CN105324838A - 半导体装置用接合线及其制造方法 - Google Patents
半导体装置用接合线及其制造方法 Download PDFInfo
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- CN105324838A CN105324838A CN201580000889.6A CN201580000889A CN105324838A CN 105324838 A CN105324838 A CN 105324838A CN 201580000889 A CN201580000889 A CN 201580000889A CN 105324838 A CN105324838 A CN 105324838A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C22C5/08—Alloys based on silver with copper as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- C—CHEMISTRY; METALLURGY
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-072650 | 2014-03-31 | ||
JP2014072650 | 2014-03-31 | ||
PCT/JP2015/060035 WO2015152191A1 (ja) | 2014-03-31 | 2015-03-31 | 半導体装置用ボンディングワイヤ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105324838A true CN105324838A (zh) | 2016-02-10 |
CN105324838B CN105324838B (zh) | 2016-10-19 |
Family
ID=54240512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580000889.6A Active CN105324838B (zh) | 2014-03-31 | 2015-03-31 | 半导体装置用接合线及其制造方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US9536854B2 (zh) |
EP (1) | EP2993693B1 (zh) |
JP (1) | JP5840328B1 (zh) |
KR (1) | KR101633414B1 (zh) |
CN (1) | CN105324838B (zh) |
MY (1) | MY161721A (zh) |
PH (1) | PH12015502633B1 (zh) |
PT (1) | PT2993693T (zh) |
SG (1) | SG11201509513SA (zh) |
TW (1) | TWI536476B (zh) |
WO (1) | WO2015152191A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111033706A (zh) * | 2017-08-09 | 2020-04-17 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN111886685A (zh) * | 2018-09-21 | 2020-11-03 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN113433133A (zh) * | 2020-03-23 | 2021-09-24 | 株式会社东芝 | 压接判定方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105296789B (zh) * | 2015-11-13 | 2018-02-02 | 汕头市骏码凯撒有限公司 | 一种高可靠性银合金键合丝及其制造方法 |
SG11201811428WA (en) * | 2017-02-22 | 2019-01-30 | Nippon Steel Chemical & Material Co Ltd | Bonding wire for semiconductor device |
JP6371932B1 (ja) * | 2017-02-22 | 2018-08-08 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
US10629562B2 (en) * | 2017-12-29 | 2020-04-21 | Texas Instruments Incorporated | Integrated circuit packaging |
TWI749372B (zh) * | 2018-09-21 | 2021-12-11 | 日商日鐵化學材料股份有限公司 | 半導體裝置用Cu合金接合導線 |
EP4109498A4 (en) * | 2020-02-18 | 2023-11-08 | NIPPON STEEL Chemical & Material Co., Ltd. | BONDING WIRE MADE OF CU ALLOY FOR SEMICONDUCTOR COMPONENT |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5721830A (en) * | 1980-07-14 | 1982-02-04 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor element |
JP2002023618A (ja) | 2000-06-30 | 2002-01-23 | Pioneer Goods Kk | 点 筆 |
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2015
- 2015-03-31 EP EP15773517.6A patent/EP2993693B1/en active Active
- 2015-03-31 JP JP2015516369A patent/JP5840328B1/ja active Active
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- 2015-03-31 WO PCT/JP2015/060035 patent/WO2015152191A1/ja active Application Filing
- 2015-03-31 US US14/893,833 patent/US9536854B2/en active Active
- 2015-03-31 CN CN201580000889.6A patent/CN105324838B/zh active Active
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111033706A (zh) * | 2017-08-09 | 2020-04-17 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN111033706B (zh) * | 2017-08-09 | 2021-05-25 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN111886685A (zh) * | 2018-09-21 | 2020-11-03 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN111886685B (zh) * | 2018-09-21 | 2021-10-08 | 日铁化学材料株式会社 | 半导体装置用Cu合金接合线 |
CN113433133A (zh) * | 2020-03-23 | 2021-09-24 | 株式会社东芝 | 压接判定方法 |
Also Published As
Publication number | Publication date |
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TWI536476B (zh) | 2016-06-01 |
JP5840328B1 (ja) | 2016-01-06 |
PT2993693T (pt) | 2018-10-19 |
PH12015502633A1 (en) | 2016-03-07 |
US9536854B2 (en) | 2017-01-03 |
PH12015502633B1 (en) | 2016-03-07 |
TW201603151A (zh) | 2016-01-16 |
MY161721A (en) | 2017-05-15 |
US20160111389A1 (en) | 2016-04-21 |
JPWO2015152191A1 (ja) | 2017-04-13 |
EP2993693A4 (en) | 2017-01-04 |
WO2015152191A1 (ja) | 2015-10-08 |
KR101633414B1 (ko) | 2016-06-24 |
EP2993693B1 (en) | 2018-06-06 |
EP2993693A1 (en) | 2016-03-09 |
KR20150140405A (ko) | 2015-12-15 |
SG11201509513SA (en) | 2015-12-30 |
CN105324838B (zh) | 2016-10-19 |
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