CN1052347C - 印刷电路板火花放电器 - Google Patents
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- H—ELECTRICITY
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- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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Abstract
印刷电路板(PCB)火花放电器,用一个或多个表面贴装器件(SMD)(210,310),SMD的导电端(230、320)和焊盘(220、320)构成一个或多火花放电器(400)的一个或多个电极,在产生电弧时,SMD有助于吸收电能和热量。
Description
本发明涉及火花放电器,用于保护电路,特别涉及与印刷电路板有关的火花放电器。
火花放电器在高电压冲击电路之前用支路消除高电压浪涌对电路的损坏而对其保护。火花放电器确定电路中瞬时放电或浪涌放电的位置,并确定该放电的具体电位。用所包含的电路网络,这种瞬时源和优选的放电路径确定要求放电的位置。用火花放电器包含的两个导电点之间的间隙确定放电所需的不同电压。确定瞬时源或浪涌源和要求保护的电平来建立要求放电的电位。例如,它可以按规定的要求来确定。
现有的火花放电器包括分立的火花放电器如图1A和图1B所示,或成本较贵的印刷电路板(PCB)火花放电器,如图2A和图2B所示。
分立火花放电器通常由各导电表面间有固定间隔的玻璃、陶瓷或塑料壳中的引线引出端构成。分离的火花放电器有两类,一类是用受控气氛密封,如图1A所示。另一类是处于常压的不密封,如图1B所示。这两类均要求安装在例如PCB上的较大空间,而且,在装配中,由于要考虑安装间隔和其它机械上的要求,因此,必须注意实际的安放位置和取向。而且分离火花放电器比印刷电路火花放电器价格贵,寿命更长,通常具有更可控的放电电位。
众所周知,印刷电路板是用导电带将所包括有各种电路元件的一层或多层硬的或柔软的绝缘层,例如玻璃纤维或塑料与一层或多层导电材料例如铜或导电浆料电气连接的构成的。
如图2A和2B所示,PCB火花放电器利用彼此有固定间隔的PCB的导电带,例如铜,并设置有控制不需要的瞬时放电或电位的控制点。PCB火花放电器在节点之间在迭置板中有冲击的槽,这与所包含的电压电位和能量有关。P B火花放电器的由实际误差和配置而致的变化很小,因此,容易精确地制造PCB火花放电器,而且重复性好,这与分离火花放电器不同。PCB的操作可确定,而且价格便宜,比电路板材料的实际价格低得多。
印刷电路板火花放电路的缺点是明显的重复放电、毁灭性的或长期持续放电。导电节点之间的铜箔蒸发而使印刷电路板表面和铜箔迅速损坏。随着放电间隔上飞弧所需电压电位的增大、飞弧位置的可控性下降。而且,由于这种情况下可能产生热,而在毁灭性的长期放电中会使迭置板破坏。
改善PCB火花放电器通常有几种方法。例如,增加箔厚来延迟其箔蒸发问题,槽型PCB火花放电器中,用增长槽的长度,保持宽度不变。遗憾的是,用该技术,会使需要进行火花放电器的PCB面积增大,而且,蒸发会使PCB火花放电器性能变坏。另一种方法是,用多个顺序间隔开的放电间隙,因而,使放电能量在两个间隙上消耗掉,如图2B所示。该方法在牺牲PCB面积的情况下使箔的损坏减缓。
为克服现有火花放电器的缺点提出一种新的火花放电器。
本发明涉及的上述PCB火花放电器的改进它用表面贴装器件(S MD)按一端至另一端的顺序焊接到火花放电器的各个PCB导体上。
参见附图详细说明本发明,其中:
图1和2是现有火花放电器示意图;
图3A是本发明优选实施例的火花放电器的平面图和侧视图;
图3B是本发明另一实施例的火花放电器的平面图和侧视图;
图4是本发明实施例的火花放电器的等角投影图;
图5是图3A所示本发明优选实施例火花放电器的平面图和侧视图;
图6是本发明又一实施例火花放电器的平面图和侧视图;
各图中相同的数字表示相同或类似的构件。
参照图3A和5,说明按本发明的PCB火花放电器的实施例。PCB包括不导电衬底或迭层100,和导电层,该导电层包括构成在迭层100上的导体200和300。导体200和300相互隔离并电气隔离,构成火花放电气隙400。增加分别焊到导体200和300上的表面贴装器件(S MD),使火花放电气隙400增大。图示的放电气隙400包括穿过迭层100冲击的槽。但是,本发明不必冲这种槽。S MD 210通过导电端230和231处的焊料盘220和221电气和机械连接到导体200上。S MD 310通过导电端230和231处的焊盘320和321电气和机械地连接到导体300上。
用导体200与300之间的间隔最初形成电能以火花放电形式运行的实际气隙400。这些导体会有一定程度的蒸发,因而会腐蚀S MD 210与310之间形成的间隙。用S MD工艺的位置误差和焊盘形成来确定S MD与导体边缘之间的导体量。
用导体200和焊盘220构成火花放电间隙400的第1电极,用导体300和焊盘320构成其第2电极。两个电极之间的电位差超过由间隙宽度和材料的介电强度(例如,槽中的空气或玻璃纤维)所决定的电平时,电火花从一个电极跳到另一电极。S MD 210或310之间的导电箔构形以设置一确定点,使焊盘220和320流入该形状。要想更严格地控制感应电弧,要求按此方式确定电弧位置和电压电平差。该定点有助于在规定位置按规定电位放电,这与不易控制的圆形或宽的放电表面不同。
只考虑第1电极,用导体200、焊盘220和S MD 210的导电端230消耗因产生电弧而存在于电极上的电能。此外,电极导电材料中的(其它因素中)I2R损耗产生的热会传到相邻材料中,如S MD 210和迭层件100中。
图2A所示的现有电火花放电器中,只由铜和迭层件消耗电能和热能,造成导体和迭层件腐蚀,如上所述。用表面贴装器件及其相关的焊盘和导电端,可避免从铜吸收的热量增加,并使铜和相邻的迭层件的损坏降至最小。此外,用焊盘和导电端提供的较大的横截面积,会减少飞弧产生时电流流动的电阻值来直接减小I2R损耗,由此减小所产生的热量。
可按图示实践本发明,分别用导体200和300使S MD 210和310不出现“短路”。但是,在S MD下的附加铜可既减小电阻(即小的I2R损耗)和增大热容(即,吸收更大热量不损坏)使S MD得到进一步的保护。用不同的焊料组分也能增大热容。例如,可选择有高比热特性的特有焊料组分。也可选用有特定流性和凝固性的特有焊料组分。由此构成不常见的厚焊点。
用标准方法和误差将所用的S MD焊到PCB的铜层上。例如,用波峰焊或回流焊,汽相或远红外技术。此外,上述的器件“短路”处用的S MD的实际元件类型没有严格规定。重要的是选择不“短路”的器件,适当选择低阻抗元件,例如,跨接型S MD。实际上,发现S MD电阻器比S MD电容器更适合机械焊接,因而,更适用,但两者均可用。按同样的方式,没有严格限制所选器件的误差。若这些电剔除部件仍保持适当的机械特性,即,没破碎,则仍能使用。此外,电火花放电器用的S MD不必专门储存,其它用途等级的S MD也可以用。
也可按图4所示结构实施本发明,其中用两个相对设置的S MD构成火花放电器400。图4的配置的改型示于图3A和3B中。图3A中第1导体200上贴装有第1对S MD 210A、210B,与此相对,在第2导体300上贴装有第2对S MD 310A和310B,两对相对设置的S MD构成火花放电器400。该结构中设置有一定余度用于确定产生飞弧的两个确定表面,设置两个这样的表面使火花放电器的寿命延长,因为,相对设置的S MD之间的电弧最后会造成相对设置的一组S MD的确定表面中的明显损坏。
图3B是图3A所示配置的又一增强型结构。在所贴装的第1对S MD210A、210B和第2对S MD 310A、310B之间的第3导体500上贴装第3对S MD 510A、510B,构成第2火花放电器400B。该配置能分割间隙400A和400B之间产生电弧的能量,因而,减小构成火花放电器的单个元件上的应力。例如,假定产生电弧的电压相等,按图3A所配置的单个电火花放电间隙的宽度必须比图3B配置的两个火花放电间隙的任何一个间隙的宽度宽,而且,按图3A的配置能用更少的元件消耗热能和电能。因而,图3B的配置比图3A的配置允许的火花放电电压高,而不增加对相关元件的损坏。
也可按图6所示结构实施发明。在与第2导体300相对设置的第1导体200上贴装第1 S MD 210A或第2 S MD 210B。火花放电器400包括第1导体与第2导体之间的间隙,第1导体包括其上贴装的一个或多个S MD的导电面。该实施例是在现有技术基础上增加了保护,防止火花放电器的一边被电弧损坏。
与现有的PCB火花放电器相比,造价增加降到最小,造价主要由两个或多个S MD和在PCB上设置它们的花费构成。此外,用S MD代替图1A的分立火花放电器,其优点是,具有表面贴装技术的优点,例如,精度高和元件可重复放置等。
应选择S MD的位置,因此,所选位置/焊接工艺的机械误差和位置误差组合的最坏情况下将保证间隙边缘总是有一定量的导体不被元件覆盖。这样设置的目的是既能保证焊料也能确定起始放电的开始点。
用805或1206 S MD元件构成火花放电器。例如,测试图3A所示发明实施例,从一端到另一端的S MD对位精度为约0.5密耳,边与边的裕度(中心线到中心线)为约100密耳,有良好的结果。配置工艺的标志线是指超出S MD端的20密耳的铜,该距离可随保护强度而减小。
由于S MD贴装工艺因素(例如相邻元件焊料)的影响,805大小的SMD的中心线至中心线的边与边中心线裕度应为90密耳,而1206大小的S MD的中心线与中心线间裕度为100密耳。焊盘的端部裕度要求达到5密耳,并具有足够的机械电气连接强度。
对图3A的配置进行瞬时和浪涌性能的重复试验,对实际尺寸有令人极其满意的结果。用跨接型S MD进行@6KV和0.51uf的20次以上的浪涌试验。发现导体实质上无损坏。对图2A所示现有配置进行同样试验,发现铜明显损坏。本发明的火花放电路作为瞬时和长期放电器均有用。
本发明是用实施例来说明的,对本领域的技术人员而言,显然还会有各种改型和变化,但这些均不脱离本发明的精神和要求保护的范围。
Claims (3)
1.印刷电路板火花放电器,其特征是,印刷电路板(PCB)的表面(200,300)上有多个表面贴装器件(210,310);
所述表面贴装器件相互隔开预定距离(400)其间构成能使极高能量放电的火花放电器。
2.火花放电器,其特征是,
第1表面(200)上有一个或多个表面贴装器件(210A、210B);
所述第1表面(200)和所述器件与第2表面(300)隔开预定距离(400),并与第2表面一起构成其间能产生电弧的间隙。
3.新型PCB火花放电器,其特征是,
不导电表面上有多个导电元件;
所述导体元件相互隔开预定距离,并一起构成其间能产生电弧的间隙;
所述导电元件由表面贴装器件构成。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US08/603,050 US5933307A (en) | 1996-02-16 | 1996-02-16 | Printed circuit board sparkgap |
US603,050 | 1996-02-16 |
Publications (2)
Publication Number | Publication Date |
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CN1165419A CN1165419A (zh) | 1997-11-19 |
CN1052347C true CN1052347C (zh) | 2000-05-10 |
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CN96121363A Expired - Fee Related CN1052347C (zh) | 1996-02-16 | 1996-12-17 | 印刷电路板火花放电器 |
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US (1) | US5933307A (zh) |
EP (1) | EP0790758B1 (zh) |
JP (2) | JPH09232065A (zh) |
KR (1) | KR100441037B1 (zh) |
CN (1) | CN1052347C (zh) |
BR (1) | BR9606195A (zh) |
DE (1) | DE69633848T2 (zh) |
HK (1) | HK1005111A1 (zh) |
ID (1) | ID15938A (zh) |
IN (1) | IN189905B (zh) |
MY (1) | MY120205A (zh) |
SG (1) | SG48504A1 (zh) |
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1996
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- 1996-12-06 EP EP96119610A patent/EP0790758B1/en not_active Expired - Lifetime
- 1996-12-06 DE DE69633848T patent/DE69633848T2/de not_active Expired - Lifetime
- 1996-12-09 IN IN2120CA1996 patent/IN189905B/en unknown
- 1996-12-11 SG SG1996011952A patent/SG48504A1/en unknown
- 1996-12-17 CN CN96121363A patent/CN1052347C/zh not_active Expired - Fee Related
- 1996-12-26 JP JP8348761A patent/JPH09232065A/ja active Pending
- 1996-12-27 BR BR9606195A patent/BR9606195A/pt not_active IP Right Cessation
- 1996-12-27 KR KR1019960072708A patent/KR100441037B1/ko not_active IP Right Cessation
-
1997
- 1997-01-03 MY MYPI97000011A patent/MY120205A/en unknown
- 1997-02-14 ID IDP970424A patent/ID15938A/id unknown
-
1998
- 1998-05-18 HK HK98104264A patent/HK1005111A1/xx not_active IP Right Cessation
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2008
- 2008-03-03 JP JP2008052492A patent/JP4745357B2/ja not_active Expired - Fee Related
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EP0090058A1 (de) * | 1982-03-25 | 1983-10-05 | Ibm Deutschland Gmbh | Transistorschaltung zum Schalten des Schreibstromes bei einem Metallpapierdrucker und zum selbsttätigen Verringern des Schreibstromes nach dem Zünden des Lichtbogens |
EP0609605A1 (en) * | 1992-09-11 | 1994-08-10 | Morton International, Inc. | Printed circuit bridge initiator for an air bag inflator |
Also Published As
Publication number | Publication date |
---|---|
ID15938A (id) | 1997-08-21 |
US5933307A (en) | 1999-08-03 |
KR970064340A (ko) | 1997-09-12 |
EP0790758B1 (en) | 2004-11-17 |
DE69633848D1 (de) | 2004-12-23 |
KR100441037B1 (ko) | 2004-10-26 |
IN189905B (zh) | 2003-05-10 |
EP0790758A1 (en) | 1997-08-20 |
JPH09232065A (ja) | 1997-09-05 |
BR9606195A (pt) | 1998-08-18 |
JP2008159597A (ja) | 2008-07-10 |
CN1165419A (zh) | 1997-11-19 |
JP4745357B2 (ja) | 2011-08-10 |
MY120205A (en) | 2005-09-30 |
HK1005111A1 (en) | 1998-12-24 |
DE69633848T2 (de) | 2005-03-31 |
SG48504A1 (en) | 1998-04-17 |
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