CN105264614B - 聚合物厚膜铜导体组合物的光子烧结 - Google Patents

聚合物厚膜铜导体组合物的光子烧结 Download PDF

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Publication number
CN105264614B
CN105264614B CN201480032685.6A CN201480032685A CN105264614B CN 105264614 B CN105264614 B CN 105264614B CN 201480032685 A CN201480032685 A CN 201480032685A CN 105264614 B CN105264614 B CN 105264614B
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China
Prior art keywords
weight
thick film
copper conductor
conductor composition
composition
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CN201480032685.6A
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English (en)
Chinese (zh)
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CN105264614A (zh
Inventor
J·D·萨默斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Mercury Holdings Inc
Original Assignee
EI Du Pont de Nemours and Co
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inorganic Chemistry (AREA)
CN201480032685.6A 2013-06-13 2014-06-06 聚合物厚膜铜导体组合物的光子烧结 Active CN105264614B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/916,759 2013-06-13
US13/916,759 US9190188B2 (en) 2013-06-13 2013-06-13 Photonic sintering of polymer thick film copper conductor compositions
PCT/US2014/041196 WO2015050589A2 (en) 2013-06-13 2014-06-06 Photonic sintering of polymer thick film copper conductor compositions

Publications (2)

Publication Number Publication Date
CN105264614A CN105264614A (zh) 2016-01-20
CN105264614B true CN105264614B (zh) 2018-01-16

Family

ID=52018433

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480032685.6A Active CN105264614B (zh) 2013-06-13 2014-06-06 聚合物厚膜铜导体组合物的光子烧结

Country Status (5)

Country Link
US (2) US9190188B2 (https=)
EP (1) EP3008735B1 (https=)
JP (1) JP2016527665A (https=)
CN (1) CN105264614B (https=)
WO (1) WO2015050589A2 (https=)

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JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
JP5941588B2 (ja) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
JP6626501B2 (ja) * 2014-10-14 2019-12-25 サン ケミカル コーポレイション 熱成形可能な導電性インクおよびコーティングならびに熱成形デバイスの製造プロセス
US20170044382A1 (en) * 2015-08-12 2017-02-16 E I Du Pont De Nemours And Company Process for forming a solderable polyimide-based polymer thick film conductor
US9649730B2 (en) * 2015-08-12 2017-05-16 E I Du Pont De Nemours And Company Paste and process for forming a solderable polyimide-based polymer thick film conductor
US9637648B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
US9637647B2 (en) * 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
JP6505572B2 (ja) * 2015-09-30 2019-04-24 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP6509770B2 (ja) * 2016-03-31 2019-05-08 Ｊｘ金属株式会社 導電性金属粉ペースト
EP3282453B1 (en) 2016-08-11 2023-07-12 Henkel AG & Co. KGaA Improved processing of polymer based inks and pastes
KR102401226B1 (ko) * 2016-11-17 2022-05-24 니폰 가가쿠 고교 가부시키가이샤 아산화구리 입자, 그의 제조 방법, 광 소결형 조성물, 그것을 사용한 도전막의 형성 방법 및 아산화구리 입자 페이스트
JP7104687B2 (ja) * 2017-03-16 2022-07-21 旭化成株式会社 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
CN116209147A (zh) 2017-07-18 2023-06-02 旭化成株式会社 层积体及其制造方法、以及铜布线
KR102559500B1 (ko) * 2017-07-27 2023-07-24 아사히 가세이 가부시키가이샤 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품
TWI652695B (zh) * 2017-08-16 2019-03-01 昇貿科技股份有限公司 Liquid composition
JP7099867B2 (ja) * 2018-05-16 2022-07-12 日本化学工業株式会社 光焼結型組成物及びそれを用いた導電膜の形成方法
KR102486410B1 (ko) * 2018-06-26 2023-01-09 알파 어셈블리 솔루션스 인크. 소결된 다이 부착 및 유사한 응용을 위한 나노구리 페이스트 및 필름
KR102699895B1 (ko) 2018-08-08 2024-08-29 미쓰이금속광업주식회사 도전체의 접합 구조의 제조 방법, 도전체의 접합 방법 및 접합용 조성물
CN111867264B (zh) * 2019-04-30 2021-10-22 云谷（固安）科技有限公司 导电线的制造方法、可拉伸显示器件以及可拉伸显示器件的制造方法
JP7766900B2 (ja) * 2021-02-05 2025-11-11 株式会社マテリアル・コンセプト 銅ペースト
CN115642000B (zh) * 2022-12-23 2023-04-07 西北工业大学 一种可光子烧结的导电铜浆制备方法
CN117820898B (zh) * 2023-12-25 2025-10-17 之江实验室 一种硼化锆浆料的制备方法及硼化锆薄膜

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EP0239901A2 (en) * 1986-03-31 1987-10-07 Tatsuta Electric Wire & Cable Co., Ltd Conductive copper paste composition
CN102601363A (zh) * 2004-11-24 2012-07-25 诺瓦森特里克斯公司 金属纳米材料合成物的电、镀敷和催化使用

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JPH064791B2 (ja) * 1985-09-30 1994-01-19 タツタ電線株式会社 導電塗料
US4687597A (en) * 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions
JPS62230869A (ja) * 1986-03-31 1987-10-09 Tatsuta Electric Wire & Cable Co Ltd 半田付可能な導電塗料
JPS6420276A (en) * 1987-07-15 1989-01-24 Mitsubishi Petrochemical Co Copper-containing electroconductive coating composition
US5064469A (en) * 1989-10-03 1991-11-12 Akzo N.V. Preparation of oxidation resistant metal powder
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
JPH11217522A (ja) * 1998-02-04 1999-08-10 Sumitomo Rubber Ind Ltd 導電性ペーストとそれを用いたプリント基板、ならびにその製造方法
JP2006117959A (ja) * 2004-10-19 2006-05-11 Fukuda Metal Foil & Powder Co Ltd 電子材料用銅粉
JP5064379B2 (ja) * 2005-04-20 2012-10-31 フィブロ−テック，インコーポレイテッド 銅粉末の生成方法、金属粉末の生成方法及びニッケル粉末の生成方法
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20110180137A1 (en) 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US10046418B2 (en) * 2010-03-18 2018-08-14 Furukawa Electric Co., Ltd. Electrically conductive paste, and electrically conducive connection member produced using the paste
US8419981B2 (en) * 2010-11-15 2013-04-16 Cheil Industries, Inc. Conductive paste composition and electrode prepared using the same
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
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EP0239901A2 (en) * 1986-03-31 1987-10-07 Tatsuta Electric Wire & Cable Co., Ltd Conductive copper paste composition
CN102601363A (zh) * 2004-11-24 2012-07-25 诺瓦森特里克斯公司 金属纳米材料合成物的电、镀敷和催化使用

Also Published As

Publication number Publication date
US20160035455A1 (en) 2016-02-04
WO2015050589A2 (en) 2015-04-09
EP3008735A2 (en) 2016-04-20
WO2015050589A3 (en) 2015-06-04
JP2016527665A (ja) 2016-09-08
CN105264614A (zh) 2016-01-20
EP3008735B1 (en) 2017-12-27
US9190188B2 (en) 2015-11-17
US20140367619A1 (en) 2014-12-18

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Effective date of registration: 20221125

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Patentee before: E.I. Nemours DuPont

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