KR102171893B1 - Lds 플라스틱용 첨가제 - Google Patents

Lds 플라스틱용 첨가제 Download PDF

Info

Publication number
KR102171893B1
KR102171893B1 KR1020157034593A KR20157034593A KR102171893B1 KR 102171893 B1 KR102171893 B1 KR 102171893B1 KR 1020157034593 A KR1020157034593 A KR 1020157034593A KR 20157034593 A KR20157034593 A KR 20157034593A KR 102171893 B1 KR102171893 B1 KR 102171893B1
Authority
KR
South Korea
Prior art keywords
core
coating
tio
composite pigment
lds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020157034593A
Other languages
English (en)
Korean (ko)
Other versions
KR20160005742A (ko
Inventor
헬게 베티나 크니쓰
울리히 퀴트만
올리버 로베르트 피닝
실비아 로젠베르거
Original Assignee
메르크 파텐트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메르크 파텐트 게엠베하 filed Critical 메르크 파텐트 게엠베하
Publication of KR20160005742A publication Critical patent/KR20160005742A/ko
Application granted granted Critical
Publication of KR102171893B1 publication Critical patent/KR102171893B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
KR1020157034593A 2013-05-07 2014-05-05 Lds 플라스틱용 첨가제 Expired - Fee Related KR102171893B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
DE102013007750.8 2013-05-07
PCT/EP2014/001183 WO2014180550A1 (de) 2013-05-07 2014-05-05 Additiv für lds-kunststoffe

Publications (2)

Publication Number Publication Date
KR20160005742A KR20160005742A (ko) 2016-01-15
KR102171893B1 true KR102171893B1 (ko) 2020-10-30

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157034593A Expired - Fee Related KR102171893B1 (ko) 2013-05-07 2014-05-05 Lds 플라스틱용 첨가제

Country Status (7)

Country Link
EP (1) EP2995178A1 (enExample)
JP (1) JP6423418B2 (enExample)
KR (1) KR102171893B1 (enExample)
CN (1) CN105230133B (enExample)
DE (1) DE102013007750A1 (enExample)
TW (1) TWI632205B (enExample)
WO (1) WO2014180550A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676927B2 (en) * 2014-04-09 2017-06-13 The Shepherd Color Company Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
US20170361584A1 (en) * 2014-12-12 2017-12-21 Sabic Global Technologies B.V. Laser-direct structuring of polymeric films and sheets and methods of making
KR102031105B1 (ko) * 2014-12-12 2019-10-11 사빅 글로벌 테크놀러지스 비.브이. 레이저 직접 구조화 물질 및 이의 제조 방법
MX2018001103A (es) * 2015-07-28 2018-03-26 Merck Patent Gmbh Polimeros y recubrimientos marcables con laser.
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
JP7068304B2 (ja) * 2016-11-22 2022-05-16 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング レーザーマーク可能なおよびレーザー溶接可能なポリマー材料のための添加物
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
EP3568437B1 (en) * 2017-01-11 2023-07-26 SHPP Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
CN110268013A (zh) * 2017-01-11 2019-09-20 沙特基础工业全球技术公司 具有可激光活化金属化合物的可激光镀敷热塑性组合物及其成形制品
KR102272924B1 (ko) * 2017-01-11 2021-07-06 에스에이치피피 글로벌 테크놀러지스 비.브이. 광물 충전제 표면 상에 코팅된 금속 화합물을 갖는 코어-쉘 구조 lds 첨가제에 의한 레이저 도금 성능 및 열전도도를 갖는 조성물
WO2019042906A1 (de) * 2017-08-29 2019-03-07 Merck Patent Gmbh Laseradditiv und additiv für lds-kunststoffe
WO2019149900A1 (de) * 2018-02-02 2019-08-08 Sivantos Pte. Ltd. Zusammensetzung zur herstellung von hörgerätekomponenten
EP3543291A1 (en) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom
CN112119128B (zh) * 2018-05-16 2022-03-01 默克专利股份有限公司 激光添加剂及其在聚合物材料中的用途
WO2020126188A1 (en) * 2018-12-19 2020-06-25 Mep Europe B.V. Thermoplastic composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US12441879B2 (en) 2019-08-21 2025-10-14 Ticona Llc Polymer composition for laser direct structuring
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
JP7737387B2 (ja) 2020-02-26 2025-09-10 ティコナ・エルエルシー 回路構造体
JP7562989B2 (ja) * 2020-03-12 2024-10-08 住友ベークライト株式会社 電子装置
JP7501131B2 (ja) * 2020-06-11 2024-06-18 住友ベークライト株式会社 Ｌｄｓ用熱硬化性樹脂組成物および構造体
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
JP6907393B1 (ja) 2020-08-05 2021-07-21 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007505959A (ja) 2003-09-17 2007-03-15 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド レーザーマーキング可能な高分子組成物
WO2012126831A1 (en) * 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Process for producing a circuit carrier
JP2013144767A (ja) 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014074160A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074161A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074162A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832560B2 (ja) * 1987-05-15 1996-03-29 テイカ株式会社 複合導電性粉末およびその製造法
JPH09249820A (ja) * 1996-03-15 1997-09-22 Titan Kogyo Kk 白色導電性粉末及びその製造方法
DE19723734C2 (de) 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
US7507511B2 (en) * 2005-01-14 2009-03-24 Ricoh Company Ltd. Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor
US8309640B2 (en) 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
BRPI1013619A2 (pt) * 2009-03-18 2016-04-19 Merck Patent Gmbh pigmento para marcação a laser
EP3046401A1 (en) 2010-10-26 2016-07-20 SABIC Global Technologies B.V. Laser direct structuring materials with all color capability
DE102011000138A1 (de) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007505959A (ja) 2003-09-17 2007-03-15 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド レーザーマーキング可能な高分子組成物
WO2012126831A1 (en) * 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Process for producing a circuit carrier
JP2013144767A (ja) 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014074160A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074161A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法
JP2014074162A (ja) 2012-09-14 2014-04-24 Mitsubishi Engineering Plastics Corp レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法

Also Published As

Publication number Publication date
TWI632205B (zh) 2018-08-11
KR20160005742A (ko) 2016-01-15
DE102013007750A1 (de) 2014-11-13
JP6423418B2 (ja) 2018-11-14
CN105230133B (zh) 2019-01-15
TW201510109A (zh) 2015-03-16
CN105230133A (zh) 2016-01-06
JP2016520139A (ja) 2016-07-11
WO2014180550A1 (de) 2014-11-13
EP2995178A1 (de) 2016-03-16

Similar Documents

Publication Publication Date Title
KR102171893B1 (ko) Lds 플라스틱용 첨가제
US9982113B2 (en) Additive for LDS plastics
CN106574105B (zh) 用于防止聚合物和树脂组合物中热氧化降解的核-壳复合无机金属氧化物及制备方法
CN110023389A (zh) 热塑性组合物
CN105531771B (zh) 用于形成导电图案的组合物和方法，及其上具有导电图案的树脂结构
CN106605272B (zh) 用于形成导电图案的组合物和具有导电图案的树脂结构
CN101331191B (zh) 聚亚芳基硫醚树脂组合物
CN106575539A (zh) 用于形成导电图案的组合物和具有导电图案的树脂结构
KR101895510B1 (ko) 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
EP3139388B1 (en) Composition for conductive pattern formation, conductive pattern formation method using same, and resin structure having conductive pattern
KR101771664B1 (ko) 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR101983271B1 (ko) 도전성 패턴 형성용 조성물 및 도전성 패턴을 가지는 수지 구조체
EP3154066B1 (en) Composition for forming conductive pattern and resin structure having conductive pattern

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231027

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231027