CN105225970B - A kind of semiconductor memory making mold - Google Patents
A kind of semiconductor memory making mold Download PDFInfo
- Publication number
- CN105225970B CN105225970B CN201410286622.5A CN201410286622A CN105225970B CN 105225970 B CN105225970 B CN 105225970B CN 201410286622 A CN201410286622 A CN 201410286622A CN 105225970 B CN105225970 B CN 105225970B
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- China
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- substrate
- mold
- epoxy resin
- fixing piece
- semiconductor memory
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A kind of semiconductor memory provided by the invention makes mold, and inside injection epoxy resin includes：Upper mold；Corresponding lid closes the lower mold of the upper mold, it is formed with the space for epoxy resin flowing, the lower mold is equipped with substrate locating rod, substrate locating rod one end is equipped at least a pair of of the locating piece diverged to outward, there are the gaps for fixing piece to be arranged between the locating piece, and the fixing piece is for fixing the substrate；Wherein, the substrate back is mutually fixed with the fixing piece upward；Since the flow velocity of substrate back will be faster than front so that the pressure of substrate back is more than front, to suppress to go out without having resin stream downwards.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, and mold is made more particularly to a kind of semiconductor memory.
Background technology
As memory chip volume reduces, in the design and chip paste position using substrate, sealed in unit uses existing
When die operation, the flowing of epoxy resin does not meet the requirement of new product, causes resin to spill on the outside of substrate package, causes
A large amount of defective products generate.
Invention content
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of semiconductor memories to make mould
Tool solves the problems, such as that resin overflows in existing epoxy resin injection mold.
In order to achieve the above objects and other related objects, the present invention provides a kind of semiconductor memory making mold, internal
Epoxy resin is injected, the mold includes：Upper mold；Corresponding lid closes the lower mold of the upper mold, is formed with for the ring
The space of resene flowing, the lower mold are equipped with substrate locating rod, and substrate locating rod one end is equipped with and diverges to outward
At least a pair of of locating piece, there are the gap for fixing piece to be arranged between the locating piece, the fixing piece is for described in fixed
Substrate；Wherein, the substrate back is mutually fixed with the fixing piece upward.
Preferably, the epoxy resin is more than the flow velocity in the substrate front side in the flow velocity of the substrate back, with
Make to be more than the application pressure of the substrate back application pressure to the substrate front side.
Preferably, the fixing piece section shape includes：Parallel upper and lower straight line；Left side connects the upper and lower straight line
The arc side of the evagination on side；And right side connects the upper following straight line.
Preferably, the upper mold is equipped with exhaust passage.
As described above, a kind of semiconductor memory provided by the invention makes mold, inside injection epoxy resin includes：
Upper mold；Corresponding lid closes the lower mold of the upper mold, is formed with the space for epoxy resin flowing, the lower mold
Equipped with substrate locating rod, substrate locating rod one end is equipped at least a pair of of the locating piece diverged to outward, between the locating piece
There are the gap for fixing piece to be arranged, the fixing piece is for fixing the substrate；Wherein, the substrate back upward with
The fixing piece is mutually fixed；Since the flow velocity of substrate back will be faster than front so that the pressure of substrate back is more than front, to
It suppresses to go out without having resin stream downwards.
Description of the drawings
Fig. 1 is shown as the structural schematic diagram of an embodiment of lower mold in the semiconductor memory making mold of the present invention.
Fig. 2 is shown as the structural schematic diagram of an embodiment of locating piece in the semiconductor memory making mold of the present invention.
Fig. 3 is shown as the structural schematic diagram of an embodiment of fixing piece in the semiconductor memory making mold of the present invention.
Fig. 4 is shown as the structural schematic diagram of an embodiment of upper mold in the semiconductor memory making mold of the present invention.
Specific implementation mode
Illustrate that embodiments of the present invention, those skilled in the art can be by this specification below by way of specific specific example
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
It please referring to Fig.1 to Fig.4, the present invention provides a kind of semiconductor memory making mold, and epoxy resin is injected in inside,
The mold includes：Lower mold 2 and upper mold 1.
As shown in Figure 1, the lower mold 2, is formed with the space for epoxy resin flowing, the lower mold 2 is set
There is substrate locating rod 21, then as shown in Fig. 2, described 21 one end of substrate locating rod is equipped at least a pair of of the locating piece diverged to outward
211, there are the gaps for fixing piece 22 to be arranged between the locating piece 211, and the fixing piece 22 is for fixing the substrate；
Wherein, the substrate back is fixed with 22 phase of the fixing piece upward.
Preferably, the epoxy resin is more than the flow velocity in the substrate front side in the flow velocity of the substrate back, with
Make the application pressure to the substrate back more than the application pressure to the substrate front side, to suppress downwards without having
Resin flows out, and splicing transfer member splicing mode is transformed and changed to existing mold, makes epoxy resin flow direction change, really
Stay in grade is protected, to achieve the effect that similar products at home and abroad is incomparable in performance, since substrate needs are inversely put
It sets, needs to be transformed sealed in unit conveyer system, it is ensured that in the case that substrate number can be identified system identification, change
Splicing transfer member splicing mode, achievees the effect that substrate is inversely placed；In actual tests, is inversely placed, changed by substrate
Become the type of flow on substrate after epoxy resin high temperature melting；Increase pressure of the epoxy resin to chip surface, stablizes
Glue overflow capability during resin flowing, glue overflow it is bad 9PPM is reduced to by 237PPM, realize the stabilization of product
Operation.
As shown in Figure 3, it is preferred that 22 section shape of the fixing piece includes：Parallel upper and lower straight line；Left side connects
The arc side of the evagination of the upper and lower straight line, arc side can be connected in the locating rod 21；And right side connection is described following
Straight line, the fixing piece width may be, for example, 2.3mm.
As shown in Figure 4, it is preferred that the upper mold 1 be equipped with exhaust passage 11, the exhaust passage 11 can have it is multiple, it is wide
Degree may be, for example, 1.8mm or 1.5mm, and the exhaust passage 11 of 1.8mm is set to the left side edge of upper mold 1.
In conclusion a kind of semiconductor memory provided by the invention makes mold, inside injection epoxy resin includes：
Upper mold；Corresponding lid closes the lower mold of the upper mold, is formed with the space for epoxy resin flowing, the lower mold
Equipped with substrate locating rod, substrate locating rod one end is equipped at least a pair of of the locating piece diverged to outward, between the locating piece
There are the gap for fixing piece to be arranged, the fixing piece is for fixing the substrate；Wherein, the substrate back upward with
The fixing piece is mutually fixed；Since the flow velocity of substrate back will be faster than front so that the pressure of substrate back is more than front, to
It suppresses to go out without having resin stream downwards.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology can all carry out modifications and changes to above-described embodiment without violating the spirit and scope of the present invention.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should by the present invention claim be covered.
Claims (2)
1. a kind of semiconductor memory makes mold, inside injection epoxy resin, which is characterized in that the mold includes：
Upper mold；
Corresponding lid closes the lower mold of the upper mold, is formed with the space for epoxy resin flowing, and the lower mold is set
There are substrate locating rod, substrate locating rod one end to be equipped at least a pair of of the locating piece diverged to outward, stayed between the locating piece
It is useful for the gap of setting fixing piece, the fixing piece is used for fixed substrate；Wherein, the substrate back upward with it is described solid
Determine part mutually to fix；
It is inversely placed by substrate, the type of flow after change epoxy resin high temperature melting on substrate so that the epoxy
Change resin and is more than the flow velocity in the substrate front side in the flow velocity of the substrate back；Increase epoxy resin to chip surface
Pressure stabilizes resin flowing so as to be more than the application pressure to the substrate front side to the application pressure of the substrate back
Glue overflow capability in the process；
The fixing piece section shape includes：Parallel upper and lower straight line；Left side connects the evagination of the upper and lower straight line
Arc side；And right side connects the straight line of the upper and lower straight line.
2. semiconductor memory according to claim 1 makes mold, which is characterized in that it is logical that the upper mold is equipped with exhaust
Road.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286622.5A CN105225970B (en) | 2014-06-25 | 2014-06-25 | A kind of semiconductor memory making mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286622.5A CN105225970B (en) | 2014-06-25 | 2014-06-25 | A kind of semiconductor memory making mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105225970A CN105225970A (en) | 2016-01-06 |
| CN105225970B true CN105225970B (en) | 2018-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410286622.5A Active CN105225970B (en) | 2014-06-25 | 2014-06-25 | A kind of semiconductor memory making mold |
Country Status (1)
| Country | Link |
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| CN (1) | CN105225970B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435900A (en) * | 2002-01-31 | 2003-08-13 | 三洋电机株式会社 | Method for mfg. lamination cell and lamination cell made thereby |
| CN204118037U (en) * | 2014-06-25 | 2015-01-21 | 海太半导体（无锡）有限公司 | A kind of semiconductor memory makes mould |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100566496B1 (en) * | 2001-12-07 | 2006-03-31 | 야마하 가부시키가이샤 | Apparatus for manufacturing semiconductor device |
| US7592204B2 (en) * | 2007-11-29 | 2009-09-22 | Honeywell International Inc. | Package design of small diameter sensor |
-
2014
- 2014-06-25 CN CN201410286622.5A patent/CN105225970B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435900A (en) * | 2002-01-31 | 2003-08-13 | 三洋电机株式会社 | Method for mfg. lamination cell and lamination cell made thereby |
| CN204118037U (en) * | 2014-06-25 | 2015-01-21 | 海太半导体（无锡）有限公司 | A kind of semiconductor memory makes mould |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105225970A (en) | 2016-01-06 |
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