requirements of high precision and high surface quality due to poor machining precision and easy occurrence of adverse phenomena such as workpiece surface cracking and the like, and are still low in efficiency and high in cost. Therefore, no mature, reliable, low-cost and high-efficiency method for machining the microprism female die with the micro-concave hemispherical structure is reported at present.
Disclosure of Invention
The invention aims to provide a cavitation-assisted micro-hemisphere concave die array polishing method under high temperature and high pressure aiming at the defects of the prior art, wherein the micro-hemisphere concave die has good surface quality and shape precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
a cavitation-assisted micro-hemispherical concave die array polishing method under high temperature and high pressure utilizes an amplitude transformer which is made of a material with extremely high hardness, such as a titanium alloy material, the upper end of the amplitude transformer is connected with a micro-ultrasonic generator, the lower end of the amplitude transformer is connected with a replaceable tool head, the amplitude transformer is driven by a double motor, and macro transmission and micro transmission can be carried out according to specific requirements. The replaceable tool head is connected with the amplitude transformer through a double-end stud, vibration of the miniature ultrasonic generator can be transmitted through resonance during working, and the replaceable tool head can be conveniently replaced after the working life is prolonged.
The ultrasonic transmission tool comprises an amplitude transformer, wherein the upper end of the amplitude transformer is connected with a miniature ultrasonic generator, the lower end of the amplitude transformer is connected with a replaceable tool head, the coating material at the bottom of the tool head is a coating with a plurality of coatings deposited by a CVD (chemical vapor deposition) process, the coating thickness is selected according to the diameter of a sphere for ultrasonic transmission, the coating thickness is 0.05-3mm, the coating material is diamond or tungsten carbide, if the coating material is diamond, the coating at the bottom of the tool head is ground by a diamond grinding wheel, the surface of the coating is ground into a plane, then the surface of the coating is polished by a chemical mechanical polishing method, the roughness of the surface of the coating is reduced, then a concave die array is processed within the coating thickness range at the bottom of the tool head, the depth of the concave die is smaller than the coating thickness (the specifications of the array m x n, m x 1 and n.
Furthermore, a guide plate is arranged below the tool head, and the guide plate is made of PEEK plastic. The guide plate can be made of plastic with good wear resistance, such as polyetheretherketone PEEK plastic. The guide plate is provided with an array of holes with s and t (s > m, t > n) and the hole diameter is larger than or equal to the diameter of the sphere.
Furthermore, the diameter of the launching sphere is selected according to the depth of the micro-hemispherical concave die array to be processed, the diameter range of the sphere is 0.1mm-5mm, and the sphere is made of alloy steel, tungsten carbide or silicon nitride ceramic. The sphere diameter is generally 0.1mm-5mm, and the sphere material can be alloy steel, tungsten carbide, silicon nitride ceramics and other metal or nonmetal materials with extremely high hardness and wear resistance. Each ball is limited in X-direction and Y-direction movement by a guide plate below the tool head, and in Z-direction movement by the tool head and the workpiece, the ball can rotate freely.
Furthermore, grinding and polishing liquid is filled among the tool head coating, the hemispherical female die at the bottom of the tool, the ball body, the guide plate and the workpiece, the solvent of the grinding and polishing liquid is stable solution and is easy to generate fluid with obvious cavitation, and a stabilizing agent and a dispersing agent are added into the grinding and polishing liquid to prevent abrasive materials from precipitating and aggregating. The grinding and polishing liquid solvent can be pure water, kerosene, etc. which can form stable solution and can easily produce obvious cavitation action, and the stabilizing agent and dispersing agent are added in the grinding and polishing liquid to prevent abrasive material from precipitating and aggregating.
Furthermore, the abrasive particles are selected from composite abrasive particles which have excellent polishing performance and small damage degree to the microscopic surface of the workpiece. Preparing solution by using cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying and then roasting at high temperature to prepare the alumina-ceria core/shell composite abrasive particles which take alumina as an inner core and ceria containing trivalent cerium as an outer shell, wherein the particle size is larger than ten microns so as to promote the influence of cavitation on the acceleration of the abrasive particles.
Further, a tool head, a guide plate, a workpiece and the like of the polishing device are placed in a specially-made sealed autoclave, the upper part of the autoclave is fixedly connected with a tool connecting rod through a flange plate and a sealing ring, the lower end of the autoclave is connected to a workbench through the sealing ring in a sealing manner, a resistance wire for heating is arranged at the bottom of the autoclave, and compressed nitrogen is introduced through a pipeline connected to the autoclave to create a high-pressure environment. The processing is carried out under the environment of high temperature and high pressure to promote the physicochemical reaction rate and improve the processing efficiency.
Further, the assembly method of the micro-hemispherical concave die array polishing device for the cavitation-assisted superhard coating composite rod under high temperature and high pressure is as follows: the center of each hole on the guide plate is aligned with the center of the bottom of the tool head corresponding to the bottom circle of the array hemispherical female die, the relative position of the tool head and the guide plate is detected and regulated through a micron-sized laser positioning sensor so that the tool head and the guide plate do not move relatively during processing, and a ball is arranged in an array ball pit below the tool head and the guide plate so that the ball can freely and smoothly move in the Z direction and can freely rotate at the same time. The guide plate and the workpiece also use a micron-sized laser positioning sensor, so that the guide plate and the workpiece cannot move relatively when being processed. The tool head performs high-frequency ultrasonic vibration within 0-5000 microns above the workpiece and performs low-speed feeding in the direction of approaching the workpiece along the Z axis. When the grinding and polishing machine is used, the downward feeding motion of the tool head and the high-frequency vibration are simultaneously carried out, and the ball body can be acted to impact the grinding and polishing liquid, so that the composite abrasive particles in the ball body impact the concave die substrate at a high speed.
Furthermore, the generation and collapse of cavitation bubbles in the polishing liquid excited by ultrasound are regulated and controlled in the processing process, so that the cavitation bubbles promote the removal of workpiece materials, and the removal of the workpiece materials is realized by combining with the hammering action of the free launching sphere on the workpiece, the impact of composite abrasive particles in the polishing liquid on the workpiece and the physical and chemical reaction, and finally the processing of the micro-hemispherical concave die array is completed.
By adopting the technical scheme of the invention, the invention has the beneficial effects that: compared with the prior art, the invention uses the micro-ultrasonic vibration of the tool head to strike the ball body in the guide plate, so as to excite the composite abrasive particles in the polishing liquid between the tool head and the micro-concave die substrate workpiece (silicon carbide wafer) and impact the concave die substrate at high speed. The whole processing process is carried out in a high-temperature and high-pressure environment, the physicochemical reaction efficiency is greatly improved, meanwhile, the development of cavitation to a direction favorable for material removal is promoted by combining an ultrasonic cavitation bubble regulation and control technology, the removal of workpiece materials is realized by combining the hammering action of a free launching sphere on a workpiece, the impact and physicochemical action of composite abrasive particles in grinding and polishing liquid on the workpiece and the like, the processing efficiency of a micro-hemispherical female die array is greatly improved, the consistency of the circumferential radius of the female die and the consistency of the geometric shapes of different female dies are ensured, and meanwhile, the abrasion to processing tools is reduced.
Drawings
Fig. 1 is a schematic view of the structure of the tool head of the present invention.
Fig. 2 is a structural view of the guide plate device of the present invention.
Fig. 3 is an overall structural diagram and an operational principle diagram of the superhard rod hemispherical concave die array ultrasonic emission machining device.
FIG. 4 is a general structural diagram of the superhard rod hemispherical concave die array ultrasonic emission machining device.
Detailed Description
Specific embodiments of the present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1-4, a cavitation-assisted micro-hemispherical concave die array polishing method at high temperature and high pressure, the polishing method comprising the steps of:
the polishing device comprises an amplitude transformer 11, a tool head 12 and an array tool hemisphere female die 13 as shown in figure 1, wherein the amplitude transformer 11 which is driven by a double motor and can carry out macro-motion and micro-motion switching according to requirements is made of a superhard titanium alloy material, the upper end of the amplitude transformer is connected with a miniature ultrasonic generator, and the lower end of the amplitude transformer is connected with the replaceable tool head 12. The diamond coating with the thickness of 2mm is plated on the bottom of the tool head 12 by a method of depositing a plurality of layers by a CVD process. 2 x 2 array concave hemisphere pits with good surface consistency are processed in the thickness range of the coating at the bottom of the tool head 12, the diameter of a concave hemisphere is equal to that of a sphere 14, and the diameter of the concave hemisphere is 1mm, so that impact and abrasion on the bottom of the tool head 12 when the free sphere 14 recoils are reduced.
A guide plate 20 with the thickness of 1/4 sphere diameter, namely 0.25mm is arranged below the tool head 12, and the material of the guide plate 20 is PEEK plastic. As shown in fig. 2, the guide plate 20 has 8 × 8 holes, each of which has a diameter slightly larger than the diameter of the ball 14 and is 1.2 mm. An array of 2 x 2 spheres 14 is arranged, the spheres 14 being conventional plastic spheres of a material of ultra hard silicon nitride ceramic having a diameter of 1 mm. Each ball 14 is constrained by guide plate 20 to move in the X and Y directions, but is free to move in the Z direction, while being free to rotate.
The grinding and polishing liquid is filled among the hemispherical concave die, the ball body 14, the guide plate 20 and the workpiece in the coating layer at the bottom of the tool head 12, the solvent of the grinding and polishing liquid is pure water, and a stabilizing agent and a dispersing agent are added into the grinding and polishing liquid to prevent abrasive materials from precipitating and aggregating. Preparing 0.5mol/L solution of cerium nitrate, introducing the solution and alumina abrasive particles into a ball mill together for superfine treatment, drying, placing the mixture into a high-temperature furnace, introducing nitrogen, and roasting for 2 hours at the temperature of about 950 ℃ to prepare the alumina-ceria core/shell composite abrasive particles with alumina as an inner core and ceria containing trivalent cerium as an outer shell, wherein the particle size of the alumina-ceria core/shell composite abrasive particles is about 15 mu m.
The tool head 12, the guide plate 20, the workpiece and the like of the polishing device are placed in a special 316 stainless steel sealed autoclave 40, the upper part of the autoclave is fixedly connected with a tool connecting rod through a flange plate and a sealing ring, the lower end of the autoclave is connected on a workbench through the sealing ring in a sealing manner, a resistance wire for heating is arranged at the bottom of the autoclave, and the autoclave is continuously heated until the temperature in the autoclave is stabilized at 300 ℃. Pure nitrogen gas is compressed to 13MPa by a gas compressor, and high-pressure nitrogen gas is input into the autoclave through a pipeline connected with the autoclave so as to create a high-pressure environment. And finally processing at 300 ℃ under the environment of 13 MPa.
As shown in FIG. 3, the tool head 12 performs high frequency ultrasonic vibration within a distance of 0-5000um above the workpiece, the frequency reaches 20kHz, the amplitude is 1-2um, and the ultrasonic intensity reaches 90W/cm2Under the condition, the cavitation effect on the acceleration of the abrasive particles is obvious, and the material removal efficiency of the abrasive particles on the workpiece is greatly improved. The tool head 12 performs a slow feed motion in a direction in which the Z axis approaches the workpiece, and the feed amount is 1um each time. A micron-sized laser visual positioning sensor 30 is additionally arranged beside the tool head 12 and the workpiece to detect and regulate the relative position of the tool head 12 and the workpiece so as to prevent the position deviation during processing. During processing, as the downward feeding motion and the high-frequency vibration of the tool head 12 are carried out simultaneously, the ball 14 is impacted with impact polishing liquid, so that the composite abrasive particles impact the die substrate at a high speed and are physically hammered by the tool head 12 along with the cavitation generated by the micro-ultrasound, and finally, the processing of the micro-hemispherical die array is realized. Since the hole diameter of each guide plate 20 is slightly larger than the diameter of the ball, the ball 14 can move and rotate freely all the time, and the wear is uniform. While the bottom of the tool head 12 is formed byThe array tool hemisphere concave die 13 is arranged, so that impact and abrasion on the bottom of the ball 14 when the ball is recoiled can be reduced. In addition, launching sphere 14 can also enhance the effect with the substrate workpiece, so that the material removal effect is more remarkable and the processing efficiency is higher.
In this example, the workpiece is a silicon carbide wafer with a thickness of 2mm, and an array micro-hemispherical concave die is formed on the workpiece by a material removal method, wherein the diameter of the processed concave die is expected to be 1mm, and the spherical crown height is expected to be 400 um. The concave die is in a hemispherical shell shape, so that the concave die is required to have excellent sphericity, the edge of the concave die is positioned at the top of the workpiece and is in smooth transition with the top of the workpiece, and the shape and the size of the concave die in the array are consistent.
In order to realize the array micro-hemisphere concave die, the principle is as follows: the ball 14 in the guide plate 20 is hit by the micro-ultrasonic vibration of the tool head 12, and the composite abrasive grains in the polishing liquid between the tool head 12 and the micro-cavity mold substrate workpiece (silicon carbide wafer) are excited to impact the cavity mold substrate at a high speed. The whole processing process is carried out in a high-temperature and high-pressure environment, the physicochemical reaction efficiency is greatly improved, meanwhile, the development of cavitation to a direction favorable for material removal is promoted by combining an ultrasonic cavitation bubble regulation and control technology, the removal of workpiece materials is realized by combining the hammering action and the physical and chemical action of the free launching sphere 14 on a workpiece and the like, the processing efficiency of the micro-hemispherical female die array is greatly improved, and the consistency of the circumferential radius of the female die and the consistency of the geometric shapes of different female dies are ensured.
The composition structure, the assembly method and the working principle of the micro-hemispherical concave die array polishing device of the cavitation-assisted superhard coating composite rod under high temperature and high pressure are shown in figures 1, 2 and 3. The polishing device comprises an amplitude transformer 11, a tool head 12 and an array tool hemisphere female die 13 as shown in figure 1, wherein the amplitude transformer 11 which is driven by a double motor and can carry out macro-motion and micro-motion switching according to requirements is made of a superhard titanium alloy material, the upper end of the amplitude transformer is connected with a miniature ultrasonic generator, and the lower end of the amplitude transformer is connected with the replaceable tool head 12. The diamond coating with the thickness of 2mm is plated on the bottom of the tool head 12 by a method of depositing a plurality of layers by a CVD process. 2 x 2 array concave hemisphere pits with good surface consistency are processed in the thickness range of the coating at the bottom of the tool head 12, the diameter of a concave hemisphere is equal to that of a sphere 14, and the diameter of the concave hemisphere is 1mm, so that impact and abrasion to the bottom of the tool head when the free sphere 14 recoils are reduced. A guide plate 20 with the thickness of 1/4 sphere diameter, namely 0.25mm is arranged below the tool head 12, and the material of the guide plate 20 is PEEK plastic. As shown in fig. 2, the guide plate 20 has 8 × 8 holes, each of which has a diameter slightly larger than the diameter of the ball 14 and is 1.2 mm. An array of 2 x 2 spheres 14 is arranged, the spheres 14 being conventional plastic spheres of a material of ultra hard silicon nitride ceramic having a diameter of 1 mm. Each ball 14 is constrained by guide plate 20 to move in the X and Y directions, but is free to move in the Z direction, while being free to rotate. The tool head 12, the guide plate 20 and the workpiece of the polishing device are placed together in an autoclave 40 and processed in a high-temperature and high-pressure environment.
As shown in figure 3, the tool head performs high-frequency ultrasonic vibration within a distance of 0-5000um above the workpiece, the frequency reaches 20kHz, and the intensity reaches 90W/cm2And the amplitude is 1-2um, so that the promotion effect of cavitation on material removal is obviously improved. The tool head 12 performs a slow feed motion in a direction in which the Z axis approaches the workpiece, and the feed amount is 1um each time. A micron-sized laser visual positioning device 30 is additionally arranged beside the tool head 12 and the workpiece to detect and regulate the relative position of the tool head 12 and the workpiece so as to prevent the position deviation during processing. During processing, as the downward feeding motion and the high-frequency vibration of the tool head 12 are carried out simultaneously, the ball 14 is impacted with impact polishing liquid, the composite abrasive particles in the ball impact the concave die substrate at a high speed and are physically hammered by the tool head 12 along with the cavitation generated by the micro-ultrasound, and finally, the processing of the micro-hemispherical concave die array is realized.
In order to solve the problem of abrasion of the ball 14 and the bottom of the tool head 12 in the machining process, the adopted technical scheme comprises the following steps: in the first option, a diamond coating with a thickness of 2mm is deposited by a CVD process or similar. 2 x 2 array concave hemisphere ball pits with good surface consistency are processed in the plating layer at the bottom of the tool head 12, so that the hardness and the wear resistance of the tool head 12 can be effectively increased, the wear of a frequently impacted bottom working surface is reduced, and the processing reliability and the processing precision consistency are improved.
The second scheme is as follows: ball 14 is a conventional plastic ball, and ball 14 may be made of alloy steel, tungsten carbide, silicon nitride ceramic, etc. with high hardness, which can effectively reduce the wear of ball 14.
In the third scheme: a guide plate 20 with the thickness of about 1/4 mm of the diameter of the ball 14 is arranged below the tool head 12, and 8-8 holes are formed in the guide plate 20, the hole diameter is slightly larger than the diameter of the ball 14 and is about 1.2mm, so that the ball 14 can move and rotate freely all the time and is worn uniformly. Meanwhile, the bottom of the tool head 12 is provided with the array tool hemisphere concave die 13, so that impact and abrasion on the bottom of the ball 14 during recoil can be reduced.
A fourth scheme: by utilizing cavitation auxiliary bubble regulation and control and a high-temperature and high-pressure environment, the processing efficiency is greatly improved, the processing time is shortened, the working time of tools is reduced, and the tool abrasion of each processing is reduced.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (8)
1. The cavitation-assisted micro-hemispherical concave die array grinding and polishing method under high temperature and high pressure is characterized by comprising an amplitude transformer, wherein the upper end of the amplitude transformer is connected with a micro-ultrasonic generator, the lower end of the amplitude transformer is connected with a replaceable tool head, the coating material at the bottom of the tool head is a coating with a plurality of layers of coatings deposited by a CVD (chemical vapor deposition) process, the thickness of the coating is 0.05-3mm, the coating material is diamond or tungsten carbide, if the coating material is diamond, the coating at the bottom of the tool is ground by a diamond grinding wheel, the surface of the coating is ground into a plane, then the surface of the coating is polished by a chemical mechanical polishing method to reduce the roughness of the surface of the coating, then a hemispherical concave die array is processed within the range of the thickness of the coating at the bottom of the tool head, the depth of the concave die is less than the thickness of the coating, the diameter of the hemispherical concave die of, the cavitation bubbles promote removal of workpiece materials, and the cavitation bubbles are combined with hammering action of the free emission ball bodies on the workpiece, impact of composite abrasive particles in grinding and polishing liquid on the workpiece and physical and chemical reactions to remove the workpiece materials, so that the micro-hemispherical concave die array is obtained.
2. The method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure assisted by cavitation as claimed in claim 1, wherein a guide plate is arranged below the tool head, and the guide plate is made of polyetheretherketone PEEK plastic.
3. The method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure assisted by cavitation as claimed in claim 2, wherein the guide plate has an array of s x t (s > m, t > n) holes, m and n are natural numbers, and the diameter of the holes is larger than or equal to the diameter of the sphere.
4. The method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure assisted by cavitation according to claim 1, wherein the diameter of a launching sphere is selected according to the depth of the micro-hemispherical concave die array to be processed, the diameter of the sphere ranges from 0.1mm to 5mm, and the sphere is made of alloy steel, tungsten carbide or silicon nitride ceramic.
5. The method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure assisted by cavitation as claimed in claim 4, wherein each sphere is constrained to move in X and Y directions by a guide plate under the tool head, the Z direction movement is constrained by the tool head and the workpiece, and the sphere can rotate freely.
6. The method of claim 1, wherein the polishing solution is filled between the tool head coating, the hemispherical female die at the bottom of the tool, the ball, the guide plate and the workpiece, the solvent of the polishing solution is a stable solution and is a fluid which is easy to generate obvious cavitation, and a stabilizer and a dispersant are added into the polishing solution to prevent abrasive precipitation and agglomeration.
7. The method for polishing and grinding a micro-hemispherical concave die array under high temperature and high pressure assisted by cavitation as claimed in claim 1, wherein a tool head, a guide plate and a workpiece of the polishing and grinding device are placed in a sealed autoclave, the upper part of the autoclave is fixedly connected with a tool connecting rod through a flange plate and a sealing ring, the lower end of the autoclave is hermetically connected to a workbench through the sealing ring, a resistance wire for heating is arranged at the bottom of the autoclave, and a high-pressure environment is created by introducing compressed nitrogen through a pipeline connected to the autoclave.
8. The method for grinding and polishing a micro-hemispherical concave die array under high temperature and high pressure with the assistance of cavitation according to claim 1, wherein the generation and collapse of cavitation bubbles in the grinding and polishing liquid excited by ultrasound are regulated and controlled in the processing process, so that the cavitation bubbles promote the removal of workpiece materials, and the workpiece materials are removed by combining the hammering action of the free-emission sphere on the workpiece, the impact of composite abrasive particles in the grinding and polishing liquid on the workpiece and the physicochemical reaction, thereby obtaining the micro-hemispherical concave die array.
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| CN105364641B (en) * | 2015-11-19 | 2017-07-28 | 浙江工业大学 | Micro- semi-ring cavity plate array polishing method and device |
| CN105479275B (en) * | 2015-11-19 | 2017-12-05 | 浙江工业大学 | A kind of micro- semi-ring cavity plate array micro ultrasound classification polishing method |
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