CN106293228A - A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears - Google Patents
A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears Download PDFInfo
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- CN106293228A CN106293228A CN201610650197.2A CN201610650197A CN106293228A CN 106293228 A CN106293228 A CN 106293228A CN 201610650197 A CN201610650197 A CN 201610650197A CN 106293228 A CN106293228 A CN 106293228A
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- 239000011521 glass Substances 0.000 title claims abstract description 130
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 230000002452 interceptive effect Effects 0.000 claims abstract description 72
- 238000004544 sputter deposition Methods 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000007688 edging Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears, the first step, top glass substrate and lower glass substrate are processed, second step, top glass substrate and lower glass substrate are sputtered upper interfering layer one, upper transparent passivating layer, upper clear layer, lower interfering layer, lower transparent passivating layer;3rd step, on the basis of top glass substrate and lower glass substrate second step sputter, carries out upper interfering layer two, lower clear layer and ito film sputtering;There is good electromagnetic shielding, electrostatic defending and the shadow effect that disappears, and existing conventional conductive glass can be replaced completely, the making capacitance plate electro-conductive glass of low power consuming, high uniformity, low cost is provided for downstream client.
Description
Technical field
The present invention relates to electro-conductive glass technical field, the processing side of a kind of two-sided shadow touch screen electro-conductive glass that disappears
Method.
Background technology
At present, capacitance plate product uses widely, and the two-sided plating electro-conductive glass in capacitance plate is its main devices, double
The conductive film of face plating electro-conductive glass requires relatively tight at aspect of performance, such as uniformity, heat resistance, acid-proof alkaline, resistance to
Hot and humid performance etc.;Making transparent circuitry when, owing to technology difficulty increases, when making circuit frequently with harsh electricity
Road.In manufacturing process, the position that should not etch readily etched away, and there is the erosion trace track of circuit etch, affect it
Electromagnetic shielding, electrostatic protection function, the erosion trace track existed can produce impact to viewing graphic pattern.
In view of the foregoing, the processing method now developing a kind of two-sided shadow touch screen electro-conductive glass that disappears.
Summary of the invention
The invention aims to overcome deficiency of the prior art, it is provided that a kind of two-sided shadow touch screen electro-conductive glass that disappears
Processing method, there is good electromagnetic shielding, electrostatic defending and the shadow effect that disappears, and existing conventional pilot can be replaced completely
Electricity glass, provides the making capacitance plate electro-conductive glass of low power consuming, high uniformity, low cost for downstream client.
The present invention to achieve these goals, adopts the following technical scheme that a kind of two-sided shadow touch screen electro-conductive glass that disappears
Processing method, the described two-sided shadow touch screen electro-conductive glass that disappears is by top glass substrate, stannum face, air surface, upper interfering layer one, upper
Bright passivation layer, upper clear layer, upper interfering layer two, lower glass substrate, lower interfering layer, lower transparent passivating layer, lower clear layer, ito film
Constitute;Two surfaces of top glass substrate and lower glass substrate are stannum face and air surface, top glass substrate and lower glass substrate
Air surface correspondence laminating, the stannum face of top glass substrate upper surface is provided above interfering layer one, and upper interfering layer one is transparent with upper
Arranging transparent passivating layer between Ceng, upper clear layer is provided above interfering layer two, and upper interfering layer two is provided above ito film, under
Lower interfering layer is set below the stannum face of glass substrate lower surface, between lower interfering layer and lower clear layer, lower transparent passivating layer is set,
Below lower clear layer, ito film is set;
Described upper transparent passivating layer and lower transparent passivating layer all use transparent silicon dioxide or transparent silicon oxynitride;
Described upper interfering layer one, upper interfering layer two and lower interfering layer all use niobium pentaoxide.
The first step, processes top glass substrate and lower glass substrate,
A, top glass substrate and lower glass substrate are cut, first X cutting, then Y cutting, break sheet the most again and process;
B, the top glass substrate after cutting and lower glass substrate being carried out edging and chamfering, first X edging chamfering again, half-twist is again
To Y edging and chamfering;
C, scrub and dry up;
D, the top glass substrate after edging and chamfering and lower glass substrate are polished;
E, scrub and dry up again;
Second step, sputters upper interfering layer one, upper transparent passivating layer, upper clear layer, lower dry to top glass substrate and lower glass substrate
Relate to layer, lower transparent passivating layer;
A, polishing is scrubbed dry up rear top glass substrate and lower glass substrate and be bonded together along air surface and heat;Use
Heating-up temperature is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to heating after top glass substrate and lower glass substrate stannum face on spatter simultaneously
Penetrate interfering layer one and lower interfering layer, upper interfering layer one and lower interfering layer and all use niobium pentaoxide, above upper interfering layer one and
It is equal that the lower section of lower interfering layer sputters transparent passivating layer and lower transparent passivating layer, upper transparent passivating layer and lower transparent passivating layer simultaneously
Use transparent silicon dioxide or transparent silicon oxynitride, the upper clear layer of sputtering above upper transparent passivating layer;
3rd step, on the basis of top glass substrate and lower glass substrate second step sputter, carries out upper interfering layer two, lower clear layer
Sputter with ito film;
A, to second step sputter after top glass substrate and lower glass substrate heat;Heating-up temperature uses 280-380 Celsius
Degree;
B, utilize magnetic control sputtering vacuum coating equipment, to the top glass substrate after heating and lower glass substrate sputtering, at upper glass
Above the upper clear layer of substrate and below the lower transparent passivating layer of lower glass substrate, carry out upper interfering layer two and lower clear layer simultaneously
Sputtering, upper interfering layer two uses niobium pentaoxide, and the top of upper interfering layer two and the lower section of lower clear layer synchronize sputtering ito film;
C, to sputtering ito film after top glass substrate and lower glass substrate, buffered room makes annealing treatment: is first cooled to 200 and takes the photograph
Family name's degree, then be heated up to 300 degrees Celsius stable, complete the plated film to top glass substrate and lower glass substrate.
The invention has the beneficial effects as follows: the present invention can protect indium tin oxide conductive film to etch circuit, not by manufacturing process
The etching of the acid solution in technique, it is to avoid etch away the position that should not etch in manufacturing process, makes oxygen in manufacturing process
Change indium stannum conducting film etching circuit to reach to design requirement, there is good electromagnetic shielding, electrostatic defending and the shadow effect that disappears, and energy
Enough replace existing conventional conductive glass completely, the making capacitance plate of low power consuming, high uniformity, low cost is provided for downstream client
Use electro-conductive glass.
Accompanying drawing explanation
The invention will be further described below in conjunction with the accompanying drawings:
Fig. 1 is, general assembly structural representation;
In Fig. 1: top glass substrate 1, stannum face 2, air surface 3, upper interfering layer 1, upper transparent passivating layer 5, upper clear layer 6, upper dry
Relate to layer 27, lower glass substrate 8, lower interfering layer 9, lower transparent passivating layer 10, lower clear layer 11, ito film 12.
Detailed description of the invention
The present invention is described in further detail with detailed description of the invention below in conjunction with embodiment:
Embodiment 1
Two surfaces of top glass substrate 1 and lower glass substrate 8 are stannum face 2 and air surface 3, top glass substrate 1 and lower glass
The corresponding laminating of the air surface 3 of substrate 8, the stannum face 2 of top glass substrate 1 upper surface is provided above interfering layer 1, upper interfering layer one
Arranging transparent passivating layer 5 between 4 and upper clear layer 6, upper clear layer 6 is provided above interfering layer 27, on upper interfering layer 27
Side arranges ito film 12, arranges lower interfering layer 9, lower interfering layer 9 and lower clear layer 11 below the stannum face 2 of lower glass substrate 8 lower surface
Between lower transparent passivating layer 10 is set, below lower clear layer 11, ito film 12 is set;
Described upper transparent passivating layer 5 and lower transparent passivating layer 10 all use transparent silicon dioxide or transparent silicon oxynitride;
Described upper interfering layer 1, upper interfering layer 27 and lower interfering layer 9 all use niobium pentaoxide.
Embodiment 2
The first step, processes top glass substrate 1 and lower glass substrate 8,
A, top glass substrate 1 and lower glass substrate 8 are cut, first X cutting, then Y cutting, break sheet the most again and process;
B, the top glass substrate 1 after cutting and lower glass substrate 8 are carried out edging and chamfering, first X edging, then chamfering, half-twist
Again to Y edging and chamfering;
C, scrub and dry up;
D, the top glass substrate 1 after edging and chamfering and lower glass substrate 8 are polished;
E, scrub and dry up again;
Second step, top glass substrate 1 and lower glass substrate 8 are sputtered upper interfering layer 1, upper transparent passivating layer 5, upper clear layer 6,
Lower interfering layer 9, lower transparent passivating layer 10;
A, polishing is scrubbed dry up rear top glass substrate 1 and lower glass substrate 8 and be bonded together along air surface 3 and heat;Adopt
Heating-up temperature be 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment on the stannum face 2 of the top glass substrate 1 after heating and lower glass substrate 8 simultaneously
In sputtering, interfering layer 1 and lower interfering layer 9, upper interfering layer 1 and lower interfering layer 9 all use niobium pentaoxide, upper interfering layer 1
Top and the lower section of lower interfering layer 9 sputter transparent passivating layer 5 and lower transparent passivating layer 10 simultaneously, upper transparent passivating layer 5 and under
Transparent passivating layer 10 all uses transparent silicon dioxide or transparent silicon oxynitride, and above upper transparent passivating layer 5, sputtering is upper transparent
Layer 6;
3rd step, on the basis of top glass substrate 1 and lower glass substrate 8 second step sputter, carries out upper interfering layer 27, lower
Bright layer 11 and ito film 12 sputter;
A, to second step sputter after top glass substrate 1 and lower glass substrate 8 heat;Heating-up temperature uses 280-380 to take the photograph
Family name's degree;
B, utilize magnetic control sputtering vacuum coating equipment, the top glass substrate 1 after heating and lower glass substrate 8 are sputtered, at upper glass
Above the upper clear layer 6 of glass substrate 1 and below the lower transparent passivating layer 10 of lower glass substrate 8, carry out upper interfering layer 27 He simultaneously
Lower clear layer 11 sputters, and upper interfering layer 27 uses niobium pentaoxide, the top of upper interfering layer 27 and the lower section of lower clear layer 11
Synchronize sputtering ito film 12;
C, to sputtering ito film 12 after top glass substrate 1 and lower glass substrate 8, buffered room makes annealing treatment: be first cooled to
200 degrees Celsius, then be heated up to 300 degrees Celsius stable, complete top glass substrate 1 and the plated film of lower glass substrate 8.
Claims (2)
1. a processing method for the two-sided shadow touch screen electro-conductive glass that disappears, the described two-sided shadow touch screen electro-conductive glass that disappears is by upper glass
Glass substrate (1), stannum face (2), air surface (3), upper interfering layer one (4), upper transparent passivating layer (5), upper clear layer (6), upper interference
Layer two (7), lower glass substrate (8), lower interfering layer (9), lower transparent passivating layer (10), lower clear layer (11), ito film (12) structure
Become;It is characterized in that: two surfaces of top glass substrate (1) and lower glass substrate (8) are stannum face (2) and air surface (3), on
The corresponding laminating of the air surface (3) of glass substrate (1) and lower glass substrate (8), on the stannum face (2) of top glass substrate (1) upper surface
Side arranges interfering layer one (4), arranges transparent passivating layer (5) between upper interfering layer one (4) and upper clear layer (6), upper transparent
Layer (6) is provided above interfering layer two (7), and upper interfering layer two (7) is provided above ito film (12), lower glass substrate (8) lower surface
Stannum face (2) lower section lower interfering layer (9) is set, between lower interfering layer (9) and lower clear layer (11), lower transparent passivating layer is set
(10), lower clear layer (11) lower section arranges ito film (12);
Described upper transparent passivating layer (5) and lower transparent passivating layer (10) all use transparent silicon dioxide or the oxidation of transparent nitrogen
Silicon;
Described upper interfering layer one (4), upper interfering layer two (7) and lower interfering layer (9) all use niobium pentaoxide.
2. the processing method of the two-sided shadow touch screen electro-conductive glass that disappears, it is characterised in that:
The first step, processes top glass substrate (1) and lower glass substrate (8),
A, top glass substrate (1) and lower glass substrate (8) are cut, first X cutting, then Y cutting, break sheet the most again and process;
B, the top glass substrate (1) after cutting and lower glass substrate (8) are carried out edging and chamfering, first X edging, then chamfering, revolve
Turn 90 ° again to Y edging and chamfering;
C, scrub and dry up;
D, the top glass substrate (1) after edging and chamfering and lower glass substrate (8) are polished;
E, scrub and dry up again;
Second step, to interfering layer one (4) in top glass substrate (1) and lower glass substrate (8) sputtering, upper transparent passivating layer (5), on
Clear layer (6), lower interfering layer (9), lower transparent passivating layer (10);
A, polishing is scrubbed dry up rear top glass substrate (1) and lower glass substrate (8) and be bonded together along air surface (3) and add
Heat;The heating-up temperature used is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to heating after top glass substrate (1) and the stannum face (2) of lower glass substrate (8)
The upper upper interfering layer one (4) of sputtering simultaneously and lower interfering layer (9), upper interfering layer one (4) and lower interfering layer (9) all use five oxidations two
Niobium, the lower section of upper interfering layer one (4) top and lower interfering layer (9) sputters transparent passivating layer (5) and lower transparent passivating layer simultaneously
(10), upper transparent passivating layer (5) and lower transparent passivating layer (10) all use transparent silicon dioxide or transparent silicon oxynitride, on
The upper clear layer (6) of transparent passivating layer (5) top sputtering;
3rd step, on the basis of top glass substrate (1) and lower glass substrate (8) second step sputter, carries out upper interfering layer two
(7), lower clear layer (11) and ito film (12) sputtering;
A, to second step sputter after top glass substrate (1) and lower glass substrate (8) heat;Heating-up temperature uses 280-
380 degrees Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, the top glass substrate (1) after heating and lower glass substrate (8) are sputtered,
Upper clear layer (6) top of top glass substrate (1) and lower transparent passivating layer (10) lower section of lower glass substrate (8), carried out simultaneously
Upper interfering layer two (7) and lower clear layer (11) sputtering, upper interfering layer two (7) uses niobium pentaoxide, upper interfering layer two (7) upper
The lower section of square and lower clear layer (11) synchronizes sputtering ito film (12);
C, to the top glass substrate (1) after sputtering ito film (12) and lower glass substrate (8), buffered room makes annealing treatment: first drop
Temperature to 200 degrees Celsius, then be heated up to 300 degrees Celsius stable, complete top glass substrate (1) and the plated film of lower glass substrate (8).
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CN201610650197.2A CN106293228A (en) | 2016-08-09 | 2016-08-09 | A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears |
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CN201610650197.2A CN106293228A (en) | 2016-08-09 | 2016-08-09 | A kind of processing method of the two-sided shadow touch screen electro-conductive glass that disappears |
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ID=57667600
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109955121A (en) * | 2017-12-25 | 2019-07-02 | 蓝思科技股份有限公司 | A kind of product processing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105271821A (en) * | 2015-10-19 | 2016-01-27 | 洛阳康耀电子有限公司 | Processing method for double-sided shadow eliminating conductive glass of touch screen |
CN105819703A (en) * | 2016-03-17 | 2016-08-03 | 江苏新浦电子科技有限公司 | Preparation method of capacitive touch screen electro-conductive glass with shadow eliminating function |
-
2016
- 2016-08-09 CN CN201610650197.2A patent/CN106293228A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105271821A (en) * | 2015-10-19 | 2016-01-27 | 洛阳康耀电子有限公司 | Processing method for double-sided shadow eliminating conductive glass of touch screen |
CN105819703A (en) * | 2016-03-17 | 2016-08-03 | 江苏新浦电子科技有限公司 | Preparation method of capacitive touch screen electro-conductive glass with shadow eliminating function |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109955121A (en) * | 2017-12-25 | 2019-07-02 | 蓝思科技股份有限公司 | A kind of product processing method |
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