CN105271820A - Processing method for single-sided shadow eliminating conductive glass of touch screen - Google Patents

Processing method for single-sided shadow eliminating conductive glass of touch screen Download PDF

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Publication number
CN105271820A
CN105271820A CN201510694920.2A CN201510694920A CN105271820A CN 105271820 A CN105271820 A CN 105271820A CN 201510694920 A CN201510694920 A CN 201510694920A CN 105271820 A CN105271820 A CN 105271820A
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CN
China
Prior art keywords
layer
glass substrate
transparent
sputtering
interfering
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Pending
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CN201510694920.2A
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Chinese (zh)
Inventor
秦遵红
王恋贵
董安光
谭华
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LUOYANG KANGYAO ELECTRONIC Co Ltd
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LUOYANG KANGYAO ELECTRONIC Co Ltd
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Application filed by LUOYANG KANGYAO ELECTRONIC Co Ltd filed Critical LUOYANG KANGYAO ELECTRONIC Co Ltd
Priority to CN201510694920.2A priority Critical patent/CN105271820A/en
Publication of CN105271820A publication Critical patent/CN105271820A/en
Pending legal-status Critical Current

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Abstract

A processing method for single-sided shadow eliminating conductive glass of a touch screen comprises following steps: step 1, a glass substrate is processed; step 2, an interference layer I, a transparent passivation layer, an interference layer II and a transparent layer are sputtered on the glass substrate; step 3, an ITO (indium tin oxide) film is sputtered on the glass substrate on the basis of sputtering in the step 2. The single-sided shadow eliminating conductive glass has good electromagnetic shielding, electrostatic protection and shadow eliminating functions and can completely replace the traditional conductive glass, and the conductive glass having low energy consumption, high uniformity and low cost and used for production of a capacitive touch screen is provided for down-stream customers.

Description

A kind of one side disappears the working method of shadow touch-screen conductive glass
Technical field
The present invention relates to conductive glass technical field, especially a kind of one side disappears the working method of shadow touch-screen conductive glass.
Background technology
At present, capacitance plate product uses widely, and the two-sided plating conductive glass in capacitance plate is its main devices, the conductive film of two-sided plating conductive glass requires relatively tighter at aspect of performance, such as homogeneity, resistance toheat, acid-proof alkaline, high-temp resisting high-humidity resisting performance etc.; When making transparent circuitry, because technology difficulty increases, often adopt harsh circuit at making circuit.In making processes, easily etch away the position that should not etch, and there is the erosion trace track of circuit etch, affect its electromagnetic shielding, electrostatic protection function, the erosion trace track of existence can have an impact to viewing graphic pattern.
In view of the foregoing, now develop a kind of one side to disappear the working method of shadow touch-screen conductive glass.
Summary of the invention
The object of the invention is to overcome deficiency of the prior art, the working method that a kind of one side disappears shadow touch-screen conductive glass is provided, there is good electromagnetic shielding, electrostatic protection and the shadow effect that disappears, and existing conventional conductive glass can be replaced completely, for downstream client provides the making capacitance plate conductive glass of low power consuming, high uniformity, low cost.
The present invention to achieve these goals, adopt following technical scheme: a kind of one side disappears the working method of shadow touch-screen conductive glass, the described one side shadow touch-screen conductive glass that disappears is made up of glass substrate, tin face, interfering layer one, transparent passivating layer, interfering layer two, transparent layer, ito film; Two surfaces of glass substrate are tin face, above tin face surperficial on the glass substrate, interfering layer one is set, between interfering layer one and interfering layer two, transparent passivating layer is set, above interfering layer two, ito film is set, transparent layer is set below the tin face of glass substrate lower surface, below transparent layer, ito film is set;
Described transparent passivating layer adopts transparent silicon-dioxide or transparent silicon oxynitride;
Described interfering layer one all adopts Niobium Pentxoxide with interfering layer two.
The first step, processes glass substrate,
A, glass substrate to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after glass substrate carry out edging and chamfering, first X edging, then chamfering, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the glass substrate after edging and chamfering;
E, scrub and dry up again;
Second step, to glass substrate sputtering interfering layer one, transparent passivating layer, interfering layer two and transparent layer;
A, polishing scrubbed dry up rear glass substrate and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to heating after glass substrate upper surface tin face above sputter interfering layer one, transparent passivating layer is sputtered above interfering layer one, transparent passivating layer is transparent silicon-dioxide or transparent silicon oxynitride, sputter interfering layer two above transparent passivating layer, interfering layer one and interfering layer two are Niobium Pentxoxide; Transparent layer is sputtered to below the tin face of glass substrate lower surface;
3rd step, on the basis of glass substrate second step sputtering, carries out ito film sputtering;
A, to sputtering interfering layer one, transparent passivating layer, interfering layer two and transparent layer after glass substrate heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, to the glass substrate after heating, synchronous sputtering ITO film above the interfering layer two on surface on the glass substrate and below the transparent layer of lower surface;
C, to the glass substrate after sputtering ITO film, do anneal through surge chamber: be first cooled to 200 degrees Celsius, then heat to 300 degrees Celsius and stablize, complete the plated film to glass substrate.
The invention has the beneficial effects as follows: the present invention can protect indium tin oxide conductive film to etch circuit; not by the etching of the acid solution made in process; avoid in making processes, etch away the position that should not etch; in making processes, make indium tin oxide conductive film etch circuit reach design requirements; there is good electromagnetic shielding, electrostatic protection and the shadow effect that disappears; and existing conventional conductive glass can be replaced completely, for downstream client provides the making capacitance plate conductive glass of low power consuming, high uniformity, low cost.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described:
Fig. 1 is, general assembly structural representation;
In Fig. 1: glass substrate 1, tin face 2, interfering layer 1, transparent passivating layer 4, interfering layer 25, transparent layer 6, ito film 7.
Embodiment
Below in conjunction with embodiment and embodiment, the present invention is described in further detail:
Embodiment 1
Two surfaces of glass substrate 1 are tin face 2, above the tin face 2 of glass substrate 1 upper surface, interfering layer 1 is set, transparent passivating layer 4 is set between interfering layer 1 and interfering layer 25, ito film 7 is set above interfering layer 25, transparent layer 6 is set below the tin face 2 of glass substrate 1 lower surface, ito film 7 is set below transparent layer 6;
Described transparent passivating layer 4 adopts transparent silicon-dioxide or transparent silicon oxynitride;
Described interfering layer 1 all adopts Niobium Pentxoxide with interfering layer 25.
Embodiment 2
The first step, processes glass substrate 1,
A, glass substrate 1 to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after glass substrate 1 carry out edging and chamfering, first X edging, then chamfering, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the glass substrate 1 after edging and chamfering;
E, scrub and dry up again;
Second step, to glass substrate 1 sputtering interfering layer 1, transparent passivating layer 4, interfering layer 25 and transparent layer 6;
A, polishing scrubbed dry up rear glass substrate 1 and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to heating after glass substrate 1 upper surface tin face 2 above sputter interfering layer 1, transparent passivating layer 4 is sputtered above interfering layer 1, transparent passivating layer 4 is transparent silicon-dioxide or transparent silicon oxynitride, sputter interfering layer 25 above transparent passivating layer 4, interfering layer 1 and interfering layer 25 are Niobium Pentxoxide; Transparent layer 6 is sputtered to below the tin face 2 of glass substrate 1 lower surface;
3rd step, on the basis of glass substrate 1 second step sputtering, carries out ito film 7 and sputters;
A, to sputtering interfering layer 1, transparent passivating layer 4, interfering layer 25 and transparent layer 6 after glass substrate 1 heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, to the glass substrate 1 after heating, synchronous sputtering ITO film 7 above the interfering layer 25 of glass substrate 1 upper surface and below the transparent layer 6 of lower surface;
C, to the glass substrate 1 after sputtering ITO film 7, do anneal through surge chamber: be first cooled to 200 degrees Celsius, then heat to 300 degrees Celsius and stablize, complete the plated film to glass substrate 1.

Claims (2)

1. one side disappears a working method for shadow touch-screen conductive glass, and the described one side shadow touch-screen conductive glass that disappears is made up of glass substrate (1), tin face (2), interfering layer one (3), transparent passivating layer (4), interfering layer two (5), transparent layer (6), ito film (7); It is characterized in that: two surfaces of glass substrate (1) are tin face (2), in top, the tin face (2) of glass substrate (1) upper surface, interfering layer one (3) is set, transparent passivating layer (4) is set between interfering layer one (3) and interfering layer two (5), interfering layer two (5) top arranges ito film (7), arrange transparent layer (6) in below, the tin face (2) of glass substrate (1) lower surface, transparent layer (6) below arranges ito film (7);
Described transparent passivating layer (4) adopts transparent silicon-dioxide or transparent silicon oxynitride;
Described interfering layer one (3) all adopts Niobium Pentxoxide with interfering layer two (5).
2. one side disappears a working method for shadow touch-screen conductive glass, it is characterized in that:
The first step, processes glass substrate (1),
A, glass substrate (1) to be cut, first X cutting, then Y cutting, and then break sheet process;
B, to cutting after glass substrate (1) carry out edging and chamfering, first X edging, then chamfering, half-twist is again to Y edging and chamfering;
C, scrub and dry up;
D, polishing is carried out to the glass substrate (1) after edging and chamfering;
E, scrub and dry up again;
Second step, to glass substrate (1) upper sputtering interfering layer one (3), transparent passivating layer (4), interfering layer two (5) and transparent layer (6);
A, polishing scrubbed dry up rear glass substrate (1) and heat; The Heating temperature adopted is 150-280 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment to heating after glass substrate (1) upper surface tin face (2) top sputtering interfering layer one (3), interfering layer one (3) top sputtering transparent passivating layer (4), transparent passivating layer (4) is transparent silicon-dioxide or transparent silicon oxynitride, transparent passivating layer (4) top sputtering interfering layer two (5), interfering layer one (3) and interfering layer two (5) are Niobium Pentxoxide; To below sputtering transparent layer, the tin face (2) (6) of glass substrate (1) lower surface;
3rd step, on the basis of glass substrate (1) second step sputtering, carries out ito film (7) sputtering;
A, to sputtering interfering layer one (3), transparent passivating layer (4), interfering layer two (5) and transparent layer (6) after glass substrate (1) heat; Heating temperature adopts 280-380 degree Celsius;
B, utilize magnetic control sputtering vacuum coating equipment, to the glass substrate (1) after heating, synchronous sputtering ITO film (7) below interfering layer two (5) top of glass substrate (1) upper surface and the transparent layer (6) of lower surface;
C, to the glass substrate (1) after sputtering ITO film (7), do anneal through surge chamber: be first cooled to 200 degrees Celsius, then heat to 300 degrees Celsius and stablize, complete the plated film to glass substrate (1).
CN201510694920.2A 2015-10-19 2015-10-19 Processing method for single-sided shadow eliminating conductive glass of touch screen Pending CN105271820A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106042531A (en) * 2016-07-24 2016-10-26 东莞汇海光电科技实业有限公司 Single-face shadow eliminating conductive glass and processing method thereof
CN106095212A (en) * 2016-08-09 2016-11-09 洛阳康耀电子有限公司 A kind of full impregnated touch screen disappears the processing method of shadow electro-conductive glass
CN106095213A (en) * 2016-08-09 2016-11-09 洛阳康耀电子有限公司 A kind of half-reflection and half-transmission touch screen disappears the processing method of shadow electro-conductive glass

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040157044A1 (en) * 2001-08-01 2004-08-12 Samsung Corning Co., Ltd. Anti-reflective and anti-static multi-layer thin film for display device
CN103218102A (en) * 2013-05-10 2013-07-24 洛阳恒兆电子有限公司 Method for machining double-sided coated glass for capacitive screen and double-sided coated glass
CN104205021A (en) * 2012-03-30 2014-12-10 应用材料公司 Transparent body for use in a touch screen panel manufacturing method and system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040157044A1 (en) * 2001-08-01 2004-08-12 Samsung Corning Co., Ltd. Anti-reflective and anti-static multi-layer thin film for display device
CN104205021A (en) * 2012-03-30 2014-12-10 应用材料公司 Transparent body for use in a touch screen panel manufacturing method and system
CN103218102A (en) * 2013-05-10 2013-07-24 洛阳恒兆电子有限公司 Method for machining double-sided coated glass for capacitive screen and double-sided coated glass

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106042531A (en) * 2016-07-24 2016-10-26 东莞汇海光电科技实业有限公司 Single-face shadow eliminating conductive glass and processing method thereof
CN106095212A (en) * 2016-08-09 2016-11-09 洛阳康耀电子有限公司 A kind of full impregnated touch screen disappears the processing method of shadow electro-conductive glass
CN106095213A (en) * 2016-08-09 2016-11-09 洛阳康耀电子有限公司 A kind of half-reflection and half-transmission touch screen disappears the processing method of shadow electro-conductive glass

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Application publication date: 20160127