CN105230133B - 用于lds-塑料的添加剂 - Google Patents

用于lds-塑料的添加剂 Download PDF

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Publication number
CN105230133B
CN105230133B CN201480025992.1A CN201480025992A CN105230133B CN 105230133 B CN105230133 B CN 105230133B CN 201480025992 A CN201480025992 A CN 201480025992A CN 105230133 B CN105230133 B CN 105230133B
Authority
CN
China
Prior art keywords
core
lds
composite pigment
coating
additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480025992.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN105230133A (zh
Inventor
H·B·克尼斯
U·奎特曼
O·R·皮厄宁
S·罗森伯格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN105230133A publication Critical patent/CN105230133A/zh
Application granted granted Critical
Publication of CN105230133B publication Critical patent/CN105230133B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
CN201480025992.1A 2013-05-07 2014-05-05 用于lds-塑料的添加剂 Expired - Fee Related CN105230133B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
DE102013007750.8 2013-05-07
PCT/EP2014/001183 WO2014180550A1 (de) 2013-05-07 2014-05-05 Additiv für lds-kunststoffe

Publications (2)

Publication Number Publication Date
CN105230133A CN105230133A (zh) 2016-01-06
CN105230133B true CN105230133B (zh) 2019-01-15

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480025992.1A Expired - Fee Related CN105230133B (zh) 2013-05-07 2014-05-05 用于lds-塑料的添加剂

Country Status (7)

Country Link
EP (1) EP2995178A1 (enExample)
JP (1) JP6423418B2 (enExample)
KR (1) KR102171893B1 (enExample)
CN (1) CN105230133B (enExample)
DE (1) DE102013007750A1 (enExample)
TW (1) TWI632205B (enExample)
WO (1) WO2014180550A1 (enExample)

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JP7068304B2 (ja) * 2016-11-22 2022-05-16 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング レーザーマーク可能なおよびレーザー溶接可能なポリマー材料のための添加物
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
EP3568437B1 (en) * 2017-01-11 2023-07-26 SHPP Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
CN110268013A (zh) * 2017-01-11 2019-09-20 沙特基础工业全球技术公司 具有可激光活化金属化合物的可激光镀敷热塑性组合物及其成形制品
KR102272924B1 (ko) * 2017-01-11 2021-07-06 에스에이치피피 글로벌 테크놀러지스 비.브이. 광물 충전제 표면 상에 코팅된 금속 화합물을 갖는 코어-쉘 구조 lds 첨가제에 의한 레이저 도금 성능 및 열전도도를 갖는 조성물
WO2019042906A1 (de) * 2017-08-29 2019-03-07 Merck Patent Gmbh Laseradditiv und additiv für lds-kunststoffe
WO2019149900A1 (de) * 2018-02-02 2019-08-08 Sivantos Pte. Ltd. Zusammensetzung zur herstellung von hörgerätekomponenten
EP3543291A1 (en) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom
CN112119128B (zh) * 2018-05-16 2022-03-01 默克专利股份有限公司 激光添加剂及其在聚合物材料中的用途
WO2020126188A1 (en) * 2018-12-19 2020-06-25 Mep Europe B.V. Thermoplastic composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US12441879B2 (en) 2019-08-21 2025-10-14 Ticona Llc Polymer composition for laser direct structuring
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
JP7737387B2 (ja) 2020-02-26 2025-09-10 ティコナ・エルエルシー 回路構造体
JP7562989B2 (ja) * 2020-03-12 2024-10-08 住友ベークライト株式会社 電子装置
JP7501131B2 (ja) * 2020-06-11 2024-06-18 住友ベークライト株式会社 Ｌｄｓ用熱硬化性樹脂組成物および構造体
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
JP6907393B1 (ja) 2020-08-05 2021-07-21 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

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Also Published As

Publication number Publication date
TWI632205B (zh) 2018-08-11
KR20160005742A (ko) 2016-01-15
DE102013007750A1 (de) 2014-11-13
KR102171893B1 (ko) 2020-10-30
JP6423418B2 (ja) 2018-11-14
TW201510109A (zh) 2015-03-16
CN105230133A (zh) 2016-01-06
JP2016520139A (ja) 2016-07-11
WO2014180550A1 (de) 2014-11-13
EP2995178A1 (de) 2016-03-16

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