CN105293426A - 传感器封装件及制造该传感器封装件的方法 - Google Patents

传感器封装件及制造该传感器封装件的方法 Download PDF

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Publication number
CN105293426A
CN105293426A CN201510106739.5A CN201510106739A CN105293426A CN 105293426 A CN105293426 A CN 105293426A CN 201510106739 A CN201510106739 A CN 201510106739A CN 105293426 A CN105293426 A CN 105293426A
Authority
CN
China
Prior art keywords
upper cover
pedestal
electrode
sensor package
combination member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510106739.5A
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English (en)
Chinese (zh)
Inventor
朴兴雨
金善湖
韩钟雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN105293426A publication Critical patent/CN105293426A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
CN201510106739.5A 2014-06-19 2015-03-11 传感器封装件及制造该传感器封装件的方法 Pending CN105293426A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0074747 2014-06-19
KR1020140074747A KR20150145413A (ko) 2014-06-19 2014-06-19 센서 패키지 및 그 제조 방법

Publications (1)

Publication Number Publication Date
CN105293426A true CN105293426A (zh) 2016-02-03

Family

ID=55087805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510106739.5A Pending CN105293426A (zh) 2014-06-19 2015-03-11 传感器封装件及制造该传感器封装件的方法

Country Status (2)

Country Link
KR (1) KR20150145413A (ko)
CN (1) CN105293426A (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200618095A (en) * 2004-10-27 2006-06-01 Hewlett Packard Development Co Method of singulating electronic devices
CN1792764A (zh) * 2005-10-27 2006-06-28 中国科学院上海微系统与信息技术研究所 微机械加速度计器件的圆片级封装工艺
CN101142137A (zh) * 2005-04-05 2008-03-12 利特夫有限责任公司 微机械元件和制造微机械元件的方法
DE102009045541A1 (de) * 2009-10-09 2011-04-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung, Verfahren zur Herstellung eines Kappenwafers für eine mikromechanische Vorrichtung, MEMS-Wafer erbund und mikromechanische Vorrichtung
CN102079502A (zh) * 2010-12-03 2011-06-01 华东光电集成器件研究所 一种mems器件及其圆片级真空封装方法
CN102795593A (zh) * 2012-08-29 2012-11-28 深迪半导体(上海)有限公司 超薄真空密封mems晶圆的加工方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337105A (ja) 2000-05-26 2001-12-07 Matsushita Electric Works Ltd 半導体加速度センサ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200618095A (en) * 2004-10-27 2006-06-01 Hewlett Packard Development Co Method of singulating electronic devices
CN101142137A (zh) * 2005-04-05 2008-03-12 利特夫有限责任公司 微机械元件和制造微机械元件的方法
CN1792764A (zh) * 2005-10-27 2006-06-28 中国科学院上海微系统与信息技术研究所 微机械加速度计器件的圆片级封装工艺
DE102009045541A1 (de) * 2009-10-09 2011-04-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung, Verfahren zur Herstellung eines Kappenwafers für eine mikromechanische Vorrichtung, MEMS-Wafer erbund und mikromechanische Vorrichtung
CN102079502A (zh) * 2010-12-03 2011-06-01 华东光电集成器件研究所 一种mems器件及其圆片级真空封装方法
CN102795593A (zh) * 2012-08-29 2012-11-28 深迪半导体(上海)有限公司 超薄真空密封mems晶圆的加工方法

Also Published As

Publication number Publication date
KR20150145413A (ko) 2015-12-30

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