CN1052347C - 印刷电路板火花放电器 - Google Patents
印刷电路板火花放电器 Download PDFInfo
- Publication number
 - CN1052347C CN1052347C CN96121363A CN96121363A CN1052347C CN 1052347 C CN1052347 C CN 1052347C CN 96121363 A CN96121363 A CN 96121363A CN 96121363 A CN96121363 A CN 96121363A CN 1052347 C CN1052347 C CN 1052347C
 - Authority
 - CN
 - China
 - Prior art keywords
 - pcb
 - spark discharger
 - spark
 - circuit board
 - printed circuit
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired - Fee Related
 
Links
- 239000004020 conductor Substances 0.000 claims description 28
 - 238000010891 electric arc Methods 0.000 claims description 8
 - 229910000679 solder Inorganic materials 0.000 abstract description 5
 - RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
 - 229910052802 copper Inorganic materials 0.000 description 9
 - 239000010949 copper Substances 0.000 description 9
 - 230000006378 damage Effects 0.000 description 9
 - 238000000034 method Methods 0.000 description 6
 - 238000005516 engineering process Methods 0.000 description 4
 - 238000001704 evaporation Methods 0.000 description 3
 - 230000008020 evaporation Effects 0.000 description 3
 - 230000007774 longterm Effects 0.000 description 3
 - 239000000463 material Substances 0.000 description 3
 - 239000000203 mixture Substances 0.000 description 3
 - 230000015572 biosynthetic process Effects 0.000 description 2
 - 239000011889 copper foil Substances 0.000 description 2
 - 230000001066 destructive effect Effects 0.000 description 2
 - 238000010586 diagram Methods 0.000 description 2
 - 238000007599 discharging Methods 0.000 description 2
 - 239000003365 glass fiber Substances 0.000 description 2
 - 239000004033 plastic Substances 0.000 description 2
 - 229920003023 plastic Polymers 0.000 description 2
 - 238000007634 remodeling Methods 0.000 description 2
 - 238000005476 soldering Methods 0.000 description 2
 - 238000003466 welding Methods 0.000 description 2
 - 230000004888 barrier function Effects 0.000 description 1
 - 239000003990 capacitor Substances 0.000 description 1
 - 238000004320 controlled atmosphere Methods 0.000 description 1
 - 230000007797 corrosion Effects 0.000 description 1
 - 238000005260 corrosion Methods 0.000 description 1
 - 238000010892 electric spark Methods 0.000 description 1
 - 230000005611 electricity Effects 0.000 description 1
 - 239000011888 foil Substances 0.000 description 1
 - 238000013467 fragmentation Methods 0.000 description 1
 - 238000006062 fragmentation reaction Methods 0.000 description 1
 - 239000011521 glass Substances 0.000 description 1
 - 238000009434 installation Methods 0.000 description 1
 - 238000002955 isolation Methods 0.000 description 1
 - 230000001681 protective effect Effects 0.000 description 1
 - 238000007789 sealing Methods 0.000 description 1
 - 238000000926 separation method Methods 0.000 description 1
 - 239000002002 slurry Substances 0.000 description 1
 - 238000010561 standard procedure Methods 0.000 description 1
 - 239000000758 substrate Substances 0.000 description 1
 
Images
Classifications
- 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K9/00—Screening of apparatus or components against electric or magnetic fields
 
 - 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K1/00—Printed circuits
 - H05K1/02—Details
 - H05K1/0213—Electrical arrangements not otherwise provided for
 - H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
 - H05K1/0257—Overvoltage protection
 - H05K1/026—Spark gaps
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
 - H01T4/00—Overvoltage arresters using spark gaps
 - H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
 
 - 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
 - H05K2201/09—Shape and layout
 - H05K2201/09009—Substrate related
 - H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
 
 - 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
 - H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
 - H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
 - H05K2201/10621—Components characterised by their electrical contacts
 - H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
 
 - 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K3/00—Apparatus or processes for manufacturing printed circuits
 - H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
 - H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
 - H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
 - H05K3/341—Surface mounted components
 - H05K3/3431—Leadless components
 - H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
 
 - 
        
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
 - Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
 - Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
 - Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Structure Of Printed Boards (AREA)
 - Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
 - Combinations Of Printed Boards (AREA)
 - Electric Connection Of Electric Components To Printed Circuits (AREA)
 
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US08/603,050 US5933307A (en) | 1996-02-16 | 1996-02-16 | Printed circuit board sparkgap | 
| US603,050 | 1996-02-16 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| CN1165419A CN1165419A (zh) | 1997-11-19 | 
| CN1052347C true CN1052347C (zh) | 2000-05-10 | 
Family
ID=24413889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| CN96121363A Expired - Fee Related CN1052347C (zh) | 1996-02-16 | 1996-12-17 | 印刷电路板火花放电器 | 
Country Status (11)
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| GB2334626B (en) * | 1998-02-20 | 2003-01-29 | Mitel Corp | Spark gap for hermetically packaged integrated circuits | 
| GB2335084B (en) * | 1998-02-21 | 2003-04-02 | Mitel Corp | Spark gap for high voltage integrated circuit electrostatic discharge protection | 
| WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material | 
| US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material | 
| US7695644B2 (en) | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles | 
| US6493198B1 (en) * | 2000-02-22 | 2002-12-10 | Motorola, Inc. | Electrostatic discharge protection device for a high density printed circuit board | 
| CN2478312Y (zh) * | 2001-04-10 | 2002-02-20 | 伊博电源(杭州)有限公司 | 表面贴封装的电气联接件 | 
| US7126804B1 (en) | 2002-07-03 | 2006-10-24 | Diversified Control, Inc. | Spark gap | 
| DE502004009835D1 (de) * | 2003-10-08 | 2009-09-10 | Continental Teves Ag & Co Ohg | Integriertes mikroprozessorsystem für sicherheitskritische regelungen | 
| US7885083B2 (en) * | 2003-12-31 | 2011-02-08 | Honeywell International, Inc. | Input transient protection for electronic devices | 
| US20060250744A1 (en) * | 2005-05-05 | 2006-11-09 | Mctigue Michael T | Micro gap method and ESD protection device | 
| EP1969627A4 (en) | 2005-11-22 | 2010-01-20 | Shocking Technologies Inc | SEMICONDUCTOR ARRANGEMENTS WITH VOLTAGE SWITCHABLE MATERIALS FOR OVERVOLTAGE PROTECTION | 
| US7968014B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles | 
| WO2008036423A2 (en) | 2006-09-24 | 2008-03-27 | Shocking Technologies, Inc. | Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same | 
| US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices | 
| US8112884B2 (en) | 2007-10-08 | 2012-02-14 | Honeywell International Inc. | Method for providing an efficient thermal transfer through a printed circuit board | 
| GB2453765A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Product packaging with printed circuit and means for preventing a short circuit | 
| US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration | 
| KR101653426B1 (ko) | 2008-09-30 | 2016-09-01 | 쇼킹 테크놀로지스 인코포레이티드 | 도전 코어 쉘 입자를 포함하는 전압 절환형 유전 물질 | 
| US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles | 
| US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials | 
| US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials | 
| WO2010110909A1 (en) | 2009-03-26 | 2010-09-30 | Shocking Technologies, Inc. | Components having voltage switchable dielectric materials | 
| US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices | 
| US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events | 
| US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials | 
| US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components | 
| US8395875B2 (en) | 2010-08-13 | 2013-03-12 | Andrew F. Tresness | Spark gap apparatus | 
| US10064266B2 (en) | 2011-07-19 | 2018-08-28 | Whirlpool Corporation | Circuit board having arc tracking protection | 
| US11311225B2 (en) * | 2017-07-11 | 2022-04-26 | General Electric Company | Systems and methods for shielded and adjustable medical monitoring devices | 
| JP2019117852A (ja) * | 2017-12-27 | 2019-07-18 | パナソニックIpマネジメント株式会社 | プリント基板及び天井扇 | 
| CN108923262B (zh) * | 2018-06-28 | 2020-09-15 | 新华三技术有限公司 | 火花放电器、电路板及电子设备 | 
| WO2020141192A1 (en) * | 2019-01-03 | 2020-07-09 | Signify Holding B.V. | Apparatus with charge dissipation | 
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| EP0090058A1 (de) * | 1982-03-25 | 1983-10-05 | Ibm Deutschland Gmbh | Transistorschaltung zum Schalten des Schreibstromes bei einem Metallpapierdrucker und zum selbsttätigen Verringern des Schreibstromes nach dem Zünden des Lichtbogens | 
| EP0609605A1 (en) * | 1992-09-11 | 1994-08-10 | Morton International, Inc. | Printed circuit bridge initiator for an air bag inflator | 
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| FR2326107A1 (fr) * | 1974-05-13 | 1977-04-22 | Seiko Instr & Electronics | Panneau de circuit imprime | 
| JPS5231376A (en) * | 1975-09-05 | 1977-03-09 | Hitachi Ltd | Discharge electrode at thick printed circuit substrate | 
| JPS54148861A (en) * | 1978-05-16 | 1979-11-21 | Naoyoshi Adachi | Parison for hollow mold articles and production thereof | 
| JPS55126983A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Discharge gap | 
| JPS57143692A (en) * | 1981-02-28 | 1982-09-04 | Matsushita Electric Works Ltd | Call chime system | 
| JPH07107867B2 (ja) * | 1986-05-27 | 1995-11-15 | 三菱マテリアル株式会社 | 多極マイクロギャップ式サージ吸収器 | 
| JPH04239114A (ja) * | 1991-01-11 | 1992-08-27 | Toyota Motor Corp | 表面実装型電子部品 | 
| DE4329251C2 (de) * | 1993-08-31 | 1996-08-14 | Philips Patentverwaltung | Anordnung zum Schutz von gegen Überspannungen empfindlichen Bauelementen auf gedruckten Schaltungsplatten | 
- 
        1996
        
- 1996-02-16 US US08/603,050 patent/US5933307A/en not_active Expired - Lifetime
 - 1996-12-06 DE DE69633848T patent/DE69633848T2/de not_active Expired - Lifetime
 - 1996-12-06 EP EP96119610A patent/EP0790758B1/en not_active Expired - Lifetime
 - 1996-12-09 IN IN2120CA1996 patent/IN189905B/en unknown
 - 1996-12-11 SG SG1996011952A patent/SG48504A1/en unknown
 - 1996-12-17 CN CN96121363A patent/CN1052347C/zh not_active Expired - Fee Related
 - 1996-12-26 JP JP8348761A patent/JPH09232065A/ja active Pending
 - 1996-12-27 KR KR1019960072708A patent/KR100441037B1/ko not_active Expired - Fee Related
 - 1996-12-27 BR BR9606195A patent/BR9606195A/pt not_active IP Right Cessation
 
 - 
        1997
        
- 1997-01-03 MY MYPI97000011A patent/MY120205A/en unknown
 - 1997-02-14 ID IDP970424A patent/ID15938A/id unknown
 
 - 
        2008
        
- 2008-03-03 JP JP2008052492A patent/JP4745357B2/ja not_active Expired - Fee Related
 
 
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| EP0090058A1 (de) * | 1982-03-25 | 1983-10-05 | Ibm Deutschland Gmbh | Transistorschaltung zum Schalten des Schreibstromes bei einem Metallpapierdrucker und zum selbsttätigen Verringern des Schreibstromes nach dem Zünden des Lichtbogens | 
| EP0609605A1 (en) * | 1992-09-11 | 1994-08-10 | Morton International, Inc. | Printed circuit bridge initiator for an air bag inflator | 
Also Published As
| Publication number | Publication date | 
|---|---|
| EP0790758A1 (en) | 1997-08-20 | 
| JP2008159597A (ja) | 2008-07-10 | 
| JPH09232065A (ja) | 1997-09-05 | 
| BR9606195A (pt) | 1998-08-18 | 
| ID15938A (id) | 1997-08-21 | 
| IN189905B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2003-05-10 | 
| DE69633848D1 (de) | 2004-12-23 | 
| KR970064340A (ko) | 1997-09-12 | 
| SG48504A1 (en) | 1998-04-17 | 
| DE69633848T2 (de) | 2005-03-31 | 
| CN1165419A (zh) | 1997-11-19 | 
| MY120205A (en) | 2005-09-30 | 
| EP0790758B1 (en) | 2004-11-17 | 
| JP4745357B2 (ja) | 2011-08-10 | 
| HK1005111A1 (en) | 1998-12-24 | 
| US5933307A (en) | 1999-08-03 | 
| KR100441037B1 (ko) | 2004-10-26 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code | 
             Ref country code: HK Ref legal event code: GR Ref document number: 1029308 Country of ref document: HK  | 
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee | 
             Granted publication date: 20000510 Termination date: 20131217  |