CN105271821A - Processing method for double-sided shadow eliminating conductive glass of touch screen - Google Patents
Processing method for double-sided shadow eliminating conductive glass of touch screen Download PDFInfo
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- CN105271821A CN105271821A CN201510695001.7A CN201510695001A CN105271821A CN 105271821 A CN105271821 A CN 105271821A CN 201510695001 A CN201510695001 A CN 201510695001A CN 105271821 A CN105271821 A CN 105271821A
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Abstract
A processing method for double-sided shadow eliminating conductive glass of a touch screen comprises following steps: step 1, an upper glass substrate and a lower glass substrate are processed; step 2, an upper interference layer I, an upper transparent passivation layer, a lower interference layer and a lower transparent passivation layer are sputtered on the upper glass substrate and the lower glass substrate; step 3, an upper interference layer II, a transparent layer and an ITO (indium tin oxide) film are sputtered on the upper transparent passivation layer and the lower transparent passivation layer sputtered on the upper glass substrate and the lower glass substrate. The double-sided shadow eliminating conductive glass has good electromagnetic shielding, electrostatic protection and shadow eliminating functions and can completely replace the traditional conductive glass, and the conductive glass having low energy consumption, high uniformity and low cost and used for production of a capacitive touch screen is provided for down-stream customers.
Description
Technical field
The present invention relates to conductive glass technical field, the working method of the two-sided shadow conductive glass that disappears of especially a kind of touch-screen.
Background technology
At present, capacitance plate product uses widely, and the two-sided plating conductive glass in capacitance plate is its main devices, the conductive film of two-sided plating conductive glass requires relatively tighter at aspect of performance, such as homogeneity, resistance toheat, acid-proof alkaline, high-temp resisting high-humidity resisting performance etc.; When making transparent circuitry, because technology difficulty increases, often adopt harsh circuit at making circuit.In making processes, easily etch away the position that should not etch, and there is the erosion trace track of circuit etch, affect its electromagnetic shielding, electrostatic protection function, the erosion trace track of existence can have an impact to viewing graphic pattern.
In view of the foregoing, the working method of the two-sided shadow conductive glass that disappears of a kind of touch-screen is now developed.
Summary of the invention
The object of the invention is to overcome deficiency of the prior art, the working method of the two-sided shadow conductive glass that disappears of a kind of touch-screen is provided, there is good electromagnetic shielding, electrostatic protection and the shadow effect that disappears, and existing conventional conductive glass can be replaced completely, for downstream client provides the making capacitance plate conductive glass of low power consuming, high uniformity, low cost.
The present invention to achieve these goals, adopt following technical scheme: the working method of the two-sided shadow conductive glass that disappears of a kind of touch-screen, the two-sided shadow conductive glass that disappears of described touch-screen is made up of top glass substrate, tin face, air surface, upper interfering layer one, upper transparent passivating layer, upper interfering layer two, lower glass substrate, lower interfering layer, lower transparent passivating layer, transparent layer, ito film; Two surfaces of top glass substrate and lower glass substrate are tin face and air surface, the air surface correspondence laminating of top glass substrate and lower glass substrate, above the tin face of top glass substrate upper surface, interfering layer one is set, between upper interfering layer one and upper interfering layer two, transparent passivating layer is set, above upper interfering layer two, ito film is set, below the tin face of lower glass substrate lower surface, lower interfering layer is set, lower lower transparent passivating layer is set between interfering layer and transparent layer, below transparent layer, ito film is set;
Described upper transparent passivating layer and lower transparent passivating layer all adopt transparent silicon-dioxide or transparent silicon oxynitride;
Described upper interfering layer one, upper interfering layer two, lower interfering layer all adopt Niobium Pentxoxide.
The first step, processes top glass substrate and lower glass substrate,
A, top glass substrate and lower glass substrate to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after top glass substrate and lower glass substrate carry out edging and chamfering, first X edging chamfering again, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the top glass substrate after edging and chamfering and lower glass substrate;
E, scrub and dry up again;
Second step, to top glass substrate and lower glass substrate sputtering upper interfering layer one, upper transparent passivating layer, lower interfering layer, lower transparent passivating layer;
A, polishing scrubbed to the top glass substrate after drying up and lower glass substrate and be bonded together along air surface and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to the upper interfering layer one of sputtering and lower interfering layer simultaneously on the tin face of the top glass substrate after heating and lower glass substrate, upper interfering layer one and lower interfering layer all adopt Niobium Pentxoxide, above upper the interfering layer one and below of lower interfering layer sputters transparent passivating layer and lower transparent passivating layer simultaneously, and upper transparent passivating layer and lower transparent passivating layer all adopt transparent silicon-dioxide or transparent silicon oxynitride;
3rd step, top glass substrate and lower glass substrate sputtering upper transparent passivating layer and lower transparent passivating layer on, carry out upper interfering layer two, transparent layer and ito film sputtering;
A, to second step sputtering after top glass substrate and lower glass substrate heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, to the top glass substrate after heating and lower glass substrate sputtering, above the upper transparent passivating layer of top glass substrate and below the lower transparent passivating layer of lower glass substrate, carry out upper interfering layer two and transparent layer sputtering simultaneously, upper interfering layer two adopts Niobium Pentxoxide, simultaneously sputtering ITO film above upper interfering layer two and below transparent layer;
C, to the top glass substrate after sputtering ITO film and lower glass substrate, do anneal through surge chamber: be first cooled to 200 degrees Celsius, then heat to 300 degrees Celsius and stablize, complete the plated film to top glass substrate and lower glass substrate.
The invention has the beneficial effects as follows: the present invention can protect indium tin oxide conductive film to etch circuit; not by the etching of the acid solution made in process; avoid in making processes, etch away the position that should not etch; in making processes, make indium tin oxide conductive film etch circuit reach design requirements; there is good electromagnetic shielding, electrostatic protection and the shadow effect that disappears; and existing conventional conductive glass can be replaced completely, for downstream client provides the making capacitance plate conductive glass of low power consuming, high uniformity, low cost.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described:
Fig. 1 is, general assembly structural representation;
In Fig. 1: top glass substrate 1, tin face 2, air surface 3, upper interfering layer 1, upper transparent passivating layer 5, upper interfering layer 26, lower glass substrate 7, lower interfering layer 8, lower transparent passivating layer 9, transparent layer 10, ito film 11.
Embodiment
Below in conjunction with embodiment and embodiment, the present invention is described in further detail:
Embodiment 1
Two surfaces of top glass substrate 1 and lower glass substrate 7 are tin face 2 and air surface 3, the air surface 3 correspondence laminating of top glass substrate 1 and lower glass substrate 7, above the tin face 2 of top glass substrate 1 upper surface, interfering layer 1 is set, between upper interfering layer 1 and upper interfering layer 26, transparent passivating layer 5 is set, above upper interfering layer 26, ito film 11 is set, below the tin face 2 of lower glass substrate 7 lower surface, lower interfering layer 8 is set, between lower interfering layer 8 and transparent layer 10, lower transparent passivating layer 9 is set, ito film 11 is set below transparent layer 10;
Described upper transparent passivating layer 5 and lower transparent passivating layer 9 all adopt transparent silicon-dioxide or transparent silicon oxynitride;
Described upper interfering layer 1, upper interfering layer 26, lower interfering layer 8 all adopt Niobium Pentxoxide.
Embodiment 2
The first step, processes top glass substrate 1 and lower glass substrate 7,
A, top glass substrate 1 and lower glass substrate 7 to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after top glass substrate 1 and lower glass substrate 7 carry out edging and chamfering, first X edging, then chamfering, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the top glass substrate 1 after edging and chamfering and lower glass substrate 7;
E, scrub and dry up again;
Second step, sputters upper interfering layer 1, upper transparent passivating layer 5, lower interfering layer 8, lower transparent passivating layer 9 to top glass substrate 1 and lower glass substrate 7;
A, polishing scrubbed to the top glass substrate 1 after drying up and lower glass substrate 7 and be bonded together along air surface 3 and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to the upper interfering layer 1 of sputtering and lower interfering layer 8 simultaneously on the tin face 2 of the top glass substrate 1 after heating and lower glass substrate 7, upper interfering layer 1 and lower interfering layer 8 all adopt Niobium Pentxoxide, above upper the interfering layer 1 and below of lower interfering layer 8 sputters transparent passivating layer 5 and lower transparent passivating layer 9 simultaneously, and upper transparent passivating layer 5 and lower transparent passivating layer 9 all adopt transparent silicon-dioxide or transparent silicon oxynitride;
3rd step, on the upper transparent passivating layer 5 sputtered in top glass substrate 1 and lower glass substrate 7 and lower transparent passivating layer 9, carries out upper interfering layer 26, transparent layer 10 and ito film 11 and sputters;
A, to second step sputtering after top glass substrate 1 and lower glass substrate 7 heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, top glass substrate 1 after heating and lower glass substrate 7 are sputtered, above the upper transparent passivating layer 5 of top glass substrate 1 and below the lower transparent passivating layer 9 of lower glass substrate 7, carry out upper interfering layer 26 and transparent layer 10 sputters simultaneously, upper interfering layer 26 adopts Niobium Pentxoxide, sputtering ITO film 11 simultaneously above upper interfering layer 26 and below transparent layer 10;
C, to the top glass substrate 1 after sputtering ITO film 11 and lower glass substrate 7, do anneal through surge chamber: be first cooled to 200 degrees Celsius, then heat to 300 degrees Celsius and stablize, complete the plated film to top glass substrate 1 and lower glass substrate 7.
Claims (2)
1. a working method for the two-sided shadow conductive glass that disappears of touch-screen, the two-sided shadow conductive glass that disappears of described touch-screen is made up of top glass substrate (1), tin face (2), air surface (3), upper interfering layer one (4), upper transparent passivating layer (5), upper interfering layer two (6), lower glass substrate (7), lower interfering layer (8), lower transparent passivating layer (9), transparent layer (10), ito film (11), it is characterized in that: two surfaces of top glass substrate (1) and lower glass substrate (7) are tin face (2) and air surface (3), air surface (3) the correspondence laminating of top glass substrate (1) and lower glass substrate (7), the top, tin face (2) of top glass substrate (1) upper surface arranges interfering layer one (4), transparent passivating layer (5) is set between upper interfering layer one (4) and upper interfering layer two (6), upper interfering layer two (6) top arranges ito film (11), the below, tin face (2) of lower glass substrate (7) lower surface arranges lower interfering layer (8), between lower interfering layer (8) and transparent layer (10), lower transparent passivating layer (9) is set, transparent layer (10) below arranges ito film (11),
Described upper transparent passivating layer (5) and lower transparent passivating layer (9) all adopt transparent silicon-dioxide or transparent silicon oxynitride;
Described upper interfering layer one (4), upper interfering layer two (6), lower interfering layer (8) all adopt Niobium Pentxoxide.
2. a working method for the two-sided shadow conductive glass that disappears of touch-screen, is characterized in that:
The first step, processes top glass substrate (1) and lower glass substrate (7),
A, top glass substrate (1) and lower glass substrate (7) to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after top glass substrate (1) and lower glass substrate (7) carry out edging and chamfering, first X edging, then chamfering, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the top glass substrate (1) after edging and chamfering and lower glass substrate (7);
E, scrub and dry up again;
Second step, to interfering layer one (4), upper transparent passivating layer (5), lower interfering layer (8), lower transparent passivating layer (9) in top glass substrate (1) and lower glass substrate (7) sputtering;
A, polishing scrubbed to the top glass substrate after drying up (1) and lower glass substrate (7) and be bonded together along air surface (3) and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, magnetic control sputtering vacuum coating equipment is utilized to go up interfering layer one (4) and lower interfering layer (8) to sputtering simultaneously on the tin face (2) of the top glass substrate (1) after heating and lower glass substrate (7), upper interfering layer one (4) and lower interfering layer (8) all adopt Niobium Pentxoxide, the below of upper interfering layer one (4) top and lower interfering layer (8) sputters transparent passivating layer (5) and lower transparent passivating layer (9) simultaneously, upper transparent passivating layer (5) and lower transparent passivating layer (9) all adopt transparent silicon-dioxide or transparent silicon oxynitride,
3rd step, on the upper transparent passivating layer (5) sputtered in top glass substrate (1) and lower glass substrate (7) and lower transparent passivating layer (9), carry out the sputtering of upper interfering layer two (6), transparent layer (10) and ito film (11);
A, to second step sputtering after top glass substrate (1) and lower glass substrate (7) heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, to the top glass substrate (1) after heating and lower glass substrate (7) sputtering, in upper transparent passivating layer (5) top of top glass substrate (1) and lower transparent passivating layer (9) below of lower glass substrate (7), carry out upper interfering layer two (6) and transparent layer (10) sputtering simultaneously, upper interfering layer two (6) adopts Niobium Pentxoxide, upper interfering layer two (6) top and transparent layer (10) below sputtering ITO film (11) simultaneously;
C, to the top glass substrate (1) after sputtering ITO film (11) and lower glass substrate (7), anneal is done: be first cooled to 200 degrees Celsius through surge chamber, heat again to 300 degrees Celsius stablize, complete the plated film to top glass substrate (1) and lower glass substrate (7).
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| CN201510695001.7A CN105271821A (en) | 2015-10-19 | 2015-10-19 | Processing method for double-sided shadow eliminating conductive glass of touch screen |
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| CN201510695001.7A CN105271821A (en) | 2015-10-19 | 2015-10-19 | Processing method for double-sided shadow eliminating conductive glass of touch screen |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106042531A (en) * | 2016-07-24 | 2016-10-26 | 东莞汇海光电科技实业有限公司 | Single-face shadow eliminating conductive glass and processing method thereof |
| CN106095213A (en) * | 2016-08-09 | 2016-11-09 | 洛阳康耀电子有限公司 | A kind of half-reflection and half-transmission touch screen disappears the processing method of shadow electro-conductive glass |
| CN106293227A (en) * | 2016-08-09 | 2017-01-04 | 洛阳康耀电子有限公司 | A kind of processing method of the touch screen electro-conductive glass of the two-sided shadow that disappears |
| CN106293228A (en) * | 2016-08-09 | 2017-01-04 | 洛阳康耀电子有限公司 | A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears |
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| CN203455792U (en) * | 2013-08-05 | 2014-02-26 | 东莞市中沛光电科技有限公司 | Touch screen with double glass layers |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106042531A (en) * | 2016-07-24 | 2016-10-26 | 东莞汇海光电科技实业有限公司 | Single-face shadow eliminating conductive glass and processing method thereof |
| CN106095213A (en) * | 2016-08-09 | 2016-11-09 | 洛阳康耀电子有限公司 | A kind of half-reflection and half-transmission touch screen disappears the processing method of shadow electro-conductive glass |
| CN106293227A (en) * | 2016-08-09 | 2017-01-04 | 洛阳康耀电子有限公司 | A kind of processing method of the touch screen electro-conductive glass of the two-sided shadow that disappears |
| CN106293228A (en) * | 2016-08-09 | 2017-01-04 | 洛阳康耀电子有限公司 | A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears |
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Application publication date: 20160127 |